TW200710471A - Array substrate for display device - Google Patents
Array substrate for display deviceInfo
- Publication number
- TW200710471A TW200710471A TW095125841A TW95125841A TW200710471A TW 200710471 A TW200710471 A TW 200710471A TW 095125841 A TW095125841 A TW 095125841A TW 95125841 A TW95125841 A TW 95125841A TW 200710471 A TW200710471 A TW 200710471A
- Authority
- TW
- Taiwan
- Prior art keywords
- display device
- metal layer
- array substrate
- metal
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 4
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 230000000802 nitrating effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050065828A KR20070010863A (ko) | 2005-07-20 | 2005-07-20 | 어레이 기판, 어레이 기판의 제조방법 및 상기 어레이기판을 갖는 표시장치 |
KR1020050100045A KR20070044110A (ko) | 2005-10-24 | 2005-10-24 | 어레이 기판의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200710471A true TW200710471A (en) | 2007-03-16 |
Family
ID=37678697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095125841A TW200710471A (en) | 2005-07-20 | 2006-07-14 | Array substrate for display device |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070019122A1 (zh) |
JP (1) | JP5008916B2 (zh) |
CN (1) | CN102097369B (zh) |
TW (1) | TW200710471A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7786497B2 (en) | 2007-05-30 | 2010-08-31 | Au Optronics Corporation | Pixel structure of LCD and fabrication method thereof |
TWI675231B (zh) * | 2018-03-30 | 2019-10-21 | 友達光電股份有限公司 | 顯示裝置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090011704A (ko) * | 2007-07-27 | 2009-02-02 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
KR100975204B1 (ko) * | 2008-08-04 | 2010-08-10 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
JP5210915B2 (ja) * | 2009-02-09 | 2013-06-12 | 株式会社東芝 | 半導体装置の製造方法 |
CN102483549A (zh) * | 2009-08-21 | 2012-05-30 | 夏普株式会社 | 液晶显示装置和液晶显示装置的制造方法 |
KR101731914B1 (ko) * | 2010-12-10 | 2017-05-04 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 이의 제조 방법 |
US9545324B2 (en) | 2013-03-13 | 2017-01-17 | Cook Medical Technologies Llc | Pre-loaded iliac branch device and methods of deployment |
KR102275519B1 (ko) * | 2013-12-16 | 2021-07-12 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
KR102349281B1 (ko) * | 2015-10-28 | 2022-01-11 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
WO2018225195A1 (ja) * | 2017-06-07 | 2018-12-13 | 三菱電機株式会社 | 半導体装置の製造方法 |
KR20190083027A (ko) * | 2018-01-02 | 2019-07-11 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
US11889721B2 (en) * | 2019-07-16 | 2024-01-30 | Ordos Yuansheng Optoelectronics Co., Ltd. | Display substrate, manufacturing method thereof and display device |
CN110928085B (zh) * | 2019-11-26 | 2021-01-15 | Tcl华星光电技术有限公司 | 阵列基板及显示面板 |
KR20230103603A (ko) * | 2021-12-31 | 2023-07-07 | 엘지디스플레이 주식회사 | 액정 표시 장치 |
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JPH04185693A (ja) * | 1990-11-21 | 1992-07-02 | Hitachi Ltd | 抵抗膜のエッチング液組成物及びそれを使用したエッチング方法 |
JPH04188770A (ja) * | 1990-11-22 | 1992-07-07 | Casio Comput Co Ltd | 薄膜トランジスタ |
DE69319760T2 (de) * | 1992-02-21 | 1999-02-11 | Toshiba Kawasaki Kk | Flüssigkristallanzeigevorrichtung |
