TW200711118A - High fill factor multi-way shared pixel - Google Patents
High fill factor multi-way shared pixelInfo
- Publication number
- TW200711118A TW200711118A TW095116783A TW95116783A TW200711118A TW 200711118 A TW200711118 A TW 200711118A TW 095116783 A TW095116783 A TW 095116783A TW 95116783 A TW95116783 A TW 95116783A TW 200711118 A TW200711118 A TW 200711118A
- Authority
- TW
- Taiwan
- Prior art keywords
- pixel cell
- fill factor
- array
- pixel
- shared
- Prior art date
Links
- 210000004027 cell Anatomy 0.000 abstract 5
- 210000003850 cellular structure Anatomy 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
- H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
- H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/126,275 US7830437B2 (en) | 2005-05-11 | 2005-05-11 | High fill factor multi-way shared pixel |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200711118A true TW200711118A (en) | 2007-03-16 |
TWI308797B TWI308797B (en) | 2009-04-11 |
Family
ID=37237163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095116783A TWI308797B (en) | 2005-05-11 | 2006-05-11 | High fill factor multi-way shared pixel |
Country Status (7)
Country | Link |
---|---|
US (1) | US7830437B2 (zh) |
EP (1) | EP1880541A2 (zh) |
JP (1) | JP2008541454A (zh) |
KR (1) | KR100944345B1 (zh) |
CN (1) | CN101171830A (zh) |
TW (1) | TWI308797B (zh) |
WO (1) | WO2006124383A2 (zh) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7446357B2 (en) * | 2005-05-11 | 2008-11-04 | Micron Technology, Inc. | Split trunk pixel layout |
US7342213B2 (en) * | 2005-06-01 | 2008-03-11 | Eastman Kodak Company | CMOS APS shared amplifier pixel with symmetrical field effect transistor placement |
KR100723487B1 (ko) * | 2005-06-08 | 2007-06-04 | 삼성전자주식회사 | 이미지 센서에서 효율적인 금속 배선의 픽셀 회로 및 구동방법 |
KR100718781B1 (ko) * | 2005-06-15 | 2007-05-16 | 매그나칩 반도체 유한회사 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
US7511323B2 (en) * | 2005-08-11 | 2009-03-31 | Aptina Imaging Corporation | Pixel cells in a honeycomb arrangement |
US7427734B2 (en) * | 2005-10-18 | 2008-09-23 | Digital Imaging Systems Gmbh | Multiple photosensor pixel |
KR100772892B1 (ko) * | 2006-01-13 | 2007-11-05 | 삼성전자주식회사 | 플로팅 확산 영역의 커패시턴스를 제어할 수 있는 공유픽셀형 이미지 센서 |
US8184190B2 (en) * | 2006-11-28 | 2012-05-22 | Youliza, Gehts B.V. Limited Liability Company | Simultaneous global shutter and correlated double sampling read out in multiple photosensor pixels |
JP5164370B2 (ja) * | 2006-12-13 | 2013-03-21 | キヤノン株式会社 | 撮像装置の製造方法 |
KR100922931B1 (ko) * | 2006-12-27 | 2009-10-22 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조 방법 |
WO2008088981A1 (en) | 2007-01-11 | 2008-07-24 | Micron Technology, Inc. | Missing pixel architecture |
US7952155B2 (en) * | 2007-02-20 | 2011-05-31 | Micron Technology, Inc. | Reduced edge effect from recesses in imagers |
US8009211B2 (en) | 2007-04-03 | 2011-08-30 | Canon Kabushiki Kaisha | Image sensing apparatus and image capturing system |
US8159585B2 (en) * | 2007-05-01 | 2012-04-17 | Omnivision Technologies, Inc. | Image sensor pixel with gain control |
JP4292426B2 (ja) * | 2007-05-15 | 2009-07-08 | ソニー株式会社 | 撮像装置および撮像データ補正方法 |
US7825966B2 (en) * | 2007-06-29 | 2010-11-02 | Omnivision Technologies, Inc. | High dynamic range sensor with blooming drain |
KR101404074B1 (ko) * | 2007-07-31 | 2014-06-05 | 삼성전기주식회사 | Cmos 영상 센서 |
US7924333B2 (en) * | 2007-08-17 | 2011-04-12 | Aptina Imaging Corporation | Method and apparatus providing shared pixel straight gate architecture |
US7964929B2 (en) * | 2007-08-23 | 2011-06-21 | Aptina Imaging Corporation | Method and apparatus providing imager pixels with shared pixel components |
US7989749B2 (en) * | 2007-10-05 | 2011-08-02 | Aptina Imaging Corporation | Method and apparatus providing shared pixel architecture |
US20090102211A1 (en) * | 2007-10-22 | 2009-04-23 | Amir Antar | Portable pet waste receptacle |
US8130300B2 (en) | 2007-12-20 | 2012-03-06 | Aptina Imaging Corporation | Imager method and apparatus having combined select signals |
US8227844B2 (en) * | 2008-01-14 | 2012-07-24 | International Business Machines Corporation | Low lag transfer gate device |
US8743247B2 (en) * | 2008-01-14 | 2014-06-03 | International Business Machines Corporation | Low lag transfer gate device |
JP4952601B2 (ja) * | 2008-02-04 | 2012-06-13 | 日本テキサス・インスツルメンツ株式会社 | 固体撮像装置 |
JP5153378B2 (ja) * | 2008-02-15 | 2013-02-27 | キヤノン株式会社 | 固体撮像装置及びその駆動方法 |
US8077236B2 (en) * | 2008-03-20 | 2011-12-13 | Aptina Imaging Corporation | Method and apparatus providing reduced metal routing in imagers |
US20090237540A1 (en) * | 2008-03-20 | 2009-09-24 | Micron Technology, Inc. | Imager method and apparatus having combined gate signals |
JP5292939B2 (ja) * | 2008-06-20 | 2013-09-18 | ソニー株式会社 | 画像処理装置および方法、製造装置 |
US8350939B2 (en) | 2008-10-01 | 2013-01-08 | Micron Technology, Inc. | Vertical 4-way shared pixel in a single column with internal reset and no row select |
GB2466213B (en) * | 2008-12-12 | 2013-03-06 | Cmosis Nv | Pixel array with shared readout circuitry |
JP5029624B2 (ja) * | 2009-01-15 | 2012-09-19 | ソニー株式会社 | 固体撮像装置及び電子機器 |
US8324548B2 (en) * | 2009-03-26 | 2012-12-04 | Aptina Imaging Corporation | Imaging devices and methods for charge transfer |
CN101902583B (zh) * | 2009-05-26 | 2013-03-13 | 英属开曼群岛商恒景科技股份有限公司 | 影像传感器及具有高转换增益的低噪声像素读出电路 |
US20100314667A1 (en) * | 2009-06-11 | 2010-12-16 | Omnivision Technologies, Inc. | Cmos pixel with dual-element transfer gate |
JP4881987B2 (ja) * | 2009-10-06 | 2012-02-22 | キヤノン株式会社 | 固体撮像装置および撮像装置 |
US8488025B2 (en) * | 2009-10-20 | 2013-07-16 | AltaSens, Inc | Sub-frame tapered reset |
US8531567B2 (en) * | 2009-10-22 | 2013-09-10 | Stmicroelectronics (Crolles 2) Sas | Image sensor with vertical transfer gate |
US8451354B2 (en) | 2010-05-17 | 2013-05-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | TDI image sensor in CMOS technology with high video capture rate |
FR2961019B1 (fr) | 2010-06-03 | 2013-04-12 | Commissariat Energie Atomique | Capteur d'image lineaire en technologie cmos |
CN103165636B (zh) * | 2013-03-21 | 2015-10-21 | 北京思比科微电子技术股份有限公司 | Cmos图像传感器的像素单元组及cmos图像传感器 |
US10134788B2 (en) | 2013-09-17 | 2018-11-20 | Omnivision Technologies, Inc. | Dual VPIN HDR image sensor pixel |
JP2015088621A (ja) * | 2013-10-30 | 2015-05-07 | 株式会社東芝 | 固体撮像装置および固体撮像装置の製造方法 |
KR20150127923A (ko) * | 2014-05-07 | 2015-11-18 | 에스케이하이닉스 주식회사 | 이미지 센싱 장치 |
KR102286111B1 (ko) | 2014-08-21 | 2021-08-04 | 삼성전자주식회사 | 단위 픽셀, 상기 단위 픽셀을 포함하는 이미지 센서, 및 상기 단위 픽셀을 포함하는 이미지 처리 시스템 |
CN113658968A (zh) * | 2014-12-18 | 2021-11-16 | 索尼公司 | 光检测设备 |
KR102363433B1 (ko) | 2015-01-15 | 2022-02-16 | 삼성전자주식회사 | 이미지 센서 |
US9888200B2 (en) | 2015-07-31 | 2018-02-06 | Pixart Imaging Inc. | Image sensor and operating method thereof |
US9930280B2 (en) | 2016-01-04 | 2018-03-27 | Sensors Unlimited, Inc. | Imaging pixel subarray with shared pulse detection |
KR102541701B1 (ko) | 2016-01-15 | 2023-06-13 | 삼성전자주식회사 | 씨모스 이미지 센서 |
US10270997B2 (en) | 2016-09-08 | 2019-04-23 | Gvbb Holdings S.A.R.L. | Cross pixel interconnection |
US10263021B2 (en) * | 2016-12-12 | 2019-04-16 | Stmicroelectronics (Research & Development) Limited | Global shutter pixels having shared isolated storage capacitors within an isolation structure surrounding the perimeter of a pixel array |
KR20180077969A (ko) | 2016-12-29 | 2018-07-09 | 삼성전자주식회사 | 이미지 센서 및 그 이미지 센서를 구비한 전자 장치 |
JP7281895B2 (ja) * | 2018-12-06 | 2023-05-26 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および電子機器 |
KR20200118723A (ko) * | 2019-04-08 | 2020-10-16 | 삼성전자주식회사 | 픽셀 그룹들을 포함하는 이미지 센서 및 이를 포함하는 전자 장치 |
CN112331686A (zh) * | 2020-11-26 | 2021-02-05 | 上海华力微电子有限公司 | Cmos图像传感器的像素结构及像素结构的形成方法 |
CN113676652B (zh) * | 2021-08-25 | 2023-05-26 | 维沃移动通信有限公司 | 图像传感器、控制方法、控制装置、电子设备和存储介质 |
CN113676651B (zh) * | 2021-08-25 | 2023-05-26 | 维沃移动通信有限公司 | 图像传感器、控制方法、控制装置、电子设备和存储介质 |
CN113674685B (zh) * | 2021-08-25 | 2023-02-24 | 维沃移动通信有限公司 | 像素阵列的控制方法、装置、电子设备和可读存储介质 |
US11956557B1 (en) | 2022-10-17 | 2024-04-09 | BAE Systems Imaging Solutions Inc. | Pixel architecture with high dynamic range |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2977060B2 (ja) | 1992-01-29 | 1999-11-10 | オリンパス光学工業株式会社 | 固体撮像装置及びその制御方法 |
JP3031606B2 (ja) * | 1995-08-02 | 2000-04-10 | キヤノン株式会社 | 固体撮像装置と画像撮像装置 |
US6160281A (en) * | 1997-02-28 | 2000-12-12 | Eastman Kodak Company | Active pixel sensor with inter-pixel function sharing |
US6107655A (en) * | 1997-08-15 | 2000-08-22 | Eastman Kodak Company | Active pixel image sensor with shared amplifier read-out |
US5962844A (en) * | 1997-09-03 | 1999-10-05 | Foveon, Inc. | Active pixel image cell with embedded memory and pixel level signal processing capability |
US6977684B1 (en) | 1998-04-30 | 2005-12-20 | Canon Kabushiki Kaisha | Arrangement of circuits in pixels, each circuit shared by a plurality of pixels, in image sensing apparatus |
KR19990084630A (ko) * | 1998-05-08 | 1999-12-06 | 김영환 | 씨모스 이미지 센서 및 그 구동 방법 |
US6218656B1 (en) * | 1998-12-30 | 2001-04-17 | Eastman Kodak Company | Photodiode active pixel sensor with shared reset signal row select |
US6657665B1 (en) * | 1998-12-31 | 2003-12-02 | Eastman Kodak Company | Active Pixel Sensor with wired floating diffusions and shared amplifier |
US6486913B1 (en) * | 1999-09-30 | 2002-11-26 | Intel Corporation | Pixel array with shared reset circuitry |
JP3658278B2 (ja) * | 2000-05-16 | 2005-06-08 | キヤノン株式会社 | 固体撮像装置およびそれを用いた固体撮像システム |
US6552322B1 (en) * | 2000-05-16 | 2003-04-22 | Micron Technology, Inc. | Shared photodetector pixel image sensor |
US6552323B2 (en) * | 2000-12-06 | 2003-04-22 | Eastman Kodak Company | Image sensor with a shared output signal line |
US6478519B1 (en) | 2001-04-27 | 2002-11-12 | Bamal Corporation | Bolt retaining article |
US6567028B2 (en) * | 2001-10-12 | 2003-05-20 | Micron Technology, Inc. | Reference voltage stabilization in CMOS sensors |
JP3988189B2 (ja) | 2002-11-20 | 2007-10-10 | ソニー株式会社 | 固体撮像装置 |
CN100362854C (zh) * | 2003-02-13 | 2008-01-16 | 松下电器产业株式会社 | 固体摄像装置、其驱动方法及使用它的照相机 |
US7075049B2 (en) * | 2003-06-11 | 2006-07-11 | Micron Technology, Inc. | Dual conversion gain imagers |
US7078746B2 (en) * | 2003-07-15 | 2006-07-18 | Micron Technology, Inc. | Image sensor with floating diffusion gate capacitor |
US7443437B2 (en) * | 2003-11-26 | 2008-10-28 | Micron Technology, Inc. | Image sensor with a gated storage node linked to transfer gate |
US7087883B2 (en) * | 2004-02-04 | 2006-08-08 | Omnivision Technologies, Inc. | CMOS image sensor using shared transistors between pixels with dual pinned photodiode |
-
2005
- 2005-05-11 US US11/126,275 patent/US7830437B2/en active Active
-
2006
- 2006-05-09 KR KR1020077028831A patent/KR100944345B1/ko active IP Right Grant
- 2006-05-09 CN CNA2006800155824A patent/CN101171830A/zh active Pending
- 2006-05-09 EP EP06770102A patent/EP1880541A2/en not_active Withdrawn
- 2006-05-09 JP JP2008511247A patent/JP2008541454A/ja active Pending
- 2006-05-09 WO PCT/US2006/017808 patent/WO2006124383A2/en active Application Filing
- 2006-05-11 TW TW095116783A patent/TWI308797B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2006124383A8 (en) | 2007-12-21 |
WO2006124383A2 (en) | 2006-11-23 |
KR100944345B1 (ko) | 2010-03-02 |
US20060256221A1 (en) | 2006-11-16 |
JP2008541454A (ja) | 2008-11-20 |
CN101171830A (zh) | 2008-04-30 |
TWI308797B (en) | 2009-04-11 |
WO2006124383A3 (en) | 2007-05-10 |
US7830437B2 (en) | 2010-11-09 |
EP1880541A2 (en) | 2008-01-23 |
KR20080007408A (ko) | 2008-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200711118A (en) | High fill factor multi-way shared pixel | |
TW200713574A (en) | HDR/AB on multi-way shared pixels | |
TW200707712A (en) | Split trunk pixel layout | |
TW200731788A (en) | Image pixel reset through dual conversion gain gate | |
GB2465712A (en) | Method and apparatus providing shared pixel straight gate architecture | |
WO2008073225A3 (en) | Imaging method, apparatus, and system providing improved imager quantum efficiency | |
TW200715841A (en) | Method and apparatus providing a two-way shared storage gate on a four-way shared pixel | |
TW200729472A (en) | Method and apparatus providing a two-way shared stroage gate on a four-way shared pixel | |
TWI268605B (en) | Solid-state imaging device | |
EP1952469A4 (en) | DIRECT ELECTRONIC TRANSMISSION OVER ENZYMES IN BIOANODES, BIOCATHODES, AND BIOFUEL CELLS | |
TW200721814A (en) | Efficient charge transferring in CMOS imagers | |
TW200733355A (en) | Memory array structure with strapping cells | |
WO2011115893A3 (en) | Techniques for providing a semiconductor memory device | |
WO2010102116A3 (en) | Photovoltaic cell having multiple electron donors | |
TW200735337A (en) | Method and apparatus for setting black level in an imager using both optically black and tied pixels | |
WO2006066195A3 (en) | Local macroblock information buffer | |
WO2007112041A3 (en) | Memory based computation systems and methods of using the same | |
WO2004112161A3 (de) | Tandemsolarzelle mit einer gemeinsamen organischen elektrode | |
TW200742054A (en) | Fused multi-array color image sensor | |
WO2009089612A8 (en) | Nonvolatile semiconductor memory device | |
EP1816679A3 (en) | Thermal isolation of phase change memory cells | |
TW200729929A (en) | Pixel binning and averaging based on illumination | |
WO2011117316A3 (en) | Pixellated scintillator readout arrangement and method | |
WO2008099520A1 (ja) | 固体撮像装置およびその駆動方法、撮像装置 | |
WO2017212075A3 (en) | Cmos image sensors with reduced power consumption |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |