TW200943447A - Wafer testing apparatus and processing equipment having the same - Google Patents
Wafer testing apparatus and processing equipment having the sameInfo
- Publication number
- TW200943447A TW200943447A TW097119396A TW97119396A TW200943447A TW 200943447 A TW200943447 A TW 200943447A TW 097119396 A TW097119396 A TW 097119396A TW 97119396 A TW97119396 A TW 97119396A TW 200943447 A TW200943447 A TW 200943447A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- testing apparatus
- processing equipment
- crack
- wafer testing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention provides a wafer testing apparatus. The wafer testing apparatus includes a wafer transferring part which transfers a wafer along a transfer path, and is placed near an edge of the wafer to be transferred, inspects whether a crack or a particle exists in the edge of the wafer, and distinguishes between the crack and the particle. There is provided an inspector for taking out the wafer to another transfer path if there exists the crack or the particle. Further, the present invention provides processing equipment having the wafer testing apparatus, which can inspect qualities of a wafer to be introduced into a series of processes and determine whether to introduce or take out the wafer into or from a processing chamber or the next series of processes according to results from inspecting the qualities.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080032868 | 2008-04-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200943447A true TW200943447A (en) | 2009-10-16 |
TWI388021B TWI388021B (en) | 2013-03-01 |
Family
ID=41162024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097119396A TWI388021B (en) | 2008-04-08 | 2008-05-26 | Wafer testing apparatus and processing equipment having the same |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101060712B1 (en) |
CN (1) | CN101990706A (en) |
TW (1) | TWI388021B (en) |
WO (1) | WO2009125896A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009050711A1 (en) | 2009-10-26 | 2011-05-05 | Schott Ag | Method and device for detecting cracks in semiconductor substrates |
KR102044788B1 (en) * | 2012-10-30 | 2019-11-18 | 삼성디스플레이 주식회사 | Inspection Apparatus for Glass substrate |
KR101514031B1 (en) * | 2014-04-28 | 2015-04-22 | 이성수 | Shield Box |
WO2015168282A1 (en) | 2014-04-29 | 2015-11-05 | Pleotint, L.L.C. | Absorbing solar control interlayers |
CN103972126A (en) * | 2014-05-21 | 2014-08-06 | 上海华力微电子有限公司 | Method for preventing silicon wafers from being broken |
WO2016162406A1 (en) * | 2015-04-07 | 2016-10-13 | Albert-Ludwigs-Universität Freiburg | Device for detecting electronic defects in the edge region of silicon-based semiconductors |
KR101990639B1 (en) * | 2017-11-08 | 2019-06-18 | 주식회사 테스 | Substrate inspection method and Substrate processing apparatus |
WO2020174990A1 (en) * | 2019-02-28 | 2020-09-03 | 吉野石膏株式会社 | Inspection device for plate-like body |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020046829A (en) * | 2000-12-15 | 2002-06-21 | 윤종용 | Apparatus for inspecting wafer |
KR100445457B1 (en) * | 2002-02-25 | 2004-08-21 | 삼성전자주식회사 | Apparatus and method for inspecting wafer backside |
KR100596048B1 (en) * | 2002-07-08 | 2006-07-03 | 삼성코닝정밀유리 주식회사 | System for inspecting edge of glass substrate |
JP4298238B2 (en) * | 2002-08-27 | 2009-07-15 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing system |
US7366344B2 (en) | 2003-07-14 | 2008-04-29 | Rudolph Technologies, Inc. | Edge normal process |
US7968859B2 (en) | 2003-07-28 | 2011-06-28 | Lsi Corporation | Wafer edge defect inspection using captured image analysis |
-
2008
- 2008-05-19 WO PCT/KR2008/002795 patent/WO2009125896A1/en active Application Filing
- 2008-05-19 CN CN2008801285260A patent/CN101990706A/en active Pending
- 2008-05-26 TW TW097119396A patent/TWI388021B/en not_active IP Right Cessation
- 2008-11-21 KR KR1020080116286A patent/KR101060712B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20090107400A (en) | 2009-10-13 |
KR101060712B1 (en) | 2011-08-30 |
CN101990706A (en) | 2011-03-23 |
TWI388021B (en) | 2013-03-01 |
WO2009125896A1 (en) | 2009-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |