TW200602375A - Thermosetting resin composition and use thereof - Google Patents

Thermosetting resin composition and use thereof

Info

Publication number
TW200602375A
TW200602375A TW094105460A TW94105460A TW200602375A TW 200602375 A TW200602375 A TW 200602375A TW 094105460 A TW094105460 A TW 094105460A TW 94105460 A TW94105460 A TW 94105460A TW 200602375 A TW200602375 A TW 200602375A
Authority
TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
component
imidazole
amine
Prior art date
Application number
TW094105460A
Other languages
English (en)
Other versions
TWI400268B (zh
Inventor
Shigeru Tanaka
Kanji Shimoohsakao
Takashi Itoh
Mutsuaki Murakami
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200602375A publication Critical patent/TW200602375A/zh
Application granted granted Critical
Publication of TWI400268B publication Critical patent/TWI400268B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
TW94105460A 2004-02-25 2005-02-23 熱固性樹脂組合物及其用途 TWI400268B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004049388 2004-02-25

Publications (2)

Publication Number Publication Date
TW200602375A true TW200602375A (en) 2006-01-16
TWI400268B TWI400268B (zh) 2013-07-01

Family

ID=34879543

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94105460A TWI400268B (zh) 2004-02-25 2005-02-23 熱固性樹脂組合物及其用途

Country Status (6)

Country Link
US (1) US7838114B2 (zh)
JP (1) JP5232386B2 (zh)
KR (1) KR101182026B1 (zh)
CN (1) CN100572416C (zh)
TW (1) TWI400268B (zh)
WO (1) WO2005080466A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009040919A (ja) * 2007-08-09 2009-02-26 Sekisui Chem Co Ltd 熱硬化性樹脂組成物、及びこれを用いてなる樹脂フィルム、積層板、プリプレグ
TWI488841B (zh) * 2009-03-27 2015-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition, and an insulating film, a laminate, and a printed wiring board
US8886106B2 (en) * 2011-03-02 2014-11-11 Konica Minolta Business Technologies, Inc. Intermediate transfer belt and method for producing the same
CN102363723B (zh) * 2011-06-28 2012-11-28 衡阳恒缘电工材料有限公司 一种耐高温铜箔胶的制备方法
JP2012246497A (ja) * 2012-09-04 2012-12-13 Sekisui Chem Co Ltd 樹脂フィルム、積層板、及びプリプレグ
JP6228732B2 (ja) * 2012-11-19 2017-11-08 日東電工株式会社 樹脂シート
JP5786839B2 (ja) * 2012-12-05 2015-09-30 株式会社デンソー エポキシ樹脂組成物および接着構造体の製造方法
JP6403503B2 (ja) * 2013-09-30 2018-10-10 新日鉄住金化学株式会社 銅張積層板、プリント配線板及びその使用方法
JP6168005B2 (ja) * 2014-07-01 2017-07-26 株式会社デンソー 電装部品
JP6770789B2 (ja) * 2014-10-03 2020-10-21 味の素株式会社 保護フィルム付き接着シートの製造方法
US11166383B2 (en) 2015-07-23 2021-11-02 Mitsui Mining & Smelting Co., Ltd. Resin-clad copper foil, copper-clad laminated plate, and printed wiring board
CN105111960A (zh) * 2015-09-23 2015-12-02 苏州华周胶带有限公司 一种带有信号线缆的胶带
KR20200013649A (ko) * 2017-05-31 2020-02-07 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 경화물, 접착제, 접착 필름, 커버레이 필름, 및, 프린트 배선판
KR102660753B1 (ko) * 2018-02-01 2024-04-26 미쓰이금속광업주식회사 수지 조성물, 수지를 구비하는 구리박, 유전체층, 동장 적층판, 커패시터 소자 및 커패시터 내장 프린트 배선판
CN111937500A (zh) * 2018-04-04 2020-11-13 住友电工印刷电路株式会社 柔性印刷线路板用覆膜以及柔性印刷线路板
WO2021153339A1 (ja) * 2020-01-28 2021-08-05 三井金属鉱業株式会社 樹脂積層体、誘電体層、樹脂付金属箔、キャパシタ素子及びキャパシタ内蔵プリント配線板
CN111961415A (zh) * 2020-08-20 2020-11-20 衡阳华灏新材料科技有限公司 一种mpi高频柔性纯胶膜及制备方法及其应用
CN113025117A (zh) * 2020-08-20 2021-06-25 深圳市百柔新材料技术有限公司 阻焊油墨及制备方法和使用方法、印制电路板
CN114874695B (zh) * 2022-05-18 2023-03-31 大同共聚(西安)科技有限公司 一种电动汽车电机聚酰亚胺绝缘浸渍漆及其制备方法
CN115449335A (zh) * 2022-09-05 2022-12-09 瑞声科技（南京）有限公司 树脂组合物及胶粘剂
CN115820084B (zh) * 2022-12-22 2024-03-29 湖南大麓科技有限公司 一种高强度防腐管道加固复合材料及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2743185B2 (ja) 1988-11-29 1998-04-22 東芝ケミカル株式会社 回路基板およびその製造方法
JP2000017148A (ja) * 1998-07-01 2000-01-18 Ajinomoto Co Inc 熱硬化性樹脂組成物及びこれを用いたプリント配線板用層間接着フィルム
JP4875794B2 (ja) 1998-10-05 2012-02-15 株式会社カネカ 樹脂組成物
DE60016217T2 (de) * 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
WO2001034678A1 (fr) 1999-11-10 2001-05-17 Kaneka Corporation Polyimide soluble et composition contenant ce dernier, feuille de liaison, film lamine adhesif utilise pour recouvrir un tube de faisceau d'accelerateur et film lamine adhesif utilise pour recouvrir un fil conducteur destine a un dispositif de chauffe refroidissant un accelerateur
JP4748292B2 (ja) * 2000-03-15 2011-08-17 信越化学工業株式会社 フィルム状電子部品用接着剤及び電子部品
JP4620834B2 (ja) 2000-04-04 2011-01-26 株式会社カネカ ボンディングシート
JP2001329246A (ja) * 2000-05-25 2001-11-27 Kanegafuchi Chem Ind Co Ltd 耐湿特性が改良された接着剤用硬化性樹脂組成物、それより得られる硬化物およびその製造方法。
JP2002047472A (ja) 2000-08-03 2002-02-12 Kanegafuchi Chem Ind Co Ltd ポリイミド系接着剤溶液およびそれを用いて得られるフィルム状接着部材、フィルム状積層部材
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
JP4426774B2 (ja) 2003-04-18 2010-03-03 株式会社カネカ 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
JP4005006B2 (ja) * 2003-09-04 2007-11-07 京セラケミカル株式会社 成形用耐熱性樹脂組成物

Also Published As

Publication number Publication date
TWI400268B (zh) 2013-07-01
US7838114B2 (en) 2010-11-23
WO2005080466A1 (ja) 2005-09-01
KR101182026B1 (ko) 2012-09-11
CN1914246A (zh) 2007-02-14
CN100572416C (zh) 2009-12-23
JP5232386B2 (ja) 2013-07-10
JPWO2005080466A1 (ja) 2007-10-25
KR20070018851A (ko) 2007-02-14
US20080230261A1 (en) 2008-09-25

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees