TW200721275A - Heating device of the light irradiation type - Google Patents

Heating device of the light irradiation type

Info

Publication number
TW200721275A
TW200721275A TW095136750A TW95136750A TW200721275A TW 200721275 A TW200721275 A TW 200721275A TW 095136750 A TW095136750 A TW 095136750A TW 95136750 A TW95136750 A TW 95136750A TW 200721275 A TW200721275 A TW 200721275A
Authority
TW
Taiwan
Prior art keywords
heating device
light irradiation
irradiation type
filament lamps
light
Prior art date
Application number
TW095136750A
Other languages
English (en)
Other versions
TWI372420B (zh
Inventor
Shinji Suzuki
Kyohei Seki
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37845376&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200721275(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200721275A publication Critical patent/TW200721275A/zh
Application granted granted Critical
Publication of TWI372420B publication Critical patent/TWI372420B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Recrystallisation Techniques (AREA)
TW095136750A 2005-11-30 2006-10-03 Heating device of the light irradiation type TW200721275A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005346983A JP5013044B2 (ja) 2005-11-30 2005-11-30 光照射式加熱装置

Publications (2)

Publication Number Publication Date
TW200721275A true TW200721275A (en) 2007-06-01
TWI372420B TWI372420B (zh) 2012-09-11

Family

ID=37845376

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136750A TW200721275A (en) 2005-11-30 2006-10-03 Heating device of the light irradiation type

Country Status (6)

Country Link
US (1) US7700899B2 (zh)
EP (1) EP1793413B2 (zh)
JP (1) JP5013044B2 (zh)
KR (1) KR101036404B1 (zh)
DE (1) DE602006004540D1 (zh)
TW (1) TW200721275A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5282393B2 (ja) * 2007-11-06 2013-09-04 ウシオ電機株式会社 光照射式加熱処理装置
JP5282409B2 (ja) * 2008-02-25 2013-09-04 ウシオ電機株式会社 光照射式加熱方法及び光照射式加熱装置
DE102011080202A1 (de) * 2011-08-01 2013-02-07 Gebr. Schmid Gmbh Vorrichtung und Verfahren zur Herstellung von dünnen Schichten
DE102012106667B3 (de) * 2012-07-23 2013-07-25 Heraeus Noblelight Gmbh Vorrichtung zur Bestrahlung eines Substrats
KR102069078B1 (ko) * 2014-08-27 2020-01-23 주식회사 제우스 기판 처리장치
WO2016126381A1 (en) * 2015-02-05 2016-08-11 Applied Materials, Inc. Rapid thermal processing chamber with linear control lamps
JP6622617B2 (ja) * 2016-02-18 2019-12-18 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US11456274B1 (en) * 2021-08-31 2022-09-27 Yield Engineering Systems, Inc. Method of using a processing oven

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6081819A (ja) * 1983-10-11 1985-05-09 Fujitsu Ltd 赤外線熱処理装置
US4789771A (en) † 1985-10-07 1988-12-06 Epsilon Limited Partnership Method and apparatus for substrate heating in an axially symmetric epitaxial deposition apparatus
DE3938437A1 (de) † 1989-11-20 1991-05-23 Heraeus Quarzglas Infrarot-strahler
JPH0448724A (ja) * 1990-06-15 1992-02-18 Hitachi Ltd 半導体熱処理装置
JP3103896B2 (ja) * 1991-03-15 2000-10-30 ソニー株式会社 ハロゲンランプ及び熱処理炉
JPH04329253A (ja) 1991-04-30 1992-11-18 Toshiba Lighting & Technol Corp 管形白熱電球
DE69207965T2 (de) * 1991-07-08 1996-08-22 Philips Electronics Nv Elektrisches Gerät zur Nahrungsmittelbereitung und elektrische Lampe zur Verwendung in diesem Gerät
JPH05106050A (ja) * 1991-10-17 1993-04-27 Toshiba Mach Co Ltd 走行薄平板の均等加熱装置
JPH0716353U (ja) 1993-08-31 1995-03-17 ウシオ電機株式会社 管型ランプ
GB9611800D0 (en) † 1996-06-06 1996-08-07 Univ Bristol Post-reception focusing in remote detection systems
US5951896A (en) † 1996-12-04 1999-09-14 Micro C Technologies, Inc. Rapid thermal processing heater technology and method of use
JPH11176389A (ja) * 1997-12-12 1999-07-02 Ushio Inc ウエハ加熱用フィラメントランプおよび加熱用光源
JP3296300B2 (ja) * 1998-08-07 2002-06-24 ウシオ電機株式会社 光照射式加熱装置
JP3988338B2 (ja) * 1999-10-07 2007-10-10 ウシオ電機株式会社 光照射式急速加熱処理装置の制御装置
DE10024709B4 (de) * 2000-05-18 2008-03-13 Steag Rtp Systems Gmbh Vorrichtung zum thermischen Behandeln von Substraten
TW540121B (en) * 2000-10-10 2003-07-01 Ushio Electric Inc Heat treatment device and process with light irradiation
DE10051125A1 (de) * 2000-10-16 2002-05-02 Steag Rtp Systems Gmbh Vorrichtung zum thermischen Behandeln von Substraten
JP4948701B2 (ja) * 2000-12-28 2012-06-06 東京エレクトロン株式会社 加熱装置、当該加熱装置を有する熱処理装置、及び、熱処理制御方法
JP2003031517A (ja) 2001-07-19 2003-01-31 Dainippon Screen Mfg Co Ltd 基板の熱処理装置

Also Published As

Publication number Publication date
EP1793413B1 (en) 2008-12-31
JP2007157780A (ja) 2007-06-21
US7700899B2 (en) 2010-04-20
TWI372420B (zh) 2012-09-11
US20070120227A1 (en) 2007-05-31
DE602006004540D1 (de) 2009-02-12
EP1793413A1 (en) 2007-06-06
KR101036404B1 (ko) 2011-05-23
EP1793413B2 (en) 2019-05-08
JP5013044B2 (ja) 2012-08-29
KR20070056944A (ko) 2007-06-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees