TW200619312A - Curable high refractive index resins for optoelectronic applications - Google Patents

Curable high refractive index resins for optoelectronic applications

Info

Publication number
TW200619312A
TW200619312A TW094133712A TW94133712A TW200619312A TW 200619312 A TW200619312 A TW 200619312A TW 094133712 A TW094133712 A TW 094133712A TW 94133712 A TW94133712 A TW 94133712A TW 200619312 A TW200619312 A TW 200619312A
Authority
TW
Taiwan
Prior art keywords
refractive index
high refractive
compositions
vinyl ethers
include aromatic
Prior art date
Application number
TW094133712A
Other languages
English (en)
Inventor
Ramil-Marcelo L Mercado
Robert V Morford
Curtis Planje
Willie Perez
Tony D Flaim
Taylor R Bass
Original Assignee
Brewer Science Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brewer Science Inc filed Critical Brewer Science Inc
Publication of TW200619312A publication Critical patent/TW200619312A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • C08G59/245Di-epoxy compounds carbocyclic aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04Epoxynovolacs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08Epoxidised polymerised polyenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10Epoxy resins modified by unsaturated compounds
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/879Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW094133712A 2004-09-28 2005-09-28 Curable high refractive index resins for optoelectronic applications TW200619312A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61401704P 2004-09-28 2004-09-28
US11/235,619 US20060068207A1 (en) 2004-09-28 2005-09-26 Curable high refractive index resins for optoelectronic applications

Publications (1)

Publication Number Publication Date
TW200619312A true TW200619312A (en) 2006-06-16

Family

ID=37570879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133712A TW200619312A (en) 2004-09-28 2005-09-28 Curable high refractive index resins for optoelectronic applications

Country Status (7)

Country Link
US (2) US20060068207A1 (zh)
EP (1) EP1815273A2 (zh)
JP (1) JP2008514764A (zh)
KR (1) KR20070072939A (zh)
CN (1) CN101142499A (zh)
TW (1) TW200619312A (zh)
WO (1) WO2006137884A2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8809413B2 (en) 2011-06-29 2014-08-19 Chau Ha Ultraviolet radiation-curable high refractive index optically clear resins
CN112233970B (zh) * 2020-12-15 2021-03-23 度亘激光技术(苏州)有限公司 砷化镓基半导体器件的制造方法

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4710557A (en) * 1985-02-01 1987-12-01 Eastman Kodak Company Polymers of thiophenyl thioacrylate and thiomethacrylate monomers
US5230906A (en) * 1986-11-24 1993-07-27 Polytex Plastic Sa Method of and apparatus for manufacturing fiber-reinforced plastics articles
US5886101A (en) * 1988-03-02 1999-03-23 E. I. Du Pont De Nemours And Company Solvent dispersible interpenetrating polymer networks
US5214116A (en) * 1989-02-07 1993-05-25 Tokuyama Soda Kabushiki Kaisha Resin derived from sulfur-containing unsaturated compound and having a high refractive index
US5132430A (en) * 1991-06-26 1992-07-21 Polaroid Corporation High refractive index polymers
WO1994014866A1 (en) * 1992-12-21 1994-07-07 Alliedsignal, Inc. Solvent free epoxy resin compositions
JPH06273631A (ja) * 1993-03-18 1994-09-30 Nippon Telegr & Teleph Corp <Ntt> 光導波路
US5789039A (en) * 1994-09-06 1998-08-04 Herberts Powder Coatings, Inc. Radiation curing of powder coatings on heat sensitive substrates: chemical compositions and processes for obtaining coated workpieces
US5855983A (en) * 1995-02-03 1999-01-05 Minnesota Mining And Manufacturing Company Flame retardant ultraviolet cured multi-layered film
JP2917884B2 (ja) * 1995-12-19 1999-07-12 東洋製罐株式会社 水性塗料
DE69714106T2 (de) * 1996-03-13 2003-01-23 Ibiden Co Ltd Resistzusammenzetzungen zum Metallabscheiden
US6521714B2 (en) * 1996-09-26 2003-02-18 Albemarle Corporation Brominated polystyrenic resins
JPH11199651A (ja) * 1998-01-12 1999-07-27 Sumitomo Bakelite Co Ltd デバイス中空パッケージ封止用紫外線硬化型接着剤樹脂組成物
US6204311B1 (en) * 1998-03-13 2001-03-20 Mitsui Chemicals, Inc. Polymerizable composition
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
US6037096A (en) * 1998-05-26 2000-03-14 International Business Machines Corporation Film composition and method for a planar surface atop a plated through hole
US6320020B1 (en) * 1998-09-08 2001-11-20 Mitsui Chemicals, Inc. Sulfur-containing (thio)ether (co)polymer and a use thereof
US6583196B2 (en) * 1999-04-23 2003-06-24 Rodenstock North America, Inc. Curable casting compositions having a high refractive index and high impact resistance
DE19936605A1 (de) * 1999-08-04 2001-02-15 Osram Opto Semiconductors Gmbh Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken
DK1210380T3 (da) * 1999-09-07 2005-05-30 Alcon Inc Sammenfoldelige oftalmiske og otorhinolaryngologiske anordningsmaterialer
JP4122661B2 (ja) * 1999-10-22 2008-07-23 Jsr株式会社 光硬化性樹脂組成物およびプラスチックシート
US6288210B1 (en) * 1999-11-12 2001-09-11 Virginia Tech. Intellectual Properties, Inc. High refractive index thermoplastic polyphosphonates
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
US20010047043A1 (en) * 2000-03-20 2001-11-29 Okoroafor Michael O. Method of preparing a polymerizate
US6593388B2 (en) * 2000-04-04 2003-07-15 Renssealer Polytechnic Institute Oligomeric and polymeric photosensitizers comprising a polynuclear aromatic group
US6376704B1 (en) * 2000-06-28 2002-04-23 3M Innovative Properties Company Naphthyoxyalkyl(meth)acrylates with high refractive indices and low glass transition temperatures
WO2002006038A2 (en) * 2000-07-19 2002-01-24 Koninklijke Philips Electronics N.V. Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization
KR100315158B1 (ko) * 2000-08-02 2001-11-26 윤덕용 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법
US6794058B2 (en) * 2000-09-12 2004-09-21 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
EP1350618B1 (en) * 2000-11-27 2009-01-14 Teijin Limited Multilayered film and near-infrared-ray reflection film
US6541591B2 (en) * 2000-12-21 2003-04-01 3M Innovative Properties Company High refractive index microreplication resin from naphthyloxyalkylmethacrylates or naphthyloxyacrylates polymers
DE10100442A1 (de) * 2001-01-08 2002-07-11 Bayer Ag Transparente Kunststoff-Formmasse
US20030176529A1 (en) * 2001-01-15 2003-09-18 Kenji Yamauchi Photoreactive hot-melt adhesive composition
DE60213372T2 (de) * 2001-02-15 2007-09-27 Great Lakes Chemical Corp., West Lafayette Neue hydroxyphenylphosphinoxid zusammensetzung, glycidylether und epoxidharzmischungen und davon abgeleitete verbundwerkstoffe und laminate
TW593450B (en) * 2001-03-21 2004-06-21 Hoya Corp Transparent molded articles, optical components, plastic lenses and preparation method thereof
DE10122188B4 (de) * 2001-05-08 2007-04-12 Ems-Chemie Ag Polyamidformmassen zur Herstellung optischer Linsen
JP4857489B2 (ja) * 2001-06-19 2012-01-18 三菱瓦斯化学株式会社 光学材料用脂肪族環状化合物
US20030036580A1 (en) * 2001-08-17 2003-02-20 Mingxin Fan Bromine-containing radiation curable acrylates and methacrylates
JP3963170B2 (ja) * 2001-08-30 2007-08-22 三菱瓦斯化学株式会社 光学材料用組成物
AU2002367417A1 (en) * 2002-01-11 2003-07-24 Koninklijke Philips Electronics N.V. Method of manufacturing a replica as well as a replica obtained by carrying out an uv light-initiated cationic polymerization
US6924000B2 (en) * 2002-03-07 2005-08-02 Lord Corporation Environmentally preferred high solids, low viscosity flock adhesives
US20030207050A1 (en) * 2002-04-29 2003-11-06 Grant Hay Polymeric substrate for display and light emitting devices
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
KR100511100B1 (ko) * 2002-07-12 2005-08-31 김미화 퍼플루오로스티렌 화합물, 이를 이용한 코팅액 및광도파로형 광소자
WO2004011158A1 (en) * 2002-07-31 2004-02-05 Vision-Ease Lens, Inc. Spin application of thermally cured coatings
US6818306B2 (en) * 2002-09-27 2004-11-16 The Boeing Company Optically clear structural laminate
JP4249996B2 (ja) * 2003-02-10 2009-04-08 日東電工株式会社 ポリカルボジイミド共重合体からなるレンズ材料
US6939939B2 (en) * 2003-02-24 2005-09-06 Younger Mfg. Polyurea/urethane optical material and method for making it

Also Published As

Publication number Publication date
EP1815273A2 (en) 2007-08-08
US20090087666A1 (en) 2009-04-02
KR20070072939A (ko) 2007-07-10
CN101142499A (zh) 2008-03-12
US20060068207A1 (en) 2006-03-30
WO2006137884A2 (en) 2006-12-28
JP2008514764A (ja) 2008-05-08
WO2006137884A3 (en) 2007-06-28

Similar Documents

Publication Publication Date Title
JP6960616B2 (ja) 光導波路用組成物、光導波路用ドライフィルム、及び光導波路
CN102149667B (zh) 基于氟的化合物和包含该化合物的涂料组合物
TWI445758B (zh) 光學元件用樹脂組合物及使用其之光學元件
CN101775143A (zh) 一种含有含氟聚硅氧烷的紫外光固化复合涂料及其制备方法
EP1247843A3 (en) UV-curable coatings composition for optical fiber for a fast cure and with improved adhesion to glass
WO2009025292A1 (ja) 反射防止フィルム
Matsukawa et al. Preparation of photo-curable thiol-ene hybrids and their application for optical materials
TW201539076A (zh) 製備光學連接器之方法及包含由此製備之光學連接器之光學裝置
US20190338157A1 (en) (meth)acrylic composition, coating material containing same and cured body
TW200619312A (en) Curable high refractive index resins for optoelectronic applications
CN110591490A (zh) 防指纹涂料组合物
TW200631994A (en) Low refractive index coating composition for use in antireflection polymer film coatings and manufacturing method
JP5070131B2 (ja) 光学部品用樹脂組成物およびそれを用いた光学部品
JP4439017B2 (ja) 成型体用硬化性樹脂組成物、成型体及びその製造方法
CN1795215A (zh) 可固化树脂组合物、光学部件和光波导管
JP5296472B2 (ja) 成型体用硬化性樹脂組成物、成型体及びその製造方法
TW201129589A (en) Ultraviolet curing type composition for optical disk and optical disk
JP2012063620A (ja) 硬化性組成物および光導波路の製造方法
JP6691855B2 (ja) 硬化性組成物およびこれを硬化させた硬化物
JP5448358B2 (ja) 樹脂組成物、光学材料、及び、光学部材
JP6073690B2 (ja) 積層用樹脂組成物、及び、硬化物
Stroganov et al. Optical adhesives: analysis, achievements, and trends in development
JP5116730B2 (ja) 紫外線硬化型エポキシ樹脂組成物
JP5119846B2 (ja) エポキシ樹脂組成物及び透明複合シート
Kwon et al. Polarizing group attached acrylates and polymers viewing high refractive index