TW200616265A - Light emitting device, lighting equipment or liquid crystal display device using such light emitting device - Google Patents
Light emitting device, lighting equipment or liquid crystal display device using such light emitting deviceInfo
- Publication number
- TW200616265A TW200616265A TW094134496A TW94134496A TW200616265A TW 200616265 A TW200616265 A TW 200616265A TW 094134496 A TW094134496 A TW 094134496A TW 94134496 A TW94134496 A TW 94134496A TW 200616265 A TW200616265 A TW 200616265A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- emitting device
- liquid crystal
- crystal display
- lighting equipment
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004291608 | 2004-10-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200616265A true TW200616265A (en) | 2006-05-16 |
TWI295860B TWI295860B (zh) | 2008-04-11 |
Family
ID=36142933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094134496A TW200616265A (en) | 2004-10-04 | 2005-10-03 | Light emitting device, lighting equipment or liquid crystal display device using such light emitting device |
Country Status (7)
Country | Link |
---|---|
US (1) | US7812360B2 (zh) |
EP (1) | EP1806789B1 (zh) |
JP (1) | JP4960099B2 (zh) |
KR (1) | KR100867970B1 (zh) |
CN (1) | CN101036238B (zh) |
TW (1) | TW200616265A (zh) |
WO (1) | WO2006038543A2 (zh) |
Cited By (3)
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---|---|---|---|---|
TWI405355B (zh) * | 2008-07-17 | 2013-08-11 | Toshiba Kk | A light emitting device, and a backlight, a liquid crystal display device, and a lighting device using the same |
TWI406620B (zh) * | 2010-12-29 | 2013-08-21 | ||
US9608184B2 (en) | 2006-06-02 | 2017-03-28 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
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US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
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US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US20080205057A1 (en) * | 2007-02-23 | 2008-08-28 | Frontend Analog And Digital Technology Corporation | Light source device assembly |
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JP2022148613A (ja) * | 2021-03-24 | 2022-10-06 | 富士フイルムビジネスイノベーション株式会社 | 発光装置、伝熱部材、及び光計測装置 |
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- 2005-09-30 KR KR1020077007653A patent/KR100867970B1/ko active IP Right Grant
- 2005-09-30 CN CN200580033649.2A patent/CN101036238B/zh active Active
- 2005-09-30 US US11/576,533 patent/US7812360B2/en active Active
- 2005-09-30 EP EP05788119A patent/EP1806789B1/en active Active
- 2005-09-30 JP JP2006539258A patent/JP4960099B2/ja active Active
- 2005-09-30 WO PCT/JP2005/018083 patent/WO2006038543A2/ja active Application Filing
- 2005-10-03 TW TW094134496A patent/TW200616265A/zh unknown
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US9608184B2 (en) | 2006-06-02 | 2017-03-28 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
US9660156B2 (en) | 2006-06-02 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
US9673362B2 (en) | 2006-06-02 | 2017-06-06 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
US10205072B2 (en) | 2006-06-02 | 2019-02-12 | Hitachi Chemical Company, Ltd. | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same |
US10326063B2 (en) | 2006-06-02 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same |
US10950767B2 (en) | 2006-06-02 | 2021-03-16 | Shenzhen Jufei Optoelectronics Co., Ltd. | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same |
US11810778B2 (en) | 2006-06-02 | 2023-11-07 | Shenzhen Jufei Optoelectronics Co., Ltd. | Optical semiconductor element mounting package and optical semiconductor device using the same |
TWI405355B (zh) * | 2008-07-17 | 2013-08-11 | Toshiba Kk | A light emitting device, and a backlight, a liquid crystal display device, and a lighting device using the same |
TWI406620B (zh) * | 2010-12-29 | 2013-08-21 |
Also Published As
Publication number | Publication date |
---|---|
WO2006038543A3 (ja) | 2006-05-26 |
KR100867970B1 (ko) | 2008-11-11 |
CN101036238A (zh) | 2007-09-12 |
TWI295860B (zh) | 2008-04-11 |
US20070247855A1 (en) | 2007-10-25 |
JPWO2006038543A1 (ja) | 2008-05-15 |
JP4960099B2 (ja) | 2012-06-27 |
EP1806789A4 (en) | 2009-09-02 |
KR20070089784A (ko) | 2007-09-03 |
US7812360B2 (en) | 2010-10-12 |
WO2006038543A2 (ja) | 2006-04-13 |
EP1806789B1 (en) | 2012-05-09 |
EP1806789A2 (en) | 2007-07-11 |
CN101036238B (zh) | 2014-01-08 |
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