TW200629393A - Substrate treating device - Google Patents

Substrate treating device

Info

Publication number
TW200629393A
TW200629393A TW094134445A TW94134445A TW200629393A TW 200629393 A TW200629393 A TW 200629393A TW 094134445 A TW094134445 A TW 094134445A TW 94134445 A TW94134445 A TW 94134445A TW 200629393 A TW200629393 A TW 200629393A
Authority
TW
Taiwan
Prior art keywords
supply nozzle
treating
nozzle pipes
treating bath
bath
Prior art date
Application number
TW094134445A
Other languages
English (en)
Inventor
Hiroshi Kizawa
Takahiro Koga
Katsuyoshi Nakatsukasa
Kazuhisa Ogasawara
Hiroshi Yamaguchi
Original Assignee
Ses Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ses Co Ltd filed Critical Ses Co Ltd
Publication of TW200629393A publication Critical patent/TW200629393A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
TW094134445A 2004-10-07 2005-10-03 Substrate treating device TW200629393A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004295337A JP2006108512A (ja) 2004-10-07 2004-10-07 基板処理装置

Publications (1)

Publication Number Publication Date
TW200629393A true TW200629393A (en) 2006-08-16

Family

ID=36142429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134445A TW200629393A (en) 2004-10-07 2005-10-03 Substrate treating device

Country Status (6)

Country Link
US (1) US20080105286A1 (zh)
JP (1) JP2006108512A (zh)
KR (1) KR20070102475A (zh)
CN (1) CN101061574A (zh)
TW (1) TW200629393A (zh)
WO (1) WO2006038341A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4705517B2 (ja) 2006-05-19 2011-06-22 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
JP5259952B2 (ja) * 2006-12-26 2013-08-07 東京エレクトロン株式会社 基板処理装置
US7775219B2 (en) 2006-12-29 2010-08-17 Applied Materials, Inc. Process chamber lid and controlled exhaust
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
JP4859703B2 (ja) * 2007-02-22 2012-01-25 大日本スクリーン製造株式会社 基板処理装置
DE102007040851A1 (de) * 2007-08-29 2009-03-05 Wacker Chemie Ag Verfahren zum Reinigen von polykristallinem Silicium
JP4838904B1 (ja) * 2011-02-21 2011-12-14 島田化成株式会社 ワーク洗浄方法及びそのシステム
JP5802098B2 (ja) * 2011-09-29 2015-10-28 島田化成株式会社 ワーク洗浄方法及びそのシステム並びにその洗浄装置
US10522444B2 (en) 2013-03-11 2019-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Surface treatment method and apparatus for semiconductor packaging
JP6455319B2 (ja) * 2015-05-29 2019-01-23 株式会社Sumco 半導体ウェーハのエッチング装置及び半導体ウェーハのエッチング方法
JP6231249B2 (ja) * 2015-06-15 2017-11-15 株式会社ジェイ・イー・ティ 基板処理装置
CN106128983A (zh) * 2016-08-30 2016-11-16 上海华力微电子有限公司 一种提高清洗效率的湿法清洗水槽及其清洗方法
CN109318114A (zh) * 2017-07-31 2019-02-12 上海新昇半导体科技有限公司 一种半导体晶圆的最终抛光机以及最终抛光及清洗方法
JP6985957B2 (ja) 2018-02-21 2021-12-22 キオクシア株式会社 半導体処理装置
JP2019220560A (ja) * 2018-06-19 2019-12-26 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
CN109273383B (zh) * 2018-08-28 2021-04-13 长江存储科技有限责任公司 化学液槽装置
CN108906351B (zh) * 2018-08-28 2021-05-18 长江存储科技有限责任公司 喷嘴和化学液槽装置
CN110888305A (zh) * 2018-09-07 2020-03-17 王彦智 高阶负型光阻剥膜槽
CN110571137A (zh) * 2019-09-27 2019-12-13 西安奕斯伟硅片技术有限公司 一种晶圆的处理方法和处理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162800A (ja) * 1985-01-11 1986-07-23 日立造船株式会社 汚染物の水中洗浄装置
JPH0833876A (ja) * 1990-03-14 1996-02-06 Seiko Epson Corp 液中ジェット洗浄方法及び洗浄装置
US6767840B1 (en) * 1997-02-21 2004-07-27 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
TW504041U (en) * 1997-02-21 2002-09-21 Canon Kk Wafer processing apparatus
US6098643A (en) * 1998-11-14 2000-08-08 Miranda; Henry R. Bath system for semiconductor wafers with obliquely mounted transducers
JP3748016B2 (ja) * 1999-08-30 2006-02-22 大日本スクリーン製造株式会社 基板処理装置
US6896997B2 (en) * 1999-11-19 2005-05-24 Oki Electric Industry Co., Ltd. Method for forming resist pattern
TW434668B (en) * 2000-01-27 2001-05-16 Ind Tech Res Inst Wafer rinse apparatus and rinse method of the same
JP3851486B2 (ja) * 2000-03-27 2006-11-29 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2006108512A (ja) 2006-04-20
WO2006038341A1 (ja) 2006-04-13
US20080105286A1 (en) 2008-05-08
KR20070102475A (ko) 2007-10-18
CN101061574A (zh) 2007-10-24

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