TW200618088A - Method for dividing semiconductor wafer and manufacturing method for semiconductor devices - Google Patents

Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

Info

Publication number
TW200618088A
TW200618088A TW094134646A TW94134646A TW200618088A TW 200618088 A TW200618088 A TW 200618088A TW 094134646 A TW094134646 A TW 094134646A TW 94134646 A TW94134646 A TW 94134646A TW 200618088 A TW200618088 A TW 200618088A
Authority
TW
Taiwan
Prior art keywords
regions
semiconductor wafer
wafer
dividing
imaginary
Prior art date
Application number
TW094134646A
Other languages
English (en)
Inventor
Hiroshi Haji
Kiyoshi Arita
Akira Nakagawa
Kazuhiro Noda
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200618088A publication Critical patent/TW200618088A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
TW094134646A 2004-10-05 2005-10-04 Method for dividing semiconductor wafer and manufacturing method for semiconductor devices TW200618088A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004292181A JP4018096B2 (ja) 2004-10-05 2004-10-05 半導体ウェハの分割方法、及び半導体素子の製造方法

Publications (1)

Publication Number Publication Date
TW200618088A true TW200618088A (en) 2006-06-01

Family

ID=35501299

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134646A TW200618088A (en) 2004-10-05 2005-10-04 Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

Country Status (7)

Country Link
US (1) US7927973B2 (zh)
JP (1) JP4018096B2 (zh)
KR (1) KR101261070B1 (zh)
CN (1) CN100589239C (zh)
DE (1) DE112005002441T5 (zh)
TW (1) TW200618088A (zh)
WO (1) WO2006038699A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421143B (zh) * 2011-01-25 2014-01-01 Mitsuboshi Diamond Ind Co Ltd The workpiece holder is placed in the fixing table and the workpiece is placed with a fixing glass holder

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JP6672647B2 (ja) 2015-09-08 2020-03-25 セイコーエプソン株式会社 Ｍｅｍｓデバイス、液体噴射ヘッド、及び液体噴射装置
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Also Published As

Publication number Publication date
CN100589239C (zh) 2010-02-10
DE112005002441T5 (de) 2007-09-06
US20090197393A1 (en) 2009-08-06
WO2006038699A1 (en) 2006-04-13
KR20070058521A (ko) 2007-06-08
KR101261070B1 (ko) 2013-05-06
JP4018096B2 (ja) 2007-12-05
CN101036224A (zh) 2007-09-12
JP2006108339A (ja) 2006-04-20
US7927973B2 (en) 2011-04-19

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