TW200627618A - Analogue measurement of alignment between layers of a semiconductor device - Google Patents

Analogue measurement of alignment between layers of a semiconductor device

Info

Publication number
TW200627618A
TW200627618A TW094132535A TW94132535A TW200627618A TW 200627618 A TW200627618 A TW 200627618A TW 094132535 A TW094132535 A TW 094132535A TW 94132535 A TW94132535 A TW 94132535A TW 200627618 A TW200627618 A TW 200627618A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
layers
meander
alignment
analogue measurement
Prior art date
Application number
TW094132535A
Other languages
English (en)
Inventor
Vires Dirk Kenneth De
De Goor Albert Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200627618A publication Critical patent/TW200627618A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW094132535A 2004-09-23 2005-09-20 Analogue measurement of alignment between layers of a semiconductor device TW200627618A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04300618 2004-09-23

Publications (1)

Publication Number Publication Date
TW200627618A true TW200627618A (en) 2006-08-01

Family

ID=35501596

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132535A TW200627618A (en) 2004-09-23 2005-09-20 Analogue measurement of alignment between layers of a semiconductor device

Country Status (6)

Country Link
US (1) US7688083B2 (zh)
EP (1) EP1794794A1 (zh)
JP (1) JP2008514024A (zh)
CN (1) CN100505237C (zh)
TW (1) TW200627618A (zh)
WO (1) WO2006033073A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8264235B2 (en) * 2006-10-30 2012-09-11 Nxp B.V. Test structure for detection of defect devices with lowered resistance
US9029172B2 (en) 2012-01-20 2015-05-12 International Business Machines Corporation On-chip poly-to-contact process monitoring and reliability evaluation system and method of use
US8502544B1 (en) * 2012-05-14 2013-08-06 Taiwan Mask Corporation Method for testing mask articles
US8957694B2 (en) * 2012-05-22 2015-02-17 Broadcom Corporation Wafer level package resistance monitor scheme
CN108333500A (zh) * 2013-10-12 2018-07-27 深圳市爱德特科技有限公司 一种基于ddr的测试装置
US9786568B2 (en) * 2016-02-19 2017-10-10 Infineon Technologies Ag Method of manufacturing an integrated circuit substrate
US10269635B2 (en) 2016-02-19 2019-04-23 Infineon Technologies Ag Integrated circuit substrate and method for manufacturing the same
US10580753B2 (en) 2017-07-21 2020-03-03 Infineon Technologies Ag Method for manufacturing semiconductor devices
CN117116915B (zh) * 2023-10-25 2024-01-19 合肥晶合集成电路股份有限公司 半导体结构及其制备方法、方块电阻的测量方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386459A (en) * 1980-07-11 1983-06-07 Bell Telephone Laboratories, Incorporated Electrical measurement of level-to-level misalignment in integrated circuits
JPS62203340A (ja) * 1986-03-04 1987-09-08 Oki Electric Ind Co Ltd フオトリソグラフイの精度測定パタ−ン
US4835466A (en) * 1987-02-06 1989-05-30 Fairchild Semiconductor Corporation Apparatus and method for detecting spot defects in integrated circuits
JP3149940B2 (ja) * 1989-05-26 2001-03-26 フェアチャイルド・セミコンダクター・コーポレーション 集積回路における垂直方向に伝搬した欠陥を検知する装置及び方法
JPH04216647A (ja) * 1990-12-17 1992-08-06 Fujitsu Ltd 位置ずれ測定方法
JPH0927529A (ja) * 1995-07-12 1997-01-28 Sony Corp 位置合わせ検出用半導体装置
JP3552077B2 (ja) * 1996-07-26 2004-08-11 ソニー株式会社 合わせずれ測定方法及び合わせずれ測定パターン
US5898228A (en) * 1997-10-03 1999-04-27 Lsi Logic Corporation On-chip misalignment indication
JP3363082B2 (ja) * 1997-12-05 2003-01-07 株式会社東芝 パターンの合わせずれの電気的測定方法
US6684520B1 (en) * 2000-02-25 2004-02-03 Xilinx, Inc. Mask-alignment detection circuit in x and y directions
US6383827B1 (en) * 2000-04-17 2002-05-07 Advanced Micro Devices, Inc. Electrical alignment test structure using local interconnect ladder resistor
CN1723419A (zh) * 2002-12-13 2006-01-18 皇家飞利浦电子股份有限公司 用于电测量缝合掩膜的单向未对准的电阻结构

Also Published As

Publication number Publication date
JP2008514024A (ja) 2008-05-01
US20090009196A1 (en) 2009-01-08
EP1794794A1 (en) 2007-06-13
CN101061581A (zh) 2007-10-24
WO2006033073A1 (en) 2006-03-30
CN100505237C (zh) 2009-06-24
US7688083B2 (en) 2010-03-30

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