TW200525579A - Method for producing plasma display panel member and duplicating film - Google Patents

Method for producing plasma display panel member and duplicating film Download PDF

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Publication number
TW200525579A
TW200525579A TW093138604A TW93138604A TW200525579A TW 200525579 A TW200525579 A TW 200525579A TW 093138604 A TW093138604 A TW 093138604A TW 93138604 A TW93138604 A TW 93138604A TW 200525579 A TW200525579 A TW 200525579A
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Taiwan
Prior art keywords
layer
alkali
soluble resin
contained
composition
Prior art date
Application number
TW093138604A
Other languages
Chinese (zh)
Inventor
Hiroaki Mukai
Jirou Takahashi
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Jsr Corp
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Publication date
Priority claimed from JP2004017464A external-priority patent/JP2005209588A/en
Priority claimed from JP2004017465A external-priority patent/JP2005209589A/en
Priority claimed from JP2004019813A external-priority patent/JP2005216604A/en
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200525579A publication Critical patent/TW200525579A/en

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    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/50—Road surface markings; Kerbs or road edgings, specially adapted for alerting road users
    • E01F9/553—Low discrete bodies, e.g. marking blocks, studs or flexible vehicle-striking members
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/50—Road surface markings; Kerbs or road edgings, specially adapted for alerting road users
    • E01F9/576—Traffic lines
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/12—Reflex reflectors
    • G02B5/126—Reflex reflectors including curved refracting surface

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Materials For Photolithography (AREA)

Abstract

The topics of this invention is to provide a method of manufacturing a PDP member having an excellent pattern shape and to provide a transfer film suitably usable for the manufacturing method. The PDP component is manufactured by forming a photosensitive layer or a resist layer containing specific alkali soluble resin and specific inorganic powder on a non-photosensitive layer containing specific alkali soluble resin and specific inorganic powder, and then exposing, developing and sintering it. Further, a photosensitive layer or a resist layer containing specific alkali soluble resin and specific inorganic powder is formed on a supporting film, and a non-photosensitive layer containing specific alkali soluble resin and specific inorganic powder is formed on the formed layer, thereby obtaining a transfer film suitably used for manufacturing the PDP component.

Description

200525579 ⑴ 九、發明說明 【發明所屬之技術領域】 本發明係關於電漿顯示器面板構件之製造方法，及該 製造方法可恰當使用之轉印薄膜。 【先前技術】 近年來，平板狀之螢光顯示器以電漿顯示器廣受囑 目。第1圖係顯示交流型電漿顯示器面板（以下，稱爲 「PDP」）之剖面形狀之模式圖。在同圖中，1及2爲對 向配置之玻璃基板，3爲隔壁，藉由玻璃基板I，玻璃基 板2及隔壁3使電路胞（cell )劃分形成。4爲固定於玻 璃基板1之透明電極，5爲在以降低透明電極4之電阻之 目的，形成於該透明電極4上之匯流排電極，6爲固定於 玻璃基板2之位址電極，7爲保持於電路胞（cell )內之 螢光物質，8爲爲了被覆透明電極4及匯流排（bus )電極 5而形成於玻璃基板1表面之電介質層，9爲了被覆位址 電極6而在玻璃基板2表面形成之電介質層，10爲例如氧 化鎂所成保護膜。又，在彩色PDP，爲了獲得對比高之影 像，則在玻璃基板與電介質層間，可設置濾色器（紅色 綠色藍色）或黑色矩陣等。 在爲PDP構件之隔壁，電極，.電阻體，螢光體，濾色 器及黑色條帶（矩陣）等之形成方法方面，以光微影術法 爲恰當。在此，光微影術法係指，將含有無機粉體與展色 劑（vehicle )之糊狀感光性組成物所成層形成於基板等之 -4 - 200525579 (2) 表面’藉由該等之曝光’顯影來形成圖型，接著將此此圖 型焙燒除去有機物質使無機粉體燒結之方法。尤以，使用 具有感光性組成物所成層之轉印薄膜，在基板等之表面轉 印爲其特徵之光微影術法，可獲得厚度均勻性優異之膜， 同時，因可改善作業效率故爲非常好。 在上述方法’例如形成隔壁之情形，在焙燒步驟可除 去有機物質使膜厚變小，故轉印層成爲要形成之隔壁膜厚 之1 · 3〜2 · 0倍左右爲必要。例如，爲使隔壁膜厚成爲I 0 〇 〜1 50μΐΏ，有必要使轉印層之厚度在1 30〜3 00 μιη左右。 構成PDP之隔壁，就可顯現良好電特性之觀點而言，以長 寬比高，形狀均勻爲所望。但是，轉印層之厚度大時，於 顯影之際，圖型之側壁易於成爲凹陷形狀，圖型形狀難以 獲得均勻且良好的隔壁。又，顯影之際圖型之側壁在凹陷 狀態進行焙燒處理時，圖型會剝離，或有大爲變形之情 形。 爲解決此種問題點，則有關例如在PDP用隔壁之製造 方法中，隔壁形成用組成物之膜，具有將相對於顯影液之 溶解性不同之2以上之隔壁形成用組成物予以層合所成構 造爲其特徵之PDP用隔壁之製造方法的發明被揭示（例 如，請參照專利文獻1及2 )。 但是，在上述揭示之方法，僅係將該組成物之共聚組 成比改變來使溶解性變化而已，會有溶解性之差異並非充 分之情形，在獲得圖型形狀爲均勻且良好隔壁之點而言， 在目前仍爲問題。 200525579 (3) 專利文獻1:日本特開平9 — 92137號公報 專利文獻2 :日本特開2 〇 〇 〇 _ 2 2 8 I 4 3號公報 【發明內容】 •〔發明欲解決之課題〕 本發明之課題係提供，圖型形狀優異之P D p構件之製 造方法及可恰當使用於該製造方法之轉印薄膜。 〔解決課題之手段〕 本發明之第一 PDP構件之製造方法（以下，稱爲 「PDP構件製造方法1 ))，係含有， (1 )基板上’形成含有無機粉體與鹼可溶性樹脂之 非感光性層（A 1 )之步驟， (2 )在A 1層上，形成含有無機粉體與鹼可溶性樹脂 與敏輻射性成分之感光性層（B 1 )之步驟， (3 )使B 1層曝光處理，形成圖型之潛像之步驟， (4 )藉由顯影處理使B 1層之圖型形成之步驟， (5 )透過B1層之圖型，藉由顯影處理，使A1層選 擇性溶解，來形成A 1層之圖型之步驟，及 (6 )將所得之圖型予以焙燒處理之步驟， 之電漿顯示器面板構件之製造方法，其中，A 1層與 B1層，係以滿足下述（i )〜（iii )所示條件至少之一爲 其特徵。 (i ) A ]層所含之鹸可溶性樹脂之聚苯乙烯換算重量 -6 - 200525579 (4) 平均分子量，比B 1層所含之鹼可溶性樹脂之聚苯乙燒換 算重量平均分子量更小。 (ii ) A1層所含鹼可溶性樹脂具有來自丙烯酸構造單 元之樹脂，B 1層所含之鹼可溶性樹脂具有來自甲基丙_酸 構造單元之樹脂。 (iii )在A]層進而含有溶解促進劑，A1層所含溶解 促進劑相對於A1層全重量之含量，比B1層所含溶解促31 劑之相對於B1層全重量之含量更多。 本發明之第二 PDP構件之製造方法（以下’稱爲 「PDP構件製造方法II」），含有 (1 )在基板上，可形成含有無機粉體與鹼可溶彳'生胃 脂之非感光性層（A2)之步驟， (2 )在A2層上可形成含有無機粉體與鹼可溶性樹^ 之非感光性層（A3 )之步驟， (3 )在A3層上可形成光阻層之步驟， (4 )使光阻層曝光處理，形成圖型之潛像之步驟’ (5 )藉由顯影處理使光阻層之圖型形成之步驟， (6)透過光阻層之圖型，藉由顯影處理使A3層及 A 2層選擇性溶解，以形成A 3層及A 2層之圖型之步驟， 及 (7 )所得之圖型予以焙燒處理之步驟， 之電漿顯示器面板構件之製造方法，其中，A2層與 A 3層係，可滿足下述（i v )〜（v i )所示條件至少之一爲 其特徵。 -7- 200525579 (5) (i v ) A 2層所含鹼可溶性樹脂之聚苯乙烯換算重量平 均分子量，比A3層所含鹼可溶性樹脂之聚苯乙烯換算重 量平均分子量更小。 (v ) A 2層所含鹼可溶性樹脂具有來自丙烯酸構造單 元之樹脂，A 3層所含鹼可溶性樹脂具有來自甲基丙烯酸 構造單元之樹脂。 (vi)在A2層進而含有溶解促進劑，A2層所含之溶 解促進劑之相對於A 2層全重量之含量，比A 3層所含之 溶解促進劑之相對於A3層全重量之含量更多。 本發明之轉印薄膜，係在支持薄膜上，含有無機粉體 與鹼可溶性樹脂與因應需要之感光性成分，之層可形成2 層以上之轉印薄膜，其爲滿足下述（a )〜（c )所示條件 至少之一爲其特徵。 (a)在支持薄膜上所形成之任意一層（I)中所含鹼 可溶性樹脂之聚苯乙烯換算重量平均分子量，比在該 (I )層上所形成之其他一層（11 )中所含鹼可溶性樹脂之 聚苯乙烯換算重量平均分子量爲大。 (b )在支持薄膜上所形成之任意一層（III )中所含 之鹼可溶性樹脂具有來自甲基丙烯酸構造單元之樹脂，該 (ΙΠ )層上所形成之其他一層（IV )中所含鹼可溶性樹脂 具有來自丙烯酸構造單元之樹脂。 (c)在支持薄膜上所形成之任意之一層（V)上可形 成其他一層（VI)，至少該（VI)層中進而含有溶解促進 劑，該（V I )層中所含之溶解促進劑之相對於（V I )層全 -8- 200525579 (6) 重重之a量，比該（v )層中所含溶解促進劑之（v )層 全重量之含量更多。 本發明PDP構件之製造方法，在製造隔壁用爲特別好 用。又，上述轉印薄膜所含無機粉體以玻璃粉末爲佳。 〔發明之效果〕 根據本發明之p D P構件之製造方法，可形成圖型形狀 優異之構件。又，使用本發明之轉印薄膜時，可髟成膜厚 均勻的PDP構件，又，因可實質地減少步驟數，故可改善 作業效率。 . 〔貫施發明之最佳型態〕 以下’關於本發明予以詳細說明。 &lt;PDP構件之製造方法1：&gt; 本發明之P D P構件之製造方法I含有，〔1〕非感光 性層（A1 )之形成步驟，〔2〕感光性層（b 1 )之形成步 驟’ 〔3〕B1層之曝光步驟，〔4〕B1層及A1層之顯影步 驟及[5 ]焙燒步驟。依照本製造方法I係由選自隔壁，電 極’電阻體，螢光體，濾色器及黑矩陣之至少一種之PDP 構件來形成。本發明之PDP構件之製造方法，在隔壁之形 成特別好用。 以下，關於本發明之各步騾’以隔壁之製造爲例加以 說明。 200525579 (7) 〔1〕非感光性層（A 1 )之形成步驟 此步驟係在基板上形成非感光性層（A 1 )。構成a 1 層之組成物（以下，稱爲「組成物a ]」），係與後述之具 有本發明轉印薄膜之非感光性層（A 1 )之構成成分相同。 A 1層，可由網版印刷法，輥塗布法，旋轉塗布法，流延 (c a s t i n g )塗布法，轉印法等各種方法來塗布組成物a j 後，藉由塗膜之乾燥來形成。又，就所得層之厚度均勻性 與作業效率牲之觀點而言，使用轉印薄膜形成A 1層於基 板上亦可。 在此使用之轉印薄膜’係在支持薄膜之上A 1層所形 成之薄膜。又，此轉印薄膜，係在A 1層之上可具有保護 薄膜。另外，在此使用之支持薄膜，與後述之具有本發明 轉印薄膜之支持薄膜之構成成分相同。 若示以轉印步驟之一例則如以下。使因應需要使用之 轉印薄膜之保護薄膜層剝離後’在基板表面，使A 1層表 面抵接之方式，使轉印薄膜重疊。其後，藉由加熱輕進行 熱壓塗，使支持薄膜剝離除去。藉此，在基板表面A 1層 被轉印成爲密接狀態。轉印條件方面，係使加熱輥表面溫 度爲80〜140°C，輥壓爲1〜5kg/cm2，移動速度爲〇1〜 10.0 m/分。又，基板可被預熱，予熱溫度爲例如40〜1000 t：。 A1層之膜厚方面，因形成之構件而異，但，在隔壁之 情形，通常爲5 0〜1 5 0 μ m，較佳爲7 0〜]2 〇 μ m。 -10- 200525579 (8) 〔2〕感光性層（B丨）之形成步驟 在此步驟，係在A1層上形成感光性層（B】）。構成 B ]層之組成物（以下，稱爲「組成物bl」），與後述之 具有本發明轉印薄膜之感光性層（B1 )之構成成分相同。 B1層’係藉由與A ]層同樣之方法來形成。因此，B】 層’係使用轉印薄膜，可在A 1層之上形成。根據此方 法’可形成厚度均勻性優異之層，且，可改善作業效率。 在β 1層之厚度方面，因形成之構件而異，但，在隔 壁之情形’通常爲50〜150μηι，較佳爲70〜12〇μηι。 步驟〔1〕可與步驟〔2〕爲分別進行，但就膜厚均勻 Γ生’作業效率改善之觀點而言，使用本發明之轉印薄膜， 使步驟〔1〕及步驟〔2〕總括進行之方法特佳。 〔3〕Β 1層之曝光步驟 在此步驟’係在於A1層上所形成之β 1層表面，透過 曝光用掩罩，使紫外線等之輻射線予以選擇性照射（曝 光），來形成Β 1層圖型之潛像。 輻射線照射裝置，並無特別限定，但，可使用一般光 微影術法所使用紫外線照射裝置，或半導體或者製造液晶 表示裝置之際所使用之曝光裝置。 〔4〕Β 1層及A 1層之顯影步驟 在此步驟，係將被曝光之Β 1層予以顯影處理來使潛 -11 - 200525579 (9) 像顯著化，來形成B1層之圖型。因此’藉由所形成之B1 層之圖型，由顯影處理使A 1層選擇性溶解’來形成A 1 層之圖型。 顯影液之種類·組成·濃度，顯影時間，顯影溫度等 之顯影條件，可因應B 1層及A 1層中樹脂之種類等而適宜 選擇。 又，可以浸漬法，搖動法，沖洗法，噴灑法’浸置法 等各種顯影方法予以顯影。顯影裝置亦無特別限制。 因此顯影步驟，可形成B 1層之殘留部與B 1層之除去 部所構成之B〗層之圖型（對應於曝光掩罩之圖型）°此 圖型，可作爲連續顯影之A1層之掩罩來作用。亦即，對 應於B 1層除去部之A 1層部分溶解於顯影液而可選擇性除 去。進而持續顯影處理時，對應於B 1層除去部部分之基 板表面爲曝光。藉此，在B1層圖型之下’可形成對應於 B1層圖型之AI層圖型。 〔5〕焙燒處理步騾 在此步驟，係將具有所形成圖型之層予以焙燒處理。 藉此，層中之有機物質燒失，可形成無機物質所成層，而 可獲得在基板表面所形成之PDP構件。 焙燒處理之溫度方面，以層中之有機物質燒失溫度爲 必要，通常爲 4 0 0〜6 0 0 °C。又，焙燒時間爲通常1 0〜9 0 分。 -12- 200525579 (10) A1層與B1 在上述 〜（iii )所 〜（i i i )所 顯影液則易 難以凹陷， 條件（i ) 條件（ 算重量平均 鹼可溶性樹 平均分子量 之重量平均 B 1層所含齡 月旨之Mw之 佳。 條件（Π) 條件（： 酸構造單元 基丙烯酸構 A 1層所含虐 在全重覆單: I 0〜4 0重量 層之關係 製造方法1，A1層與B1層，以滿足下述（〇 示條件至少之一爲必要。藉由滿足下述（i ) 不條件之至少之一，A 1層與B 1層比較相對於 於溶解。因此，在顯影處理之際，圖型之側壁 可獲得圖型形狀優異之PDP構件。 i )係，A1層所含鹼可溶性樹脂之聚苯乙烯換 分子量（以下，稱爲「Mw」），比B ]層所含 脂Mw更小。本發明中所謂聚苯乙烯換算重量 (Mw )係指，依照GPC測定之聚苯乙烯換算 分子量之意。爲使本發明之效果更爲顯著，則 自可溶性樹脂之M w與，A ]層所含鹼可溶性樹 差以 5,000 〜60,000 爲佳，1〇5〇〇〇 〜40,000 更 i i )係，A 1層所含鹼可溶性樹脂具有來自丙烯 之樹脂，B 1層所含鹼可溶性樹脂具有來自甲 造單元之樹脂。爲使本發明之效果顯著’則 舍可溶性樹脂之來自丙烯酸構造單元之比率， 元中，通常爲5〜5 0重量％之範圍，較佳爲， %，特佳爲，1 5〜3 0重量％之範圍。又’爲使 -13- 200525579 (11) 本發明之效果顯著，則B 1層所含鹼可溶性樹脂之來自甲 基丙烯酸構造單元之比率，在全重覆單元中，通常爲5〜 5 〇重量％之範圍，較佳爲，1 0〜4 0重量％，特佳爲’ 1 5〜 3 〇重量％之範圍。爲使本發明之效果更爲顯著，則A】層 及B 1層可同時滿足上述要件爲佳。 (C )條件（iii ) 條件（i i i )，在 A 1層進而可含有溶解促進劑。因 此，在B 1層通常，不含有溶解促進劑，即使含有作爲任 意成分，則A 1層所含之溶解促進劑之相對於A ]層全重 量之含量，比B 1層所含之溶解促進劑之相對於B 1層全重 量之含量更多爲必要。 &lt;PDP構件之製造方法11&gt; 本發明之PDP構件之製造方法II係含有，〔1〕非感 光性層（A2 )之形成步驟，〔2〕非感光性層（A3 )之形 成步驟，〔2。光阻層之形成步驟，〔3〕光阻層之曝光步 驟，〔4〕光阻層，A3層及A2層之顯影步驟及〔5〕焙燒 步驟。 依照本製造方法II可形成選自隔壁，電極，電阻體， 螢光體，濾色器及黑矩陣之至少一個之面板構件。本發明 PDP構件之製造方法，在隔壁之形成特別好用。 上述各步驟係各自準照PDP構件之製造方法1之各步 驟。又’上述步驟〔1〕，步驟〔2〕及步驟〔2，〕可個別 -14- 200525579 (12) 進行，但就膜厚均勻性，作業效率改善之觀點而言，以使 用本發明之轉印薄膜，使步驟〔1〕，步驟〔2〕及步驟 〔2 1〕總括進行之方法特佳。 A2層與B2層之關係 在上述製造方法Π，A 2層與A 3層，係滿足下述 (iv )〜（vi )所示條件至少之一爲必要。藉由滿足下述 (i v )〜（v i )所不條件至少之一，A 2層與A 3層比較， 相對於顯影液變的易於溶解。因此，在顯影處理之際圖型 之側壁則難以凹陷’可獲得圖型形狀優異之PDP構件。 (a )條件（iv ) 條件（i v )係’ A 2層所含鹼可溶性樹脂之μ w，比 A 3層所含鹼可溶性樹脂M w更小。爲了使本發明之效果 更爲顯著，則A3層所含鹼可溶性樹脂之Mw與，Α2層所 含鹼可溶性樹脂之 Mw之差以 5,0 0 0〜60,0 00爲佳’ 10,000 〜40,000 更佳。 條件（v ) 條件（v )係，A 2層所含鹼可溶性樹脂具有來自丙 燃酸構造單元之樹脂’ A 3層所含驗可溶丨生樹肖曰具有來自 甲基丙烯酸構造單元之樹脂。爲使本發明之效果更爲咸 著，則A 2層所含鹼可溶性樹脂之來自丙烯酸構造單兀之 比率，在全重覆單元中，通常爲5〜5 〇重量％之範圍，較 200525579 (13) 佳爲1 0〜4 0重量％，特佳爲1 5〜3 0重量％之範圍。又， 爲使本發明之效果更爲顯著，則A 3層所含鹼可溶性樹脂 之來自甲基丙烯酸之構造單元之比率，在全重覆單元中， 通常爲5〜5 0重量％範圍，較佳爲，1 〇〜4 0重量％，特佳 爲’ 1 5〜3 0重量％範圍。爲使本發明效果更爲顯著，則 A 2層及A 3層可同時滿足上述要件爲佳。 (c )條件（v i ) 條件（W )係，在 A2層進而含有溶解促進劑。因 此’在A 3層通常，並不含有溶解促進劑，即使含有作爲 任意成分者，在A2層所含溶解促進劑之相對於A2層全 重量含量，以比A 3層所含溶解促進劑之相對於A 3層全 重量之含量更多爲必要。 以下’就前述PDP構件之製造方法1及II之各步驟 所使用材料，各種條件等加以說明。 基板材料係，例如玻璃，矽，氧化鋁等之絕緣性材 料。此基板表面，可因應需要，實施矽烷偶合劑等所致藥 品處理；電漿處理；離子電鍍法，濺鍍法，氣相反應法， 真空蒸鍍法等所致薄膜形成處理等之前處理亦可。 曝光用掩罩 曝光步驟中所使用之曝光用掩罩之曝光圖型，因目的 而異，但，可用於例如，10〜5 00 μπι寬之條帶。 200525579 (14) 顯影液 本發明使用之顯影液方面，以鹼顯影液較佳驗顯影 液之有效成分方面，可例舉例如氫氧化_，氫氧化納，氫 氧化鉀，憐酸氫鈉，磷酸氫二錢，磷酸氡二鉀，憐酸氫二 鈉，磷酸二氫銨，磷酸二氫鉀，磷酸二氣鈉，砂酸鋰，矽 酸鈉，矽酸鉀，碳酸鋰，碳酸鈉，碳酸_，硼酸鋰，硼酸 鈉，硼酸鉀，氨等之無機鹼性化合物；氣氧化四甲基錢， 氣氧化二甲基淫乙錢，單甲胺’ 一罕趣胺，三曱胺，單 乙胺，二乙胺，三乙胺，單異丙胺，二骞丙胺，乙醇胺等 之有機鹼性化合物等。鹼顯影液係將，前述驗性化合物之 1種或2種以上溶解於水等來調製。鹼性顯影液中驗性化 合物之濃度，通常爲 0 · 0 0 1〜1 0質量°/〇，較佳爲 〇 . 〇 ]〜5 質量％。另外，在進行鹼顯影液所致之顯影處理後，通 常，則實施水洗處理。 〈轉印薄膜〉 本發明之轉印薄膜係在支持薄膜上，可因應需要使無 機粉體與鹼可溶性樹脂，含有感光性成分之層可形成2層 以上之多層薄膜，在此多層薄膜之上可具有保護薄膜。轉 印薄膜，在支持薄膜上使無機粉體與鹼可溶性樹脂因應需 要塗佈含有感光性成分之組成物，將塗膜乾燥使除去溶劑 之一部份或全部者予以重複來製作。另外’因應需要’可 在支持薄膜上塗佈光阻組成物，使塗膜乾燥來形成光阻 層，在該光阻層上塗佈上述組成物，予以乾燥以製作轉印 -17- 200525579 (15) 薄膜爲佳。 本發明之較佳轉印薄膜之態樣，係如下述。 1.PDP構件之製造方法I爲恰當之轉印薄膜 在支持薄膜上，含有無機粉體與鹼可溶性樹脂與敏輻 射性成分之感光性層（B I )，及含有無機粉體與鹼可溶性 樹脂之具有非感光性層（A 1 )之轉印薄膜，其中，在B1 層之上具有A1層，A1層與B1層，係可滿足下述〇)〜 (i i i )所示條件之至少一種爲其特徵。 (i ) A 1層所含鹼可溶性樹脂之μ w，比B 1層所含鹼 可溶性樹脂之M w更小。 (i i ) Β 1層所含鹼可溶性樹脂具有來自甲基丙烯酸構 造單元之樹脂’ A1層所含鹼可溶性樹脂具有來自丙烯酸構 造單元之樹脂。 (i i i )在A 1層進而含有溶解促進劑，相對於a 1層 所含溶解促進劑之A 1層全重量之含量，比相對於β 1層所 含溶解促進劑之B1層全重量之含量更多。 2 · P D P構件之製造方法〗〗爲恰當的轉印薄膜 在支持溥膜上具有，含有無機粉體與鹼可溶性樹脂之 非感光性層（A 3 )，及含有無機粉體與鹼可溶性樹脂之非 感光性層（A2)之薄膜’其中，在A3層上具有A2層， A 2層與A 3層係至少一種滿足下述（丨v )〜（v丨）所示條 件爲其特徵。 -18- 200525579 (16) (iv ) A2層所含鹼可溶性樹脂之Mw，比A3層所含 鹼可溶性樹脂之Mw更小。 (v ) A 3層所含鹼可溶性樹脂具有來自甲基丙烯酸構 造單元之樹脂，A2層所含鹼可溶性樹脂具有來自丙橋酸 構造單元之樹脂。 (v i )在A 2層進而含有彳谷解促進劑，a 2層所含溶解 促進劑之相對於A2層全重量之含量，比A 3層所含溶解 促進劑之相對於A 3層全重量之含量更多。 又，支持薄膜上’具有含有光阻層，無機粉體與驗可 溶性樹脂之非感光性層（A3)，及含有無機粉體與驗可哲 性樹脂之非感光性層（A 2 )之薄膜，其中，在光阻層上具 有A3層，且在A3層上具有A2層，A2層與A3層係爲至 少一種滿足上述（iv )〜（vi )所示條件爲其特徵者爲 佳。 以下，根據本發明轉印薄膜之各構成要素予以具體說 支持薄膜 支持薄膜係在，具有耐熱性及耐溶劑性之同時，以具 有可撓性之樹脂薄膜爲佳。因支持薄膜具有可撓性，故可 藉由輥塗佈機來塗佈糊狀組成物，使隔壁形成材料層在捲 繞成滾筒狀之狀態下保存，供給。在可形成支持薄膜之樹 脂方面’可例舉例如聚對苯二甲酸乙二醇酯等之聚酯，聚 乙烯，聚丙烯，聚苯乙烯，聚醯亞胺，聚乙烯醇，聚氯乙 -19- 200525579 (17) 録’聚氟乙烯等之含氟樹脂，耐綸，纖維素等。 之厚度爲，例如2 0〜1 0 0 μ m。 另外，在支持薄膜表面以實施離型處理爲佳 在前述轉印步驟中，可使支持薄膜之剝離操作容 A 1層 A 1層係，含有無機粉體，鹼可溶性樹脂， 因應需要之溶解促進劑所成糊狀非感光性之組成 稱爲「組成物a 1」）塗布，使塗膜乾燥並藉由溶 份或全部之除去來形成。 (1 )無機粉體 本發明之組成物a 1所使用之無機粉體，因 之種類而異。 在使用於P D P之隔壁形成材料之無機粉體方 舉玻璃粉末，例如’低融點玻璃釉。此種低融點 面可例舉’ （Ϊ )氧化鋅，氧化硼，氧化矽； B 2 Ο 3 S i Ο 2系），（2 )氧化鉛，氧化硼，氧化矽 B 2 〇 3 S i 〇 2系），（3 )氧化錯，氧化硼，氧化石夕 系（PbO- B2O3 Si〇2Al：2〇3 系），（4)氧化錯， 氧化硼，氧化矽系（Pb〇_ZnO· B2〇3- Si02系） 化鉍，氧化硼，氧化矽系（B i 2 〇 3 B 2 0 3 · S i 0 2系） 氧化鉍，氧化硼，氧化矽，氧化鋁系（B i 2 0 3 B A 1 203系）等。又，其他之無機粉體，例如氧化 支持薄膜 。藉此， 易進行。 溶劑，及 物（以下 劑之一部 形成材料 面，可例 玻璃釉方 系（ZnO-系（PbO-，氧化鋁 氧化鋅， ，（5 )氧 ，（6) )〇3 Si02-鋁粉末可 200525579 (18) 適宜添加。 在使用於p D P之電極形成材料之無機粉體方面，可例 舉Ag，An，Al，Ni，Ag-Pd合金’ Cu’ Cr等之金屬粉。 又，使用於透明電極形成材料之無機粉體方面’可例舉氧 化銦，氧化錫，錫含有氧化銦（ITO )，含有銻氧化錫 (ΑΤΟ )，氟添加氧化銦（FIO )，氟添加氧化錫 (FTO )，氟添加氧化鋅（FZO)，以及，含有選自 Α1， C 〇，F e，I η，S η及T i之一種或者二種以上金屬之氧化鋅 等金屬氧化物所成粉體。 在使周於PDP電阻體形成材料之無機粉體方面，可例 舉Ru02之粉體等。 使用於 P D P螢光體形成材料之無機粉體，可例舉 Y2〇3:Ell3+，'2Si〇5:EU3+，Y3Al5〇】2:Eu3+，YV〇4:EU3+， (Y，Gd) B03:Eu3+，Zn3(P〇4) 2:Mn 等之紅色用螢光 體；Zn2Si〇4:Mn ， BaAl12〇i9:Mn ， BaMgA]】4〇23:Mn ， LaP〇4: ( Ce，Tb ) ，Y3 (A1，Ga) 5012:Tb 等之綠色用螢 光 體 ； Y2Si05:Ce ， BaMgAl]0〇17：Eu2+ ， BaMgAl]4〇23:Eu2+，（ Ca，Sr，Ba) 10 ( P〇4 ) 6C12：Eu2+ ^ (Zn，Cd) S:Ag等之藍色用螢光體。 使用於PDP，LCD，有機EL元件等之濾色器形成材 料之無機粉體，紅色用方面可例示Fe2〇3等，綠色用方面 Cr2〇3等，藍色用方面CoO AI2O3等。 在使用於PDP，LCD，有機EL元件等黑矩陣形成材 料之無機粉體方面，可例舉Μη，Fe，Cr等之金屬粉或， -21 - 200525579 (19)200525579 说明 IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a plasma display panel member, and a transfer film that can be suitably used by the manufacturing method. [Prior art] In recent years, flat-panel fluorescent displays have been widely used as plasma displays. Fig. 1 is a schematic diagram showing a cross-sectional shape of an AC plasma display panel (hereinafter referred to as "PDP"). In the figure, 1 and 2 are glass substrates disposed opposite to each other, and 3 is a partition wall. The circuit substrate is formed by dividing the glass substrate I, the glass substrate 2 and the partition wall 3 into cells. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode 4 to reduce the resistance of the transparent electrode 4, 6 is an address electrode fixed to the glass substrate 2, and 7 is The fluorescent substance held in the circuit cell (8) is a dielectric layer formed on the surface of the glass substrate 1 to cover the transparent electrode 4 and the bus electrode 5; 9 is to cover the address electrode 6 on the glass substrate The dielectric layer formed on the surface 2 is a protective film made of, for example, magnesium oxide. Further, in a color PDP, in order to obtain a high contrast image, a color filter (red green blue), a black matrix, or the like may be provided between a glass substrate and a dielectric layer. For forming the partition wall, electrode, resistor, phosphor, color filter, and black stripe (matrix) of the PDP member, photolithography is appropriate. Here, the photolithography method refers to forming a layer of a paste-like photosensitive composition containing an inorganic powder and a vehicle on a substrate such as -4-200525579 (2) Surfaces The method of exposing and developing to form a pattern, and then baking this pattern to remove organic matter and sinter the inorganic powder. In particular, by using a photolithography method in which a transfer film having a layer formed of a photosensitive composition is used to transfer characteristics on the surface of a substrate, etc., a film having excellent thickness uniformity can be obtained. At the same time, work efficiency is improved For very good. In the above method ', for example, in the case of forming a partition wall, the organic material can be removed in the firing step to reduce the film thickness, so that the transfer layer needs to be approximately 1 to 3 to 2 times the thickness of the partition wall film to be formed. For example, in order to make the film thickness of the partition wall from 100 to 150 μΐΏ, it is necessary to set the thickness of the transfer layer to about 130 to 300 μm. From the viewpoint of exhibiting good electrical characteristics, the partition wall constituting the PDP is expected to have a high aspect ratio and a uniform shape. However, when the thickness of the transfer layer is large, the sidewall of the pattern tends to become a concave shape during development, and it is difficult to obtain a uniform and good partition wall in the pattern shape. In addition, when the sidewall of the pattern is subjected to firing treatment in a recessed state during development, the pattern may be peeled off or greatly deformed. In order to solve such a problem, for example, in a method for manufacturing a partition wall for a PDP, a film for a composition for forming a partition wall has a layer for laminating a composition for forming a partition wall having a solubility difference of 2 or more with respect to a developer Inventions of a method for manufacturing a PDP partition having a structure characteristic are disclosed (for example, refer to Patent Documents 1 and 2). However, in the method disclosed above, only the copolymer composition ratio of the composition is changed to change the solubility. There may be cases where the difference in solubility is not sufficient. When the pattern shape is uniform and a good partition is obtained, It is still a problem at present. 200525579 (3) Patent Document 1: Japanese Patent Application Laid-Open No. 9-92137 Patent Document 2: Japanese Patent Application Laid-Open No. 2000- 2 2 8 I 4 [Inventive Content] • [Problems to be Solved by the Invention] The present invention The subject is to provide a method for manufacturing a PD p member having an excellent pattern shape and a transfer film that can be suitably used in the manufacturing method. [Means for Solving the Problem] The manufacturing method of the first PDP member (hereinafter, referred to as "PDP member manufacturing method 1") of the present invention includes, (1) forming a non-containing inorganic powder and an alkali-soluble resin on a substrate. The step of the photosensitive layer (A 1), (2) the step of forming a photosensitive layer (B 1) containing inorganic powder, an alkali-soluble resin and a radiation-sensitive component on the A 1 layer, and (3) making B 1 Step of layer exposure processing to form a pattern of latent image, (4) Step of forming a pattern of layer B 1 through development processing, (5) Through the pattern of layer B1, through development processing, select A1 layer A step of forming a pattern of layer A 1 and (6) a step of firing the obtained pattern, a method for manufacturing a panel member of a plasma display, wherein the layer A 1 and the layer B 1 are It satisfies at least one of the conditions shown in the following (i) to (iii). (I) A] Polystyrene-equivalent weight of the rhenium-soluble resin contained in the layer -6-200525579 (4) Average molecular weight, compared with B The weight-average molecular weight of polystyrene based on alkali-soluble resin contained in one layer is smaller. (Ii) A1 layer The alkali-soluble resin contained has a resin derived from an acrylic structural unit, and the alkali-soluble resin contained in layer B 1 has a resin derived from a methylpropionic acid structural unit. (Iii) A) further contains a dissolution promoter, and the A1 layer contains The content of the dissolution accelerator with respect to the total weight of the A1 layer is more than the content of the dissolution promoting agent contained in the B1 layer with respect to the total weight of the B1 layer. The manufacturing method of the second PDP member of the present invention (hereinafter referred to as "" PDP component manufacturing method II "), containing (1) a step of forming a non-photosensitive layer (A2) containing inorganic powder and an alkali-soluble peptone on the substrate, and (2) forming a layer on the A2 layer A step of forming a non-photosensitive layer (A3) containing inorganic powder and an alkali-soluble tree ^, (3) a step of forming a photoresist layer on the A3 layer, and (4) exposing the photoresist layer to form a pattern Step of latent image '(5) Step of forming pattern of photoresist layer by developing process, (6) Through pattern of photoresist layer, selectively dissolving A3 layer and A2 layer by developing process to The step of forming the pattern of the A 3 layer and the A 2 layer, and the step of firing the pattern obtained in (7) A method for manufacturing a plasma display panel member, wherein the A2 layer and the A3 layer system can satisfy at least one of the conditions shown in the following (i v) to (v i). -7- 200525579 (5) (i v) The average molecular weight of polystyrene-equivalent weight of the alkali-soluble resin contained in layer A2 is smaller than the average molecular weight of polystyrene-equivalent weight of alkali-soluble resin contained in layer A3. (v) The alkali-soluble resin contained in layer A 2 has a resin derived from an acrylic structural unit, and the alkali-soluble resin contained in layer A 3 has a resin derived from a methacrylic structural unit. (vi) The layer A2 further contains a dissolution accelerator, and the content of the dissolution accelerator contained in the layer A2 with respect to the total weight of the layer A2 is greater than the content of the dissolution accelerator contained in the layer A3 with respect to the total weight of the layer A3. More. The transfer film of the present invention is on a support film, and contains inorganic powder, alkali-soluble resin, and a photosensitive component according to needs. One layer can form a transfer film of more than two layers, which satisfies the following (a) ~ (C) At least one of the conditions shown is characteristic. (a) The polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in any of the layers (I) formed on the supporting film is higher than that of the alkali contained in the other layer (11) formed on the (I) layer The polystyrene equivalent weight average molecular weight of the soluble resin is large. (b) The alkali-soluble resin contained in any one of the layers (III) formed on the supporting film has a resin derived from a methacrylic acid structural unit, and the alkali contained in the other layer (IV) formed on the (III) layer The soluble resin has a resin derived from an acrylic structural unit. (c) Any one of the layers (V) formed on the supporting film may form another layer (VI), and at least the (VI) layer further contains a dissolution promoter, and the dissolution promoter contained in the (VI) layer Relative to the total amount of (VI) layer-8-200525579 (6) The amount of a is more than the total weight of (v) layer of the dissolution accelerator contained in the (v) layer. The method for manufacturing a PDP member of the present invention is particularly useful for manufacturing a partition wall. The inorganic powder contained in the transfer film is preferably glass powder. [Effects of the Invention] According to the method for manufacturing a p D P member of the present invention, a member having an excellent pattern shape can be formed. In addition, when the transfer film of the present invention is used, a PDP member having a uniform film thickness can be formed, and the number of steps can be substantially reduced, so that work efficiency can be improved. [The best form of the present invention] Hereinafter, the present invention will be described in detail. &lt; Manufacturing method 1 of PDP member: &gt; The manufacturing method I of the PDP member of the present invention contains [1] a step of forming a non-photosensitive layer (A1), and [2] a step of forming a photosensitive layer (b1) ' [3] B1 layer exposure step, [4] B1 layer and A1 layer development step and [5] firing step. According to the manufacturing method I, a PDP member selected from at least one of a partition wall, an electrode 'resistor, a phosphor, a color filter, and a black matrix is formed. The manufacturing method of the PDP member of the present invention is particularly useful in forming a partition wall. Hereinafter, each step 骡 'of the present invention will be described by taking the production of the next wall as an example. 200525579 (7) [1] Step of forming non-photosensitive layer (A 1) This step is to form a non-photosensitive layer (A 1) on a substrate. The composition constituting the a 1 layer (hereinafter referred to as "composition a") has the same constituents as those of the non-photosensitive layer (A 1) having the transfer film of the present invention described later. The A 1 layer can be formed by coating the composition a j by various methods such as a screen printing method, a roll coating method, a spin coating method, a casting method (ca s t i n g) coating method, and a transfer method, and then drying the coating film. From the viewpoint of the thickness uniformity of the obtained layer and the work efficiency, it is also possible to form the A 1 layer on the substrate using a transfer film. The transfer film 'used here is a film formed by an A 1 layer on a support film. The transfer film may have a protective film on the A1 layer. In addition, the supporting film used here has the same constituents as the supporting film having the transfer film of the present invention described later. An example of the transfer process is shown below. After peeling off the protective film layer of the transfer film to be used as needed, the transfer film is overlapped in such a manner that the surface of the A1 layer abuts on the substrate surface. Thereafter, the support film was peeled off and removed by heating and hot-pressing. Thereby, the A1 layer is transferred to the substrate surface in a tight state. Regarding the transfer conditions, the surface temperature of the heating roller was 80 to 140 ° C, the roll pressure was 1 to 5 kg / cm2, and the moving speed was 0 to 10.0 m / min. The substrate may be preheated, and the preheating temperature is, for example, 40 to 1000 t :. The thickness of the A1 layer varies depending on the member to be formed, but in the case of the partition wall, it is usually 50 to 150 μm, and preferably 70 to 200 μm. -10- 200525579 (8) [2] Step of forming photosensitive layer (B 丨) In this step, a photosensitive layer (B) is formed on the A1 layer. The composition (hereinafter referred to as "composition bl") constituting the B] layer is the same as the constituents of the photosensitive layer (B1) having the transfer film of the present invention described later. The B1 layer 'is formed in the same manner as the A] layer. Therefore, the B] layer 'can be formed on the A 1 layer by using a transfer film. According to this method ', a layer having excellent thickness uniformity can be formed, and work efficiency can be improved. The thickness of the β 1 layer varies depending on the member to be formed, but in the case of the partition wall ', it is usually 50 to 150 μm, and preferably 70 to 12 μm. Step [1] can be performed separately from step [2], but from the viewpoint of uniform film thickness and improved work efficiency, using the transfer film of the present invention, step [1] and step [2] are performed collectively The method is particularly good. [3] Exposure step of the B 1 layer In this step, the β 1 layer surface formed on the A1 layer is selectively irradiated (exposed) with ultraviolet rays or the like through an exposure mask to form B 1 Latent image of layer pattern. The radiation irradiation device is not particularly limited, but an ultraviolet irradiation device used in a general photolithography method, or an exposure device used in the manufacture of a semiconductor or a liquid crystal display device can be used. 〔4〕 Development step of B 1 layer and A 1 layer In this step, the exposed B 1 layer is developed to make the latent image -11-200525579 (9). The pattern of B1 layer is formed. Therefore, 'the pattern of the A1 layer is selectively formed by developing the pattern of the B1 layer and selectively dissolving the A1 layer by the development process'. The developing conditions such as the type, composition, concentration, developing time, and developing temperature of the developing solution can be appropriately selected according to the type of the resin in the B 1 layer and the A 1 layer. Further, development can be performed by various development methods such as a dipping method, a shaking method, a rinsing method, and a spray method 'dipping method. The developing device is also not particularly limited. Therefore, in the developing step, a pattern (corresponding to the pattern of the exposure mask) of the B layer formed by the residual portion of the B 1 layer and the removed portion of the B 1 layer can be formed. This pattern can be used as the A1 layer for continuous development. Mask to work. That is, the part of the A1 layer corresponding to the B1 layer removing portion is dissolved in the developer and can be selectively removed. When the development process is continued, the surface of the substrate corresponding to the removed portion of the B 1 layer is exposed. Thereby, under the B1 layer pattern, an AI layer pattern corresponding to the B1 layer pattern can be formed. [5] Step of roasting treatment: In this step, the layer having the pattern formed is subjected to a roasting treatment. Thereby, the organic substance in the layer is burned out, and a layer formed by an inorganic substance can be formed, and a PDP member formed on the substrate surface can be obtained. For the temperature of the roasting treatment, the temperature at which the organic matter in the layer is lost is necessary, and it is usually 400 to 600 ° C. The firing time is usually 10 to 90 minutes. -12- 200525579 (10) A1 layer and B1 in the above ~ (iii) ~ ~ (iii) developer solution is difficult to sink, condition (i) condition (calculated weight average alkali soluble tree average molecular weight weight average B1 layer The Mw of the contained age is good. Condition (Π) Condition (: Acid construction unit based acrylic structure A 1 layer contained in the full repeat order: I 0 ~ 4 0 weight layer relationship Manufacturing method 1, A1 layer With the B1 layer, it is necessary to satisfy at least one of the following conditions (0). By satisfying at least one of the following (i) conditions, the A1 layer is more soluble than the B1 layer. Therefore, during development At the time of processing, the side wall of the pattern can obtain a PDP member with excellent pattern shape. I) System, the molecular weight of polystyrene (hereinafter referred to as "Mw") of the alkali-soluble resin contained in layer A1 is lower than that of layer B]. The fat Mw is smaller. The so-called polystyrene-equivalent weight (Mw) in the present invention means the polystyrene-equivalent molecular weight measured according to GPC. In order to make the effect of the present invention more significant, the Mw of the soluble resin And, the difference in alkali solubility tree contained in layer A] is preferably 5,000 ~ 60,000, 1 5000 ~ 40,000 more ii) system, the alkali-soluble resin contained in layer A 1 has a resin derived from propylene, and the alkali-soluble resin contained in layer B 1 has a resin derived from formazan units. In order to make the effect of the present invention remarkable, then The ratio of the soluble resin derived from the acrylic structural unit is generally in the range of 5 to 50% by weight, preferably,%, and particularly preferably in the range of 15 to 30% by weight. 13- 200525579 (11) The effect of the present invention is remarkable. The ratio of the alkali-soluble resin contained in the layer B 1 from the methacrylic acid structural unit is usually in the range of 5 to 50% by weight in the fully-replicated unit, which is more than Preferably, it is in the range of 10 to 40% by weight, and particularly preferably in the range of 15 to 300% by weight. In order to make the effect of the present invention more remarkable, it is better that the layers A] and B1 can satisfy the above requirements at the same time. (C) Condition (iii) Condition (iii) may further include a dissolution accelerator in the layer A1. Therefore, the layer B1 usually does not contain a dissolution accelerator, and even if it is contained as an optional component, the layer A1 contains The content of the dissolution accelerator relative to the total weight of the A] layer is more than that of B 1 It is necessary that the content of the dissolution accelerator is more than the total weight of the B 1 layer. &Lt; Manufacturing method of PDP member 11 &gt; The manufacturing method II of the PDP member of the present invention contains [1] a non-photosensitive layer ( A2) forming step, [2] non-photosensitive layer (A3) forming step, [2. photoresist layer forming step, [3] photoresist layer exposing step, [4] photoresist layer, A3 layer and A2 layer developing step and [5] baking step. According to the manufacturing method II, a panel member selected from at least one of a partition wall, an electrode, a resistor, a phosphor, a color filter, and a black matrix can be formed. The manufacturing method of the PDP member of the present invention is particularly useful in the formation of a partition wall. Each of the above steps corresponds to each step of the manufacturing method 1 of the PDP member. Also, the above steps [1], [2], and [2,] can be performed individually -14- 200525579 (12), but from the viewpoint of uniformity of film thickness and improvement of work efficiency, the conversion of the present invention is used. The method of printing a film to perform step [1], step [2], and step [2 1] collectively is particularly preferable. Relationship between the A2 layer and the B2 layer In the aforementioned manufacturing method Π, the A 2 layer and the A 3 layer are required to satisfy at least one of the conditions shown in the following (iv) to (vi). By satisfying at least one of the following conditions (i v) to (v i), the A 2 layer becomes easier to dissolve with respect to the developing solution than the A 3 layer. Therefore, it is difficult to dent the sidewalls of the pattern during the development process' to obtain a PDP member having an excellent pattern shape. (a) Condition (iv) Condition (i v) is the μ w of the alkali-soluble resin contained in the 'A 2 layer, which is smaller than that of the alkali-soluble resin M w contained in the A 3 layer. In order to make the effect of the present invention more remarkable, the difference between the Mw of the alkali-soluble resin contained in the A3 layer and the Mw of the alkali-soluble resin contained in the A2 layer is preferably 5,0 0 0 to 60,00 00 '10,000 to 40,000. Better. Condition (v) Condition (v) is that the alkali-soluble resin contained in layer A 2 has a resin derived from the propionic acid structural unit, and the soluble matter contained in layer A 3 has been tested. The tree has a resin derived from a methacrylic acid structural unit. . In order to make the effect of the present invention more salty, the ratio of the alkali-soluble resin contained in the layer A 2 from the acrylic structural unit is usually in the range of 5 to 50% by weight in the full repeat unit, which is higher than 200525579 ( 13) It is preferably in the range of 10 to 40% by weight, and particularly preferably in the range of 15 to 30% by weight. In addition, in order to make the effect of the present invention more remarkable, the ratio of the structural unit derived from methacrylic acid of the alkali-soluble resin contained in the A 3 layer is usually in the range of 5 to 50% by weight in the full-repeat unit, Preferably, it is 10 to 40% by weight, and particularly preferably, it is in the range of 15 to 30% by weight. In order to make the effect of the present invention more remarkable, it is better that the A 2 layer and the A 3 layer can satisfy the above requirements at the same time. (c) Condition (vi) Condition (W) is a solution in which a dissolution promoter is further contained in the layer A2. Therefore, 'A3 layer usually does not contain a dissolution accelerator. Even if it contains any component, the content of the dissolution accelerator contained in the A2 layer relative to the total weight of the A2 layer is greater than that of the dissolution accelerator contained in the A3 layer. It is necessary that the content is more than the total weight of the A 3 layer. Hereinafter, the materials used in each step of the aforementioned manufacturing methods 1 and II of PDP members, various conditions, etc. will be described. The substrate material is an insulating material such as glass, silicon, or alumina. The surface of this substrate can be treated with pharmaceuticals caused by silane coupling agents, etc. as required; plasma treatment; pre-treatments such as film formation by ion plating, sputtering, vapor phase reaction, vacuum evaporation, etc. . Exposure mask The exposure pattern of the exposure mask used in the exposure step differs depending on the purpose, but it can be used, for example, for a strip with a width of 10 to 5 00 μm. 200525579 (14) Developing solution In terms of the developing solution used in the present invention, alkaline developing solution is preferred to check the effective components of the developing solution, and examples thereof include hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, and phosphoric acid. Dihydrogen, dipotassium phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium dibasic phosphate, lithium oxalate, sodium silicate, potassium silicate, lithium carbonate, sodium carbonate, carbonate_ , Lithium borate, sodium borate, potassium borate, ammonia and other inorganic basic compounds; aerobic oxidation of tetramethylanisole, aerobic oxidation of dimethyl ethyl acetate, monomethylamine, monoamine, trimethylamine, monoethylamine , Organic compounds such as diethylamine, triethylamine, monoisopropylamine, diisopropylamine, ethanolamine, etc. The alkali developing solution is prepared by dissolving one or two or more of the aforementioned test compounds in water or the like. The concentration of the test compound in the alkaline developing solution is usually 0. 0 0 1 to 10 mass / °, preferably 0. 0] to 5 mass%. In addition, after the development treatment by the alkali developer is performed, the water washing treatment is usually performed. <Transfer Film> The transfer film of the present invention is on a support film, and an inorganic powder and an alkali-soluble resin can be used as required. A layer containing a photosensitive component can form a multilayer film of two or more layers on top of this multilayer film. May have a protective film. A transfer film is produced by repeatedly coating an inorganic powder and an alkali-soluble resin on a supporting film with a composition containing a photosensitive component, drying the coating film, and removing a part or all of the solvent. In addition, as needed, a photoresist composition can be coated on a supporting film, the coating film is dried to form a photoresist layer, the above composition is coated on the photoresist layer, and dried to make a transfer-17- 200525579 ( 15) Film is preferred. The preferred aspect of the transfer film of the present invention is as follows. 1. The manufacturing method of the PDP member I is a suitable transfer film on a supporting film, a photosensitive layer (BI) containing inorganic powder and an alkali-soluble resin and a radiation-sensitive component, and a photosensitive layer containing an inorganic powder and an alkali-soluble resin. A transfer film having a non-photosensitive layer (A 1), in which an A1 layer, an A1 layer, and a B1 layer are provided on the B1 layer, and at least one of the conditions shown in the following 0) to (iii) is satisfied feature. (i) The μ w of the alkali-soluble resin contained in the layer A 1 is smaller than the M w of the alkali-soluble resin contained in the layer B 1. (i i) Alkali-soluble resin contained in layer B1 has resin derived from methacrylic acid building units' Alkali-soluble resin contained in layer A1 has resin derived from acrylic acid building units. (iii) A layer 1 further contains a dissolution accelerator, and the content relative to the total weight of the layer A 1 of the dissolution accelerator contained in the layer a 1 is greater than the content of the total weight of the layer B 1 dissolution accelerator contained in the β 1 layer. More. 2 · Manufacturing method of PDP member: It is a suitable transfer film on a support film, which contains a non-photosensitive layer (A 3) containing inorganic powder and alkali-soluble resin, and a layer containing inorganic powder and alkali-soluble resin. The film of the non-photosensitive layer (A2) is characterized in that it has an A2 layer on the A3 layer, and at least one of the A2 layer and the A3 layer satisfies the conditions shown in the following (丨 v) to (v 丨). -18- 200525579 (16) (iv) The Mw of the alkali-soluble resin contained in the A2 layer is smaller than the Mw of the alkali-soluble resin contained in the A3 layer. (v) The alkali-soluble resin contained in the A3 layer has a resin derived from a methacrylic acid building unit, and the alkali-soluble resin contained in the A2 layer has a resin derived from a propionate structural unit. (vi) The A 2 layer further contains a gluten decomposition accelerator, and the content of the dissolution accelerator contained in the a 2 layer relative to the total weight of the A 2 layer is greater than the dissolution accelerator contained in the A 3 layer relative to the total weight of the A 3 layer. More content. In addition, on the supporting film, a film having a non-photosensitive layer (A3) containing a photoresist layer, an inorganic powder and a soluble resin, and a non-photosensitive layer (A 2) containing an inorganic powder and a soluble resin Among them, there is an A3 layer on the photoresist layer and an A2 layer on the A3 layer, and the A2 layer and the A3 layer are at least one that satisfies the conditions shown in the above (iv) to (vi) as its characteristics. Hereinafter, the constituent elements of the transfer film of the present invention will be specifically described. A supporting film is preferably a resin film having flexibility while having heat resistance and solvent resistance. Since the supporting film is flexible, the paste-like composition can be applied by a roll coater, and the partition wall forming material layer can be stored and supplied while being wound into a roll shape. As for the resin capable of forming a supporting film, polyesters such as polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, and polyvinyl chloride may be exemplified. 19- 200525579 (17) Record 'fluorinated resins such as polyvinyl fluoride, nylon, cellulose, etc. The thickness is, for example, 20 to 100 μm. In addition, it is better to perform a release treatment on the surface of the support film. In the foregoing transfer step, the peeling operation capacity of the support film can be A 1 layer A 1 layer system, containing inorganic powder, alkali-soluble resin, and dissolution promotion according to need. The paste-like non-photosensitive composition formed by the agent is referred to as "composition a 1"), and the coating film is dried and formed by removing all or all of the solvent. (1) Inorganic powder The inorganic powder used in the composition a 1 of the present invention varies depending on the kind. As the inorganic powder used as a material for forming a partition wall of P D P, a glass powder such as a 'low melting point glass glaze' is used. Such low melting point surfaces can be exemplified by '(Ϊ) zinc oxide, boron oxide, and silicon oxide; B 2 Ο 3 S i 〇 2 series), (2) lead oxide, boron oxide, and silicon oxide B 2 〇3 S i 〇2 system), (3) oxidized oxide, boron oxide, stone oxide (PbO-B2O3 Si〇2Al: 203 system), (4) oxidized oxide, boron oxide, silicon oxide (Pb〇_ZnO · B2〇3-Si02 system) Bismuth oxide, boron oxide, silicon oxide system (B i 2 〇3 B 2 0 3 · S i 0 2 system) Bismuth oxide, boron oxide, silicon oxide, alumina system (B i 2 0 3 BA 1 203 series) and so on. Also, other inorganic powders, such as an oxidation support film. This makes it easy. Solvents and transits (one of the following agents forms the material surface, for example, glass glaze square (ZnO-based (PbO-, alumina, zinc oxide, (5) oxygen, (6))) SiO2-aluminum powder may 200525579 (18) It is suitable to add. As for the inorganic powder used for the electrode forming material of p DP, metal powders such as Ag, An, Al, Ni, Ag-Pd alloy 'Cu' Cr, etc. can be exemplified. In terms of the inorganic powder of the transparent electrode forming material, indium oxide, tin oxide, tin containing indium oxide (ITO), antimony tin oxide (ATO), fluorine-added indium oxide (FIO), fluorine-added tin oxide (FTO) Fluorine-added zinc oxide (FZO), and powders made of metal oxides such as zinc oxide containing one or more metals selected from A1, C0, F e, I η, S η, and T i. In terms of inorganic powders used in the PDP resistor-forming material, powders such as Ru02 can be cited. For inorganic powders used in the PDP phosphor-forming material, Y2〇3: Ell3 +, '2Si〇5: EU3 +, Y3Al5〇] 2: Eu3 +, YV〇4: EU3 +, (Y, Gd) B03: Eu3 +, Zn3 (P〇4) 2: Mn and other red phosphors Zn2Si〇4: Mn, BaAl120i9: Mn, BaMgA]] 4〇23: Mn, LaP〇4: (Ce, Tb), Y3 (A1, Ga) 5012: Tb and other green phosphors; Y2Si05: Ce, BaMgAl] 0〇17: Eu2 +, BaMgAl] 4〇23: Eu2 +, (Ca, Sr, Ba) 10 (P〇4) 6C12: Eu2 + ^ (Zn, Cd) S: Ag, etc. Inorganic powder used as a color filter forming material for PDP, LCD, and organic EL elements. Examples of red are Fe2O3, green, Cr2O3, and blue. CoO, AI2O3, etc. For inorganic powders used in black matrix forming materials such as PDP, LCD, and organic EL elements, metal powders such as Mn, Fe, and Cr, or -21-200525579 (19)

Cu〇-Cr203 ， Cu0-Fe2 03 - Mn2〇3 ， Cu0-Cr2 0 3 -Mn 2 0 3 ， Co〇-Ρ^2〇3-(^2〇3等之複合氧化物之粉體。 另外，在電極，電阻體，螢光體，濾色器，黑矩陣之 形成材料等，使用低融點玻璃釉以外之無機粉體之情形， 可倂用使用於隔壁形成材料之低融點玻璃釉。此情形之低 融點玻璃釉之含量，因用途而異，但，通常相對於含低融 點玻璃釉之無機粉體全量1 00重量份爲50重量份以下。CuO-Cr203, Cu0-Fe2 03-Mn2O3, Cu0-Cr2 03-Mn2 0 3, Co0-P ^ 2〇3-(^ 2〇3, etc. powders of composite oxides. In addition, In the case of electrodes, resistors, phosphors, color filters, black matrix forming materials, and other inorganic powders other than low-melting-point glass glazes, low-melting-point glass glazes can be used as materials forming the partition. The content of the low-melting-point glass glaze in this case varies depending on the application, but it is usually 50 parts by weight or less based on 100 parts by weight of the inorganic powder containing the low-melting point glass glaze.

(2 )鹼可溶性樹脂 使用於組成物a 1之鹼可溶性樹脂方面，可使周名種 樹脂，具有黏合樹脂用途者。 在此，「鹼可溶性」係指，在可處理爲目的之顯〶處 理之程度±，溶解於前述驗顯影液之性質。在此驗可溶性 樹脂方面’浙構件之製造方法！中可因應必須滿足Μ 層與B 1層之條件（〗）〜（i i i )而可使用。 在P DP構件之製造方法中可滿足條件（i ) 造方法I ( i )來簡稱。 以卞，例如， 1胃形則以製(2) Alkali-soluble resins Used for alkali-soluble resins in the composition a1, it is possible to make resins of various kinds and use them as adhesive resins. Here, the "alkali solubility" means the property of being dissolved in the aforementioned developer solution to the extent that it can be processed for the purpose of significant processing. In this test of soluble resin, ‘Zhejiang ’s manufacturing method! Zhong can be used because it must meet the conditions of the M layer and the B 1 layer (〗) ~ (i i i). In the manufacturing method of the P DP member, the condition (i) can be satisfied, and the manufacturing method I (i) can be simply referred to. For example, 1 stomach shape is made by

_可溶性樹 簞體（B ) 韆（A)之 製造方法I ( i )中，組成物al所使用之 脂方面，以選自下述單體（A)之單體，與選自 及/或單體（C)之單體之共聚物較佳。藉由壤 共聚，可對樹脂賦與鹼可溶性。 -22- 200525579 (20) 單體（A ): 丙烯酸，甲基丙烯酸，順丁烯二酸，反丁烯二酸，巴 豆酸，伊康酸，檸康酸（c i 11· a c ο n i c a c 1 d )，中康酸，肉 桂酸，琥珀酸單（2-(甲基）丙烯醯氧乙基），ω-羧基-聚 己內酯單（甲基）丙烯酸酯等之含羧基單體類； (甲基）丙烯酸2-羥基乙酯基，（甲基）丙烯酸2-羥 基丙酯，（甲基）丙烯酸3 -羥基丙酯，（α —羥基甲基） 丙烯酸酯等之含羥基單體類； 鄰羥基苯乙烯，間羥基苯乙烯，對羥基苯乙烯等之苯 酚性含羥基之單體類等所代表之含鹼可溶性官能基單體 單體一（Β ): (甲基）丙烯酸甲酯，（甲基）丙烯酸乙酯，（甲 基）丙烯酸正丁酯，（甲基）丙烯酸苄酯，環氧丙基（甲 基）丙烯酸酯，二環戊基（甲基）丙烯酸酯等之單體 (甲）以外之（甲基）丙烯酸酯類；苯乙烯，α-甲基苯乙 烯等芳香族乙烯系單體類；丁二烯，異戊二烯等共軛二烯 類等所代表之單體（甲）與可共聚之單體類， 單體（C): 聚苯乙烯，聚（甲基）丙烯酸甲酯，聚（甲基）丙烯 酸乙酯，聚（甲基）丙烯酸苄酯等之聚合物鏈之一方之末 端，具有（甲基）丙烯醯基等聚合性不飽和基之巨單體等 -23- 200525579 (21) 所代表之巨單體類， 特佳之單體（A )方面，可例舉丙烯酸，甲基丙烯酸 等。又，來自單體（A)之構造單元之含量，在全重覆單 元中，通常，5〜5 0重量％，較佳爲，1 〇〜4 0重量％，特 佳爲，15〜30重量％。又上述單體（A)之共聚成分（B) 及（C )中，特佳之單體可例舉甲基丙烯酸正丁酯。 (2-b )製造方法1 ( ii )之情形 製造方法I ( i i )中’組成物a 1所使用之鹼可溶性樹 脂方面可使用各種樹脂，但，以具有來自丙烯酸構造單元 之樹脂，亦即使丙烯酸（共）聚合所得樹脂爲必須。另 外，上述鹸可溶性樹脂係如前述’將來自丙烯酸之構造單 元，在全重覆單元中，通常含有爲5〜50重量％，較佳爲 1 0〜4 0重量·· ％，特佳爲1 5〜3 0重量％之範圍。 使丙烯酸與其他單體共聚之情形’在丙嫌酸之共聚成 分則以選自下述單體（A，）〜（c ’）之單體爲佳’尤以單 體（B ’）較佳。 單體（A’）： 順丁烯二酸，反丁烯二酸，巴豆酸’伊康酸’檸康酸 (citraconic acid)，中康酸’肉桂酸’號ϊ白酸單（2-(甲 基）丙烯醯氧乙基），ω-羧基-聚己內醋單（甲基）丙稀 酸酯等之丙烯酸以外之含羧基之單體類； (甲基）丙烯酸2 -羥基乙酯’（甲基）丙燃酸2 -經基 -24- 200525579 (22) 丙醋’（甲基）丙烯酸3 -羥基丙酯等之含羥基之單體類； 鄰經基苯乙嫌，間羥基苯乙烯，對羥基苯乙烯等含苯酚性 經基之單體類等所代表之含鹼可溶性官能基之單體類， 單體（B’）： (甲基）丙烯酸甲酯，（甲基）丙烯酸乙酯，（甲 基）丙綠酸正丁酯，（甲基）丙烯酸苄酯，環氧丙基（甲 基）丙燒酸醋’二環戊基（甲基）丙烯酸酯等之單體 (甲）以外之（甲基）丙烯酸酯類；苯乙烯，α_甲基苯 乙嫌等之芳香族乙烯系單體類；丁二烯；異戊二烯等之共 I厄一儲類等所代表之單體（甲）與可共聚之單體類， 單體-(C，.）： 聚本乙稀’聚（甲基）丙烯酸甲酯，聚（甲基）丙烯 酸乙醋’聚（甲基）丙烯酸苄酯等之聚合物鏈之一方末 牺’具有（甲基）丙烯醯基等之具有聚合性不飽和基之巨 單體等所代表之巨單體類， (2 **c )製造方法I ( i i i )之情形 在製迎方法1 ( iii )中，組成物al所使用之鹼可溶性 樹S曰，在上述製造方法i ( i )中，與組成物a i所使用之 樹脂相同。 (2d)聚合方法，條件，及分子量等 上述驗可溶性樹脂之聚合，例如可以自由基聚合來進 -25- 200525579 (23) 行。自由基聚合之引發劑方面，可使用偶氮異丁腈，過氧 化苯醯基等。在自由基聚合之溶劑方面，可使用丙二醇單 甲基醚乙酸酯，丙二醇單甲基醚等。聚合溫度可在通常50 〜100，進行，聚合時間通常爲30〜600分。 鹼可溶性樹脂之]\4〜，通常爲5,000〜500,000，較佳 爲]0,000 〜200,000 〇 鹼可溶性樹脂之Mw，例如，可以單體與聚合引發劑 之比來控制。 組成物a 1中鹼可溶性樹脂之含量方面，相對於無機 粉體1〇〇重量份，通常爲1〜500重量份，較佳爲5〜]00 重量份，特佳爲1 5〜4 0重量份。 (3 ):溶解促進劑 在上述製造方法I ( i i i )之情形，，在組成物a 1進而 可含有溶解促進劑。 在組成物a 1含有溶解促進劑時，可提高組成物al所 成 A1層之顯影速度。另外，上述製造方法I(i)及I (i i )之任一情形，任意成分係可使溶解促進劑含於組成 物al。 在斯等溶解促進劑方面，並無特別限定，但可例舉， 聚乙二醇，聚丙二醇，聚丁二醇等之聚烷撐二醇； 乙基纖維素，羥乙基纖維素，羥丙基纖維素，殘甲基 纖維素，羧甲基乙基纖維素等之纖維素類； 聚乙烯醇，澱粉，葡聚糖，糊精，殼聚糖，膠原，明 -26- 200525579 (24) 膠’菠羅蛋白酶 （b r 〇 m e 1 i η ) 等之兩親媒性 (amphipathic)化合物； 油酸，亞油酸，亞麻酸，硬脂酸，棕櫚酸，月桂酸等 之高級脂肪酸； 聚氧乙烯烷基醚，聚氧烷撐烷基醚，聚氧烷撐壬基苯 基醚’醇羥乙基酯，甘油脂肪酸酯，聚氧乙烯脂肪酸酯， 聚氧乙烯硬化蓖麻油，聚氧乙烯烷基胺，烷基烷醇醯胺， 山梨聚糖脂肪酸酯等之非離子性界面活性劑等。 該等中，以兩親媒性化台物及非離子t生界面活性劑爲 佳，其中以聚烷撐二醇類，在形成轉印薄膜情髟之構件彤 成材料層之燃燒性之觀點而言爲佳，尤以，聚乙二醇及聚 汽一醇較佳。 (4 )溶劑 構成組成物a 1之溶劑，爲賦與該組成物a 1之流動性 ^ 塑性，或形成良好膜所含有者。 構成組成物a 1之溶劑方面，並無特別限制，例如， 酿類，酯類，醚酯類，酮類，酮酯類，醯胺類醯胺酯類， 内醯胺類內酯類，亞颯類，颯類，烴類，鹵化烴類等。 此種溶劑之具體例方面，可例舉四氫呋喃，苯甲醚， 〜嚼烷，乙二醇單烷醚類，二乙二醇而烷醚類，羥基丙酸 _類，烷氧基丙酸酯類，乳酸酯類，乙二醇單烷基醚乙酸 酷類，丙二醇單烷醚乙酸酯類，烷氧基乙酸酯類，環式酮 ㉙’非環式酮類，乙醒乙酸酯類，丙酮酸醋類，]sj，N -二 -27- 200525579 (25) 烷基甲醯胺類，N，N-二烷基乙醯胺類，N-烷基吡咯啶酮 類’ γ -內酯類，二烷基亞碾類：，二烷基颯類，篕烯醇 (tei*pine(&gt;〇 ’ Ν_甲基-2_吡略啶酮等，該等可單獨或組合 2種以上使用。 在組成物a 1中溶劑之含量方面，在可獲得良好膜形 成性（流動性或可塑性）之範圍內可適宜選擇。 在組成物a 1，任意成分則可含有，可塑劑，黏接助 劑’防光暈劑’保存安定劑，消泡劑，氧化防止劑，紫外 線吸收劑’充塡劑，低融點玻璃等之各種添加劑。 B1層 B 1層含有作爲無機粉體，鹼可溶性樹脂.，溶劑及感 光性成分爲必須成分者，以糊狀來塗布感光性之組成物 (以下，稱爲「組成物b 1 ))，使塗膜乾燥藉由溶劑一部 份或全部之除去來形成。 構成組成物b 1之無機粉體及溶劑，係可使用以前述 組成物a 1之構成成分記載者相同之物。 (1 )鹼可溶性樹脂 使用於組成物b 1之鹼可溶性樹脂方面，可使用各種樹 脂，具有黏合樹脂之作用。在此鹼可溶性樹脂方面，於 PDP構件之製造方法1中，可因應必須滿足A1層與B1層 之條件（i )〜（丨丨i )來使用。 -28- 200525579 (26) (1 - a )製造方法i (丨）之情形 在製造方法I ( i )中，於組成物b 1所使用之鹼可溶 性樹脂方面’以前述製造方法I ( i )所使用組成物a i之 構成成分所記載者爲相同之物可予使用。 但疋’製造方法I ( 1 )中組成物bl所使用之驗可溶 性樹脂之M w，與構成組成物a!之鹼可溶性樹脂之μw比 較更大爲必要。又，爲使本發明之效果更爲顯著，則構成 組成物b 1之鹼可溶性樹脂M w與構成組成物^〗之鹼可溶 性樹脂Mw之差爲55000〜60,000爲佳，1〇, 〇〇〇〜40,000 更佳。Mw可以，與構成組成物a 1之鹼可溶性樹脂之情髟 同樣之方法，來予以控制。 製造方法1 ( i )中組成物b 1所使用驗可溶性樹脂之 Mw，通常爲，5,000〜500,000，較佳爲，1〇,〇〇〇〜 2005000 〇 組成物b 1中上述鹼可溶性樹脂之含量方面、相對於 無機粉體100重量份，通常爲1〜500重量份，較佳爲5〜 1〇〇重量份，特佳爲15〜40重量份。 (Ι-b)製造方法I ( ii)之情形 製造方法I ( ii )中，組成物b 1所使用之鹼可溶性樹 脂方面可使用各種樹脂，但，以具有來自甲基丙烯酸構造 單元之樹脂，亦即使甲基丙烯酸（共）聚合所得之樹脂爲 必須。另外，上述鹼可溶性樹脂，係如前述使來自甲基丙 燒酸之構造單元在全重覆單兀中，在通常爲5〜50重量 -29- 200525579 (27) °/。’較佳爲1 〇〜4 〇重量％，特佳爲〗5〜3 〇重量。之範圍內 含有量％，特佳爲1 5〜3 0重量％之範圍內含有。 在甲基丙烯酸與其他單體共聚之情形，在甲基丙烯酸 之共聚成分方面，以選自前述製造方法丨（i丨）中組成物 ^所使用之單體（a，）〜（C )之單體爲佳，尤以單體 (B ·)較佳。 製造方法1 ( i i )中，組成物b 1所使用鹼可溶性樹脂 之 Mw，通常，爲 5,〇〇〇〜5 00,000，較佳爲，1〇5〇〇〇〜 200,000 〇 在Μ成物bl中上述鹼可溶性樹脂之含量方面，相對 於無機粉體100重量份，通常爲1〜5〇〇重量份，較佳爲5 〜1 0 0重量份，特佳爲1 5〜4 0重量份。 (1 -c )製造方法I ( i i i )之情形 製造方法I ( iii )中，組成物bl所使用之鹼可溶性樹 脂方面’以前述製造方法I ( in )所使用組成物al之構成 成分所記載者相同之物可予使用。 製造方法I ( iii )中組成物b 1所使用鹼可溶性樹脂之 Mw’ 通常爲 5,0〇〇 〜500,000，較佳爲]〇,〇〇〇 〜200,000。 在組成物bl中上述鹼可溶性樹脂之含量方面，相對 於無機粉體1 〇〇重量份，通常爲1〜5〇〇重量份，較佳爲5 〜100重量份，特佳爲15〜40重量份。 (2 )感光性成分 -30- 200525579 在構成組成物b 1之感光性成分方面，例如，（a )多 官能性單體與輻射線聚合引發劑之組合，（B )三聚氰胺 樹脂與因輻射線照射所致形成酸之光酸產生劑之組合爲 佳，上述（A )之組合方面，以多官能性（甲基）丙烯酸 酯與輻射線聚合引發劑之組合特佳。 在構成感光性成分之多官能性（甲基）丙烯酸酯之具 體例方面，可例舉乙二醇，丙二醇等之烷撐二醇之二（甲 基）丙烯酸酯類； 聚乙二醇，聚丙二醇等聚烷撐二醇之二（甲基）丙烯 酸醋類；兩末端羥基聚丁二烯，雨末端羥基聚異戊二燒， 兩末基聚己內醋等之兩末端羥基化聚合物之二（甲 基）丙烯酸酯類； 甘油，1，2，4 - 丁三醇，三羥甲基鏈烷，四羥甲基鏈 太兀，新戊四醇，一新戊四醇等3價以上之多價醇之聚（甲 基）丙烯酸酯類； 3價以上多價醇之聚烯烴二醇加成物之聚（甲基）丙 嫌酸醋類；1，4 -環己二醇，1，4 -苯二醇類等環式聚醇之 聚（甲基）丙烯酸酯類；聚酯（甲基）丙烯酸酯，環氧基 (甲基）丙烯酸酯，氨基甲酸乙酯（甲基丙烯酸酯，醇酸 樹脂（甲基）丙烯酸酯，聚矽氧樹脂（甲基）丙烯酸酯， 螺烷樹脂（甲基）丙烯酸酯等之低聚（〇lig〇)(甲基）丙 烯酸酯類等，該等可單獨或組合組合兩種以上使用。 又’構成感光性成分之輻射線聚合引發劑之具體例方 面可例舉，苄基，安息香，二苯基酮，樟腦醌，羥基-2_ -31 - 200525579 (29) 甲基-1-苯基丙烷-1-酮，羥基環己基苯基酮，： 氧基-2-苯基乙醯苯，2 -甲基-〔4，-(甲基硫代） 嗎啉代-1 -丙酮，2-苄基-2-二甲基胺基小（4_ 基丁烷-1-酮等之羰化合物； 偶氮二異丁腈，4 一疊氮基苯甲醛等之偶氮 疊氮基化合物；硫醇二硫化物等之有機硫化合物 苯醯基過氧化物，二-三級丁基過氧化物， 至v過氧化物’氣過氧異丙苯（c υ e n e ]] y d r 〇 p e r ( 田0甲火兀氣過執化物（p a r a ni e t h a n e h y d r o p e r o x i d e 機過氧化构； 1，3-雙（三氯甲基 ）-5- ( 2，-氯苯基） 嗪，2-〔 2- ( 2“呋喃）乙撐基〕-4，6_雙（三氯 1 ’ 3，5-三嗪等之三鹵甲烷類； 2，2’-雙（2-氯苯基）4，5，4，，5，-四苯基 咪唑等之咪唑二聚物等。該等可單獨或組合2 用。 組成物b 1中感光性成分之含量，相對於無 100重量份’通常爲10〜60重量份，較佳爲2〇〃 份。尤以感光性成分係以多官能性單體與輻射線 劑之組合使用之情形，相對於無機粉體1 〇 〇重量 目匕丨生％體’通常爲5〜4 0重量份，較佳爲1 〇〜 份’輻射線聚合引發劑相對於多官能性單體1〇〇 通吊爲1〜20重量份，較佳爲5〜]5重量份。 2.二甲 苯基〕-2· 嗎B林代苯 化合物或 9 三級丁基 )X i d e )， ) 等之有 ’ 3，5 -三 甲基 )· 1，2丨-雙 種以上使 無機粉體 - 40重量 聚合引發 份，多官 '30重量 重量份， 200525579 (30) (3 )溶解促進劑等其他成分 在上述製造方法1 ( Hi )之情形’在組成物b〗溶解促 進劑通常並不含有，而係以任意成分含有。但是，在組成 物b 1含有溶解促進劑之情形’相對於此溶解促進劑之組 成物b 1全重量之含量，組成物al所含溶解促進劑之’相 對於組成物a 1全重量之含量更小爲必要。 另外，在上述製造方法1 ( i )及1 (丨丨）之情形’在 組成物bl溶解促進劑通常並不含有’但係以任葸成分含 有。但是，溶解促進劑之含有比率增多時’相對於組成物 b 1所成B 1層與A 1層之顯影液溶解度之差因會變小’亦 會有不佳之情形。因此，相對於組成物b 1所含溶解促進 劑之組成物b 1全重量之含有比率’與相對於組成物a 1所 含溶解促進劑之組成物a 1全重量之含有比率比較傾向於 以更小者爲佳。 又，在組成物b 1，任意成分係可含有，可塑劑，黏接 助劑，防光暈劑，保存安定劑’消泡劑’氧化防止劑，紫 外線吸收劑，充塡劑，低融點玻璃等各種添加劑。 A2層 A2層係含有無機粉體’鹼可溶性樹脂，溶劑，及因 應需要含有溶解促進劑之糊狀’使非感光性之組成物（以 下，稱爲「組成物a2」）塗布’使塗膜乾燥並除去溶劑之 一部份或全部來形成。 構成組成物a 2之無機粉體及溶劑可使用與作爲前述 -33- 200525579 (31) 組成物a 1構成成分所記載者相同之物。 (1 )鹼可溶性樹脂 在使用於組成物a2之鹼可溶性樹脂方面，可使用各 種樹脂，而具有黏合樹脂作用。在此鹼可溶性樹脂方面， 在PDP構件之製造方法Π中，可因應必須滿足A2層與 A3層之條件（iv)〜（vi)來使用。 P D P構件之製造方法11中，在可滿足條件（丨v )爲必 要之情形（以下，稱爲「製造方法11 ( i v )))，組成物 所使用之鹼可溶性樹脂，與製造方法I(i)之組成物 a 1所使用之鹼可溶性樹脂相同。同樣地，在製造方法Π (v )之情況，組成物a2所使用之鹼可溶性樹脂，與製造 方法I ( i i )之組成物a 1所使用之鹼可溶性樹脂相同，在 製造方法II ( vi )之情形，組成物a2所使用之鹼可溶性 樹脂與，製造方法I ( iH )之組成物al所使用之鹼可溶性 樹脂相同。 (2 )溶解促進劑 在上述製造方法II ( vi )之情形，在組成物a2進而 含有溶解促進劑。 在組成物a2含有溶解促進劑時，可提高組成物a2所 成A2層之顯影速度。此製造方法u ( vi )所使用溶解促 進劑與上述製造方法I ( iii )之組成物al所使用溶解促進 劑相同。 -34- 200525579 (32) 另外，在上述製造方法II ( iv )及II ( V )之任一情 況，任意成分係使溶解促進劑含於組成物a2。 在組成物a2，任意成分則可含有可塑劑，接著助劑， 防光暈劑，保存安定劑，消泡劑，氧化防止劑，紫外線吸 收劑，充塡劑，低融點玻璃等之各種添加劑。 A3層 A3層，係含有無機粉體，鹼可溶性樹脂及溶劑之糊 狀，來塗布非感光性之組成物（以下，稱爲「組成物 a3」），使塗膜乾燥，藉由溶劑一部扮或全部之除去來彤 成。 構成組成物a3之無機粉體及溶劑，係使用與作爲前 述組成物a 1之構成成分而記載者相同之物。 (1 )鹼可溶性樹脂 使用於組成物a3之鹼可溶性樹脂方面，可使用各種 樹脂’而具有黏合樹脂之作用。此鹼可溶性樹脂方面，在 PDP構件之製造方法Π中，可因應必須滿足A2層與A3 層之上述條件（iv )〜（vi )來使用。 在製造方法II ( iv )之情形，組成物a3所使用之鹼 可溶性樹脂，與製造方法I ( i )之情形，與組成物b 1所 使用之鹼可溶性樹脂相同。同樣地，在製造方法II ( v ) 之情形’組成物a3所使用之鹼可溶性樹脂，與製造方法I (Π )之組成物b 1所使用之鹼可溶性樹脂相同，在製造方 -35- 200525579 (33) 法Π ( vi )之情形，組成物a3所使用之驗可溶性樹脂’ 與製造方法I ( i i i )之組成物b 1所使用之驗可彳谷性樹®曰相 同。 (2 )溶解促進劑等其他成分 上述製造方法Π ( vi )之情形，在組成物a3可含有 溶解促進劑，可以任意成分含有。但是’即使在組成物 含有溶解促進劑之情形，此溶解促進劑之相對於組成物&quot;3 全重量之含量，組成物a2所含溶解促進劑之相對於組成 物a 2全重量之含量更小爲必要。 另外，即使在上述製造方法Π (丨〇及I ( v )之情 形，，在組成物a3，溶解浞進劑通常並不含有’而以任意成 分含有。但是，溶解促進劑之含有比率增多時’因相對於 組成物a3所成A3層與A2層顯影液之溶解度之差變小’ 會有不佳之情形。因此，組成物a 3所含溶解促進劑之相 對於組成物a3全重量之含有比率，以組成物a2所含溶解 促進劑之相對於組成物a2全重量之含有比率更小者爲 佳。 又，在組成物a3，任意成分則可含有，可塑劑，接著 助劑，防光暈劑，保存安定劑，消泡劑，氧化防止劑，紫 外線吸收劑，充塡劑，低融點玻璃等各種添加劑。 光阻層 光阻層係，以含有鹼可溶性樹脂，多官能性單體，輻 -36- 200525579 (34) 射線聚合引發劑及溶劑之光阻組成物塗布，使塗膜乾燥， 藉由溶劑一部份或全部之除去來形成。 光阻組成物所使用之各成分，可使用以前述組成物b】 之構成成分記載之物相同者來使用。 轉印薄膜之形成方法， 有關本發明之轉印薄fl吴’係塗布本發明所使用之組成 物，使塗膜乾燥，將溶劑之一部份或全部除去予以重覆操 作來製造。在此時，塗膜之乾燥以一層一層來進行爲佳， 但可視情況將層合之塗膜一次乾燥亦可。又，因應需要， 在支持薄膜上塗布光阻組成物，使塗膜乾燥來形成光阻 層，在該光阻層上塗布上述組成物，乾燥之，來製造轉印 薄膜亦可。 各組成物之塗布方法，以可有效率地，使膜厚均勻， 可形成具有厚度塗膜之方法爲佳。例如，藉由輥塗佈機塗 布方法，藉由刮片（doctor blade)之塗布方法，藉由屏 塗料器（curtain coater )之塗布方法，藉由線塗料器 (wire coater)之塗布方法等較佳。 塗膜之乾燥條件，例如，在 5 0〜1 5 0 t , 0 · 5〜3 0分左 右，乾燥後溶劑之殘存率（隔壁形成材料層中之含有 率），通常在2重量％以內。 形成於上述方式支持薄膜上之各材料層之厚度方面， 因無機粉體之含量’構件之種類或尺寸等而異，但，例如 A1層或A2層之厚度〜150μηι，B】層或A3層之厚度10 -37- 200525579 (35) 〜150μπα。又，光阻層之厚度，通常爲5〜50μηι。 另外，轉印薄膜可在表面具有保護薄膜，在此種保護 薄膜方面，可例舉聚乙烯薄膜，聚乙烯醇系薄膜。 又，本發明之轉印薄膜，係將支持薄膜上與保護薄膜 上各自組成物予以塗布，形成材料層（或光阻層），藉由 使相互之材料層（或光阻層）靣重疊，予以壓塗之方法， 可恰當地形成。在此種形成方法方面，例如可例舉下述 例。 〈I〉在支持薄膜上形成Β 1層，在保護薄膜上形成 A】層’使Α1層之面與Β1層之面重疊予以壓塗之方法， 〈2〉在支持薄膜上形成光阻層與A 3層，在保護薄膜 上开&gt;成A2層’使A3層之面與A2層之面重疊予以壓塗之 方法， 〈3〉在支持薄膜上形成光阻層，在保護薄膜上形成 A2®與A3層之層合，使光阻層之面與A3層之面重疊予 以壓塗之方法， 【實施方式】 〔實施例〕 以下’關於本發明之實施例予以說明，但，本發明並 非限+Λ 疋於該等。另外，以下，「份」 及「％」 ，各自 表^ Γ亀量份」及「重量％」。 ^ ’ Mw係藉由’ Tosoh公司製凝膠滲透色譜法 (GPC X 广一一 〇 μ )(商品名：HLC- 8 22 0GPC)來測定之聚苯乙烯換算 -38- 200525579 (36) 之重量平均分子量。G P C測定條件則如下述。 GPC 柱：（Tosoh 製 TSKguard column Supem HZ-L) 溶劑：THF 測定溫度：4 crc 〔合成例1〕 將丙二醇單甲基醚乙酸酯200份，正丁基甲基丙烯酸 酯7 0份，甲基丙烯酸3 0份及偶氮異丁腈2份，裝入附有 攪拌機之熱壓器，在氮氛圍中，攪拌至在室溫爲均勻。接 著，在8 (TC進行3小時聚合，進而在1 〇 〇 t持續1小時聚 合反應後’冷卻至室溫爲止獲得聚合物溶液。聚合率爲 9 8%，自此聚合物溶液析出之共聚物（以下，稱爲「聚合 物·（ I )」）之 Mw 爲，40,000。 〔合成例2〕 除了將丙二醇單甲基醚乙酸酯2 0 0份，正丁基甲基丙 烯酸酯7 0份，甲基丙烯酸3 0份及偶氮異丁腈1份裝入熱 壓器以外，其他與合成例1相同方式獲得聚合物溶液。聚 合率爲9 7 %，自此聚合物溶液析出之共聚物（以下，稱爲 「聚合物（2)」）之Mw爲70,000。 〔合成例3〕 將丙二醇單甲基醚乙酸酯2 00份，正丁基甲基丙烧酸 酯7 0份，丙烯酸3 6份及偶氮異丁腈1份裝入附有攪泮機 -39- 200525579 (37) 之熱壓器，在氮氛圍下中，在室溫攪拌至均勻爲止後，在 8 0 °C聚合3小時，進而在1 0 〇 °C持續1小時聚合反應後冷 卻至室溫爲止，來獲得聚合物溶液。在此，聚合率爲 9 8 %，自此聚合物溶液析出之共聚物（以下，稱爲「聚合 物（3)」）之 Mw 爲，70,000。 〔調製例1〕_ In the method I (i) for the production of soluble tree carcass (B) thousand (A), in the lipid used in the composition al, a monomer selected from the following monomers (A) and a monomer selected from and / or Copolymers of monomers of monomer (C) are preferred. By soil copolymerization, alkali-solubility can be imparted to the resin. -22- 200525579 (20) Monomer (A): acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid (ci 11 · ac ο nicac 1 d ), Carboxyl-containing monomers such as mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) acryloxyethyl), ω-carboxy-polycaprolactone mono (meth) acrylate; ( Hydroxy-containing monomers such as 2-hydroxyethyl methacrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, (α-hydroxymethyl) acrylate, etc .; Alkali-soluble functional group-containing monomer monomers represented by phenolic hydroxyl-containing monomers such as o-hydroxystyrene, m-hydroxystyrene, and p-hydroxystyrene, etc. (B): (meth) methyl acrylate, Monomers of ethyl (meth) acrylate, n-butyl (meth) acrylate, benzyl (meth) acrylate, epoxypropyl (meth) acrylate, dicyclopentyl (meth) acrylate, etc. (A) Other (meth) acrylates; aromatic vinyl monomers such as styrene and α-methylstyrene; butadiene Monomers (A) and copolymerizable monomers represented by conjugated diene such as isoprene, etc. Monomer (C): polystyrene, polymethyl (meth) acrylate, poly (methyl) ) One end of polymer chain such as ethyl acrylate, poly (benzyl) (meth) acrylate, etc., and a macromonomer having a polymerizable unsaturated group such as (meth) acrylfluorenyl group, etc.-23- 200525579 (21) Representative macromonomers, and particularly preferred monomers (A) include acrylic acid and methacrylic acid. In addition, the content of the structural unit derived from the monomer (A) is usually 5 to 50% by weight, preferably 10 to 40% by weight, and particularly preferably 15 to 30% by weight in the full-repetition unit. %. Among the copolymerization components (B) and (C) of the monomer (A), particularly preferred monomers include n-butyl methacrylate. (2-b) In the case of manufacturing method 1 (ii) Various resins can be used for the alkali-soluble resin used in 'composition a 1' in manufacturing method I (ii). The acrylic (co) polymerized resin is required. In addition, the above-mentioned 鹸 soluble resin is a structural unit derived from acrylic acid as described above, and it is usually contained in a full-repetition unit in an amount of 5 to 50% by weight, preferably 10 to 40% by weight, and particularly preferably 1 5 to 30% by weight. In the case of copolymerizing acrylic acid with other monomers, the copolymerization component of propionic acid is preferably a monomer selected from the following monomers (A,) to (c '), and particularly preferably monomer (B') . Monomer (A '): Maleic acid, fumaric acid, crotonic acid' Iconic acid ', citraconic acid, mesaconic acid' cinnamic acid 'ϊ white acid mono (2- ( (Meth) acrylic acid oxyethyl), ω-carboxy-polycaprolactone mono (meth) acrylic acid and other carboxyl group-containing monomers other than acrylic acid; (meth) acrylic acid 2-hydroxyethyl ' (Methyl) propionic acid 2-meryl-24- 200525579 (22) Hydroxy-containing monomers such as 3-hydroxypropyl (meth) acrylic acid; o-Acetophenethyl, m-hydroxybenzene Alkali-soluble functional group-containing monomers represented by ethylene, p-hydroxystyrene-containing monomers and the like, monomers (B '): methyl (meth) acrylate, (meth) acrylic acid Monomers of ethyl acetate, n-butyl (meth) propionate, benzyl (meth) acrylate, epoxypropyl (meth) propionate, dicyclopentyl (meth) acrylate, etc. ( A) Other (meth) acrylic esters; aromatic vinyl monomers such as styrene, α-methylstyrene, etc .; butadiene; isoprene, etc. generation Monomers (A) and copolymerizable monomers in the table, Monomer- (C ,.): Polyethylene (Poly (meth) acrylate, Poly (meth) acrylate) One of the polymer chains such as benzyl acrylate, etc., is a macromonomer represented by a macromonomer having a polymerizable unsaturated group, such as a (meth) acrylfluorenyl group, (2 ** c) In the case of the manufacturing method I (iii) In the manufacturing method 1 (iii), the alkali-soluble tree S used in the composition al is the same as the resin used in the composition ai in the manufacturing method i (i). (2d) Polymerization method, conditions, molecular weight, etc. Polymerization of the above-mentioned soluble resin can be performed by, for example, -25-200525579 (23). As the initiator of the radical polymerization, azoisobutyronitrile, benzoyl peroxide and the like can be used. As the solvent for radical polymerization, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether and the like can be used. The polymerization temperature can be generally 50 to 100, and the polymerization time is usually 30 to 600 minutes. The alkali-soluble resin] 4 ~, usually 5,000 ~ 500,000, preferably] 0,000 ~ 200,000. The Mw of the alkali-soluble resin can be controlled, for example, by the ratio of the monomer to the polymerization initiator. The content of the alkali-soluble resin in the composition a 1 is generally 1 to 500 parts by weight, preferably 5 to 500 parts by weight, and particularly preferably 15 to 40 parts by weight relative to 100 parts by weight of the inorganic powder. Serving. (3): Dissolution accelerator In the case of the aforementioned production method I (i i i), the composition a 1 may further contain a dissolution accelerator. When the composition a 1 contains a dissolution accelerator, the development speed of the A1 layer formed by the composition al can be increased. In addition, in any of the above-mentioned production methods I (i) and I (i i), an arbitrary component may contain a dissolution accelerator in the composition a1. There is no particular limitation on the dissolution accelerator such as Sri Lanka, but examples thereof include polyalkylene glycols such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; ethyl cellulose, hydroxyethyl cellulose, and hydroxyethyl cellulose. Cellulose such as propyl cellulose, residual methyl cellulose, carboxymethyl ethyl cellulose; polyvinyl alcohol, starch, dextran, dextrin, chitosan, collagen, Ming-26- 200525579 (24 ) Amphipathic compounds such as gum 'spinase (br ome 1 i η); higher fatty acids such as oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid, lauric acid, etc .; Oxyethylene alkyl ether, polyoxyalkylene alkyl ether, polyoxyalkylene nonylphenyl ether 'alcohol hydroxyethyl ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene hardened castor oil, poly Non-ionic surfactants such as oxyethylene alkylamines, alkylalkanolamines, sorbitan fatty acid esters, and the like. Among these, amphiphilic mediators and non-ionic surfactants are preferred. Among them, polyalkylene glycols are used in forming the material layer of the transfer film to form a material layer in terms of flammability. In particular, polyethylene glycol and polyethylene glycol are preferred. (4) Solvent The solvent constituting the composition a 1 is one that imparts fluidity to the composition a 1, plasticity, or formation of a good film. The solvent constituting the composition a 1 is not particularly limited, for example, brews, esters, ether esters, ketones, ketoesters, amidoamines, amidoamines, lactams, lactones, , 飒, hydrocarbons, halogenated hydrocarbons, etc. As specific examples of such a solvent, tetrahydrofuran, anisole, acetic acid, ethylene glycol monoalkyl ethers, diethylene glycol and alkyl ethers, hydroxypropionic acids, alkoxypropionates Type, lactate type, ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, alkoxyacetate, cyclic ketones, acyclic ketones, ethyl acetate, acetone Acid and vinegar,] sj, N-di-27- 200525579 (25) Alkylformamides, N, N-dialkylacetamidines, N-alkylpyrrolidones' γ-lactones , Dialkylarylenes: Dialkylfluorenes, pinenols (tei * pine (&gt; 0 'N_methyl-2_pyrrolidone, etc.), these can be used alone or in combination of two or more The content of the solvent in the composition a 1 may be appropriately selected within a range in which good film formation properties (flowability or plasticity) can be obtained. In the composition a 1, any component may be contained, a plasticizer, and an adhesion aid. Agents' anti-halo agents' storage stabilizers, defoamers, oxidation inhibitors, UV absorbers' fillers, low melting point glass and other additives. B1 layer B 1 layer contains as Inorganic powder, alkali-soluble resin. If the solvent and the photosensitive component are necessary components, the photosensitive composition (hereinafter, referred to as "composition b 1)" is applied in a paste form, and the coating film is dried by the solvent. Partially or completely removed and formed. The inorganic powder and the solvent constituting the composition b 1 can be the same as those described in the constituents of the composition a 1. (1) An alkali-soluble resin is used in the composition b. In the alkali-soluble resin of 1, various resins can be used, which has the function of a binding resin. In this alkali-soluble resin, in the manufacturing method 1 of the PDP member, the conditions (i) of the A1 layer and the B1 layer must be satisfied according to (1) ~ (丨 丨 i). -28- 200525579 (26) (1-a) Production method i (丨) In the production method I (i), the alkali-soluble resin used in the composition b 1 'is The same can be used as described in the constituent components of the composition ai used in the aforementioned manufacturing method I (i). However, w 'M w of the soluble resin used in the composition bl in the manufacturing method I (1), and The alkali-soluble resin constituting the composition a! It is necessary that the w is larger. Also, in order to make the effect of the present invention more remarkable, the difference between the alkali-soluble resin Mw constituting the composition b 1 and the alkali-soluble resin Mw constituting the composition ^ is preferably 55,000 to 60,000. 10,000 to 40,000 is more preferable. Mw can be controlled in the same manner as in the case of the alkali-soluble resin constituting the composition a 1. The method used for the composition b 1 in the manufacturing method 1 (i) can be controlled. The Mw of the soluble resin is usually 5,000 to 500,000, preferably 10,000 to 2005000. The content of the alkali-soluble resin in the composition b 1 is usually 1 part by weight with respect to 100 parts by weight of the inorganic powder. ~ 500 parts by weight, preferably 5 to 100 parts by weight, and particularly preferably 15 to 40 parts by weight. (I-b) In the case of production method I (ii) In production method I (ii), various resins can be used for the alkali-soluble resin used in composition b1. However, in the case of having a resin derived from a methacrylic acid structural unit, Even resins obtained by (co) polymerization of methacrylic acid are necessary. In addition, the above-mentioned alkali-soluble resin is such that the structural unit derived from methylpropionic acid is in a fully-repeated unit as described above, and is usually 5 to 50 weights -29- 200525579 (27) ° /. 'Is preferably 10 to 40% by weight, and particularly preferably 5 to 300% by weight. The content is in the range of%, particularly preferably in the range of 15 to 30% by weight. In the case where methacrylic acid is copolymerized with other monomers, in terms of the copolymerization component of methacrylic acid, it is selected from the monomers (a,) to (C) used in the composition ^ in the aforementioned manufacturing method (i). Monomers are preferred, and monomer (B ·) is particularly preferred. In the production method 1 (ii), the Mw of the alkali-soluble resin used in the composition b 1 is usually 5,000 to 50,000, and preferably 1050 to 200,000. The content of the above-mentioned alkali-soluble resin is usually 1 to 5000 parts by weight, preferably 5 to 100 parts by weight, and particularly preferably 15 to 40 parts by weight with respect to 100 parts by weight of the inorganic powder. (1-c) In the case of manufacturing method I (iii) In the manufacturing method I (iii), the alkali-soluble resin used in the composition bl is described by the constituent components of the composition al used in the aforementioned manufacturing method I (in) The same thing can be used. The Mw 'of the alkali-soluble resin used in the composition b 1 in the production method I (iii) is usually 5,000 to 500,000, and preferably 0.001 to 200,000. In terms of the content of the alkali-soluble resin in the composition bl, it is usually 1 to 5000 parts by weight, preferably 5 to 100 parts by weight, and particularly preferably 15 to 40 parts by weight based on 1,000 parts by weight of the inorganic powder. Serving. (2) Photosensitive component-30- 200525579 In terms of the photosensitive component constituting composition b 1, for example, (a) a combination of a polyfunctional monomer and a radiation polymerization initiator, (B) a melamine resin and radiation-induced radiation A combination of a photoacid generator that forms an acid by irradiation is preferable. In terms of the combination of (A) above, a combination of a polyfunctional (meth) acrylate and a radiation polymerization initiator is particularly preferred. Specific examples of the polyfunctional (meth) acrylate constituting the photosensitive component include di (meth) acrylates of alkylene glycols such as ethylene glycol and propylene glycol; polyethylene glycol, poly Dialkyl (meth) acrylic acid vinegars such as propylene glycol; polyhydroxy dibutadienes at both ends, polyisoprene at the end of the rain, polyhydroxyprepolymers at the ends, polycaprolactone, etc. Di (meth) acrylates; glycerol, 1,2,4-butanetriol, trimethylolalkane, tetramethylol chain, neopentyl tetraol, monopentaerythritol, etc. Poly (meth) acrylates of polyvalent alcohols; poly (meth) acrylic acid vinegars of polyolefin diol adducts of polyvalent alcohols of trivalent or higher; 1,4-cyclohexanediol, 1 Poly (meth) acrylates of cyclic polyalcohols such as 4,4-benzenediols; polyester (meth) acrylates, epoxy (meth) acrylates, urethanes (methacrylates) , Oligomers of alkyd resin (meth) acrylate, polysiloxane resin (meth) acrylate, spirane resin (meth) acrylate, etc. 〇lig〇) (meth) acrylates, etc., these can be used alone or in combination of two or more. Specific examples of the radiation polymerization initiator constituting the photosensitive component include benzyl, benzoin, Diphenyl ketone, camphorquinone, hydroxy-2_ -31-200525579 (29) methyl-1-phenylpropane-1-one, hydroxycyclohexylphenyl ketone, oxy-2-phenylacetophenone, 2-methyl- [4,-(methylthio) morpholino-1 -acetone, 2-benzyl-2-dimethylamino small (4-ylbutane-1-one, and other carbonyl compounds; Azobisisobutyronitrile, 4 azide benzaldehyde and other azo azide compounds; organic sulfur compounds such as thiol disulfide phenyl amidyl peroxide, di-tertiary butyl peroxide, To v peroxide 'gas cumene (c υ ene]] ydr 〇per (para 0 ethane fire gas peroxo compounds (para ni ethanehydroperoxide organic peroxides; 1,3-bis (trichloromethyl ) -5- (2, -chlorophenyl) azine, 2- [2- (2 "furan) ethenyl] -4,6_bis (trichloro1'3,5-triazine, etc. trihalomethanes Class; 2, 2'-double (2- Phenyl) 4,5,4,5, -tetraphenylimidazole and other imidazole dimers, etc. These can be used alone or in combination of 2. The content of the photosensitive component in composition b 1 is 100% by weight "Parts" is usually 10 to 60 parts by weight, preferably 20 parts by weight. Especially when the photosensitive component is used in combination with a polyfunctional monomer and a radiation agent, it is 1,000 parts by weight relative to the inorganic powder. The percentage of the "% body" is usually 5 to 40 parts by weight, preferably 10 to 10 parts by weight. The radiation polymerization initiator is 1 to 20 parts by weight with respect to 100 parts of the polyfunctional monomer, preferably 5 ~] 5 parts by weight. 2. Xylyl] -2 · B-Linylbenzene compound or 9 tertiary butyl) X ide),) etc. There are '3,5 -trimethyl) · 1, 2 丨-two or more kinds of inorganic Powder-40 parts by weight of polymerization initiator, 30 parts by weight of polyphenols, 200525579 (30) (3) In the case of the above-mentioned manufacturing method 1 (Hi), other ingredients such as a dissolution accelerator are used in the composition b. The dissolution accelerator is usually It is not contained, but is contained in an arbitrary ingredient. However, in the case where the composition b 1 contains a dissolution accelerator, the content of the composition b 1 based on the total weight of the dissolution accelerator, and the content of the dissolution accelerator contained in the composition a, relative to the total weight of the composition a 1 Smaller is necessary. In the case of the above-mentioned production methods 1 (i) and 1 (丨 丨), 'the dissolution accelerator in the composition bl is not usually contained', but is contained as an optional ingredient. However, when the content of the dissolution accelerator is increased, the difference in the solubility of the developer with respect to the B 1 layer and the A 1 layer formed from the composition b 1 may become smaller, and the result may be unfavorable. Therefore, the content ratio of the composition b 1 with respect to the entire weight of the composition b 1 containing the dissolution accelerator and the content ratio of the composition a 1 with respect to the total weight of the composition a 1 containing the dissolution accelerator are more likely to be Smaller is better. Also, in the composition b 1, optional components may be contained, a plasticizer, an adhesion aid, an anti-halation agent, a storage stabilizer, an "antifoaming agent", an oxidation inhibitor, an ultraviolet absorber, a tincture filler, and a low melting point Various additives such as glass. A2 layer A2 layer contains inorganic powder 'alkali soluble resin, solvent, and a paste containing a dissolution accelerator if necessary,' coating a non-photosensitive composition (hereinafter, referred to as "composition a2"), and coating the film It is formed by drying and removing part or all of the solvent. The inorganic powder and the solvent constituting the composition a 2 can be the same as those described in the above-33-200525579 (31) The composition of the composition a 1. (1) Alkali-soluble resin As for the alkali-soluble resin used in the composition a2, various resins can be used, and they have the function of binding resin. With regard to this alkali-soluble resin, in the manufacturing method II of the PDP member, it can be used in accordance with the requirements (iv) to (vi) of the A2 layer and the A3 layer. In the manufacturing method 11 of the PDP member, when it is necessary to satisfy the condition (丨 v) (hereinafter, referred to as "manufacturing method 11 (iv))", the alkali-soluble resin used in the composition and the manufacturing method I (i ) Is the same as the alkali-soluble resin used in the composition a 1. Similarly, in the case of the production method II (v), the alkali-soluble resin used in the composition a 2 is the same as the composition a 1 of the production method I (ii). The alkali-soluble resin used is the same, and in the case of the manufacturing method II (vi), the alkali-soluble resin used in the composition a2 is the same as the alkali-soluble resin used in the composition al of the manufacturing method I (iH). (2) Dissolution In the case of the above-mentioned manufacturing method II (vi), the accelerator contains a dissolution accelerator in the composition a2. When the dissolution accelerator is contained in the composition a2, the development speed of the A2 layer formed by the composition a2 can be increased. This manufacturing method u (vi) The dissolution accelerator used is the same as the dissolution accelerator used in the composition al of the above-mentioned production method I (iii). -34- 200525579 (32) In addition, in the above-mentioned production methods II (iv) and II (V) Either case The composition a2 is included in the composition a2. In the composition a2, any component may include a plasticizer, an adjuvant, a halo-preventive agent, a storage stabilizer, a defoamer, an oxidation inhibitor, an ultraviolet absorber, and a filler. Various additives such as tincture, low melting point glass, etc. A3 layer A3 layer is a paste containing inorganic powder, alkali-soluble resin and solvent to coat non-photosensitive composition (hereinafter referred to as "composition a3" ), The coating film is dried, and it is formed by removing part or all of the solvent. The inorganic powder and the solvent constituting the composition a3 are the same as those described as the constituent components of the aforementioned composition a1. (1) Alkali-soluble resin As for the alkali-soluble resin used in the composition a3, various resins can be used to function as a binder resin. This alkali-soluble resin can be used in accordance with the above-mentioned conditions (iv) to (vi) of the A2 layer and the A3 layer in the method for manufacturing a PDP member. In the case of the manufacturing method II (iv), the alkali-soluble resin used in the composition a3 is the same as that in the case of the manufacturing method I (i), and is the same as the alkali-soluble resin used in the composition b1. Similarly, in the case of the manufacturing method II (v), the alkali-soluble resin used in the composition a3 is the same as the alkali-soluble resin used in the composition b 1 of the manufacturing method I (Π), and the manufacturing method is -35-200525579. (33) In the case of the method II (vi), the test soluble resin used in the composition a3 'is the same as the test cereal used in the composition b 1 of the manufacturing method I (iii). (2) Other components such as a dissolution accelerator In the case of the above-mentioned production method II (vi), the composition a3 may contain a dissolution accelerator, and may be contained in any component. However, even when the composition contains a dissolution accelerator, the content of the dissolution accelerator relative to the total weight of the composition &quot; 3, and the content of the dissolution accelerator contained in the composition a2 relative to the total weight of the composition a 2 is more Small is necessary. In addition, even in the case of the above-mentioned production methods Π (丨 0 and I (v)), in the composition a3, the dissolving agent is usually not contained, but is contained as an arbitrary component. However, when the content of the dissolution accelerator is increased, 'Because the difference between the solubility of the A3 layer and the A2 layer developer with respect to the composition a3 becomes smaller', there may be a case where it is not good. Therefore, the content of the dissolution accelerator contained in the composition a 3 is relative to the total weight of the composition a3. The ratio is preferably a smaller content ratio of the dissolution accelerator contained in the composition a2 with respect to the total weight of the composition a2. Also, in the composition a3, any component may be contained, a plasticizer, an auxiliary agent, and light resistance Corona agents, storage stabilizers, defoamers, oxidation inhibitors, UV absorbers, fillers, low melting point glass and other additives. Photoresist layer Photoresist layer to contain alkali-soluble resin, polyfunctional monomer , Radium-36- 200525579 (34) Coating the photoresist composition of the radiation polymerization initiator and solvent, drying the coating film, and forming it by removing part or all of the solvent. Each component used in the photoresist composition, Available before The composition b] has the same composition as described in the constituents. The method for forming a transfer film is related to the transfer film of the present invention. The coating composition used in the present invention is coated, the coating film is dried, and the solvent is used. A part or all of it is removed and manufactured by repeated operations. At this time, the drying of the coating film is preferably performed layer by layer, but the laminated coating film may be dried at one time depending on the situation. Also, if necessary, support A photoresist composition is coated on the film, and the coating film is dried to form a photoresist layer. The above composition is coated on the photoresist layer and dried to produce a transfer film. The coating method of each composition may be Efficiently, the method of making the film thickness uniform and forming a coating film having a thickness is preferred. For example, a coating method by a roll coater, a coating method by a doctor blade, and a curtain coater ) The coating method is preferably a wire coater coating method, etc. The drying conditions of the coating film are, for example, about 50 to 1500 t, 0.5 to 30 minutes, and the solvent after drying Survival rate (next door formation The content of the material layer) is usually within 2% by weight. The thickness of each material layer formed on the support film in the above manner varies depending on the content of the inorganic powder, the type or size of the member, but, for example, A1 The thickness of the layer or A2 layer is ~ 150μηι, the thickness of the B] layer or A3 layer is 10 -37- 200525579 (35) ~ 150μπα. In addition, the thickness of the photoresist layer is usually 5 ~ 50μηι. In addition, the transfer film can be on the surface It has a protective film, and examples of such a protective film include a polyethylene film and a polyvinyl alcohol-based film. The transfer film of the present invention is formed by coating respective components on a support film and a protective film to form a material. The layer (or photoresist layer) can be appropriately formed by overlapping the material layers (or photoresist layers) with each other and applying pressure. With respect to such a forming method, the following examples can be mentioned, for example. <I> A layer B1 is formed on the support film, and an A] layer is formed on the protective film. A method of overlaying the surface of the layer A1 and the surface of the layer B1 and applying pressure is applied. <2> Forming a photoresist layer on the support film and A 3 layer, open on the protective film &gt; form the A2 layer 'make the surface of the A3 layer and the surface of the A2 layer overlap and apply pressure coating, <3> form a photoresist layer on the support film, and form A2 on the protection film The method of laminating ® with the A3 layer so that the surface of the photoresist layer and the surface of the A3 layer are overlapped and press-coated. [Embodiment] [Example] The following is an explanation of an embodiment of the present invention, but the present invention is not a Limit + Λ 疋 in these. In addition, "parts" and "%" are shown below as "parts by weight" and "% by weight", respectively. ^ 'Mw is the weight of polystyrene conversion -38- 200525579 (36) measured by Gel Permeation Chromatography (GPC X Hi-110 μ) (trade name: HLC-8 22 0GPC) manufactured by Tosoh Corporation. Average molecular weight. G P C measurement conditions are as follows. GPC column: (TSKguard column Supem HZ-L manufactured by Tosoh) Solvent: THF Measurement temperature: 4 crc [Synthesis Example 1] 200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methacrylate, and methacrylic acid 30 parts and 2 parts of azoisobutyronitrile were put into a hot press equipped with a stirrer and stirred in a nitrogen atmosphere until the temperature was uniform. Next, polymerization was performed at 8 ° C for 3 hours, and the polymer solution was cooled to room temperature after the polymerization reaction was continued for 1 hour at 1000 t. The polymerization rate was 98%, and the copolymer precipitated from the polymer solution (Hereinafter, referred to as "polymer · (I)"), Mw was 40,000. [Synthesis Example 2] Except that propylene glycol monomethyl ether acetate was 200 parts, n-butyl methacrylate 70 parts, and A polymer solution was obtained in the same manner as in Synthesis Example 1 except that 30 parts of methacrylic acid and 1 part of azoisobutyronitrile were put into the autoclave. The polymerization rate was 97.7%, and the copolymer precipitated from the polymer solution (hereinafter , Called "Polymer (2)") Mw is 70,000. [Synthesis Example 3] 200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methyl propionate, 36 parts of acrylic acid and 1 part of azoisobutyronitrile was placed in a hot press equipped with a stirrer-39- 200525579 (37). After stirring at room temperature in a nitrogen atmosphere until homogeneous, polymerization was performed at 80 ° C for 3 hours. Further, the polymerization reaction was continued at 100 ° C. for 1 hour and then cooled to room temperature to obtain a polymer solution. Was 98% since the polymer solution to precipitate the copolymer (hereinafter referred to as "polymer (3)") of Mw of 70,000. [Preparation Example 1]

無機粉體係以玻璃釉（Bi2〇3-B203_Si02_Al2〇3系；以 下單稱爲「玻璃釉」）10 0份，鹼可溶性樹脂係以聚合物 (1) 30份，可塑劑係以二-2-乙基己基壬二酸酯2份及溶 劑係以丙二醇單甲基醚乙酸酯5 0份來混煉，藉以調製糊 狀之非感光性組成物（以下，稱爲「非感光性組成物（a. 1 )」）。 〔調製例2〕 無機粉體係以玻璃釉1 〇 〇份，鹼可溶性樹脂係以聚合 物（2 ) 30份，可塑劑係以二-2-乙基己基壬二酸酯2份及 溶劑係以丙二醇單甲基醚乙酸酯5 0份予以混煉，來調製 糊狀之非感光性組成物（以下，稱爲「非感光性組成物 (a-2 )」）。 〔調製例3〕 無機粉體係以玻璃釉1 00份，鹼可溶性樹脂係以聚合 物（3 ) 30份’可塑劑係以二-2-乙基己基壬二酸酯2份及 -40- 200525579 (38) 溶劑係以丙二醇單甲基醚乙酸酯5 0份予以混煉，來調製 糊狀之非感光性組成物（以下，稱爲「非感光性組成物 (a - 3)」）。 〔調製例4〕 無機粉體係以玻璃釉1 〇〇份，鹼可溶性樹脂係以聚合 物（2 ) 30份，可塑劑係以二-2-乙基己基壬二酸酯2份’ 溶解促進劑係以聚丙二醇（分子量4 0 0 ) 5份及溶劑係以 丙二醇單甲基醚乙酸酯5 0份予以混煉，來調製糊狀之非 感光性組成物（以下，稱爲「非感光性耝成物（a-4)」）° 〔調製例5〕 無機粉體係以玻璃釉1 〇〇份，鹼可溶性樹脂係以聚合物 (1 ) 30份，可塑劑係以二乙基己基壬二酸酯2份，溶 劑係以丙二醇單甲基醚乙酸酯5 〇份，敏輻射性成分係以 三經甲基丙烷三丙烯酸酯1 〇份及2 -苄基-2 -二甲基胺基-1 -(4-嗎啉代苯基）-丙烷小酮2份予以混煉，來調製糊狀 之感光性組成物（以下，稱爲「感光性組成物（b_ 1)」）。 〔調製例6〕 無機粉體係以玻璃釉丨〇 〇份，鹼可溶性樹脂係以聚合 物（2 ) 30份，可塑劑係以二乙基己基壬二酸酯2份， -41 - 200525579 (39) ί谷劑係以丙一 I單甲基醚乙酸醋5 0份，輻射線性成分係 以三羥甲基丙烷單丙烯酸酯I 〇份及2 _苄基—2、二甲基胺其 1 - ( 4 ·嗎啉代苯基）-丁烷-：[-酮2份予以混煉，來調製糊 狀之感光性組成物（以下稱爲，「感光性組成物（b 2)」）° 〔調製例7〕 無機粉體係以玻璃勒！ 〇 〇份，鹼可溶性樹脂係以聚a 物（3 ) 3 0份，可塑劑係以二·2 _乙基己基壬二酸酯2份， 溶劑係以两二醇單甲基醒乙酸酯]00份及感光性成分係以 三羥甲基丙烷三丙烯酸酯]0份及苄基二甲基胺基_ (4 -嗎啉代苯基）_ 丁烷-卜酮2份予以混煉，來調製糊狀 之感光性組成物（以下，稱爲「感光性組成物（匕 3 )」）。 〔調製例8〕 無機粉體係以玻璃釉丨〇 〇份，鹼可溶性樹脂係以聚合 物（2 ) 30份，可塑劑係以二-2_乙基己基壬二酸酯2份， 溶解促進劑係以聚丙二醇（分子量4 00 ) 5份，溶劑係以 Μ = _胃甲基醚乙酸酯1 〇〇份及敏輻射性成分係以三羥甲 基丙院二丙烯酸酯1 0份及2 -苄基-2 -二甲基胺基-1 - ( 4 -嗎 0林代苯基）-丁烷-1 -酮2份予以混煉，來調製糊狀之感光 性組成物（以下，稱爲「感光性組成物（b -4 )」）。 -42- 200525579 (40) 〔調製例9〕 鹼可溶性樹脂係以聚合物（1 ) _ 1 0 0份，多官能性單體 係以三羥甲基丙烷三丙烯酸酯5 〇 ^ 甘 Μ，輻射線聚合引發劑 係以2-苄基-2-二甲基胺基_丨-(4、 馬啉代苯基）-丁烷-卜酮 1 5份，及溶劑係以丙二醇單甲基g _ 乙酸醋1 5 0份予以混 煉，來調製光阻層用之組成物（ 卜’稱爲「光阻組成物 (卜1 )」）〇 〔調製例1 〇〕 驗cj溶性樹腊係以聚合物（I ) 〕5 ^份，多官能性單體 係以新戊四醇四丙嫌酸醋4 0份，鮮π — 敗Β日4U彳刀^射線聚合引發劑係以1 一羥基環己基苯基@!司1 〇爾景份，·^、^由 土 hL i U里里扮，及溶劑係以3 _乙氧基丙 酸乙基 1 5 0份予以混煉，亦f固制&amp; 低牌 米卩周软光阻層用之組成物（以 下，稱爲「光阻組成物（r - 2 )」）。 (顯影速度評價方法） 在鈉玻璃基板（1 5 c m角，厚1 · 1 m m )表面，使用棒 塗布機’來塗布隔壁形成用組成物，在1丨〇它乾燥5分以 將溶劑完全除去’並製造具有厚100μηι之隔壁形成材料層 之試驗片。 所得之g式驗片浸瀆於〇 · 2重量％之氫氧化钾水溶液， &lt;吏用磁力攪拌器進行溶液之攪拌，並觀察試驗片表面。藉 @ §式驗片表面之隔壁形成材料層之溶解，將基板表面之一 半：暴露之時間爲溶解時間來加以測定，以以下之式算出溶 -43- 200525579 (41) 解速度。求出結果，係如下述表1所示。 式：溶解速度（μΐΏ/秒）=膜厚（μηι ) /溶解時間（秒） 〔實施例1〕 (轉印薄膜之製作） 將所得之感光性組成物（b-2 )，在預先予以離型處 理之聚對苯二甲酸乙二醇酯（PET )薄膜所成支持薄膜 (寬2 0 0 m m，長3 0 m v厚3 8 μ m )上以輥塗料器塗布，來形 成塗膜，使所形成之塗膜於1 1 0 °C進行乾燥5分，以將溶 劑除去，來形成厚1 0 0 μηι之感光性層（b )。接著，將非 感光性組成物（a- 1 )，在感光性層（b )上藉由輥塗佈機 塗布，來形成塗膜，將所形成之塗膜在1] 0 °C乾燥5分， 以將溶劑除去，來形成厚1 0 0 μηι之非感光性層（a )。藉 此，可形成厚200μιη之，由二層所成隔壁形成材料層，來 製造本發明之轉印薄膜（以下，稱爲「轉印薄膜 (PDP用隔壁之製造） 〈轉印步驟〉 6英吋面板用之玻璃基板表面，使轉印薄膜（1 )重 疊’使非感光性層（a )表面爲抵接之方式，將此轉印薄 膜（1 )以加熱輥予以熱壓塗。壓塗條件，係以加熱輥表 面溫度爲120°C，輥壓爲4kg/cm2，加熱輥之移動速度爲 0.5 m/分。藉此，在玻璃基板表面轉印層被轉印而成爲密 -44 - 200525579 (42) 接之狀態。在測定此轉印層（非感光性層（a ) +感光性層 (b ))之厚度時，爲2 00μηι±5μηι之範圍。 〈感光性層（b )之曝光步驟〉 相對於感光性層（b )，透過曝光用掩罩（40μιη寬之 條帶圖型），藉由超高壓水銀燈，照射i線（波長3 6 5 n m 之紫外線）。照射量爲4 0 0 m J7 c m 2。 〈顯影步驟〉 在曝光步驟完成後由感光性層（b)將支持薄膜剝離 除去後，相對於曝光處理之感光性層（b )，進行使0.2 重量％之氫氧化鉀水溶液（25 °C ).，成爲顯影液之沖洗法所 致顯影處理。藉此，可將紫外線所無照射之未硬化之感光 性層（b )之部分予以除去，進而使其圖型係以連續地非 感光性層（a )之顯影。接著進行以超純水之水洗處理及 乾燥處理。藉此，可形成隔壁形成用之層之圖型。 〈焙燒步驟〉 將具有圖型所形成之層之玻璃基板，在焙燒爐內與 6 0 0 C之溫度氛圍下經3 0分焙燒處理。藉此，可獲得在玻 璃基板表面可形成隔壁之面板材料。 所得之面板材料中隔壁之剖面形狀以掃瞄型電子顯微 鏡來觀察’測定該剖面形狀之底面之寬及高。結果，底面 之莧爲40μηι±：)μιη’局爲200μΓπ±5μηι，尺寸精度極高，且 200525579 (43)Inorganic powder system uses glass glaze (Bi2〇3-B203_Si02_Al2 03 series; hereinafter referred to as "glass glaze") 100 parts, alkali-soluble resin based on polymer (1) 30 parts, plasticizer based on di-2- Two parts of ethylhexyl azelate and the solvent were mixed with 50 parts of propylene glycol monomethyl ether acetate to prepare a paste-like non-photosensitive composition (hereinafter referred to as "non-photosensitive composition ( a. 1) "). [Preparation Example 2] Inorganic powder system was 100 parts of glass glaze, alkali-soluble resin was 30 parts of polymer (2), plasticizer was 2 parts of di-2-ethylhexyl azelate and solvent was used. 50 parts of propylene glycol monomethyl ether acetate was kneaded to prepare a paste-like non-photosensitive composition (hereinafter referred to as "non-photosensitive composition (a-2)"). [Preparation Example 3] Inorganic powder system with 100 parts of glass glaze, alkali soluble resin based on polymer (3) 30 parts' plasticizer based on 2 parts of di-2-ethylhexyl azelate and -40-200525579 (38) The solvent is kneaded with 50 parts of propylene glycol monomethyl ether acetate to prepare a paste-like non-photosensitive composition (hereinafter referred to as "non-photosensitive composition (a-3)"). [Preparation Example 4] Inorganic powder system was 100 parts of glass glaze, alkali-soluble resin was 30 parts of polymer (2), and plasticizer was 2 parts of di-2-ethylhexyl azelate. Dissolution accelerator 5 parts of polypropylene glycol (molecular weight 400) and 50 parts of propylene glycol monomethyl ether acetate are mixed to prepare a paste-like non-photosensitive composition (hereinafter referred to as "non-photosensitive耝 成 物 (a-4) ″) ° [Preparation Example 5] Inorganic powder system with 1000 parts of glass glaze, alkali-soluble resin based on polymer (1) 30 parts, and plasticizer based on diethylhexylnonane 2 parts of acid ester, 50 parts of propylene glycol monomethyl ether acetate as solvent, 10 parts of tris (methyl propane triacrylate) and 2-benzyl-2-dimethylamino group Two parts of -1-(4-morpholinophenyl) -propane ketone were kneaded to prepare a paste-like photosensitive composition (hereinafter, referred to as "photosensitive composition (b_1)"). [Preparation Example 6] Inorganic powder system with glass glaze, 100 parts, alkali-soluble resin based on polymer (2) 30 parts, plasticizer based on diethylhexyl azelate, -41-200525579 (39 ) Grain agent is 50 parts of propylene mono monomethyl ether acetate, and the radiation linear component is trimethylolpropane monoacrylate I 0 parts and 2-benzyl-2, dimethylamine and 1- (4 · morpholinophenyl) -butane-: 2 parts of [-one are kneaded to prepare a paste-like photosensitive composition (hereinafter referred to as “photosensitive composition (b 2)”) ° [ Preparation Example 7] The inorganic powder system is made of glass! 〇part, the alkali-soluble resin is poly (3) 30 parts, the plasticizer is di · 2-ethylhexyl azelate, and the solvent is diglycol monomethyl acetate [00 parts and photosensitive components are trimethylolpropane triacrylate] 0 parts and 2 parts of benzyldimethylamino- (4-morpholinophenyl) -butane-butanone are kneaded, To prepare a paste-like photosensitive composition (hereinafter referred to as "photosensitive composition (Dagger 3)"). [Preparation Example 8] Inorganic powder system with glass glaze, 100 parts, alkali-soluble resin based on polymer (2) 30 parts, plasticizer based on di-2-ethylhexyl azelate, 2 parts, dissolution accelerator Based on 5 parts of polypropylene glycol (molecular weight 400), solvent is based on 100 parts of M = _ gastric methyl ether acetate and sensitive components are based on 10 parts of trimethylolpropane diacrylate and 2 -2 parts of -benzyl-2 -dimethylamino-1-(4-morpholinophenyl) -butane-1 -one are kneaded to prepare a paste-like photosensitive composition (hereinafter, called Is "photosensitive composition (b -4)"). -42- 200525579 (40) [Preparation Example 9] The alkali-soluble resin is polymer (1) _ 100 parts, and the polyfunctional monosystem is trimethylolpropane triacrylate 5 ^^ M, radiation The linear polymerization initiator is 2-benzyl-2-dimethylamino group 丨 丨-(4, maslinophenyl) -butane-butanone 15 parts, and the solvent is propylene glycol monomethyl g _ 150 parts of vinegar acetate were kneaded to prepare a composition for a photoresist layer (referred to as "photoresist composition (b1)"). [Modification example 1 〇] Examination of cj soluble tree wax to polymerize (I)] 5 ^ parts, polyfunctional monosystem with neopentyl tetraol tetrapropionic acid vinegar 40 parts, fresh π — 4U trowel ^ ray polymerization initiator based on 1-hydroxycyclohexyl Phenyl @! 司 1 〇 尔 景 份, · ^, ^ are made of soil hL i U Li, and the solvent is mixed with 150 parts of ethyl 3_ethoxypropionate, also f solid & amp A composition for a low-brand Mizhi Zhou soft photoresist layer (hereinafter, referred to as "photoresist composition (r-2)"). (Development speed evaluation method) On the surface of a soda glass substrate (15 cm angle, thickness 1.1 mm), a composition for forming a partition wall was applied using a bar coater, and dried for 5 minutes at 1 to remove the solvent completely. 'And a test piece having a partition wall forming material layer with a thickness of 100 μm was manufactured. The obtained g-type test piece was immersed in a 0.2% by weight potassium hydroxide aqueous solution, and the solution was stirred with a magnetic stirrer, and the surface of the test piece was observed. Based on the dissolution of the barrier layer-forming material layer on the surface of the @ § type test piece, the half of the substrate surface: the exposure time is measured as the dissolution time, and the dissolution rate is calculated by the following formula: -43- 200525579 (41). The results are shown in Table 1 below. Formula: dissolution rate (μΐΏ / sec) = film thickness (μηι) / dissolution time (sec) [Example 1] (Production of transfer film) The obtained photosensitive composition (b-2) was separated in advance. A support film (width 200 mm, length 30 mv, thickness 3 8 μm) formed by a polyethylene terephthalate (PET) film of a type treatment is coated with a roll coater to form a coating film, so that The formed coating film was dried at 110 ° C. for 5 minutes to remove the solvent to form a photosensitive layer (b) having a thickness of 100 μm. Next, the non-photosensitive composition (a-1) was coated on the photosensitive layer (b) by a roll coater to form a coating film, and the formed coating film was dried at 1] 0 ° C for 5 minutes. To remove the solvent to form a non-photosensitive layer (a) with a thickness of 100 μm. Thereby, the transfer film of the present invention (hereinafter, referred to as "transfer film (manufactured by a partition wall for PDP)" (transfer step) 6 inches can be formed with a thickness of 200 μm and a barrier layer forming material layer formed by two layers. On the surface of the glass substrate for the panel, the transfer film (1) is overlapped, so that the surface of the non-photosensitive layer (a) is abutted, and the transfer film (1) is hot-pressed by a heating roller. Pressure coating The conditions are based on a heating roller surface temperature of 120 ° C, a rolling pressure of 4 kg / cm2, and a moving speed of the heating roller of 0.5 m / min. As a result, the transfer layer on the surface of the glass substrate is transferred to become dense -44- 200525579 (42) connected state. When measuring the thickness of this transfer layer (non-photosensitive layer (a) + photosensitive layer (b)), it is in the range of 200 μm ± 5 μm. Exposure procedure> For the photosensitive layer (b), through an exposure mask (40 μm wide strip pattern), an i-line (ultraviolet wavelength of 3 65 nm) is irradiated with an ultra-high pressure mercury lamp. The exposure amount is 4 0 0 m J7 cm 2. <Developing step> After the exposure step is completed, the photosensitive layer (b) will support the thin film. After the film is peeled and removed, a 0.2% by weight potassium hydroxide aqueous solution (25 ° C) is used as a developing solution with respect to the photosensitive layer (b) subjected to the exposure treatment. The portion of the non-cured photosensitive layer (b) that was not irradiated with ultraviolet rays was removed, and then the pattern was developed continuously with the non-photosensitive layer (a). Then, washing treatment with ultrapure water and drying treatment were performed. ... by this, the pattern of the layer for forming the partition wall can be formed. <Baking step> The glass substrate having the layer formed by the pattern is subjected to a 30-minute baking treatment in a baking furnace at a temperature of 600 ° C. This way, a panel material can be formed on the surface of the glass substrate. The cross-sectional shape of the partition wall in the obtained panel material is observed with a scanning electron microscope to determine 'the width and height of the bottom surface of the cross-sectional shape. As a result, the bottom surface苋 is 40μηι ± :) μιη ′ is 200μΓπ ± 5μηι, and the dimensional accuracy is extremely high, and 200525579 (43)

Pi壁之触刻可形成銳利圖型爲自明。又，並無法觀察到殘 留或圖型之剝離，變形。評價結果如表丨所示。 〔實施例2〕 除了使用之非感光性組成物（a- 1 )改爲非感光性組 成物（a - 3 )以外，其他與實施例]相同方式來製造轉印 薄膜’使用所得之轉印薄膜，在玻璃基板上形成隔壁形成 用之層’進行曝光，顯影，焙燒。藉此可獲得在玻璃基板 表面可形成隔壁之面板材料。 所得之面板材料中隔壁之剖靣形狀以掃瞄型電子顯微 鏡觀察，測定該剖面形狀之底面之寬及高。結果，底面之 寬爲40pm士 3μηι，高爲2 00 μηι±5μη]，尺寸精度極高，且隔 壁之蝕刻可形成銳利圖型爲自明。又，並無觀察到殘留或 圖型之剝離，變形。評價結果如表1所示。 〔實施例3〕 除了使用之非感光性組成物（a- 1 )改爲非感光性組 成物（a - 4 )以外，其他與實施例1相同方式來製造轉印 薄膜，使用所得之轉印薄膜，在玻璃基板上形成隔壁形成 用之層，進行曝光，顯影，焙燒。藉此，可獲得在玻璃基 板表面可形成隔壁之面板材料。 所得之面板材料中隔壁之剖面形狀以掃瞄型電子顯微 鏡觀察，測定該剖面形狀之底面之寬及高。結果，底面之 寬爲4 0 μ m 士 3 μ m ’局爲2 0 0 μ m 土 5 μ m，尺寸精度極高，且隔 -46- 200525579 (44) 壁之蝕刻可形成銳利圖型爲自明。又，無法觀察到殘留或 圖型之剝離，變形。評價結果如表1所示。 〔比較例1〜9〕The touch of the Pi wall can form a sharp pattern for self-evident. In addition, it was not possible to observe residual or pattern peeling and deformation. The evaluation results are shown in Table 丨. [Example 2] A transfer film was produced in the same manner as in Example except that the non-photosensitive composition (a-1) used was changed to the non-photosensitive composition (a-3). A thin film is formed on the glass substrate to form a layer for forming a partition wall, and is exposed, developed, and fired. Thereby, a panel material capable of forming a partition wall on the surface of the glass substrate can be obtained. The sectional shape of the partition wall in the obtained panel material was observed with a scanning electron microscope, and the width and height of the bottom surface of the sectional shape were measured. As a result, the width of the bottom surface is 40 pm ± 3 μηι, and the height is 200 μηι ± 5 μη]. The dimensional accuracy is extremely high, and the sharp pattern of the etching on the partition wall is self-explanatory. Moreover, no peeling or deformation of the pattern was observed. The evaluation results are shown in Table 1. [Example 3] A transfer film was produced in the same manner as in Example 1 except that the non-photosensitive composition (a-1) used was changed to the non-photosensitive composition (a-4), and the resulting transfer was used. The thin film forms a layer for forming a partition on a glass substrate, and is exposed, developed, and fired. Thereby, a panel material which can form a partition wall on the surface of a glass substrate can be obtained. The cross-sectional shape of the partition wall in the obtained panel material was observed with a scanning electron microscope, and the width and height of the bottom surface of the cross-sectional shape were measured. As a result, the width of the bottom surface is 40 μm ± 3 μm. The thickness is 200 μm and the soil is 5 μm. The dimensional accuracy is extremely high, and the etching of -46- 200525579 (44) wall can form a sharp pattern. Self-evident. In addition, no peeling or deformation of the pattern was observed. The evaluation results are shown in Table 1. [Comparative Examples 1 to 9]

比較例係以，2層各自使用之組成物之組合以外，其 他則與實施例]相同方式來製造轉印薄膜，使用所得之轉 印薄膜’在玻璃基板上形成隔壁形成用之層，進行曝光， 顯影’焙燒。所甩之組成物及評價結杲如表1所示。 表1 實施例] 實施例2 實施例3 比較例] 比較例2 比較例3 A1層組成物 a-1 a-3 a-4 a-1 a-2 a-2 B]層組成物 b-2 b-2 b-2 b-1 b-2 b-1 A1層顯影速度(μιη/秒） 0.95 0.85 0.88 0.95 0.54 0.54 Β1層顯影速度(μηι/秒 0.54 0.49 0.49 0.90 0.49 0.90 隔壁形狀 良好 良好 良好 不良 不良 不良 比較例4 比較例5 比較例6 比較例7 比較例8 比較例9 Α1層組成物 a_3 a-2 a-4 a-2 a-2 Β1層組成物 b-3 b-2 b-3 b-4 b-2 b-4 Α1層顯影速度(μπι/秒） 0.85 0.54 0.54 0.88 0.54 0.54 Β1層顯影速度(μηι/秒 0.82 0.49 0.82 0.80 0.49 0.80 隔壁形狀 不良 不良 不良 不良 不良 不良In the comparative example, a transfer film was produced in the same manner as in Example except that the composition of the two layers was used separately. The transfer film was used to form a layer for forming a partition on a glass substrate and exposed. , Development 'baking. The composition and evaluation results of the discarded are shown in Table 1. Table 1 Example] Example 2 Example 3 Comparative Example] Comparative Example 2 Comparative Example 3 A1 layer composition a-1 a-3 a-4 a-1 a-2 a-2 B] layer composition b-2 b-2 b-2 b-1 b-2 b-1 A1 layer development speed (μιη / second) 0.95 0.85 0.88 0.95 0.54 0.54 B1 layer development speed (μηι / second 0.54 0.49 0.49 0.90 0.49 0.90 Good shape of the partition wall Good good bad Poor Poor Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Comparative Example 9 A1 layer composition a_3 a-2 a-4 a-2 a-2 a1 layer composition b-3 b-2 b-3 b-4 b-2 b-4 Development speed of A1 layer (μπι / s) 0.85 0.54 0.54 0.88 0.54 0.54 Development speed of B1 layer (μηm / s 0.82 0.49 0.82 0.80 0.49 0.80 Poor shape of the partition wall

〔實施例4〕 (轉印薄膜之製作） — 47- 200525579 (45) 將光阻用組成物（r-1 )，在預先離型處理之PET薄 月旲所成支持溥膜（寬2 0 0 m m，長3 0 m，厚3 8 μ m )上以車昆 塗佈機塗布來形成塗膜，將所形成之塗膜在1 〇 (TC乾燥5 分以將溶劑除去，來形成厚1 5 μη之光阻層。 接著，將非感光性組成物（a_2 )，於光阻層上藉由 輕塗佈機予以塗布來形成塗膜，使所形成之塗膜在]⑽它 乾燥5分以將溶劑除去來形成厚10〇|im之層（a，）。 進而，將非感光性組成物（1 )，在層（a')上以輥 塗佈機塗布來形成塗膜，將所形成之塗膜在1 〇〇 t乾燥5 分以將溶劑除去彩成厚1 〇 Q μ m之層（a 。藉此，可形成 厚2 1 5 μιη之’三層所成隔壁形成材料層，來製作本發明之 轉印薄膜（以下，.稱爲「轉印薄膜（2 )」）。 (PDP用隔壁之製造） 〈轉印步驟&gt; 在6英吋面板用之玻璃基板表面，使轉印薄膜（2 ) 重疊’使層（a ”）表面抵接之方式，使此轉印薄膜（2 ) 藉由加熱輥予以熱壓塗。壓塗條件與實施例1相同。藉 此’在玻璃基板表面轉印層被轉印成爲密接之狀態。在測 定此轉印層（光阻層+ ( ^ ) +層（a”））之厚度時，在 2 1 5 μ m 士 5 μ m 之範圍。 〈光阻層之曝光步驟〉 相對於光阻層，透過曝光用掩罩（4 0 μ m寬之條帶圖 200525579 (46) 型）’藉由超问壓水銀燈’照射i線（波長3 6 5 n m之紫外 線）。照射量爲4 0 0 m J / c m 2。 〈顯影步驟〉 在曝光步驟之完成後藉由光阻層使支持薄膜剝離除去 後’相對於曝光處理之光阻層，進行使0 · 3重量％之氧化 氫氧化水溶液2 5 °C成爲顯影液之沖洗法所致之顯影處理。 藉此’除去紫外線無照射之未硬化之光阻層之部分，進而 使其作爲圖型予以連續地進行層（a，）及隔壁形成材料層 (a ”）之顯影。接著進行超純水之水洗處理及乾燥處理。 藉此，可形成由材料層殘留部與材料層除去部所構成之隔 壁形成材料層之圖型。 〈焙燒步驟〉 將具有圖型所形成之層之玻璃基板在焙燒爐內於5 6 〇 C之溫度氛圍下進行經3 Q分之焙燒處理。藉此，可獲得 在玻璃基板表面可形成隔壁所成面板材料。 將所得之面板材料中隔壁之剖面形狀在掃猫型電子顯 微鏡觀察。結果，在測定該剖面形狀之底面寬度及高度 時’底面之寬爲40μπι±3μηι，高度爲ΐ50μηι：£3μιη，尺寸精 度極高’且隔壁之蝕刻可形成銳利圖型爲自明。又，無法 觀察到殘留或圖型之剝離，變形。評價結果如表2所示。 〔實施例5〕 -49- 200525579 (47) 除了使用之光阻組成物（r_ 1 )改爲光阻組成物（r_ 2 )，使用之非感光性組成物（a- 1 )改爲非感光性組成物 (a - 3 )以外其他與實施例4相同方式來製造轉印薄膜， 使用所得之轉印薄膜在玻璃基板上形成隔壁形成用之層， 進行曝光，顯影，焙燒。藉此，可獲得在玻璃基板表面可 形成隔壁之面板材料。 所得之面板材料中隔壁之剖面形狀以掃瞄型電子顯微 鏡觀察。結果’在測定該剖面形狀之底面之寬及高時，底 面/&lt;1寬爲 40μηι：±：3μιη，高爲 150μιη 土 5μ m，尺寸精度極高， 且可形成隔壁之蝕刻爲銳利圖型爲自明。又，無法觀察到 殘留或圖型之剝離，變形。評價結果如表2所示。 〔實施例6〕 除了使用之光阻組成物（r- 1 )改爲光阻組成物（卜 2 ) ’使用之非感光性組成物（a - 1 )改爲非感光性組成物 (a-4 )以外’其他與實施例4相同方式來製造轉印薄 月莫’使用所得之轉印薄膜在玻璃基板上形成隔壁形成用之 層，進行曝光，顯影，焙燒。藉此，可獲得在玻璃基板表 面可形成隔壁之面板材料。 將所得之面板材料中隔壁之剖面形狀藉由掃瞄型電子 顯微鏡觀察。結果，在測定該剖面形狀之底面之寬及高 曰守’底面之寬爲40μηι：±3μΓη，高爲150μπι：^5μΓη，尺寸精度 極高，且隔壁之蝕刻可形成銳利圖型爲自明。又，無法觀 祭到殘留或圖型之剝離，變形。評價結果如表2所示。 -50- 200525579 (48) 〔比較例1 0〜1 2〕 作爲比較例係以，除了在各層使用之組成物之組合以 外’其他與實施例4相同方式來製造轉印薄膜，使用所得 之轉印薄膜在玻璃基板上形成隔壁形成用之層，進行曝 光’顯影，焙燒。使用之組成物及評價結果如表2所示。 表2 實施 實施 實施 比較 比較 比較 例4 例5 例6 例10 例1 1 例12 A 2層組或物 1 a-3 8-4 a - 1 2-2 a - 2 A 3層組成物 a-2 a-2 a-2 a - 1 a-2 a -] 光阻層組成物 r- 1 r-2 r-2 卜1 卜1 r- 1 光阻層顯影速度（μ ra /秒） 0.43 0.43 0.43 0.43 A2層顯影速度（μΓη/秒） 0.95 0.85 0.88 0.95 0.54 0.54 A 3層顯影速度（μ m /秒） 0.54 0.54 0.54 0.95 0.54 0.95 隔壁形狀 良好 良好 良好 不良 不良 不良[Example 4] (Production of transfer film) — 47- 200525579 (45) A photoresist composition (r-1) was prepared by using a thin PET film with a release treatment in advance (width 20) 0 mm, length 30 m, thickness 3 8 μm) with a Chekun coater to form a coating film, and the formed coating film was dried at 10 ° C for 5 minutes to remove the solvent to form a thickness of 1 A photoresist layer of 5 μη. Next, a non-photosensitive composition (a_2) was applied on the photoresist layer by a light coater to form a coating film, and the formed coating film was dried for 5 minutes. A layer (a,) having a thickness of 100 μm was formed by removing the solvent. Further, a non-photosensitive composition (1) was applied on the layer (a ′) with a roll coater to form a coating film, and The formed coating film was dried at 100 t for 5 minutes to remove the solvent into a layer having a thickness of 100 μm (a. By this, a partition wall forming material layer formed by three layers having a thickness of 2 1 5 μm can be formed. The transfer film of the present invention (hereinafter, referred to as "transfer film (2)") was made. (Production of a partition wall for PDP) <Transfer Step> On the surface of a glass substrate for a 6-inch panel, the transfer The printing film (2) is superimposed on the surface of the layer (a), so that the transfer film (2) is hot-pressed by a heating roller. The conditions of the press-coating are the same as in Example 1. By this, the glass The transfer layer on the substrate surface is transferred into a tight state. When measuring the thickness of this transfer layer (photoresist layer + (^) + layer (a ")), it is in the range of 2 1 5 μm ± 5 μm 〈Exposure Steps of Photoresistive Layer〉 Relative to the photoresistive layer, a mask for exposure (40 μm wide strip chart 200525579 (46) type) is used to illuminate the i-line (wavelength 3 with an ultra-high pressure mercury lamp). UV at 65 nm). The irradiation amount is 400 m J / cm 2. <Developing step> After the exposure step is completed, the supporting film is peeled off and removed by the photoresist layer. A developing process by a flushing method in which a 0.3% by weight aqueous oxidized hydroxide solution at 25 ° C is used as a developing solution is performed. Thereby, a portion of the non-hardened photoresist layer that is not irradiated with ultraviolet rays is removed, and further shown as a drawing The development of the layer (a,) and the partition wall forming material layer (a) is performed continuously. The ultra-pure water is washed and dried. Thereby, the pattern of the partition wall forming material layer composed of the material layer residual portion and the material layer removing portion can be formed. <Baking step> The layer having the pattern formed layer will be formed. The glass substrate is baked in a firing furnace at a temperature of 560 ° C for 3 Q minutes. In this way, a panel material can be formed on the surface of the glass substrate. A cross-section of the partition wall in the obtained panel material is obtained. The shape was observed with a scanning cat-type electron microscope. As a result, when measuring the width and height of the bottom surface of the cross-sectional shape, the width of the bottom surface was 40 μπι ± 3 μηι, and the height was ΐ50 μηι: £ 3 μιη, the dimensional accuracy was extremely high, and the etching of the next wall could form sharp The figure is self-explanatory. In addition, no peeling or deformation of the pattern was observed. The evaluation results are shown in Table 2. [Example 5] -49- 200525579 (47) Except that the photoresist composition (r_ 1) used was changed to the photoresist composition (r_ 2), and the non-photosensitive composition (a-1) used was changed to non-photosensitive A transfer film was produced in the same manner as in Example 4 except for the component (a-3), and the obtained transfer film was used to form a layer for forming a barrier rib on a glass substrate, followed by exposure, development, and firing. Thereby, a panel material capable of forming a partition wall on the surface of the glass substrate can be obtained. The cross-sectional shape of the partition wall in the obtained panel material was observed with a scanning electron microscope. Result 'When measuring the width and height of the bottom surface of the cross-sectional shape, the bottom surface / &lt; 1 width is 40 μηι: ±: 3 μιη, the height is 150 μιη soil 5 μm, the dimensional accuracy is extremely high, and the etching that can form the partition wall has a sharp pattern For self-evident. In addition, no peeling or deformation of the pattern was observed. The evaluation results are shown in Table 2. [Example 6] Except that the used photoresist composition (r-1) was changed to a photoresist composition (b2) 'The used non-photosensitive composition (a-1) was changed to a non-photosensitive composition (a- 4) Except for “other than the same method as in Example 4, a transfer thin film was produced”. The obtained transfer film was used to form a layer for forming a partition on a glass substrate, and exposed, developed, and fired. Thereby, a panel material capable of forming a partition wall on the surface of the glass substrate can be obtained. The cross-sectional shape of the partition wall in the obtained panel material was observed with a scanning electron microscope. As a result, in measuring the width and height of the bottom surface of the cross-sectional shape, the width of the bottom surface was 40 μηι: ± 3 μΓη, and the height was 150 μπι: ^ 5 μΓη. The dimensional accuracy was extremely high, and the sharp pattern of the etching of the partition wall was self-evident. In addition, it is impossible to observe the peeling or deformation of the residue or pattern. The evaluation results are shown in Table 2. -50- 200525579 (48) [Comparative Examples 1 0 to 12] As a comparative example, a transfer film was produced in the same manner as in Example 4 except for the combination of the composition used in each layer, and the obtained transfer film was used. The printed film forms a layer for forming a partition wall on a glass substrate, and is exposed, developed, and fired. The composition used and the evaluation results are shown in Table 2. Table 2 Implementation Comparison Comparative Example 4 Example 5 Example 6 Example 10 Example 1 1 Example 12 A 2-layer group or object 1 a-3 8-4 a-1 2-2 a-2 A 3-layer composition a- 2 a-2 a-2 a-1 a-2 a-] Photoresist layer composition r- 1 r-2 r-2 Bu 1 Bu 1 r- 1 Photoresist layer development speed (μ ra / sec) 0.43 0.43 0.43 0.43 A2 layer development speed (μΓη / second) 0.95 0.85 0.88 0.95 0.54 0.54 A 3 layer development speed (μ m / second) 0.54 0.54 0.54 0.95 0.54 0.95 Good shape of the partition wall Good Good Bad Bad

【圖式簡單說明】 第1圖：表示一般PDP之說明用剖面圖。 【主要元件符號說明】 1 玻璃基板 2 玻璃基板 3 隔壁 -51 - 200525579 (49) 4 透明電極 5 匯流排電極 6 位址電極 7 螢光體 8 電介質層 9 電介質層 10 保護膜[Brief Description of the Drawings] Figure 1: A cross-sectional view for explaining a general PDP. [Description of main component symbols] 1 Glass substrate 2 Glass substrate 3 Partition -51-200525579 (49) 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Phosphor 8 Dielectric layer 9 Dielectric layer 10 Protective film

-52--52-

Claims (1)

200525579 (1) 十、申請專利範圍 1. 一*種電漿顯示器面板構件之製造方法，其爲含 有，（1)基板上，使含無機粉體與鹼可溶性樹脂之非感 、 光性層（A1 )形成之步驟， ， (2 )在A 1層上，使含有無機粉體與鹼可溶性樹脂與 敏輻射性成分之感光性層（B〗）形成之步驟， (3 )將B ]層曝光處理使圖型之潛像形成之步驟， (4 )藉由顯影處理使b 1層之圖型形成之步騾， # (5 )透過B〗層之圖型，藉由顯影處理使A 1層選擇 性溶解，使A1層之圖型形咸之步驟，及 (6 )將所得之圖型予以焙燒處理之步驟 如此所構成者，其特徵爲，A1層與B 1層係，可滿足 下述（i )〜（iii )所示條件至少之一者， (i ) A 1層所含鹼可溶性樹脂之聚苯乙烯換算重量平 均分子量，比B1層所含鹼可溶性樹脂之聚苯乙烯換算重 量平均分子量比較更小， ® (ii ) A 1層所含鹼可溶性樹脂具有來自丙烯酸構造單 元之樹脂，B 1層所含鹼可溶性樹脂具有來自甲基丙烯酸 構造單元之樹脂， (iii )在A1層進而含有溶解促進劑’ A1層所含溶解 ~ 促進劑之相對於A 1層全重量之含量’比B1層所含溶解促 進劑之相對於B 1層全重量之含量多。 2. 如申請專利範圍第1項記載之電漿顯示器面板構 件之製造方法，其中’ B 1層所含驗可溶性樹脂之聚苯乙 -53- 200525579 (2) 烯換算重量平均分子量與，A 1層所含鹼可溶性樹脂之聚 苯乙烯換算重量平均分子量之差爲5,000〜60,000° 3.如申請專利範圍第1項記載之電漿顯示器面板構 件之製造方法，其中，A1層所含溶解促進劑爲聚烷撐二 醇。 4 . 一種電漿顯示器面板構件之製造方法’其爲含 有，（1 )在基板上，使含有無機粉體與鹼可溶性樹脂之 非感光性層（A2 )彤成之步驟， (2 )在A2層上，使含有無機粉體與鹼可溶性樹脂之 非感光性層（A3 )彭成之步驟， (3 )在A3層上使光阻層形成之步驟， (4 )使光阻層曝光處理，以使圖型之潛像形成之步 驟， (5 )藉由顯影處理使光阻層之圖型形成之步驟， (6 )透過光阻層之圖型，藉由顯影處理使 A3層及 A2層選擇性溶解，A3層及A2層之圖型形成之步驟，及 (7 )使所得之圖型予以焙燒處理之步驟 如此所構成者，其特徵爲，A2層與A3層係，可滿足 下述（iv )〜（Λ/i )所示條件至少之一者， (iv ) A2層所含鹼可溶性樹脂之聚苯乙烯換算重量平 均分子量，比層所含驗可溶性樹脂之聚苯乙條換算重 量平均分子量小， (v ) A2層所含鹼可溶性樹脂具有來自丙烯酸構造單 元之樹脂，A 3層所含鹼可溶性樹脂具有來自甲基丙烯酸 -54- 200525579 (3) 構造單元之樹脂， (v i )在A 2層進而含有溶解促進劑，A 2層所含溶解 促進劑之相對於A2層全重量之含量，比A3層所含溶解 促進劑之相對於A 3層全重量之含量多。 5 .如申請專利範圍第4項記載之電漿顯示器面板構 件之製造方法，其中，A 3層所含鹼可溶性樹之聚苯乙烯 換算重量平均分子量，與A2層所含鹼可溶性樹脂之聚苯 乙烯換算重量平均分子量之差爲5，〇〇〇〜60，000， 6 .如申請專利範圍第4項記載之電漿顯示器面板構 件之製造方法，其中，A2層衔含溶解促進劑係聚烷撐二 1，如申請專利範圍第1〜6項中任一項記載之電漿顯 示器面板構件之製造方法，其中，電漿顯示器面板構件， 係選自隔壁’電極’電阻體，螢光體，濾色器及黑矩陣之 至少一種之構件。 8 .如申請專利範圍第1〜6項中任一項記載之電漿顯 示器面板構件之製造方法，其中，上述電漿顯示器面板構 件爲隔壁。 9 · 一種轉印薄膜，其爲在支持薄膜上含有，無機粉體 與驗可溶性樹脂與因應需要之感光性成分之層爲二層以上 所形成之轉印薄賤，其特徵爲滿足下述（a )〜（c )所示 條件至少之一， (a )在支持薄膜上所形成之任意之一層（I )中所含 驗可溶性樹脂之聚苯乙烯換算重量平均分子量，比該層上 -55- 200525579 (4) 所形成之另一層（11 )中所含鹼可溶性樹脂之聚苯乙烯換 算重量平均分子量大， (b)在支持薄膜上所形成之任意之一層（ΙΠ)中所 含鹼可溶性樹脂具有來自甲基丙烯酸之構造單元之樹脂， 該.（111 )層上所形成之另一層（I v )中所含鹼可溶性樹脂 具有來自丙烯酸構造單元之樹脂， (C )在支持薄膜上所形成之任意之一層（V )上可形 成另一層（V I )，在至少該（V I )層中進而含有溶解促進 劑，該（V I )層中所含溶解促進劑之相對於（V ][)層全重 量之含量，比該（V)層中靳含相對於溶解促進劑之 (V)層全重量含量多。 10. —種轉印薄膜，其爲在支持薄膜上，具有，含無 機粉體與鹼可溶性樹脂與敏輻射性成分之感光性層 (Β 1 )，及含有無機粉體與鹼可溶性樹脂之非感光性層 (Α1 )，之轉印薄膜，在Β1層之上具有Α1層，Α1層與 Β 1層滿足下述（i )〜（i i i )所示條件至少之一者， (i ) A 1層所含鹼可溶性樹脂之聚苯乙烯換算重量平 均分子量，比Β 1層所含鹼可溶性樹脂之聚苯乙烯換算重 量平均分子量小， (Π ) Β 1層所含鹼可溶性樹脂具有來自甲基丙烯酸構 造單元之樹脂，A1層所含鹼可溶性樹脂具有來自丙烯酸構 造單元之樹脂， (iii )在A1層進而含有溶解促進劑，A1層所含溶解 促進劑之相對於A 1層全重量之含量’比Β 1層所含溶解促 -56- 200525579 (5) 進劑相對於B 1層全重量之含量多。 11.如申請專利範圍第1 〇項記載之轉印薄膜，其 中，B 1層所含鹼可溶性樹脂之聚苯乙燏換算重量平均分 子量與，A 1層所含鹼可溶性樹脂之聚苯乙燒換算重量平 均分子量之差爲5,000〜60,〇〇〇。 】2 .如申請專利範圍第1 0項記載之轉印薄膜，其中A ] 層所含溶解促進劑爲聚烷撐二醇。 13. —種轉印薄膜，其爲具有，在支持薄膜上，含有 無機粉體與鹼可溶性樹脂之非感光性層（A 3 ),及含有無 機粉體與鹼可溶性樹脂之非感光性層（A2 )，之薄膜， 其特徵爲，A3層之上具有A2層，A2層與A3層可滿 足下述（i v )〜（vi )所示·條件至少之一者， (i v ) A 2層所含鹼可溶性樹脂之聚苯乙烯換算重量平 均分子量，比A3層所含鹼可溶性樹脂之聚苯乙烯換算重 量平均分子量小， (v ) A 3層所含鹼可溶性樹脂具有來自甲基丙烯酸構 造單元之樹脂，A2層所含鹼可溶性樹脂具有來自丙烯酸 構造單元之樹脂’ (v i ) A 2層進而含有溶解促進劑，A 2層所含溶解促 進劑之相對於A 2層全重量之含量，比A 3層所含溶解促 進劑之相對於A3層全重量之含量多。 1 4 ·如申請專利範圍第1 3項記載之轉印薄膜，其 中，A 3層與支持薄膜之間具有光阻層。 15.如申請專利範圍第1 3或14項記載之轉印薄膜， -57- 200525579 (6) 其中，A3層所含鹼可溶性樹脂之聚苯乙烯換算重量平均 分子量與，A2層所含鹼可溶牲樹脂之聚苯乙烯換算重量 平均分子量之差係5;000〜60,000。 16.如申請專利範圍第1 3或14項記載之轉印薄膜， 其中A2層所含溶解促進劑爲聚烷撐二醇。 ]7 .如申請專利範圍第9〜]4項中任一項記載之轉印薄 膜，其中，無機粉體爲玻璃粉末。200525579 (1) X. Application for patent scope 1. A method for manufacturing a plasma display panel member, comprising: (1) a non-sensitive, light-sensitive layer on a substrate, containing inorganic powder and an alkali-soluble resin ( A1) forming step, (2) forming a photosensitive layer (B) containing inorganic powder, alkali-soluble resin and radiation-sensitive component on layer A1, and (3) exposing layer B] The process of forming the latent image of the pattern, (4) the step of forming the pattern of the b 1 layer by the development process, # (5) the pattern of the B layer, and the A 1 layer by the development process The step of selectively dissolving and making the pattern of the A1 layer salty, and (6) the step of baking the obtained pattern is composed of the characteristics that the A1 layer and the B1 layer are able to satisfy the following At least one of the conditions shown in (i) to (iii), (i) The polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in layer A1 is larger than the polystyrene-equivalent weight-average molecular weight of the alkali-soluble resin contained in layer B1. The molecular weight is smaller, and the alkali-soluble resin contained in ® (ii) A 1 layer has a structure derived from acrylic acid. Resin for building unit. Alkali soluble resin contained in layer B1 has resin derived from methacrylic acid structural unit. (Iii) A1 layer further contains a dissolution accelerator. The dissolution in the A1 layer ~ promoter is higher than that of the A1 layer. The content of weight 'is larger than the content of the dissolution accelerator contained in the B1 layer with respect to the total weight of the B1 layer. 2. The method for manufacturing a plasma display panel member as described in item 1 of the scope of the patent application, wherein 'B 1 layer of polystyrene-53-200525579 for the soluble resin contained in the test resin (2) olefin-equivalent weight average molecular weight and A 1 The difference between the polystyrene-equivalent weight average molecular weights of the alkali-soluble resins contained in the layers is 5,000 to 60,000 ° 3. The method for manufacturing a plasma display panel member described in item 1 of the patent application scope, wherein the dissolution promoter contained in the A1 layer Polyalkylene glycol. 4. A method for manufacturing a panel member of a plasma display panel, comprising the steps of: (1) forming a non-photosensitive layer (A2) containing an inorganic powder and an alkali-soluble resin on a substrate, and (2) in A2 A step of forming a non-photosensitive layer (A3) containing inorganic powder and an alkali-soluble resin on the layer, (3) forming a photoresist layer on the A3 layer, and (4) exposing the photoresist layer to Step of forming a latent image of a pattern, (5) a step of forming a pattern of a photoresist layer by a development process, (6) a pattern of a photoresist layer, and making the A3 layer and the A2 layer selective by a development process The steps of dissolution, pattern formation of the A3 layer and the A2 layer, and (7) the step of firing the obtained pattern are composed of the features that the A2 layer and the A3 layer system can satisfy the following (iv (Iv) At least one of the conditions shown in (Λ / i), (iv) The polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the A2 layer, and the polystyrene-equivalent weight-average molecular weight of the soluble resin contained in the layer. (V) Alkali-soluble resin contained in (v) A2 layer The resin, the alkali soluble resin contained in layer A 3 has resin derived from methacrylic acid-54-200525579 (3) the structural unit, (vi) the layer A 2 further contains a dissolution promoter, and the layer A 2 contains a dissolution promoter. The content relative to the total weight of the A2 layer is larger than the content relative to the total weight of the A3 layer contained in the A3 layer. 5. The method for manufacturing a plasma display panel member according to item 4 of the scope of the patent application, wherein the polystyrene-equivalent weight average molecular weight of the alkali-soluble tree contained in the layer A 3 and the polybenzene of the alkali-soluble resin contained in the layer A 2 The difference between the weight-average molecular weights in terms of ethylene is 5,000 to 60,000, 6. As described in the method for manufacturing a plasma display panel member described in item 4 of the scope of patent application, wherein the A2 layer contains a dissolution promoter polyalkane. Supporting method 1. The manufacturing method of a plasma display panel member as described in any one of items 1 to 6 of the scope of application for a patent, wherein the plasma display panel member is selected from a partition 'electrode' resistor, a phosphor, A component of at least one of a color filter and a black matrix. 8. The method for manufacturing a plasma display panel member according to any one of items 1 to 6 of the scope of application for a patent, wherein the plasma display panel member is a partition wall. 9 · A transfer film containing two or more layers of inorganic powder, a soluble resin, and a photosensitive component as required, on a support film, which is characterized by the following ( a) at least one of the conditions shown in (c), (a) the polystyrene-equivalent weight-average molecular weight of the soluble resin contained in any one of the layers (I) formed on the support film, which is -55 over the layer -200525579 (4) The polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the other layer (11) formed is large, and (b) the alkali-solubility contained in any of the layers (IΠ) formed on the supporting film The resin has a resin derived from a methacrylic structural unit. The alkali-soluble resin contained in another layer (I v) formed on the (111) layer has a resin derived from an acrylic structural unit, and (C) is supported on a supporting film. Another layer (VI) may be formed on any one of the formed layers (V), and at least the (VI) layer further contains a dissolution accelerator, and the dissolution accelerator contained in the (VI) layer is relative to (V) [) Layer weight content It is more than the content of the (V) layer in the (V) layer relative to the total weight of the (V) layer in the dissolution accelerator. 10. A transfer film comprising a photosensitive layer (B 1) containing an inorganic powder and an alkali-soluble resin and a radiation-sensitive component on a supporting film, and a non-ionic layer containing an inorganic powder and an alkali-soluble resin. The photosensitive layer (Α1), the transfer film, has an A1 layer on top of the B1 layer, and the A1 layer and the B1 layer satisfy at least one of the conditions shown in (i) to (iii) below, (i) A 1 The polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the layer is smaller than the polystyrene-equivalent weight-average molecular weight of the alkali-soluble resin contained in the B1 layer. (Π) The alkali-soluble resin contained in the B1 layer is derived from methacrylic acid. Resin of the construction unit, the alkali-soluble resin contained in the A1 layer has a resin derived from the acrylic construction unit, (iii) further contains a dissolution accelerator in the A1 layer, and the content of the dissolution accelerator contained in the A1 layer relative to the total weight of the A1 layer ' More than the dissolution promoting -56- 200525579 contained in the layer B 1 (5) The content of the agent relative to the total weight of the layer B 1 is greater. 11. The transfer film according to item 10 in the scope of the patent application, wherein the polystyrene-equivalent weight-average molecular weight of the alkali-soluble resin contained in the B 1 layer is the same as that of the polyphenylene terephthalate of the alkali-soluble resin contained in the A 1 layer. The difference between the converted weight average molecular weights is 5,000 to 60,000. ] 2. The transfer film according to item 10 in the scope of the patent application, wherein the dissolution promoter contained in the A] layer is a polyalkylene glycol. 13. A transfer film comprising, on a supporting film, a non-photosensitive layer (A 3) containing an inorganic powder and an alkali-soluble resin, and a non-photosensitive layer containing an inorganic powder and an alkali-soluble resin ( A2) is a thin film, characterized in that A2 layer is provided on A3 layer, and A2 layer and A3 layer can satisfy at least one of the conditions shown in (iv) to (vi) below, (iv) A2 layer The polystyrene equivalent weight average molecular weight of the alkali-soluble resin contains less than the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the A3 layer. (V) The alkali-soluble resin contained in the A3 layer has a derivation unit derived from methacrylic acid. Resin, the alkali-soluble resin contained in the A2 layer has a resin derived from an acrylic structural unit. (Vi) The A2 layer further contains a dissolution accelerator, and the content of the dissolution accelerator contained in the A2 layer relative to the total weight of the A2 layer is greater than A The content of the dissolution promoter contained in the three layers is larger than the total weight of the A3 layer. 14 · The transfer film according to item 13 of the scope of patent application, wherein a photoresist layer is provided between the A 3 layer and the supporting film. 15. The transfer film described in item 13 or 14 of the scope of patent application, -57- 200525579 (6) Among them, the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the A3 layer and the alkali contained in the A2 layer may be The difference between the polystyrene-equivalent weight-average molecular weight of the solvent resin is 5,000 to 60,000. 16. The transfer film according to item 13 or 14 of the scope of the patent application, wherein the dissolution promoter contained in the A2 layer is a polyalkylene glycol. ] 7. The transfer film according to any one of claims 9 to 4 in the scope of the patent application, wherein the inorganic powder is a glass powder. -58--58-
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