TW200633810A - Lead-free solder flux and solder paste - Google Patents

Lead-free solder flux and solder paste

Info

Publication number
TW200633810A
TW200633810A TW094142781A TW94142781A TW200633810A TW 200633810 A TW200633810 A TW 200633810A TW 094142781 A TW094142781 A TW 094142781A TW 94142781 A TW94142781 A TW 94142781A TW 200633810 A TW200633810 A TW 200633810A
Authority
TW
Taiwan
Prior art keywords
lead
free solder
solder
flux
solder flux
Prior art date
Application number
TW094142781A
Other languages
English (en)
Other versions
TWI355981B (zh
Inventor
Fumio Ishiga
Yasuo Chiba
Kazushige Kajita
Original Assignee
Arakawa Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chem Ind filed Critical Arakawa Chem Ind
Publication of TW200633810A publication Critical patent/TW200633810A/zh
Application granted granted Critical
Publication of TWI355981B publication Critical patent/TWI355981B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW094142781A 2004-12-28 2005-12-05 Lead-free solder flux and solder paste TW200633810A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004380624 2004-12-28
JP2005141909 2005-05-13

Publications (2)

Publication Number Publication Date
TW200633810A true TW200633810A (en) 2006-10-01
TWI355981B TWI355981B (zh) 2012-01-11

Family

ID=36614909

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142781A TW200633810A (en) 2004-12-28 2005-12-05 Lead-free solder flux and solder paste

Country Status (7)

Country Link
US (1) US20080115861A1 (zh)
EP (1) EP1834728A4 (zh)
JP (1) JP5012028B2 (zh)
KR (1) KR101125383B1 (zh)
CN (1) CN101090797B (zh)
TW (1) TW200633810A (zh)
WO (1) WO2006070797A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465427B (zh) * 2009-01-27 2014-12-21 Arakawa Chem Ind 不含鉛之銲錫用助銲劑組成物、不含鉛之銲錫組成物及含松香銲錫
TWI498184B (zh) * 2008-01-31 2015-09-01 Arakawa Chem Ind 助焊劑及膏狀焊劑
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006109441A1 (ja) * 2005-03-30 2008-10-16 荒川化学工業株式会社 粘着付与剤および粘着付与樹脂エマルジョン
KR100718169B1 (ko) * 2006-01-12 2007-05-15 한국과학기술원 니켈 표면 처리된 전자부품과 무전해 니켈 표면 처리된전자부품의 접합방법
JP4780527B2 (ja) * 2006-07-31 2011-09-28 荒川化学工業株式会社 はんだ付け用フラックス組成物、クリームはんだ組成物および電子部品
JP5502732B2 (ja) * 2007-07-23 2014-05-28 ヘンケル リミテッド ハンダ用フラックス
JP5067565B2 (ja) * 2008-05-30 2012-11-07 荒川化学工業株式会社 はんだフラックスおよびクリームはんだ
JP5019057B2 (ja) * 2008-01-31 2012-09-05 荒川化学工業株式会社 はんだフラックスおよびクリームはんだ
JP5513876B2 (ja) * 2009-12-24 2014-06-04 ハリマ化成株式会社 アルミニウムろう付け用組成物
US20120319268A1 (en) * 2010-01-29 2012-12-20 Tomohiro Kagimoto Conductive connection sheet, method for connecting terminals, method for forming connection terminal, semiconductor device, and electronic device
KR101862723B1 (ko) * 2010-09-24 2018-05-30 아라까와 가가꾸 고교 가부시끼가이샤 땜납용 로진계 플럭스 및 솔더페이스트
JP5756933B2 (ja) * 2010-09-29 2015-07-29 株式会社弘輝 フラックス
JP2012161829A (ja) * 2011-02-08 2012-08-30 Mitsubishi Materials Corp フラックス、はんだペースト及び実装基板の製造方法
JP5974608B2 (ja) * 2011-04-26 2016-08-23 荒川化学工業株式会社 ディップはんだ付用フラックス
JP5520973B2 (ja) * 2012-01-17 2014-06-11 株式会社デンソー やに入りはんだ用フラックス及びやに入りはんだ
KR101991355B1 (ko) * 2012-05-18 2019-06-20 아라까와 가가꾸 고교 가부시끼가이샤 납땜 플럭스용 베이스 수지, 납땜 플럭스 및 납땜 페이스트
JP5880300B2 (ja) * 2012-06-14 2016-03-08 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置
US8628571B1 (en) 2012-11-13 2014-01-14 Mitraltech Ltd. Percutaneously-deliverable mechanical valve
JP5992961B2 (ja) * 2014-06-25 2016-09-14 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
CN104476016A (zh) * 2014-11-05 2015-04-01 苏州赛普特电子科技有限公司 一种半导体用无铅无卤焊锡膏
JP5790862B1 (ja) * 2014-12-25 2015-10-07 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ
KR20170098233A (ko) * 2014-12-26 2017-08-29 유니버시티 오브 리머릭 땜납용 플럭스, 땜납 페이스트 및 땜납용 플럭스의 제조 방법
CN104942481B (zh) * 2015-07-13 2017-04-12 中国林业科学研究院林产化学工业研究所 一种电子焊接用松香衍生物的制备方法
JP6191896B2 (ja) * 2015-08-10 2017-09-06 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト
KR101962107B1 (ko) 2017-08-07 2019-03-28 한국생산기술연구원 나노복합솔더의 제조방법
JP6826059B2 (ja) * 2018-01-31 2021-02-03 株式会社タムラ製作所 フラックス組成物、はんだ組成物および電子基板
CN111015010B (zh) * 2019-12-27 2021-12-07 苏州优诺电子材料科技有限公司 一种性能稳定的焊锡膏及其制备方法
US20230060880A1 (en) * 2021-08-24 2023-03-02 Robert Bosch Gmbh Flattening surface of pasted track in stencil printing process

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GB1550648A (en) * 1976-06-11 1979-08-15 Multicore Solders Ltd Soft soldering
JPS56141997A (en) * 1980-03-17 1981-11-05 Multicore Solders Ltd Solder material for forming solder bath
CN85102604B (zh) * 1985-04-06 1988-08-24 福建师范大学 树脂型软钎焊助焊剂
JP3189133B2 (ja) * 1992-07-03 2001-07-16 ニホンハンダ株式会社 クリームはんだ
JP3345138B2 (ja) * 1992-12-28 2002-11-18 株式会社豊田中央研究所 はんだ付け用フラックス
JP3513513B2 (ja) * 1993-12-27 2004-03-31 トヨタ自動車株式会社 クリームはんだ用フラックス
JP3787857B2 (ja) * 1995-03-10 2006-06-21 タムラ化研株式会社 回路基板はんだ付け用フラックス及び回路基板
JPH10230389A (ja) * 1997-02-20 1998-09-02 Taiho Kogyo Co Ltd クリームはんだ用フラックス組成物及びクリームはんだ
JP2002120090A (ja) * 2000-10-17 2002-04-23 Topy Ind Ltd クリームはんだ
TWI228132B (en) * 2001-09-26 2005-02-21 Nof Corp Soldering flux composition and solder paste
JP2003264367A (ja) * 2002-03-11 2003-09-19 Tamura Kaken Co Ltd リフローはんだ付用ソルダーペースト組成物及び回路基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498184B (zh) * 2008-01-31 2015-09-01 Arakawa Chem Ind 助焊劑及膏狀焊劑
TWI465427B (zh) * 2009-01-27 2014-12-21 Arakawa Chem Ind 不含鉛之銲錫用助銲劑組成物、不含鉛之銲錫組成物及含松香銲錫
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏

Also Published As

Publication number Publication date
KR20070118587A (ko) 2007-12-17
JP5012028B2 (ja) 2012-08-29
US20080115861A1 (en) 2008-05-22
CN101090797B (zh) 2013-03-27
CN101090797A (zh) 2007-12-19
JPWO2006070797A1 (ja) 2008-06-12
TWI355981B (zh) 2012-01-11
EP1834728A1 (en) 2007-09-19
EP1834728A4 (en) 2009-11-04
WO2006070797A1 (ja) 2006-07-06
KR101125383B1 (ko) 2012-03-27

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