JP2005216604A - Method of manufacturing plasma display panel member and transfer film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a plasma display component excellent in shaping a pattern and transfer film suitably used for this method. <P>SOLUTION: The PDP component is manufactured by forming a photosensitive layer or a resist layer containing specific alkali soluble resin and specific inorganic powder on a non-photosensitive layer containing specific alkali soluble resin and specific inorganic powder, and then exposing, developing and sintering it. Further, a photosensitive layer or a resist layer containing specific alkali soluble resin and specific inorganic powder is formed on a supporting film, and a non-photosensitive layer containing specific alkali soluble resin and specific inorganic powder is formed on the formed layer, thereby obtaining a transfer film suitably used for manufacturing the PDP component. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for producing a plasma display panel member and a transfer film suitably used for the production method.

  In recent years, a plasma display has attracted attention as a flat fluorescent display. FIG. 1 is a schematic view showing a cross-sectional shape of an AC type plasma display panel (hereinafter also referred to as “PDP”). In the figure, reference numerals 1 and 2 denote glass substrates arranged opposite to each other, 3 denotes a partition, and cells are defined by the glass substrate 1, the glass substrate 2, and the partition 3. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode 4 for the purpose of reducing the resistance of the transparent electrode 4, 6 is an address electrode fixed to the glass substrate 2, and 7 is a cell. Fluorescent material held inside, 8 is a dielectric layer formed on the surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, and 9 is formed on the surface of the glass substrate 2 so as to cover the address electrode 6 The dielectric layers 10 are protective films made of, for example, magnesium oxide. In the color PDP, a color filter (red / green / blue) or a black matrix may be provided between the glass substrate and the dielectric layer in order to obtain a high contrast image.

  As a method for forming the partition walls, electrodes, resistors, phosphors, color filters, black matrix and the like which are PDP members, a photolithography method is suitable. Here, the photolithography method is to form a layer made of a paste-like photosensitive composition containing an inorganic powder and a vehicle on the surface of a substrate or the like, and to form a pattern by exposing and developing the layer. This pattern is fired to remove organic substances and sinter inorganic powder. In particular, a photolithographic method characterized by using a transfer film having a layer made of a photosensitive composition and transferring it to the surface of a substrate or the like can provide a film with excellent thickness uniformity and work efficiency. It is very preferable because it is improved.

  For example, when the partition is formed by the above-described method, the organic material is removed in the baking process and the film thickness is reduced. Therefore, the transfer layer is about 1.3 to 2.0 times the thickness of the partition wall to be formed. It is necessary. For example, in order to set the partition wall thickness to 100 to 150 μm, the transfer layer needs to have a thickness of about 130 to 300 μm. It is desirable that the partition walls constituting the PDP have a high aspect ratio and a uniform shape from the viewpoint of developing good electrical characteristics. However, when the thickness of the transfer layer is large, the pattern side wall tends to be removed during development, and it is difficult to obtain a partition having a uniform and good pattern shape. In addition, if the baking process is performed with the side walls of the pattern removed during development, the pattern may be peeled off or the deformation may be severe.

In order to solve such problems, for example, in a method of manufacturing a PDP barrier rib, the barrier rib forming composition film has a structure in which two or more barrier rib forming compositions having different solubility in a developer are laminated. An invention relating to a method for manufacturing a partition wall for PDP is disclosed (for example, see Patent Document 1).
However, in the above disclosed method, only the copolymer composition ratio of the composition is changed to change the solubility, so the difference in solubility may not be sufficient, and the partition shape is uniform and good. There was still a problem in terms of getting.
Japanese Patent Laid-Open No. 9-92137 (page 2-12, FIG. 3-5)

  An object of the present invention is to provide a method for producing a PDP member having an excellent pattern shape and a transfer film that can be suitably used for the production method.

The first PDP member manufacturing method of the present invention (hereinafter also referred to as “PDP member manufacturing method I”) is:
(1) forming a non-photosensitive layer (A1) containing an inorganic powder and an alkali-soluble resin on a substrate;
(2) forming a photosensitive layer (B1) containing inorganic powder, an alkali-soluble resin and a radiation-sensitive component on the A1 layer;
(3) A step of exposing the B1 layer to form a latent image of the pattern,
(4) forming a B1 layer pattern by development processing;
(5) A plasma display panel including a step of selectively dissolving the A1 layer by development processing through the pattern of the B1 layer to form a pattern of the A1 layer, and (6) a step of baking the obtained pattern A method for manufacturing a member, comprising:
The weight average molecular weight in terms of polystyrene of the alkali-soluble resin contained in the A1 layer is smaller than the weight average molecular weight in terms of polystyrene of the alkali-soluble resin contained in the B1 layer.

The second PDP member manufacturing method of the present invention (hereinafter also referred to as “PDP member manufacturing method II”) is:
(1) forming a non-photosensitive layer (A2) containing inorganic powder and an alkali-soluble resin on a substrate;
(2) forming a non-photosensitive layer (A3) containing inorganic powder and alkali-soluble resin on the A2 layer;
(3) A step of forming a resist layer on the A3 layer,
(4) a step of exposing the resist layer to form a latent image of the pattern;
(5) a step of forming a pattern of the resist layer by development processing;
(6) A step of selectively dissolving the A3 layer and the A2 layer by a development process through the pattern of the resist layer to form a pattern of the A3 layer and the A2 layer, and (7) baking the obtained pattern. A method of manufacturing a plasma display panel member including a process,
The weight average molecular weight in terms of polystyrene of the alkali-soluble resin contained in the A2 layer is smaller than the weight average molecular weight in terms of polystyrene of the alkali-soluble resin contained in the A3 layer.

The transfer film of the present invention is a multilayer film in which two or more layers containing an inorganic powder, an alkali-soluble resin and, if necessary, a photosensitive component are formed on a support film,
The weight average molecular weight in terms of polystyrene of the alkali-soluble resin contained in one layer (I) is the weight average molecular weight in terms of polystyrene of the alkali-soluble resin contained in the other layer (II) on the (I) layer. It is characterized by being smaller than the molecular weight.

  The method for producing a PDP member of the present invention is particularly preferably used for producing a partition wall.

  According to the method for producing a PDP member of the present invention, a member having an excellent pattern shape can be formed. Moreover, if the transfer film of the present invention is used, a PDP member having a uniform film thickness can be formed, and the work efficiency is improved because the number of steps is substantially reduced.

  Hereinafter, the present invention will be described in detail.

<PDP member manufacturing method I>
The manufacturing method I of the PDP member of the present invention includes [1] a non-photosensitive layer (A1) forming step, [2] a photosensitive layer (B1) forming step, [3] a B1 layer exposing step, [4] B1 layer and A1 layer development step and [5] firing step. By this production method I, it is possible to form at least one PDP member selected from partition walls, electrodes, resistors, phosphors, color filters, and black matrices. The method for producing a PDP member of the present invention is particularly preferably used for forming partition walls.

  The production method I of the PDP member of the present invention is characterized in that the weight average molecular weight (Mw) of the alkali-soluble resin contained in the A1 layer is smaller than the alkali-soluble resin Mw contained in the B1 layer. The polystyrene equivalent weight average molecular weight in the present invention means a polystyrene equivalent weight average molecular weight by GPC measurement.

  When the alkali-soluble resin Mw contained in the A1 layer is smaller than the alkali-soluble resin Mw contained in the B1 layer, the A1 layer is more easily dissolved in the developer than the B1 layer. Therefore, the side wall of the pattern is hardly removed during the development process, and a PDP member having an excellent pattern shape can be obtained. In order to make the effect of the present invention more remarkable, the difference between the Mw of the alkali-soluble resin contained in the B1 layer and the Mw of the alkali-soluble resin contained in the A1 layer is 5,000 to 60,000. It is preferable that it is 10,000 to 40,000.

  Hereinafter, each process of the present invention will be described by taking the production of the partition wall as an example.

[1] Formation Step of Non-Photosensitive Layer (A1) In this step, the non-photosensitive layer (A1) is formed on the substrate. The composition constituting the A1 layer (hereinafter also referred to as “composition a1”) is the same as the constituent of the transfer film of the present invention described later. The A1 layer can be formed by applying the composition a1 by various methods such as a screen printing method, a roll coating method, a spin coating method, a casting coating method, and a transfer method, and then drying the coating film. Further, from the viewpoint of thickness uniformity of the obtained layer and work efficiency, the A1 layer can also be formed on the substrate using a transfer film.

  The transfer film used here is a film in which an A1 layer is formed on a support film. Moreover, this transfer film may have a protective film on the A1 layer. The support film used here is the same as the constituent components of the transfer film of the present invention described later.

An example of the transfer process is as follows. After peeling off the protective film layer of the transfer film, the transfer film is overlaid so that the surface of the A1 layer is in contact with the surface of the substrate. Then, thermocompression bonding is performed with a heating roller, and the support film is peeled off. As a result, the A1 layer is transferred to and closely attached to the surface of the substrate. As the transfer conditions, the surface temperature of the heating roller can be 80 to 140 ° C., the roll pressure can be 1 to 5 kg / cm ² , and the moving speed can be 0.1 to 10.0 m / min. The substrate may be preheated, and the preheating temperature is, for example, 40 to 100 ° C.

  The thickness of the material layer A1 varies depending on the member to be formed, but in the case of a partition wall, it is usually 50 to 150 μm, preferably 70 to 120 μm.

[2] Step of forming photosensitive layer (B1) In this step, the photosensitive layer (B1) is formed on the A1 layer. The composition constituting the B1 layer (hereinafter also referred to as “composition b1”) is the same as the constituent of the transfer film of the present invention described later.

  The B1 layer can be formed by the same method as the A1 layer. Therefore, the B1 layer may be formed on the A1 layer using a transfer film. According to this method, a layer having excellent thickness uniformity can be formed, and the working efficiency can be improved.

  The thickness of the B1 layer varies depending on the member to be formed, but in the case of a partition wall, it is usually 50 to 150 μm, preferably 70 to 120 μm.

  The step [1] and the step [2] can be performed separately, but from the viewpoint of improving the film thickness uniformity and the working efficiency, the transfer film of the present invention is used, and the steps [1] and [2] ] Is particularly preferable.

[3] B1 layer exposure step In this step, the surface of the B1 layer formed on the A1 layer is selectively irradiated (exposed) with radiation such as ultraviolet rays through an exposure mask to form a pattern of the B1 layer. The latent image is formed.

  Although the radiation irradiation apparatus is not particularly limited, an ultraviolet irradiation apparatus used in a general enemy photolithography method or an exposure apparatus used when manufacturing a semiconductor or a liquid crystal display device can be used.

[4] B1 layer and A1 layer development step In this step, the exposed B1 layer is developed to form a B1 layer pattern. Then, the A1 layer is selectively dissolved by the development process through the formed B1 layer pattern to form the A1 layer pattern.

  Development conditions such as the type / composition / concentration of the developer, the development time, and the development temperature can be appropriately selected according to the type of resin in the B1 layer and the A1 layer.

  Further, development can be performed by various development methods such as an immersion method, a rocking method, a shower method, a spray method, and a paddle method. The developing device is not particularly limited.

  By this development step, a B1 layer pattern (pattern corresponding to an exposure mask) composed of the remaining portion of the B1 layer and the removed portion of the B1 layer is formed. This pattern acts as a mask for the A1 layer that is continuously developed. That is, the A1 layer portion corresponding to the B1 layer removing portion is dissolved in the developer and selectively removed. If the development process is further continued, the portion of the substrate surface corresponding to the B1 layer removal portion is exposed. Thereby, the pattern of the A1 layer corresponding to the pattern of the B1 layer is formed below the pattern of the B1 layer.

[5] Baking process In this process, the layer having the formed pattern is baked. As a result, the organic material in the layer is burned out to form a layer made of an inorganic material, and a PDP member formed on the surface of the substrate can be obtained.

  The temperature of the baking treatment needs to be a temperature at which the organic substance in the layer is burned out, and is usually 400 to 600 ° C. The firing time is usually 10 to 90 minutes.

<PDP member manufacturing method II>
The production method II of the PDP member of the present invention includes [1] a non-photosensitive layer (A2) forming step, [2] a non-photosensitive layer (A3) forming step, [2 ′] a resist layer forming step, [ 3) a resist layer exposure step, [4] a resist layer, an A3 layer and an A2 layer developing step, and [5] a baking step. By this production method II, it is possible to form at least one panel member selected from barrier ribs, electrodes, resistors, phosphors, color filters, and black matrices. The method for producing a PDP member of the present invention is particularly preferably used for forming partition walls.

  The PDP member manufacturing method II is characterized in that the Mw of the alkali-soluble resin contained in the A2 layer is smaller than the Mw of the alkali-soluble resin contained in the A3 layer.

Since the alkali-soluble resin Mw contained in the A2 layer is smaller than the alkali-soluble resin Mw contained in the A3 layer, the A2 layer is more easily dissolved in the developer than the A3 layer. For this reason, a PDP member having an excellent pattern shape can be obtained in which the side wall of the pattern is not easily removed during the development process. In order to make the effect of the present invention more remarkable, the difference between the Mw of the alkali-soluble resin contained in the A2 layer and the Mw of the alkali-soluble resin contained in the A3 layer is 5,
It is preferable that it is 000-60,000, and it is more preferable that it is 10,000-40,000.

  Each said process applies to each process of the manufacturing method I of a PDP member, respectively. Moreover, although the said process [1], a process [2], and a process [2 '] can also be performed separately, from a viewpoint of improvement of film thickness uniformity and work efficiency, using the transfer film of this invention, A method in which the step [1], the step [2] and the step [2 ′] are collectively performed is particularly preferable.

  Below, the material used for each process of the manufacturing methods I and II of the said PDP member, various conditions, etc. are demonstrated.

The substrate substrate material is an insulating material such as glass, silicon, or alumina. The substrate surface is subjected to pretreatment such as chemical treatment with a silane coupling agent, etc .; plasma treatment; thin film formation treatment by ion plating, sputtering, gas phase reaction, vacuum deposition, etc., as necessary. It may be.

Although the exposure pattern of the exposure mask used in the exposure mask exposure step varies depending on the purpose, for example, stripes having a width of 10 to 500 μm are used.

Developer The developer used in the present invention is an alkaline developer. As an active ingredient of the alkaline developer, for example, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate , Potassium dihydrogen phosphate, sodium dihydrogen phosphate, lithium silicate, sodium silicate, potassium silicate, lithium hydrogen carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, Inorganic alkaline compounds such as sodium borate, potassium borate and ammonia; tetramethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamino , Triethylamine, monoisopropylamine, diisopropylamine, organic alkali compounds such as ethanolamine and the like.

The alkaline developer can be prepared by dissolving one or more of the alkaline compounds in water or the like. The concentration of the alkaline compound in the alkaline developer is usually 0.001 to 10% by weight, preferably 0.01 to 5% by weight. In addition, after the development process with an alkali developer is performed, a washing process is usually performed.

<Transfer film>
The transfer film of the present invention is a multilayer film in which two or more layers containing an inorganic powder, an alkali-soluble resin and, if necessary, a photosensitive component are formed on a support film, and in one layer (I) thereof The polystyrene-converted weight average molecular weight of the alkali-soluble resin contained is smaller than the polystyrene-converted weight average molecular weight of the alkali-soluble resin contained in the other layer (II) on the (I) layer. Moreover, you may have a protective film on this multilayer film. The transfer film repeats applying a composition containing an inorganic powder, an alkali-soluble resin and, if necessary, a photosensitive component on a support film, drying the coating film and removing part or all of the solvent. Can be produced. If necessary, a resist composition is applied onto a support film, the coating film is dried to form a resist layer, and the composition is applied onto the resist layer and dried to produce a transfer film. Also good.

  Preferred embodiments of the transfer film of the present invention are as follows.

1. Transfer film suitable for manufacturing method I of PDP member Non-photosensitive layer (B1) containing inorganic powder, alkali-soluble resin and radiation-sensitive component on support film, and non-containing material containing inorganic powder and alkali-soluble resin A transfer film having a photosensitive layer (A1), having an A1 layer on the B1 layer, and the Mw of the alkali-soluble resin contained in the B1 layer is smaller than the Mw of the alkali-soluble resin contained in the A1 layer Transfer film characterized by

2. Transfer film suitable for production method II of PDP member Non-photosensitive layer (A3) containing inorganic powder and alkali-soluble resin on support film, and non-photosensitive layer containing inorganic powder and alkali-soluble resin (A3) A2) is a film having an A2 layer on the A3 layer, and the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the A2 layer is the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the A3 layer Transfer film characterized by being smaller than. A transfer film comprising a resist layer between the A3 layer of the transfer film and the support film.

  Further, a film having a resist layer, a non-photosensitive layer (A3) containing an inorganic powder and an alkali-soluble resin, and a non-photosensitive layer (A2) containing an inorganic powder and an alkali-soluble resin on a support film. And having an A3 layer on the resist layer and an A2 layer on the A3 layer, and the polystyrene-converted weight average molecular weight of the alkali-soluble resin contained in the A2 layer is the alkali-soluble in the A3 layer. A transfer film characterized by being smaller than the polystyrene-reduced weight average molecular weight of the resin.

  Hereinafter, each component of the transfer film of this invention is demonstrated concretely.

The support film is preferably a resin film having heat resistance and solvent resistance and flexibility. Since the support film has flexibility, the paste-like composition can be applied by a roll coater, and the partition-forming material layer can be stored and supplied in a state of being wound in a roll. Examples of the resin forming the support film include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, and other fluorine-containing resins, nylon, and cellulose. The thickness of the support film is, for example, 20 to 100 μm.

  In addition, it is preferable that the mold release process is performed to the surface of the support film. Thereby, the peeling operation of a support film can be easily performed in the above-mentioned transfer process.

A1 layer A1 layer is a paste-like non-photosensitive composition (hereinafter also referred to as “composition a1”) containing inorganic powder, an alkali-soluble resin and a solvent, and the coating film is dried. It can be formed by removing part or all of the solvent.

(1) Inorganic powder The inorganic powder used in the composition a1 of the present invention varies depending on the type of forming material.

Examples of the inorganic powder used for the PDP partition wall forming material include glass powder, for example, a low-melting glass frit. Examples of such low melting point glass frit include (1) zinc oxide, boron oxide, silicon oxide type (ZnO—B ₂ O ₃ —SiO ₂ type), (2) lead oxide,
Boron oxide, silicon oxide system (PbO—B ₂ O ₃ —SiO ₂ system), (3) lead oxide, boron oxide, silicon oxide, aluminum oxide system (PbO—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ system) ), (4)
Lead oxide, zinc oxide, boron oxide, silicon oxide series (PbO-ZnO-B ₂ O ₃ --SiO ₂ series)
(5) Bismuth oxide, boron oxide, silicon oxide system (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ system),
(6) Bismuth oxide, boron oxide, silicon oxide, aluminum oxide type (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ type) and the like can be mentioned. Further, other inorganic powders such as alumina powder may be added as appropriate.

  Examples of the inorganic powder used for the electrode forming material of PDP include metal powders such as Ag, Au, Al, Ni, Ag—Pd alloy, Cu, and Cr. Examples of the inorganic powder used for the transparent electrode forming material include indium oxide, tin oxide, tin-containing indium oxide (ITO), antimony-containing tin oxide (ATO), fluorine-added indium oxide (FIO), and fluorine-added tin oxide. (FTO), fluorinated zinc oxide (FZO), and a powder comprising a metal oxide such as zinc oxide containing one or more metals selected from Al, Co, Fe, In, Sn and Ti. Can be mentioned.

Examples of the inorganic powder used for the resistor forming material of the PDP include RuO ₂ powder.

The inorganic powder used for the PDP phosphor forming material is Y ₂ for red. O ₃ : Eu ³⁺ , Y ₂ SiO ₅ : Eu ³⁺ , Y ₃ Al ₅ O _12: Eu ^3+, YVO ₄ : Eu ³⁺ , (Y, Gd) BO ₃ : Eu ³⁺ , Zn ₃ (PO _{4 2} : Mn, etc. For green, Zn ₂ SiO ₄ : Mn, BaAl ₁₂ O ₁₉ : Mn, BaMgAl ₁₄ O ₂₃ : Mn, LaPO ₄ : (Ce, Tb), Y ₃ (Al, Ga) ₅ O _12: Tb, etc., as the blue Y ₂ SiO ₅ : Ce, BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , BaMgAl ₁₄ O ₂₃ : Eu ²⁺ , (Ca, Sr, Ba) ₁₀ (PO _{4 6} Cl ₂ : Eu ²⁺ , (Zn, Cd) S: Ag, and the like.

Inorganic powder used for color filter forming materials such as PDP, LCD, organic EL element is Fe ₂ for red. O ₃ For green, Cr ₂ O ₃ For blue, CoO · Al ₂ O ₃ And so on.

Examples of inorganic powders used for black matrix forming materials such as PDP, LCD, and organic EL elements include metal powders such as Mn, Fe, and Cr, and CuO—Cr _2. O ₃ , CuO-Fe ₂ O ₃ -Mn ₂ O ₃ , CuO-Cr ₂ O ₃ -Mn ₂ O ₃ , CoO-Fe ₂ O ₃ -Cr ₂ O ₃
And the like.

  In addition, when using inorganic powders other than the low-melting glass frit, such as electrodes, resistors, phosphors, color filters, and black matrix forming materials, the low-melting glass frit used for the barrier rib forming material is used in combination. Also good. In this case, the content of the low-melting glass frit varies depending on the use, but is usually 50 parts by weight or less with respect to 100 parts by weight of the total amount of the inorganic powder containing the low-melting glass frit.

(2) Alkali-soluble resin Various resins can be used as the alkali-soluble resin used in the composition a1. Here, “alkali-soluble” refers to the property of being dissolved in the above-mentioned alkaline developer to the extent that the desired development processing is possible.

  As the alkali-soluble resin used in the present invention, a copolymer of a monomer selected from the following monomers (A) and a monomer selected from monomers (B) and / or monomers (C) is preferable. By copolymerizing the monomer (a), alkali solubility can be imparted to the resin. Particularly preferred monomers (A) include acrylic acid and methacrylic acid. Further, the content of the unit derived from the monomer (a) is usually 5 to 50% by weight, preferably 10 to 40% by weight, and particularly preferably 15 to 30% by weight in all repeating units.

Monomer (I):
Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) acryloyloxyethyl), ω-carboxy-polycaprolactone mono Carboxyl group-containing monomers such as (meth) acrylate;
Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, (α-hydroxymethyl) acrylate;
Alkali-soluble functional group-containing monomers represented by phenolic hydroxyl group-containing monomers such as o-hydroxystyrene, m-hydroxystyrene, and p-hydroxystyrene.

Monomer (b):
Monomers such as methyl (meth) acrylate, ethyl (meth) acrylate, (n-butyl) (meth) acrylate, benzyl (meth) acrylate, glycidyl (meth) acrylate, dicyclopentanyl (meth) acrylate (Meth) acrylic acid esters other than); aromatic vinyl monomers such as styrene and α-methylstyrene; monomers copolymerizable with monomers (a) typified by conjugated dienes such as butadiene and isoprene .

Monomer (C):
A macro having a polymerizable unsaturated group such as a (meth) acryloyl group at one end of a polymer chain such as polystyrene, poly (meth) acrylate methyl, poly (meth) ethyl acrylate, poly (meth) acrylate benzyl, etc. Macromonomer represented by monomer.

  The polymerization of the alkali-soluble resin can be performed, for example, by radical polymerization. As an initiator for radical polymerization, azobisisobutyronitrile, benzoyl peroxide, or the like can be used. As a solvent for radical polymerization, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, or the like can be used. The polymerization temperature can usually be carried out at 50 to 100 ° C., and the polymerization time is usually 30 to 600 minutes.

  The Mw of the alkali-soluble resin is usually 5,000 to 500,000, preferably 10,000 to 200,000.

  The Mw of the alkali-soluble resin can be controlled by, for example, the ratio between the monomer and the polymerization initiator.

  The content of the alkali-soluble resin in the composition a1 is usually 1 to 500 parts by weight, preferably 5 to 100 parts by weight, and particularly preferably 15 to 40 parts by weight with respect to 100 parts by weight of the inorganic powder.

(3) Solvent The solvent constituting the composition a1 is included for imparting fluidity or plasticity to the composition a1 or for forming a good film.

  The solvent constituting the composition a1 is not particularly limited, and examples thereof include ethers, esters, ether esters, ketones, ketone esters, amides, amide esters, lactams, lactones, Examples thereof include sulfoxides, sulfones, hydrocarbons, and halogenated hydrocarbons.

  Specific examples of such solvents include tetrahydrofuran, anisole, dioxane, ethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, acetate esters, hydroxyacetate esters, Alkoxyacetic acid esters, propionic acid esters, hydroxypropionic acid esters, alkoxypropionic acid esters, lactic acid esters, ethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ether acetates, alkoxyacetic acid esters, cyclic ketones , Acyclic ketones, acetoacetic esters, pyruvates, N, N-dialkylformamides, N, -Dialkylacetamides, N-alkylpyrrolidones, γ-lactones, dialkylsulfoxides, dialkylsulfones, terpineol, N-methyl-2-pyrrolidone and the like can be mentioned alone or in combination of two or more. Can be used.

  The content of the solvent in the composition a1 can be appropriately selected within a range in which good film forming properties (fluidity or plasticity) are obtained.

  Various additives such as a plasticizer, a development accelerator, an adhesion assistant, an antihalation agent, a storage stabilizer, an antifoaming agent, an antioxidant, an ultraviolet absorber, a filler, and a low melting glass are optionally added to the composition a1. An agent may be contained.

B1 layer B1 layer is a paste-like photosensitive composition (hereinafter also referred to as “composition b1”) containing inorganic powder, an alkali-soluble resin, a solvent and a photosensitive component as essential components. Can be formed by removing a part or all of the solvent.

  As the inorganic powder, the alkali-soluble resin, and the solvent constituting the composition b1, the same ones described as the constituent components of the composition a1 can be used. Moreover, the arbitrary component in the above-mentioned composition a1 can be used similarly.

The Mw of the alkali-soluble resin constituting the composition b1 needs to be larger than the Mw of the alkali-soluble resin constituting the composition a1. In order to make the effect of the present invention more remarkable, the difference between the Mw of the alkali-soluble resin constituting the composition b1 and the Mw of the alkali-soluble resin constituting the composition a1 is 5,000 to 60,000. Preferably there is 10,000
More preferably, it is 0-40,000. Mw can be controlled by the same method as in the case of the alkali-soluble resin constituting the composition a1.

(1) Photosensitive component Examples of the photosensitive component constituting the composition b1 include (a) a combination of a polyfunctional monomer and a radiation polymerization initiator, and (b) light that forms an acid by irradiation with a melamine resin. A combination with an acid generator is preferable, and a combination of a polyfunctional (meth) acrylate and a radiation polymerization initiator is particularly preferable as the combination (a).

Specific examples of the polyfunctional (meth) acrylate constituting the photosensitive component include di (meth) acrylates of alkylene glycol such as ethylene glycol and propylene glycol;
Di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; di (meth) acrylates of hydroxylated polymers at both ends, such as hydroxypolybutadiene at both ends, hydroxypolyisoprene at both ends, and hydroxypolycaprolactone at both ends;
Poly (meth) acrylates of trihydric or higher polyhydric alcohols such as glycerin, 1,2,4-butanetriol, trimethylolalkane, tetramethylolalkane, pentaerythritol, dipentaerythritol;
Poly (meth) acrylates of polyalkylene glycol adducts of trihydric or higher polyhydric alcohols; poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediol;
List oligo (meth) acrylates such as polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spiraline resin (meth) acrylate. Can do. These can be used alone or in combination of two or more.

Specific examples of the radiation polymerization initiator constituting the photosensitive component include benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone. 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- [4 ′-(methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholino Carbonyl compounds such as phenyl) -butan-1-one;
Azo compounds or azide compounds such as azoisobutyronitrile and 4-azidobenzaldehyde; organic sulfur compounds such as mercaptan disulfide;
Organic peroxides such as benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, paraffin hydroperoxide;
1,3-bis (trichloromethyl) -5- (2′-chlorophenyl) -1,3,5-triazine, 2- [2- (2-furanyl) ethylenyl] -4,6-bis (trichloromethyl)- Trihalomethanes such as 1,3,5-triazine;
Examples thereof include imidazole dimers such as 2,2′-bis (2-chlorophenyl) 4,5,4 ′, 5′-tetraphenyl 1,2′-biimidazole. These can be used alone or in combination of two or more.

Content of the photosensitive component in composition b1 is 10-60 weight part normally with respect to 100 weight part of inorganic powder, Preferably it is 20-40 weight part. In particular, when a combination of a polyfunctional monomer and a radiation polymerization initiator is used as the photosensitive component, the polyfunctional monomer is usually 5 to 40 parts by weight, preferably 10 to 30 parts per 100 parts by weight of the inorganic powder. It is a weight part, and a radiation polymerization initiator is 1-20 weight part normally with respect to 100 weight part of polyfunctional monomers, Preferably it is 5-15 weight part.

The composition and formation method of the A2 layer A2 layer are the same as the composition and formation method of the A1 layer. For example, it can be formed by applying a paste-like non-photosensitive composition containing an inorganic powder, an alkali-soluble resin and a solvent, drying the coating film and removing a part or all of the solvent.

  The Mw of the alkali-soluble resin contained in the A2 layer is usually 5,000 to 500,000, preferably 10,000 to 200,000. Mw can be controlled by the same method as in the case of the alkali-soluble resin constituting the composition a1.

The composition and formation method of the A3 layer A3 layer are the same as the composition and formation method of the A1 layer. For example, it can be formed by applying a paste-like non-photosensitive composition containing an inorganic powder, an alkali-soluble resin and a solvent, drying the coating film and removing a part or all of the solvent.

  Mw of the alkali-soluble resin contained in the A3 layer is usually 5,000 to 500,000, preferably 10,000 to 200,000.

  The Mw of the alkali-soluble resin contained in the A3 layer needs to be larger than the Mw of the alkali-soluble resin contained in the A2 layer. In order to make the effect of the present invention more prominent, the difference between the Mw of the alkali-soluble resin contained in the A3 layer and the Mw of the alkali-soluble resin contained in the A2 layer is 5,000-60,000. Is preferable, and it is more preferable that it is 10,000-40,000. Mw can be controlled by the same method as in the case of the alkali-soluble resin constituting the composition a1.

Resist layer The resist layer is formed by applying a resist composition containing an alkali-soluble resin, a polyfunctional monomer, a radiation polymerization initiator and a solvent, drying the coating film, and removing a part or all of the solvent. Can do.

  As each component used for the resist composition, the same components as those described as the constituent components of the composition b1 can be used.

Formation method of transfer film By applying a composition containing inorganic powder, alkali-soluble resin and, if necessary, a photosensitive component, drying the coating film and removing part or all of the solvent, by repeating Can be produced. At this time, the coating film is preferably dried one by one, but in some cases, the laminated coating film may be dried at once. Further, if necessary, a resist composition is applied on a support film, the coating film is dried to form a resist layer, and the composition is applied on the resist layer and dried to prepare a transfer film. Also good.

  The method of applying each composition is preferably a method that can efficiently form a thick and uniform coating film. For example, a coating method using a roll coater, a coating method using a doctor blade, a coating method using a curtain coater, and a coating method using a wire coater can be used.

The drying condition of the coating film is, for example, about 50 to 150 ° C. for about 0.5 to 30 minutes, and the residual ratio of the solvent after drying (content ratio in the partition wall forming material layer) is usually within 2% by weight. .

  The thickness of each material layer formed on the support film as described above varies depending on the content of the inorganic powder, the type and size of the member, and the thickness of the A1 layer or A2 layer is, for example, 10 to 150 μm. The thickness of the B1 layer or the A3 layer is 10 to 150 μm. Moreover, the thickness of a resist layer shall be 5-50 micrometers normally.

  In addition, although the transfer film may have a protective film on the surface, a polyethylene film and a polyvinyl alcohol-type film can be mentioned as such a protective film.

In addition, the transfer film of the present invention forms a material layer (or resist layer) by coating the composition on the support film and the protective film, and superimposes the material layer (or resist layer) surfaces on each other. It can form suitably also by the method of crimping | bonding. Examples of such a forming method include the following examples.
1. A method in which a B1 layer is formed on a support film, an A1 layer is formed on a protective film, and the surface of the A1 layer and the surface of the B1 layer are overlapped and pressure-bonded.
2. A method in which a resist layer and an A3 layer are formed on a support film, an A2 layer is formed on a protective film, and the surface of the A3 layer and the surface of the A2 layer are overlapped and pressure-bonded.
3. A method in which a resist layer is formed on a support film, a laminate of an A2 layer and an A3 layer is formed on a protective film, and the surface of the resist layer and the surface of the A3 layer are overlapped and pressure-bonded.

[Example]
Examples of the present invention will be described below, but the present invention is not limited to these examples. In the following, “parts” and “%” indicate “parts by weight” and “% by weight”, respectively.

Moreover, Mw is the weight average molecular weight of polystyrene conversion measured by the gel permeation chromatography (GPC) (brand name: HLC-8220GPC) by Tosoh Corporation. The GPC measurement conditions are as follows.
GPC column: (TSK guard column Super HZ-L manufactured by Tosoh Corporation)
Solvent: THF
Measurement temperature: 40 ° C
[Synthesis Example 1]
200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methacrylate, 30 parts of methacrylic acid and 2 parts of azobisisobutyronitrile were charged into an autoclave equipped with a stirrer and stirred at room temperature until uniform in a nitrogen atmosphere. Next, polymerization was carried out at 80 ° C. for 3 hours, and the polymerization reaction was further continued at 100 ° C. for 1 hour, followed by cooling to room temperature to obtain a polymer solution. The polymerization rate was 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as “polymer (1)”) was 40,000.

[Synthesis Example 2]
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that 200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methacrylate, 30 parts of methacrylic acid and 1 part of azobisisobutyronitrile were charged into an autoclave. The polymerization rate was 97%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as “polymer (2)”) was 70,000.

[Preparation Example 1]
100 parts of glass frit (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ system) as inorganic powder, 30 parts of polymer (1) as alkali-soluble resin, di-2-ethylhexyl azelate as plasticizer 2 parts and 50 parts of propylene glycol monomethyl ether acetate as a solvent were kneaded to prepare composition a1 (hereinafter referred to as “non-photosensitive composition (a-1)”).

[Preparation Example 2]
Paste by kneading 100 parts of glass frit as inorganic powder, 30 parts of polymer (2) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer and 50 parts of propylene glycol monomethyl ether acetate as solvent -Shaped composition a1 (henceforth "non-photosensitive composition (a-2)") was prepared.

[Preparation Example 3]
100 parts of glass frit as inorganic powder, 30 parts of polymer (1) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 50 parts of propylene glycol monomethyl ether acetate as solvent, trimethylol as radiation sensitive component By kneading 10 parts of propane triacrylate and 2 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, composition b1 (hereinafter referred to as “photosensitive composition”). (B-1) ") was prepared.

[Preparation Example 4]
100 parts of glass frit as inorganic powder, 30 parts of polymer (2) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 50 parts of propylene glycol monomethyl ether acetate as solvent, trimethylolpropane as radiation component By kneading 10 parts of triacrylate and 2 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, composition b1 (hereinafter referred to as “photosensitive composition ( b-2) ") was prepared.

[Preparation Example 5]
100 parts of polymer (1) as an alkali-soluble resin, 50 parts of trimethylolpropane triacrylate as a polyfunctional monomer, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane as a radiation polymerization initiator A composition for a resist layer was prepared by kneading 15 parts of 1-one and 150 parts of propylene glycol monomethyl ether acetate as a solvent.

(Development speed evaluation method)
The partition wall forming composition was applied to the surface of a soda glass substrate (15 cm square, 1.1 mm thick) using a bar coater, and dried at 110 ° C. for 5 minutes to completely remove the solvent, and the thickness was 100 μm. A test piece having a partition wall forming material layer was prepared.

  The obtained test piece was immersed in a 0.2 wt% aqueous potassium hydroxide solution, and the surface of the test piece was observed while stirring the solution using a magnetic stirrer. The time when half of the substrate surface was exposed by dissolution of the partition wall forming material layer on the surface of the test piece was measured as the dissolution time, and the dissolution rate was calculated by the following equation.

    Formula: Dissolution rate (μm / second) = film thickness (μm) / dissolution time (second)

(Production of transfer film)
The obtained photosensitive composition (b-2) was applied onto a support film (width 200 mm, length 30 m, thickness 38 μm) made of a polyethylene terephthalate (PET) film that had been subjected to a release treatment in advance by a roll coater. A film was formed, and the formed coating film was dried at 110 ° C. for 5 minutes to remove the solvent, thereby forming a photosensitive layer (b) having a thickness of 100 μm. Next, the non-photosensitive composition (a-1) is applied onto the photosensitive layer (b) with a roll coater to form a coating film, and the formed coating film is dried at 110 ° C. for 5 minutes. The solvent was removed to form a non-photosensitive layer (a) having a thickness of 100 μm. Thereby, a partition wall forming material layer having a thickness of 200 μm was formed, and a transfer film of the present invention (hereinafter referred to as “transfer film (1)”) was produced.

(Manufacture of partition walls for PDP)
[Transfer process]
The transfer film (1) was superposed on the surface of the glass substrate for 6-inch panel so that the surface of the non-photosensitive layer (a) was in contact, and this transfer film (1) was thermocompression bonded with a heating roller. The pressure bonding conditions were a heating roller surface temperature of 120 ° C., a roll pressure of 4 kg / cm ² , and a heating roller moving speed of 0.5 m / min. As a result, the transfer layer was transferred and adhered to the surface of the glass substrate. The thickness of this transfer layer (non-photosensitive layer (a) + photosensitive layer (b)) was measured and found to be in the range of 200 μm ± 5 μm.

[Exposure process of photosensitive layer (b)]
The photosensitive layer (b) was irradiated with i-rays (ultraviolet light having a wavelength of 365 nm) with an ultrahigh pressure mercury lamp through an exposure mask (40 μm wide stripe pattern). The irradiation dose was 400 mJ / cm ² .

[Development process]
After the exposure process is completed, the support film is peeled off from the photosensitive layer (b), and then a 0.2 wt% aqueous potassium hydroxide solution (25 ° C.) is developed on the exposed photosensitive layer (b). Development processing by a shower method using a liquid was performed. Thereby, the part of the uncured photosensitive layer (b) which was not irradiated with ultraviolet rays was removed, and further, the development of the non-photosensitive layer (a) was continuously performed using it as a pattern. Next, washing with ultrapure water and drying were performed. Thereby, the pattern of the layer for barrier rib formation was formed.

[Baking process]
The glass substrate having the layer on which the pattern was formed was baked for 30 minutes in a baking furnace in a temperature atmosphere of 600 ° C. Thereby, the panel material by which a partition is formed in the surface of a glass substrate was obtained.

  The cross-sectional shape of the partition in the obtained panel material was observed with a scanning electron microscope, and the width and height of the bottom surface of the cross-sectional shape were measured. As a result, it was found that the bottom width was 40 μm ± 3 μm, the height was 200 μm ± 5 μm, the dimensional accuracy was extremely high, and a pattern with sharp edges on the partition walls could be formed. Moreover, the residue, pattern peeling, and deformation were not observed.

<Comparative Examples 1-3>
As a comparative example, a transfer film was produced in the same manner as in Example 1 except for the combination of polymers used for each of the two layers, and a partition forming layer was formed on a glass substrate using the obtained transfer film, and exposure and development were performed. Baked. The evaluation results in Example 1 and Comparative Examples 1 to 3 are shown in Table 1.

(Production of transfer film)
The obtained resist composition was coated on a support film (width 200 mm, length 30 m, thickness 38 μm) made of a PET film that had been subjected to a release treatment in advance using a roll coater to form a coating film. The solvent was removed by drying the film at 100 ° C. for 5 minutes to form a resist layer having a thickness of 15 μm.

  Next, the non-photosensitive composition (a-2) is applied onto the resist layer with a roll coater to form a coating film, and the solvent is removed by drying the formed coating film at 100 ° C. for 5 minutes. Thus, a layer (a ′) having a thickness of 100 μm was formed.

  Further, the non-photosensitive composition (a-1) is applied onto the layer (a ′) by a roll coater to form a coating film, and the solvent is removed by drying the formed coating film at 100 ° C. for 5 minutes. This was removed to form a layer (a ″) having a thickness of 100 μm. As a result, a three-layer partition wall forming material layer having a thickness of 215 μm was formed, and the transfer film (hereinafter referred to as “transfer film (2)” of the present invention was formed. ").

(Manufacture of partition walls for PDP)
[Transfer process]
The transfer film (2) was superimposed on the surface of the glass substrate for a 6-inch panel so that the surface of the layer (a ″) was in contact, and this transfer film (2) was thermocompression bonded with a heating roller. Is the same as in Example 1. As a result, the transfer layer was transferred and adhered to the surface of the glass substrate.The thickness of this transfer layer (resist layer + (a ′) + layer (a ″)) Was measured and found to be in the range of 215 μm ± 5 μm.

[Resist layer exposure process]
The resist layer was irradiated with i-line (ultraviolet light having a wavelength of 365 nm) with an ultrahigh pressure mercury lamp through an exposure mask (a stripe pattern having a width of 40 μm). The irradiation dose was 400 mJ / cm ² .

[Development process]
After the exposure process is completed, the support film is peeled off from the resist layer, and then the exposed resist layer is developed by a shower method using a 0.3 wt% potassium hydroxide aqueous solution at 25 ° C. as a developer. It was. Thereby, the portion of the uncured resist layer that was not irradiated with ultraviolet rays was removed, and the layer (a ′) and the partition wall forming material layer (a ″) were continuously developed using this as a pattern. Washing with pure water and a drying treatment were performed, thereby forming a pattern of the partition wall forming material layer composed of the material layer remaining portion and the material layer removing portion.

[Baking process]
The glass substrate having the layer on which the pattern was formed was baked in a baking furnace in a temperature atmosphere of 560 ° C. for 30 minutes. Thereby, the panel material by which a partition is formed in the surface of a glass substrate was obtained.

  The cross-sectional shape of the partition in the obtained panel material was observed with a scanning electron microscope. As a result, when the width and height of the bottom surface of the cross-sectional shape were measured, the width of the bottom surface was 40 μm ± 3 μm, the height was 150 μm ± 3 μm, the dimensional accuracy was extremely high, and the edges of the partition walls were sharp. It was found that a good pattern was formed. Moreover, the residue, pattern peeling, and deformation were not observed.

<Comparative Examples 4-6>
As a comparative example, a transfer film was produced in the same manner as in Example 2 except for the combination of polymers used for each of the two layers, and a partition wall forming material layer was formed on the glass substrate using the obtained transfer film, and exposure, development, Baked. The evaluation results in Example 2 and Comparative Examples 4 to 6 are shown in Table 2.

It is sectional drawing for description which shows a general PDP.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Glass substrate 3 Partition 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Phosphor 8 Dielectric layer 9 Dielectric layer 10 Protective film

Claims (13)

(1) forming a non-photosensitive layer (A1) containing an inorganic powder and an alkali-soluble resin on a substrate;
(2) forming a photosensitive layer (B1) containing inorganic powder, an alkali-soluble resin and a radiation-sensitive component on the A1 layer;
(3) A step of exposing the B1 layer to form a latent image of the pattern,
(4) forming a B1 layer pattern by development processing;
(5) A step of selectively dissolving the A1 layer by development processing through the pattern of the B1 layer, and forming a pattern of the A1 layer, and (6) a plasma display panel including a step of firing the obtained pattern A method for manufacturing a member, comprising:
The manufacturing method of the plasma display panel member characterized by the polystyrene conversion weight average molecular weight of alkali-soluble resin contained in A1 layer being smaller than the polystyrene conversion weight average molecular weight of alkali-soluble resin contained in B1 layer. The difference between the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the B1 layer and the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the A1 layer is 5,000-6.
The method of manufacturing a plasma display panel member according to claim 1, wherein the method is 0.00000. (1) forming a non-photosensitive layer (A2) containing inorganic powder and an alkali-soluble resin on a substrate;
(2) forming a non-photosensitive layer (A3) containing inorganic powder and alkali-soluble resin on the A2 layer;
(3) A step of forming a resist layer on the A3 layer,
(4) a step of exposing the resist layer to form a latent image of the pattern;
(5) a step of forming a pattern of the resist layer by development processing;
(6) a step of selectively dissolving the A3 layer and the A2 layer by a development process through the pattern of the resist layer, and forming a pattern of the A3 layer and the A2 layer; and (7) firing the obtained pattern. A method of manufacturing a plasma display panel member including a process,
The manufacturing method of the plasma display panel member characterized by the polystyrene conversion weight average molecular weight of the alkali-soluble resin contained in A2 layer being smaller than the polystyrene conversion weight average molecular weight of the alkali-soluble resin contained in A3 layer. The difference between the polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the A3 layer and the polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the A2 layer is 5,000 to
4. The method for manufacturing a plasma display panel member according to claim 3, wherein the method is 60,000.   The plasma display panel member according to any one of claims 1 to 4, wherein the plasma display panel member is at least one member selected from a partition, an electrode, a resistor, a phosphor, a color filter, and a black matrix. Manufacturing method.   The said plasma display panel member is a partition, The manufacturing method of the plasma display panel member in any one of Claims 1-4 characterized by the above-mentioned. A transfer film in which two or more layers containing an inorganic powder, an alkali-soluble resin and, if necessary, a photosensitive component are formed on a support film,
The polystyrene-converted weight average molecular weight of the alkali-soluble resin contained in any one layer (I) formed on the support film is contained in the other layer (II) formed on the (I) layer. A transfer film having a polystyrene-reduced weight average molecular weight of the alkali-soluble resin. On the support film,
A transfer film having a photosensitive layer (B1) containing an inorganic powder, an alkali-soluble resin and a radiation-sensitive component, and a non-photosensitive layer (A1) containing an inorganic powder and an alkali-soluble resin,
A1 layer on the B1 layer,
A transfer film, wherein the alkali-soluble resin contained in the A1 layer has a polystyrene-equivalent weight average molecular weight that is smaller than the polystyrene-equivalent weight-average molecular weight of the alkali-soluble resin contained in the B1 layer. The difference between the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the B1 layer and the polystyrene equivalent weight average molecular weight of the alkali-soluble resin contained in the A1 layer is 5,000-6.
The transfer film according to claim 8, wherein the transfer film is 10,000. On the support film,
A non-photosensitive layer (A3) containing an inorganic powder and an alkali-soluble resin, and a non-photosensitive layer (A2) containing an inorganic powder and an alkali-soluble resin,
A2 layer on top of A3 layer,
A transfer film, wherein the alkali-soluble resin contained in the A2 layer has a polystyrene-equivalent weight average molecular weight that is smaller than the polystyrene-equivalent weight-average molecular weight of the alkali-soluble resin contained in the A3 layer.   The transfer film according to claim 10, further comprising a resist layer between the A3 layer and the support film. The difference between the polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the A3 layer and the polystyrene-equivalent weight average molecular weight of the alkali-soluble resin contained in the A2 layer is 5,000-6.
The transfer film according to claim 10 or 11, wherein the transfer film is 0.00000.   The transfer film according to claim 7, wherein the inorganic powder is a glass powder.