TW200609339A - Thermally conductive sheet - Google Patents
Thermally conductive sheetInfo
- Publication number
- TW200609339A TW200609339A TW094118824A TW94118824A TW200609339A TW 200609339 A TW200609339 A TW 200609339A TW 094118824 A TW094118824 A TW 094118824A TW 94118824 A TW94118824 A TW 94118824A TW 200609339 A TW200609339 A TW 200609339A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermally conductive
- conductive sheet
- sheet
- inhibited
- phosphorous compound
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Coating By Spraying Or Casting (AREA)
- Surface Treatment Of Glass (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004203322A JP4714432B2 (ja) | 2004-07-09 | 2004-07-09 | 熱伝導性シート |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200609339A true TW200609339A (en) | 2006-03-16 |
TWI429738B TWI429738B (zh) | 2014-03-11 |
Family
ID=34978830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118824A TWI429738B (zh) | 2004-07-09 | 2005-06-07 | 熱傳導性片狀物 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7851534B2 (zh) |
EP (1) | EP1791874B1 (zh) |
JP (1) | JP4714432B2 (zh) |
KR (1) | KR101217289B1 (zh) |
CN (1) | CN100586962C (zh) |
AT (1) | ATE425191T1 (zh) |
DE (1) | DE602005013255D1 (zh) |
TW (1) | TWI429738B (zh) |
WO (1) | WO2006016936A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100073882A1 (en) * | 2006-11-01 | 2010-03-25 | Tooru Yoshikawa | Thermally conductive sheet, process for producing the same, and radiator utilizing thermally conductive sheet |
JP5646812B2 (ja) * | 2008-12-15 | 2014-12-24 | スリーエム イノベイティブ プロパティズ カンパニー | アクリル系熱伝導性シートおよびその製造方法 |
JP5547032B2 (ja) * | 2010-10-21 | 2014-07-09 | パナソニック株式会社 | 熱伝導性樹脂組成物、樹脂シート、プリプレグ、金属積層板およびプリント配線板 |
JP5480191B2 (ja) * | 2011-03-31 | 2014-04-23 | 古河電気工業株式会社 | 熱伝導性ゴム組成物及びその製造方法 |
CN105038078A (zh) * | 2012-08-07 | 2015-11-11 | 朱海燕 | 导热性能良好的led基板的导热绝缘材料及其制备方法 |
JP6710828B2 (ja) * | 2016-04-06 | 2020-06-17 | 北川工業株式会社 | 熱伝導シート、および、熱伝導シートの製造方法 |
JP2017199776A (ja) * | 2016-04-27 | 2017-11-02 | 北川工業株式会社 | 熱伝導シート、および、熱伝導シートの製造方法 |
WO2020236440A1 (en) | 2019-05-21 | 2020-11-26 | Ddp Specialty Electronic Materials Us, Llc | Two-part interface materials, systems including the interface material, and methods thereof |
KR20220011648A (ko) | 2019-05-21 | 2022-01-28 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | 열 인터페이스 재료 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5448852A (en) * | 1977-09-27 | 1979-04-17 | Asahi Chem Ind Co Ltd | Thermoplastic polymer composition |
JPS573841A (en) * | 1980-06-11 | 1982-01-09 | Karupu Kogyo Kk | Resin composition for heat-shrinkable film |
JPS5742750A (en) * | 1980-08-28 | 1982-03-10 | Nippon Petrochem Co Ltd | Production of polyolefin resin composition |
EP0476224A1 (en) * | 1990-08-21 | 1992-03-25 | Ricon Resins, Inc. | Adhesive rubber compositions |
JPH05171057A (ja) | 1990-11-09 | 1993-07-09 | Ajinomoto Co Inc | チタンオリゴマー表面処理フィラー |
GB9223628D0 (en) * | 1991-11-15 | 1992-12-23 | Ici Plc | Polymerisable compositions |
JPH05320414A (ja) | 1992-05-25 | 1993-12-03 | Dai Ichi Kogyo Seiyaku Co Ltd | 無機フィラー表面改質剤 |
JPH10316953A (ja) | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
JP3813301B2 (ja) | 1997-06-04 | 2006-08-23 | エフコ株式会社 | 熱伝導性ゴム組成物および熱伝導性ゴムシート |
JP3290127B2 (ja) | 1998-01-27 | 2002-06-10 | 松下電工株式会社 | 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート |
JP3636884B2 (ja) | 1998-04-03 | 2005-04-06 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 熱伝導性シート |
US5989459A (en) | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
JP4624521B2 (ja) | 2000-04-24 | 2011-02-02 | 昭和電工株式会社 | 水酸化アルミニウムの表面処理方法 |
JP2002030212A (ja) * | 2000-06-29 | 2002-01-31 | Three M Innovative Properties Co | 熱伝導性シート |
JP2002284884A (ja) | 2001-03-26 | 2002-10-03 | Sumitomo Wiring Syst Ltd | フィラー、それを含む樹脂組成物および樹脂組成物の製造方法 |
JP4588285B2 (ja) | 2002-01-25 | 2010-11-24 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
JP2004002527A (ja) | 2002-05-31 | 2004-01-08 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着体 |
JP2004010859A (ja) | 2002-06-11 | 2004-01-15 | Dainippon Ink & Chem Inc | 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート |
JP4385573B2 (ja) | 2002-07-31 | 2009-12-16 | Dic株式会社 | 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート |
-
2004
- 2004-07-09 JP JP2004203322A patent/JP4714432B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-20 CN CN200580023169A patent/CN100586962C/zh not_active Expired - Fee Related
- 2005-05-20 AT AT05760265T patent/ATE425191T1/de not_active IP Right Cessation
- 2005-05-20 WO PCT/US2005/017668 patent/WO2006016936A1/en active Application Filing
- 2005-05-20 EP EP05760265A patent/EP1791874B1/en not_active Not-in-force
- 2005-05-20 KR KR1020077000452A patent/KR101217289B1/ko active IP Right Grant
- 2005-05-20 US US11/568,231 patent/US7851534B2/en not_active Expired - Fee Related
- 2005-05-20 DE DE602005013255T patent/DE602005013255D1/de active Active
- 2005-06-07 TW TW094118824A patent/TWI429738B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101120023A (zh) | 2008-02-06 |
KR101217289B1 (ko) | 2012-12-31 |
US20070224426A1 (en) | 2007-09-27 |
DE602005013255D1 (de) | 2009-04-23 |
KR20070029795A (ko) | 2007-03-14 |
ATE425191T1 (de) | 2009-03-15 |
EP1791874B1 (en) | 2009-03-11 |
JP4714432B2 (ja) | 2011-06-29 |
EP1791874A1 (en) | 2007-06-06 |
CN100586962C (zh) | 2010-02-03 |
US7851534B2 (en) | 2010-12-14 |
JP2006022263A (ja) | 2006-01-26 |
WO2006016936A1 (en) | 2006-02-16 |
TWI429738B (zh) | 2014-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |