TW200632566A - Exposure method and exposure equipment - Google Patents

Exposure method and exposure equipment

Info

Publication number
TW200632566A
TW200632566A TW094132861A TW94132861A TW200632566A TW 200632566 A TW200632566 A TW 200632566A TW 094132861 A TW094132861 A TW 094132861A TW 94132861 A TW94132861 A TW 94132861A TW 200632566 A TW200632566 A TW 200632566A
Authority
TW
Taiwan
Prior art keywords
exposure
substrate
area
liquid
exposing
Prior art date
Application number
TW094132861A
Other languages
English (en)
Chinese (zh)
Other versions
TWI317053B (enExample
Inventor
Kazuya Fukuhara
Shinichi Ito
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200632566A publication Critical patent/TW200632566A/zh
Application granted granted Critical
Publication of TWI317053B publication Critical patent/TWI317053B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW094132861A 2004-10-15 2005-09-22 Exposure method and exposure equipment TW200632566A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004301748A JP4625673B2 (ja) 2004-10-15 2004-10-15 露光方法及び露光装置

Publications (2)

Publication Number Publication Date
TW200632566A true TW200632566A (en) 2006-09-16
TWI317053B TWI317053B (enExample) 2009-11-11

Family

ID=36180370

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132861A TW200632566A (en) 2004-10-15 2005-09-22 Exposure method and exposure equipment

Country Status (3)

Country Link
US (1) US7446853B2 (enExample)
JP (1) JP4625673B2 (enExample)
TW (1) TW200632566A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE467902T1 (de) * 2004-01-05 2010-05-15 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
US7501227B2 (en) * 2005-08-31 2009-03-10 Taiwan Semiconductor Manufacturing Company System and method for photolithography in semiconductor manufacturing
JP2007194484A (ja) * 2006-01-20 2007-08-02 Toshiba Corp 液浸露光方法
US7666576B2 (en) * 2006-06-07 2010-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure scan and step direction optimization
US20080050680A1 (en) * 2006-08-24 2008-02-28 Stefan Brandl Lithography systems and methods
JP4316595B2 (ja) * 2006-09-13 2009-08-19 株式会社東芝 液浸補助板の洗浄方法と液浸露光方法及びパターン形成方法
US8330936B2 (en) * 2006-09-20 2012-12-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4357514B2 (ja) * 2006-09-29 2009-11-04 株式会社東芝 液浸露光方法
JP2008227007A (ja) * 2007-03-09 2008-09-25 Toshiba Corp 液浸露光方法及び液浸露光装置
DE102007025340B4 (de) * 2007-05-31 2019-12-05 Globalfoundries Inc. Immersionslithograpieprozess unter Anwendung einer variablen Abtastgeschwindigkeit und Lithographiesystem
JP2009194247A (ja) * 2008-02-15 2009-08-27 Canon Inc 露光装置
US20090305171A1 (en) * 2008-06-10 2009-12-10 Nikon Corporation Apparatus for scanning sites on a wafer along a short dimension of the sites
US20090310115A1 (en) * 2008-06-12 2009-12-17 Nikon Corporation Apparatus and method for exposing adjacent sites on a substrate
NL2002983A1 (nl) 2008-06-26 2009-12-29 Asml Netherlands Bv A lithographic apparatus and a method of operating the lithographic apparatus.
EP2151717A1 (en) * 2008-08-05 2010-02-10 ASML Holding N.V. Full wafer width scanning using step and scan system
US8610878B2 (en) * 2010-03-04 2013-12-17 Asml Netherlands B.V. Lithographic apparatus and method
KR20120100628A (ko) * 2011-03-04 2012-09-12 삼성정밀화학 주식회사 전방향족 액정 폴리에스테르 수지의 제조방법과 그 방법에 의해 제조된 수지, 및 상기 수지를 포함하는 컴파운드
JP5986538B2 (ja) * 2013-06-10 2016-09-06 キヤノン株式会社 露光装置および物品の製造方法
JP2016154241A (ja) * 2013-07-02 2016-08-25 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
JP5960198B2 (ja) 2013-07-02 2016-08-02 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
US9760027B2 (en) * 2013-10-17 2017-09-12 United Microelectronics Corp. Scanner routing method for particle removal

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2747999A (en) * 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000021702A (ja) * 1998-06-30 2000-01-21 Canon Inc 露光装置ならびにデバイス製造方法
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
CN101713932B (zh) * 2002-11-12 2012-09-26 Asml荷兰有限公司 光刻装置和器件制造方法
CN101382738B (zh) * 2002-11-12 2011-01-12 Asml荷兰有限公司 光刻投射装置
TWI232357B (en) * 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2005072132A (ja) 2003-08-21 2005-03-17 Nikon Corp 露光装置及びデバイス製造方法
JPWO2005106930A1 (ja) * 2004-04-27 2008-03-21 株式会社ニコン 露光方法、露光装置及びデバイス製造方法

Also Published As

Publication number Publication date
TWI317053B (enExample) 2009-11-11
JP2006114765A (ja) 2006-04-27
US20060082747A1 (en) 2006-04-20
US7446853B2 (en) 2008-11-04
JP4625673B2 (ja) 2011-02-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees