TW200631070A - Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method - Google Patents

Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method

Info

Publication number
TW200631070A
TW200631070A TW095101920A TW95101920A TW200631070A TW 200631070 A TW200631070 A TW 200631070A TW 095101920 A TW095101920 A TW 095101920A TW 95101920 A TW95101920 A TW 95101920A TW 200631070 A TW200631070 A TW 200631070A
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
executing
storage medium
medium storing
Prior art date
Application number
TW095101920A
Other languages
English (en)
Other versions
TWI421905B (zh
Inventor
Akira Obi
Hiroshi Nakamura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200631070A publication Critical patent/TW200631070A/zh
Application granted granted Critical
Publication of TWI421905B publication Critical patent/TWI421905B/zh

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Drying Of Semiconductors (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Automation & Control Theory (AREA)
TW095101920A 2005-01-19 2006-01-18 基板處理裝置的檢查方法及收容為執行方法之檢查程式的記憶媒體 TWI421905B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005011951A JP5192122B2 (ja) 2005-01-19 2005-01-19 基板処理装置の検査方法及び検査プログラム

Publications (2)

Publication Number Publication Date
TW200631070A true TW200631070A (en) 2006-09-01
TWI421905B TWI421905B (zh) 2014-01-01

Family

ID=36844595

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101920A TWI421905B (zh) 2005-01-19 2006-01-18 基板處理裝置的檢查方法及收容為執行方法之檢查程式的記憶媒體

Country Status (4)

Country Link
JP (1) JP5192122B2 (zh)
KR (1) KR100755535B1 (zh)
CN (1) CN100474185C (zh)
TW (1) TWI421905B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306137A (ja) * 2007-06-11 2008-12-18 Hitachi Kokusai Electric Inc 基板処理装置
US9514355B2 (en) 2009-01-05 2016-12-06 Apple Inc. Organizing images by correlating faces
JP5965680B2 (ja) * 2012-03-08 2016-08-10 東京エレクトロン株式会社 処理室内部品の冷却方法、処理室内部品冷却プログラム、及び記憶媒体
KR102128722B1 (ko) * 2012-08-21 2020-07-02 세메스 주식회사 기판 처리 장치의 검사 방법
JP6148991B2 (ja) * 2014-01-31 2017-06-14 東京エレクトロン株式会社 基板処理装置、編集方法及び記憶媒体
JP6446334B2 (ja) * 2015-06-12 2018-12-26 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理装置の制御方法及び記憶媒体
JP6907508B2 (ja) * 2016-11-10 2021-07-21 オムロン株式会社 検査システム、検査装置の制御方法及びプログラム
JP7126466B2 (ja) * 2018-12-12 2022-08-26 東京エレクトロン株式会社 基板処理システム、搬送方法、および搬送プログラム
CN112364606B (zh) * 2019-07-25 2024-03-12 上海微电子装备（集团）股份有限公司 一种测量处方的加载方法及其装置、测量设备
JP7399012B2 (ja) * 2020-03-30 2023-12-15 東京エレクトロン株式会社 基板処理システム、基板処理方法、および制御装置
WO2021240572A1 (ja) * 2020-05-25 2021-12-02 株式会社日立ハイテク 半導体装置製造システムおよび半導体装置製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618938A (en) * 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection
JP3017766B2 (ja) * 1990-01-12 2000-03-13 株式会社東芝 ガス処理装置
JP3298785B2 (ja) * 1996-03-25 2002-07-08 三菱電機株式会社 半導体製造装置および発塵評価方法
JP3862322B2 (ja) * 1996-07-25 2006-12-27 株式会社ルネサステクノロジ 半導体装置の製造システムおよびそれを用いた半導体装置の製造方法
KR19980066026A (ko) * 1997-01-17 1998-10-15 김광호 반도체 제조용 케미컬 공급장치, 그리고 이에 적용되는 케미컬과 그의 수용용기 관리 방법 및 컴퓨터를 이용한 포토레지스트와 그에 연관된 데이터 관리방법
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
JP3319993B2 (ja) * 1997-09-10 2002-09-03 東京エレクトロン株式会社 被処理体のデッドロック判定方法、被処理体のデッドロック回避方法及び処理装置
KR100315912B1 (ko) * 1998-04-27 2002-02-19 윤종용 파일서버를이용한자동화시스템과그제어방법
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法
KR100793453B1 (ko) * 2000-07-07 2008-01-14 동경 엘렉트론 주식회사 처리 장치의 유지 보수 방법, 처리 장치의 자동 검사방법, 처리 장치의 자동 복귀 방법 및 처리 장치를구동하는 소프트웨어의 자기 진단 방법
JP4781505B2 (ja) * 2000-07-07 2011-09-28 東京エレクトロン株式会社 処理装置の自動検査方法および自動復帰方法
JP3660896B2 (ja) * 2001-07-26 2005-06-15 株式会社日立製作所 プラズマ処理装置のメンテナンス方法
JP4365109B2 (ja) * 2003-01-29 2009-11-18 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP3944113B2 (ja) * 2003-05-09 2007-07-11 キヤノン株式会社 試験装置及びその制御方法、並びにプログラム及び記憶媒体

Also Published As

Publication number Publication date
JP2006202912A (ja) 2006-08-03
CN1811622A (zh) 2006-08-02
KR100755535B1 (ko) 2007-09-06
CN100474185C (zh) 2009-04-01
KR20060084388A (ko) 2006-07-24
JP5192122B2 (ja) 2013-05-08
TWI421905B (zh) 2014-01-01

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