TW200631990A - Novel polyimide film improved in adhesiveness - Google Patents

Novel polyimide film improved in adhesiveness

Info

Publication number
TW200631990A
TW200631990A TW095101734A TW95101734A TW200631990A TW 200631990 A TW200631990 A TW 200631990A TW 095101734 A TW095101734 A TW 095101734A TW 95101734 A TW95101734 A TW 95101734A TW 200631990 A TW200631990 A TW 200631990A
Authority
TW
Taiwan
Prior art keywords
polyimide film
adhesiveness
thermoplastic polyimide
novel polyimide
film improved
Prior art date
Application number
TW095101734A
Other languages
English (en)
Other versions
TWI392699B (zh
Inventor
Takashi Kikuchi
Hisayasu Kaneshiro
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200631990A publication Critical patent/TW200631990A/zh
Application granted granted Critical
Publication of TWI392699B publication Critical patent/TWI392699B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
TW95101734A 2005-01-18 2006-01-17 接著性經改良之新穎聚醯亞胺膜 TWI392699B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005010961 2005-01-18

Publications (2)

Publication Number Publication Date
TW200631990A true TW200631990A (en) 2006-09-16
TWI392699B TWI392699B (zh) 2013-04-11

Family

ID=36692170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95101734A TWI392699B (zh) 2005-01-18 2006-01-17 接著性經改良之新穎聚醯亞胺膜

Country Status (6)

Country Link
US (2) US20080097073A1 (zh)
JP (1) JP5185535B2 (zh)
KR (1) KR101244589B1 (zh)
CN (1) CN101098909B (zh)
TW (1) TWI392699B (zh)
WO (1) WO2006077780A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007015583A1 (de) * 2007-03-29 2008-10-02 Albert-Ludwigs-Universität Freiburg Ein Enzym zur Herstellung von Methylmalonyl-Coenzym A oder Ethylmalonyl-Coenzym A sowie dessen Verwendung
JP7143596B2 (ja) 2017-03-13 2022-09-29 東ソー株式会社 核酸抽出および増幅試薬
KR102141893B1 (ko) * 2018-04-05 2020-08-07 피아이첨단소재 주식회사 연성금속박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성금속박적층판
KR102202484B1 (ko) * 2019-04-23 2021-01-13 피아이첨단소재 주식회사 폴리이미드 필름, 이를 포함하는 연성금속박적층판 및 폴리이미드 필름의 제조방법
CN111430642B (zh) * 2020-05-08 2022-06-10 乌海瑞森新能源材料有限公司 一种改性聚酰亚胺锂离子电池隔膜的制备方法
CN112778563A (zh) * 2021-01-25 2021-05-11 深圳和力纳米科技有限公司 聚酰亚胺薄膜及其制备方法
CN113604043B (zh) * 2021-05-11 2023-12-12 中山新高电子材料股份有限公司 一种具有低吸湿和高粘结性的聚酰亚胺薄膜及其制备方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60203638A (ja) * 1984-03-29 1985-10-15 Nitto Electric Ind Co Ltd ポリイミドフイルム
US4839232A (en) * 1985-10-31 1989-06-13 Mitsui Toatsu Chemicals, Incorporated Flexible laminate printed-circuit board and methods of making same
JPS62161831A (ja) * 1986-01-10 1987-07-17 Toray Ind Inc ポリイミドブロツク共重合体の製造方法
JP2847701B2 (ja) * 1986-11-29 1999-01-20 鐘淵化学工業株式会社 熱的寸法安定性にすぐれたポリアミド酸及びそれからなるポリイミドの製造方法
US5094919A (en) * 1988-06-30 1992-03-10 Nippon Steel Chemical Co., Ltd. Polyimide copolymers and process for preparing the same
US5202411A (en) * 1990-04-06 1993-04-13 W. R. Grace & Co.-Conn. Tri-component polyimide composition and preparation thereof
US5196500A (en) * 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
JP3022625B2 (ja) * 1991-05-10 2000-03-21 鐘淵化学工業株式会社 ポリアミック酸共重合体、それからなるポリイミド共重合体、及びポリイミドフィルム、並びにそれらの製造方法
JP2831867B2 (ja) * 1991-08-28 1998-12-02 鐘淵化学工業株式会社 ポリアミック酸共重合体、それからなるポリイミド共重合体、ポリイミドフィルム、並びにそれらの製造方法
JP3048702B2 (ja) * 1991-09-13 2000-06-05 鐘淵化学工業株式会社 ポリアミック酸共重合体、ポリイミド共重合体、ポリイミドフィルム及びそれらの製造方法
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
US5502143A (en) * 1992-12-25 1996-03-26 Pi Material Research Laboratory Process for preparing polyimide resins
US5412066A (en) * 1994-03-03 1995-05-02 Ther United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Phenylethynyl terminated imide oligomers
US5691876A (en) * 1995-01-31 1997-11-25 Applied Materials, Inc. High temperature polyimide electrostatic chuck
US5906886A (en) * 1996-05-31 1999-05-25 Ube Industries, Ltd. Aromatic polyimide article having amorphous layer
JP3982895B2 (ja) * 1997-04-09 2007-09-26 三井化学株式会社 金属ベース半導体回路基板
US6129982A (en) * 1997-11-28 2000-10-10 Ube Industries, Ltd. Aromatic polyimide film having improved adhesion
US6350844B1 (en) * 1998-11-05 2002-02-26 Kaneka Corporation Polyimide film and electric/electronic equipment bases with the use thereof
JP3287348B2 (ja) * 1999-12-17 2002-06-04 ソニーケミカル株式会社 ポリアミック酸ワニス組成物及びフレキシブルプリント基板
WO2001057112A1 (fr) * 2000-02-01 2001-08-09 Nippon Steel Chemical Co., Ltd. Resine polyimide adhesive et stratifie adhesif
TWI295966B (zh) * 2000-10-27 2008-04-21 Kaneka Corp
JP2002180044A (ja) * 2000-12-07 2002-06-26 Toray Eng Co Ltd 熱可塑性ポリイミド樹脂用エッチング液
TWI300744B (zh) * 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JPWO2003097725A1 (ja) * 2002-05-21 2005-09-15 株式会社カネカ ポリイミドフィルムおよびその製造方法、並びにポリイミドフィルムを用いたポリイミド／金属積層体
US7267883B2 (en) * 2002-09-25 2007-09-11 Kaneka Corporation Polyimide film and laminate having metal layer and same
JPWO2004050352A1 (ja) * 2002-12-05 2006-03-30 株式会社カネカ 積層体、プリント配線板およびそれらの製造方法
TWI377224B (en) * 2004-07-27 2012-11-21 Kaneka Corp Polyimide film having high adhesiveness and production method therefor
US20070292701A1 (en) * 2004-09-24 2007-12-20 Takashi Kikuchi Novel Polyimide Film Improved in Adhesion
CN101027341B (zh) * 2004-09-24 2012-06-06 株式会社钟化 具有高粘接性的聚酰亚胺薄膜的制造方法
KR101045149B1 (ko) * 2005-08-04 2011-06-30 가부시키가이샤 가네카 금속 피복 폴리이미드 필름

Also Published As

Publication number Publication date
TWI392699B (zh) 2013-04-11
KR101244589B1 (ko) 2013-03-25
WO2006077780A1 (ja) 2006-07-27
US20100003531A1 (en) 2010-01-07
CN101098909A (zh) 2008-01-02
CN101098909B (zh) 2010-07-28
JPWO2006077780A1 (ja) 2008-06-19
KR20070094810A (ko) 2007-09-21
US20080097073A1 (en) 2008-04-24
JP5185535B2 (ja) 2013-04-17

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