EP0589478B1 (en) * | 1992-09-25 | 1999-11-17 | Sony Corporation | Liquid crystal display device |
JP3204473B2 (ja) * | 1993-03-19 | 2001-09-04 | ホーヤ株式会社 | クロム膜製電極の形成方法 |
JPH07176500A (ja) * | 1993-12-17 | 1995-07-14 | Nec Corp | エッチング方法 |
US5413952A (en) * | 1994-02-02 | 1995-05-09 | Motorola, Inc. | Direct wafer bonded structure method of making |
JP3225772B2 (ja) * | 1995-01-30 | 2001-11-05 | 株式会社日立製作所 | 液晶表示装置の製造方法 |
JP3625598B2 (ja) * | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
KR100241287B1 (ko) * | 1996-09-10 | 2000-02-01 | 구본준 | 액정표시소자 제조방법 |
JP2988399B2 (ja) * | 1996-11-28 | 1999-12-13 | 日本電気株式会社 | アクティブマトリクス基板 |
JPH10303142A (ja) * | 1997-04-22 | 1998-11-13 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
US6297519B1 (en) * | 1998-08-28 | 2001-10-02 | Fujitsu Limited | TFT substrate with low contact resistance and damage resistant terminals |
JP4184522B2 (ja) * | 1999-01-29 | 2008-11-19 | 富士通株式会社 | 薄膜トランジスタ基板 |
JP2000206550A (ja) * | 1999-01-13 | 2000-07-28 | Hitachi Ltd | 液晶表示装置 |
JP3362008B2 (ja) * | 1999-02-23 | 2003-01-07 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
US6380559B1 (en) * | 1999-06-03 | 2002-04-30 | Samsung Electronics Co., Ltd. | Thin film transistor array substrate for a liquid crystal display |
KR100766493B1 (ko) * | 2001-02-12 | 2007-10-15 | 삼성전자주식회사 | 박막트랜지스터 액정표시장치 |
US7095460B2 (en) * | 2001-02-26 | 2006-08-22 | Samsung Electronics Co., Ltd. | Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same |
KR20030027302A (ko) * | 2001-09-28 | 2003-04-07 | 삼성전자주식회사 | 저유전율 절연막을 사용하는 박막 트랜지스터 기판 및 그제조 방법 |
JP2003059939A (ja) * | 2001-08-08 | 2003-02-28 | Advanced Display Inc | 薄膜トランジスタアレイ基板およびその製造方法 |
KR100685953B1 (ko) * | 2002-08-20 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 배선의 형성방법 |
JP4248853B2 (ja) * | 2002-11-20 | 2009-04-02 | 大日本印刷株式会社 | 有機半導体素子用陽極 |
JP3870292B2 (ja) * | 2002-12-10 | 2007-01-17 | 関東化学株式会社 | エッチング液組成物とそれを用いた反射板の製造方法 |
JP3730958B2 (ja) * | 2002-12-25 | 2006-01-05 | 鹿児島日本電気株式会社 | 積層膜のパターン形成方法及び積層配線電極 |
JP4400088B2 (ja) * | 2003-05-06 | 2010-01-20 | セイコーエプソン株式会社 | 電気光学装置用基板及びその製造方法並びに電気光学装置 |
TWI301330B (en) * | 2003-07-11 | 2008-09-21 | Chunghwa Picture Tubes Ltd | Thin film transistor and fabricating method thereof |
-
2006
- 2006-07-14 TW TW095125841A patent/TW200710471A/zh unknown
- 2006-07-20 US US11/490,758 patent/US20070019122A1/en not_active Abandoned
- 2006-07-20 JP JP2006197776A patent/JP5008916B2/ja not_active Expired - Fee Related
- 2006-07-20 CN CN201010546290.1A patent/CN102097369B/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7786497B2 (en) | 2007-05-30 | 2010-08-31 | Au Optronics Corporation | Pixel structure of LCD and fabrication method thereof |
US8058084B2 (en) | 2007-05-30 | 2011-11-15 | Au Optronics Corporation | Pixel structure of LCD and fabrication method thereof |
TWI675231B (zh) * | 2018-03-30 | 2019-10-21 | 友達光電股份有限公司 | 顯示裝置 |
Also Published As
Publication number | Publication date |
---|---|
CN102097369A (zh) | 2011-06-15 |
JP2007025703A (ja) | 2007-02-01 |
JP5008916B2 (ja) | 2012-08-22 |
CN102097369B (zh) | 2014-11-26 |
US20070019122A1 (en) | 2007-01-25 |
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