KR20050077024A - Production processes for plasma display panel components and transfer film - Google Patents

Abstract

This invention provides the manufacturing method of the PDP member excellent in the pattern shape, and the transfer film which can be used suitably for this manufacturing method.

In the production method of the present invention, a photosensitive layer or a resist layer containing a specific alkali-soluble resin and an inorganic powder is formed on a non-photosensitive layer containing a specific alkali-soluble resin and an inorganic powder, and subjected to exposure, development, and sintering to form a PDP member. To prepare.

Furthermore, it forms a photosensitive layer or resist layer containing a specific alkali-soluble resin and inorganic powder on a support film, and forms the non-photosensitive layer containing a specific alkali-soluble resin and inorganic powder on the formation layer, and is suitable for PDP member manufacture. Obtain a transfer film.

Description

Production Processes for Plasma Display Panel Components and Transfer Film

This invention relates to the manufacturing method of a plasma display panel member, and the transfer film which can be used suitably for this manufacturing method.

Recently, plasma displays have attracted attention as flat fluorescent displays. 1 is a schematic diagram showing a cross-sectional shape of an AC plasma display panel (hereinafter also referred to as "PDP"). In FIG. 1, 1 and 2 are the glass substrates arrange | positioned opposingly, 3 is a partition, and the cell is partitioned by the glass substrate 1, the glass substrate 2, and the partition 3. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode 4 for the purpose of lowering the resistance of the transparent electrode 4, 6 is fixed to the glass substrate 2 Address electrode, 7 is a fluorescent material retained in the cell, 8 is a dielectric layer formed on the surface of the glass substrate 1 to cover the transparent electrode 4 and the bus electrode 5, and 9 is the address electrode 6 It is a dielectric layer formed in the surface of the glass substrate 2 so that it may coat | cover, and 10 is a protective film which consists of magnesium oxide, for example. Moreover, in a color PDP, a color filter (red, green, blue), a black matrix, etc. may be provided between a glass substrate and a dielectric layer in order to acquire an image with high contrast.

A photolithography method is preferable as a method for forming partitions, electrodes, resistors, phosphors, color filters, and black matrices that are PDP members. Here, the photolithography method forms a layer containing a paste-like photosensitive composition containing inorganic powder and a vehicle on a surface of a substrate or the like, forms a pattern by exposing and developing the pattern, and subsequently fires the pattern to form an organic material. It is a method of removing and sintering inorganic powder. In particular, the photolithography method, which uses a transfer film having a layer containing a photosensitive composition, is transferred to a surface such as a substrate, from the viewpoint of obtaining a film having excellent uniformity in thickness and improving work efficiency. Very preferred.

In the above-described method, for example, in the case of forming the partition wall, since the organic material is removed in the firing step and the film thickness becomes small, it is necessary to be about 1.3 to 2.0 times the film thickness of the partition wall for forming the transfer layer. For example, in order to make the film thickness of a partition wall into 100-150 micrometers, it is necessary to make the thickness of a transfer layer about 130-300 micrometers. It is preferable that the partition wall which comprises a PDP has a high aspect ratio and a uniform shape from a viewpoint of expressing favorable electrical characteristics. However, when the thickness of the transfer layer is large, it is likely to be cut out of the sidewall of the pattern during development, and the pattern shape is uniform, and a good partition is difficult to be obtained. Moreover, when baking is performed in the state which the side wall of the pattern was cut out at the time of image development, a pattern may peel or deformation may become severe.

In order to solve this problem, for example, in the method for producing a partition wall for PDP, the film of the partition wall forming composition has a structure in which two or more partition wall forming compositions having different solubility in a developer are laminated. The invention regarding the manufacturing method of a partition is disclosed (for example, refer Unexamined-Japanese-Patent No. 9-92137, Unexamined-Japanese-Patent No. 2000-228143).

However, in the above-described method, the difference in solubility may not always be sufficient because the solubility is changed only by changing the copolymer composition ratio of the composition, and there is still a problem from the viewpoint of obtaining a uniform partition shape and a good partition. .

This invention makes it a subject to provide the manufacturing method of the PDP member excellent in the pattern shape, and the transfer film which can be used suitably for this manufacturing method.

The manufacturing method of the 1st PDP member of this invention (henceforth "PDP member manufacturing method I") is

(1) forming a non-photosensitive layer (A1) containing inorganic powder and alkali-soluble resin on a substrate,

(2) forming a photosensitive layer (B1) containing an inorganic powder, an alkali-soluble resin, and a radiation sensitive component on the A1 layer,

(3) exposing the layer B1 to form a latent image of the pattern;

(4) forming a pattern of the B1 layer by a development treatment;

(5) a step of selectively dissolving the A1 layer by developing to form a pattern of the A1 layer through the pattern of the B1 layer, and

(6) It is a manufacturing method of the plasma display panel member containing the process of baking the obtained pattern, It is characterized by the A1 layer and B1 layer satisfy | filling one or more conditions shown by following (i)-(iii).

(i) The polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A1 layer is smaller than the polystyrene reduced weight average molecular weight of alkali-soluble resin contained in B1 layer.

(ii) Alkali-soluble resin contained in A1 layer is resin which has a structural unit derived from acrylic acid, and alkali-soluble resin contained in B1 layer is resin which has structural unit derived from methacrylic acid.

(iii) The dissolution accelerator is further contained in the A1 layer, and the content of the dissolution accelerator contained in the A1 layer is higher than the content of the dissolution accelerator contained in the B1 layer relative to the total weight of the B1 layer.

The manufacturing method of the second PDP member of the present invention (hereinafter also referred to as "PDP member manufacturing method II")

(1) forming a non-photosensitive layer (A2) containing inorganic powder and alkali-soluble resin on a substrate,

(2) Process of forming non-photosensitive layer (A3) containing inorganic powder and alkali-soluble resin on A2 layer,

(3) forming a resist layer on the A3 layer;

(4) exposing the resist layer to form a latent image of the pattern,

(5) process of forming pattern of resist layer by developing process,

(6) a step of selectively dissolving the A3 layer and the A2 layer by the development treatment through the pattern of the resist layer to form a pattern of the A3 layer and the A2 layer, and

(7) It is a manufacturing method of the plasma display panel member containing the process of baking the obtained pattern, It is characterized by the A2 layer and A3 layer satisfy | filling one or more conditions shown by following (iv)-(vi).

(iv) The polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A2 layer is smaller than the polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A3 layer.

(v) Alkali-soluble resin contained in A2 layer is resin which has a structural unit derived from acrylic acid, and alkali-soluble resin contained in A3 layer is resin which has structural unit derived from methacrylic acid.

(vi) Dissolution accelerator is further contained in A2 layer, and content with respect to the total weight of A2 layer of the dissolution accelerator contained in A2 layer is more than content with respect to the total weight of A3 layer of dissolution accelerator contained in A3 layer.

The transfer film of the present invention is a transfer film formed of two or more layers containing inorganic powders, alkali-soluble resins and photosensitive components on a support film, and at least one of the conditions represented by the following (a) to (c). It is characterized by satisfying.

(a) Polystyrene conversion of the alkali-soluble resin contained in any one layer (I) formed on the support film Polystyrene conversion of the alkali-soluble resin contained in another layer (II) formed on the said (I) layer It is larger than a weight average molecular weight.

(b) Alkali-soluble resin contained in arbitrary one layer (III) formed on the support film is resin which has a structural unit derived from methacrylic acid, and is contained in another layer (IV) formed on said (III) layer. Alkali-soluble resin is resin which has a structural unit derived from acrylic acid.

(c) Another layer (VI) is formed on any one layer (V) formed on the supporting film, and at least the (VI) layer further includes a dissolution accelerator and is included in the (VI) layer. Content with respect to the whole weight of the (VI) layer of the dissolution promoter used is more than content with respect to the whole weight of the (V) layer contained in the said (V) layer.

The method for producing a PDP member of the present invention is particularly preferably used for producing partition walls. Moreover, it is preferable that the inorganic powder contained in the said transfer film is glass powder.

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

<Method for Manufacturing PDP Member I>

The manufacturing method I of the PDP member of this invention is [1] the formation process of a non-photosensitive layer (A1), [2] the formation process of a photosensitive layer (B1), [3] the exposure process of B1 layer, [4] B1 layer, and The developing step of the A1 layer and the [5] baking step are included. By this production method I, one or more PDP members selected from partitions, electrodes, resistors, phosphors, color filters, and black matrices can be formed. The manufacturing method of the PDP member of this invention is especially used for formation of a partition.

Hereinafter, the manufacturing of a partition is demonstrated about each process of this invention as an example.

[1] Formation Step of Non-Photosensitive Layer (A1)

In this step, the non-photosensitive layer A1 is formed on the substrate. The composition constituting the A1 layer (hereinafter also referred to as "composition (a1)") is the same as the component of the non-photosensitive layer (A1) which the transfer film of this invention mentioned later has. The A1 layer can be formed by drying the coating film after applying the composition (a1) by various methods such as a screen printing method, a roll coating method, a rotary coating method, a cast coating method and a transfer method. Moreover, from a viewpoint of the uniformity of the thickness of the layer obtained and the work efficiency, A1 layer can also be formed on a board | substrate using a transfer film.

The transfer film used here is a film in which an A1 layer was formed on a support film. This transfer film may also have a protective film on the A1 layer. In addition, the support film used here is the same as the structural component of the support film which the transfer film of this invention mentioned later has.

An example of the transfer process is as follows. After peeling the protective film layer of the transfer film used as needed, the transfer film is superposed so that the surface of an A1 layer may contact the surface of a board | substrate. Then, it heat-compresses with a heating roller and peels off a support film. As a result, the A1 layer is transferred to and adhered to the surface of the substrate. As transfer conditions, the surface temperature of a heating roller can be 80-140 degreeC, roll pressure 1-5 kg / cm <2>, and a moving speed | rate can be 0.1-10.0 m / min. In addition, the board | substrate may be preheated, and a preheating temperature is 40-100 degreeC, for example.

The film thickness of the A1 layer is different depending on the member to be formed, but in the case of the partition wall, it is usually 50 to 150 m, preferably 70 to 120 m.

[2] formation process of photosensitive layer (B1)

In this step, a photosensitive layer (B1) is formed on the A1 layer. The composition constituting the B1 layer (hereinafter also referred to as "composition (b1)") is the same as the structural component of the photosensitive layer (B1) which the transfer film of this invention mentioned later has.

The B1 layer can be formed by the same method as the A1 layer. Therefore, B1 layer can also be formed on A1 layer using a transfer film. According to this method, a layer excellent in uniformity in thickness can be formed, and working efficiency is improved.

The thickness of the B1 layer also varies depending on the member to be formed, but in the case of a partition, the thickness is usually 50 to 150 m, preferably 70 to 120 m.

Although step [1] and step [2] may be performed separately, from the viewpoint of improving the film thickness uniformity and working efficiency, step [1] and step [2] are collectively performed using the transfer film of the present invention. The method of performing is especially preferable.

[3] exposure step of layer B1

In this step, the surface of the B1 layer formed on the A1 layer is selectively irradiated (exposed) with radiation such as ultraviolet rays through an exposure mask to form a latent image of the pattern of the B1 layer.

Although the irradiation apparatus is not specifically limited, The ultraviolet irradiation apparatus used for the general photolithographic method, or the exposure apparatus used when manufacturing a semiconductor or a liquid crystal display device can be used.

[4] Process of developing B1 layer and A1 layer

In this step, the exposed B1 layer is developed to present the latent image to form a pattern of the B1 layer. And through the pattern of the formed B1 layer, A1 layer is selectively melt | dissolved by image development process, and the pattern of A1 layer is formed.

The developing conditions such as the type, composition, concentration, development time, development temperature, and the like of the developing solution can be appropriately selected depending on the type of resin in the B1 layer and the A1 layer, and the like.

In addition, development can be carried out by various developing methods such as dipping, shaking, showering, spraying, and paddle. The developing apparatus is not particularly limited either.

By this developing process, the pattern (pattern corresponding to an exposure mask) of the B1 layer which consists of the residual part of B1 layer and the removal part of B1 layer is formed. This pattern serves as a mask of the A1 layer that is continuously developed. That is, the A1 layer portion corresponding to the B1 layer removing portion is dissolved in the developer and selectively removed. In addition, if the developing process is continued, the substrate surface of the portion corresponding to the B1 layer removing unit is exposed. Thereby, the pattern of the A1 layer corresponding to the pattern of the B1 layer is formed below the pattern of the B1 layer.

[5] baking treatment

In this step, the layer having the formed pattern is baked. As a result, the organic material in the layer is lost to form a layer containing the inorganic material, and a PDP member formed on the surface of the substrate can be obtained.

The temperature of the baking treatment needs to be a temperature at which the organic substance in the layer disappears, and is usually 400 to 600 ° C. In addition, baking time is 10 to 90 minutes normally.

Relationship between A1 floor and B1 floor

In the said manufacturing method I, it is necessary for A1 layer and B1 layer to satisfy | fill one or more conditions shown by following (i)-(iii). By satisfying one or more of the conditions represented by the following (i) to (iii), the A1 layer is more easily dissolved in the developer than the B1 layer. Therefore, when developing, it is difficult to cut out the sidewall of the pattern, so that a PDP member having excellent pattern shape can be obtained.

(a) condition (i)

The condition (i) is that the polystyrene reduced weight average molecular weight (hereinafter also referred to as "Mw") of the alkali-soluble resin contained in the A1 layer is smaller than the alkali-soluble resin Mw contained in the B1 layer. Polystyrene conversion weight average molecular weight (Mw) in this invention means the weight average molecular weight of polystyrene conversion by GPC measurement. In order to make the effect of this invention more remarkable, it is preferable that the difference between Mw of alkali-soluble resin contained in B1 layer, and Mw of alkali-soluble resin contained in A1 layer is 5,000-60,000, and it is more preferable that it is 10,000-40,000. .

(b) condition (ii)

Condition (ii) is alkali-soluble resin contained in A1 layer which is resin which has a structural unit derived from acrylic acid, and alkali-soluble resin contained in B1 layer is resin which has structural unit derived from methacrylic acid. In order to make the effect of this invention remarkable, the ratio of the structural unit derived from acrylic acid of alkali-soluble resin contained in A1 layer is the range of 5-50 weight% normally in all the repeating units, Preferably it is 10-40 weight% And particularly preferably in the range of 15 to 30% by weight. In addition, in order to make the effect of this invention remarkable, the ratio of the structural unit derived from methacrylic acid of alkali-soluble resin contained in B1 layer is the range of 5-50 weight% normally in all the repeating units, Preferably it is 10- 40 weight percent, particularly preferably 15 to 30 weight percent. In order to make the effect of this invention more remarkable, it is preferable that A1 layer and B1 layer satisfy | fill the said requirement simultaneously.

(c) condition (iii)

Condition (iii) is further to contain a dissolution accelerator in the A1 layer. The B1 layer usually does not contain a dissolution accelerator, and even if it is included as an optional component, the content of the dissolution accelerator contained in the A1 layer relative to the total weight of the B1 layer of the dissolution accelerator contained in the B1 layer is included. More than content is needed.

<Method II for manufacturing PDP member>

Method II for producing a PDP member of the present invention is a process for forming [1] a non-photosensitive layer (A2), [2] forming a non-photosensitive layer (A3), [2 '] forming a resist layer, and [3] a resist. Layer exposure process, [4] resist layer, A3 layer, and A2 layer development process, and [5] baking process. By the present production method II, one or more panel members selected from partitions, electrodes, resistors, phosphors, color filters, and black matrices can be formed. The manufacturing method of the PDP member of this invention is especially used for formation of a partition.

Each said process corresponds to each process of the manufacturing method I of a PDP member, respectively. In addition, although the said process [1], the process [2], and the process [2 '] can be performed separately, it is the process [1] using the transfer film of this invention from a viewpoint of the uniformity of a film thickness, and an improvement of work efficiency. And a method of carrying out the step [2] and the step [2 '] at a time are particularly preferable.

Relationship between A2 floor and B2 floor

In the above production method II, the A2 layer and the A3 layer need to satisfy at least one condition represented by the following (iv) to (vi). By satisfying one or more of the conditions represented by the following (iv) to (vi), the A2 layer is more easily dissolved in the developer than the A3 layer. Therefore, when developing, it is difficult to cut out the sidewall of the pattern, so that a PDP member having excellent pattern shape can be obtained.

(a) condition (iv)

Condition (iv) is that Mw of alkali-soluble resin contained in A2 layer is smaller than Mw of alkali-soluble resin contained in A3 layer. In order to make the effect of this invention more remarkable, it is preferable that the difference between Mw of alkali-soluble resin contained in A3 layer and Mw of alkali-soluble resin contained in A2 layer is 5,000-60,000, and it is more preferable that it is 10,000-40,000. .

(b) condition (v)

Condition (v) is resin in which alkali-soluble resin contained in A2 layer is a structural unit derived from acrylic acid, and alkali-soluble resin contained in A3 layer is resin which has structural unit derived from methacrylic acid. In order to make the effect of this invention remarkable, the ratio of the structural unit derived from acrylic acid of alkali-soluble resin contained in A2 layer is the range of 5 to 50 weight% normally among all the repeating units, Preferably it is 10 to 40 weight% And particularly preferably in the range of 15 to 30% by weight. In addition, in order to make the effect of this invention remarkable, the ratio of the structural unit derived from methacrylic acid of alkali-soluble resin contained in A3 layer is the range of 5-50 weight% normally in all the repeating units, Preferably it is 10- 40 weight percent, particularly preferably 15 to 30 weight percent. In order to make the effect of this invention more remarkable, it is preferable that A2 layer and A3 layer satisfy | fill the said requirement simultaneously.

(c) conditions (vi)

Condition (vi) is a dissolution accelerator in addition to the A2 layer. The A3 layer usually does not contain a dissolution accelerator, and even if it is included as an optional component, the content of the dissolution accelerator contained in the A2 layer is contained in the A3 layer total weight of the dissolution accelerator contained in the A3 layer. It needs to be more than content about.

Hereinafter, the material, various conditions, etc. which are used for each process of the manufacturing method I and II of the said PDP member are demonstrated.

Board

The substrate material is an insulating material such as glass, silicon, alumina, or the like. If necessary, the substrate surface is chemically treated with a silane coupling agent or the like; Plasma treatment; Pretreatment, such as a thin film formation process by the ion plating method, the sputtering method, the vapor phase reaction method, the vacuum vapor deposition method, etc. may be performed.

Exposure mask

Although the exposure pattern of the mask for exposure used in an exposure process changes with the objective, the stripe of 10-500 micrometers width is used, for example.

developer

As a developing solution used for this invention, an alkaline developing solution is preferable. As an active ingredient of alkaline developing solution, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate, for example Inorganic alkaline compounds such as lithium silicate, sodium silicate, potassium silicate, lithium bicarbonate, sodium bicarbonate, potassium bicarbonate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate and ammonia; Tetramethylammonium Hydroxide, Trimethylhydroxyethylammonium Hydroxide, Monomethylamine, Dimethylamine, Trimethylamine, Monoethylamine, Diethylamine, Triethylamine, Monoisopropylamine, Diisopropylamine, Ethanolamine Organic alkaline compounds, such as these, etc. are mentioned.

The alkaline developer can be adjusted by dissolving one or two or more of the alkaline compounds in water or the like. The concentration of the alkaline compound in the alkaline developer is usually 0.001 to 10% by weight, preferably 0.01 to 5% by weight. In addition, after the image development process by alkaline developing solution is performed, the water washing process is normally performed.

<Transfer film>

The transfer film of this invention is a multilayer film in which two or more layers containing the inorganic powder, alkali-soluble resin, and the photosensitive component were formed on the support film, and may have a protective film on this multilayer film. A transfer film can be manufactured by apply | coating the composition containing an inorganic powder, alkali-soluble resin, and a photosensitive component as needed on a support film, and drying a coating film and removing part or all of a solvent. Further, if necessary, a resist composition is applied onto the support film, the coating film is dried to form a resist layer, and then the composition is applied and dried on the resist layer to produce a transfer film.

The form of the preferable transfer film of this invention is as follows.

1. Transfer film suitable for the production method I of the PDP member

It is a transfer film which has the photosensitive layer (B1) containing an inorganic powder, alkali-soluble resin, and a radiation sensitive component on a support film, and the non-photosensitive layer (A1) containing an inorganic powder and alkali-soluble resin, and is on top of a B1 layer It has A1 layer, and A1 layer and B1 layer satisfy | fill one or more conditions shown by following (i)-(iii).

(i) Mw of alkali-soluble resin contained in A1 layer is smaller than Mw of alkali-soluble resin contained in B1 layer.

(ii) Alkali-soluble resin contained in B1 layer is resin which has a structural unit derived from methacrylic acid, and alkali-soluble resin contained in A1 layer is resin which has structural unit derived from acrylic acid.

(iii) The dissolution accelerator is further contained in the A1 layer, and the content of the dissolution accelerator contained in the A1 layer is higher than the content of the dissolution accelerator contained in the B1 layer relative to the total weight of the B1 layer.

2. Transfer film suitable for the production method II of the PDP member

It is a film which has a non-photosensitive layer (A3) containing an inorganic powder and alkali-soluble resin on a support film, and a non-photosensitive layer (A2) containing an inorganic powder and alkali-soluble resin, and has A2 layer on A3 layer, A2 The layer and the A3 layer are characterized by satisfying at least one of the conditions represented by the following (iv) to (vi).

(iv) Mw of alkali-soluble resin contained in A2 layer is smaller than Mw of alkali-soluble resin contained in A3 layer.

(v) Alkali-soluble resin contained in A3 layer is resin which has a structural unit derived from methacrylic acid, and alkali-soluble resin contained in A2 layer is resin which has structural unit derived from acrylic acid.

(vi) Dissolution accelerator is further contained in A2 layer, and content with respect to the total weight of A2 layer of the dissolution accelerator contained in A2 layer is more than content with respect to the total weight of A3 layer of dissolution accelerator contained in A3 layer.

Moreover, it is a film which has a resist layer, the non-photosensitive layer (A3) containing inorganic powder and alkali-soluble resin, and the non-photosensitive layer (A2) containing inorganic powder and alkali-soluble resin on a support film, and is on top of a resist layer It is also preferable to have an A3 layer, an A2 layer on the A3 layer, and the A2 layer and the A3 layer satisfy one or more of the conditions represented by the above (iv) to (vi).

Hereinafter, each component of the transfer film of this invention is demonstrated concretely.

Support film

It is preferable that a support film is a resin film which has heat resistance and solvent resistance, and has flexibility. When a support film has flexibility, a paste composition can be apply | coated with a roll coater, and a partition formation material layer can be preserve | saved and supplied in the state wound up on roll. As resin which forms a support film, For example, polyester, such as polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, fluorine-containing resin, such as polyvinyl chloride and polyfluoroethylene, nylon, Cellulose, and the like. The thickness of a support film is 20-100 micrometers, for example.

Moreover, it is preferable that the mold release process is given to the surface of a support film. Thereby, peeling operation of a support film can be performed easily in the transfer process mentioned above.

A1 floor

The A1 layer is coated with a non-photosensitive composition (hereinafter also referred to as "composition (a1)") in the form of a paste containing an inorganic powder, an alkali-soluble resin, a solvent, and, if necessary, a dissolution accelerator, and the coating film is dried to form a solvent. It can form by removing some or all.

(1) inorganic powder

The inorganic powder used for the composition (a1) of the present invention depends on the kind of forming material.

As an inorganic powder used for the partition formation material of PDP, glass powder, for example, low melting glass frit is mentioned. Such low melting glass frits include (1) zinc oxide, boron oxide, silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ based), (2) lead oxide, boron oxide, silicon oxide (PbO-B ₂ O ₃ -SiO _{2 type} ), (3) lead oxide, boron oxide, silicon oxide, aluminum oxide type (PbO-B ₂ O ₃ -SiO ₂ -Al ₂ O _{3 type} ), (4) lead oxide, zinc oxide, oxidation Boron, silicon oxide (PbO-ZnO-B ₂ O ₃ -SiO _{2 type} ), (5) bismuth oxide, boron oxide, silicon oxide type (Bi ₂ O ₃ -B ₂ O ₃ -SiO _{2 type} ), (6 ) Bismuth oxide, boron oxide, silicon oxide, aluminum oxide type (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ -Al ₂ O _{3 type} ), and the like. In addition, other inorganic powders such as alumina powder may be appropriately added.

Examples of the inorganic powder used for the electrode forming material of the PDP include metal powders such as Ag, Au, Al, Ni, Ag-Pd alloys, Cu, and Cr. In addition, the inorganic powders used in the transparent electrode forming material include indium oxide, tin oxide, tin-containing indium oxide (ITO), antimony-containing tin oxide (ATO), fluorinated indium oxide (FIO), and fluorine-containing tin oxide (FTO). And a powder containing a metal oxide such as zinc oxide containing one or two or more metals selected from fluorinated zinc oxide (FZO) and Al, Co, Fe, In, Sn, and Ti.

Examples of the inorganic powder used in the resistor forming material of the PDP include RuO ₂ powder and the like.

The inorganic powder used for the phosphor-forming material of PDP is Y ₂ O ₃ : Eu ³⁺ , Y ₂ SiO ₅ : Eu ³⁺ , Y ₃ Al ₅ O ₁₂ : Eu ³⁺ , YVO ₄ : Eu ^{3 for red. For} green, Zn ₂ SiO ₄ : Mn, BaAl ₁₂ O ₁₉ : Mn, BaMgAl ₁₄ O ₂₃ : Mn, ⁺ , (Y, Gd) BO ₃ : Eu ³⁺ , Zn ₃ (PO ₄ ) ₂ : Mn, etc. For blue, such as LaPO ₄ : (Ce, Tb), Y ₃ (Al, Ga) ₅ O ₁₂ : Tb, Y ₂ SiO ₅ : Ce, BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , BaMgAl ₁₄ O ₂₃ : Eu ^{2 +} , (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ , (Zn, Cd) S: Ag and the like.

Inorganic powders used in color filter forming materials, such as PDPs, LCDs, and organic EL devices, include Fe ₂ O ₃ for red, Cr ₂ O ₃ for green, CoO · Al ₂ O ₃ for blue, etc. Can be mentioned.

As inorganic powders used for black matrix forming materials such as PDPs, LCDs, and organic EL devices, metal powders such as Mn, Fe, Cr, CuO-Cr ₂ O ₃ , CuO-Fe ₂ O ₃ -Mn ₂ O ₃ , _{CuO-Cr 2 O 3 -Mn 2} O 3, CoO-Fe 2 O 3 -Cr may be a powder of a composite oxide, such as ₂ O _3.

Moreover, when using inorganic powders other than low melting glass frit, such as an electrode, a resistor, fluorescent substance, a color filter, and the formation material of a black matrix, the low melting glass frit used for a partition formation material can also be used together. Although content of the low melting glass frit in this case changes with a use, it is 50 weight part or less with respect to 100 weight part of inorganic powder whole amounts containing a low melting glass frit normally.

(2) alkali soluble resin

As alkali-soluble resin used for a composition (a1), various resin can be used and it has a role of binding resin. Here, "alkali solubility" means the property which melt | dissolves in the above-mentioned alkaline developing solution to the extent that the target image development process is possible. As this alkali-soluble resin, it can use according to the conditions (i)-(iii) which A1 layer and B1 layer must satisfy in the manufacturing method I of a PDP member. Hereinafter, the case where condition (i) is satisfied in manufacturing method I of a PDP member is abbreviated as manufacturing method I (i), for example.

(2-a) In the case of manufacturing method I (i)

In production method I (i), as the alkali-soluble resin used in the composition (a1), a copolymer of a monomer selected from the following monomers (A) and a monomer selected from monomers (B) and / or monomers (C) desirable. By copolymerizing a monomer (A), alkali solubility can be provided to resin.

Monomer (A):

Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) acryloyloxyethyl), ω-carboxy-polycaprolactone Carboxyl group-containing monomers such as mono (meth) acrylate;

Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and (α-hydroxymethyl) acrylate;

Alkali-soluble functional group containing monomers represented by phenolic hydroxyl group containing monomers, such as o-hydroxy styrene, m-hydroxy styrene, and p-hydroxy styrene.

Monomer (B):

Other than monomers (a) such as methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, benzyl (meth) acrylate, glycidyl (meth) acrylate, and dicyclopentanyl (meth) acrylate (Meth) acrylic acid esters of;

Aromatic vinyl monomers such as styrene and α-methylstyrene; Monomers copolymerizable with monomers (a) represented by conjugated dienes such as butadiene and isoprene.

Monomer (C):

Macromolecules represented by macromonomers having polymerizable unsaturated groups such as (meth) acryloyl groups at one end of a polymer chain such as polystyrene, methyl poly (meth) acrylate, ethyl poly (meth) acrylate, and benzyl poly (meth) acrylate. Monomers;

Acrylic acid, methacrylic acid, etc. are mentioned as a especially preferable monomer (A). Moreover, content of the structural unit derived from a monomer (A) is 5-50 weight% normally in all the repeating units, Preferably it is 10-40 weight%, Especially preferably, it is 15-30 weight%. Moreover, n-butyl methacrylate is mentioned as a monomer especially preferable in the copolymerization component (B) and (C) of the said monomer (A).

(2-b) In the case of preparation method I (ii)

Although various resin can be used as alkali-soluble resin used for composition (a1) in manufacturing method I (ii), it is essential that it is resin which has a structural unit derived from acrylic acid, ie, resin obtained by (co) polymerizing acrylic acid. . In addition, the alkali-soluble resin is a structural unit derived from acrylic acid as described above in the range of usually 5 to 50% by weight, preferably 10 to 40% by weight, particularly preferably 15 to 30% by weight of all the repeating units It contains.

When copolymerizing acrylic acid and another monomer, the monomer chosen from the following monomers (A ')-(C') as a copolymerization component of acrylic acid is preferable, and monomer (B ') is especially preferable.

Monomer (A '):

Maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) acryloyloxyethyl), ω-carboxy-polycaprolactone mono (meth) acrylate Carboxyl group containing monomers other than acrylic acid, such as these;

Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and (α-hydroxymethyl) acrylate;

Alkali-soluble functional group containing monomers represented by phenolic hydroxyl group containing monomers, such as o-hydroxy styrene, m-hydroxy styrene, and p-hydroxy styrene.

Monomer (B '):

Other than monomers (a) such as methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, benzyl (meth) acrylate, glycidyl (meth) acrylate, and dicyclopentanyl (meth) acrylate (Meth) acrylic acid esters of;

Aromatic vinyl monomers such as styrene and α-methylstyrene; Monomers copolymerizable with monomers (a) represented by conjugated dienes such as butadiene and isoprene.

Monomer (C '):

Macromolecules represented by macromonomers having polymerizable unsaturated groups such as (meth) acryloyl groups at one end of a polymer chain such as polystyrene, methyl poly (meth) acrylate, ethyl poly (meth) acrylate, and benzyl poly (meth) acrylate. Monomers.

(2-c) in the case of production method I (iii)

The alkali-soluble resin used in the composition (a1) in the preparation method I (iii) is the same as the resin used in the composition (a1) in the preparation method I (i).

(2-d) polymerization method, conditions, molecular weight, etc.

Polymerization of the said alkali-soluble resin can be performed by radical polymerization, for example. As an initiator of radical polymerization, azobisisobutyronitrile, benzoyl peroxide, etc. can be used. Propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, etc. can be used as a solvent of radical polymerization. Polymerization temperature can be normally performed at 50-100 degreeC, and polymerization time is 30-600 minutes normally.

Mw of alkali-soluble resin is 5,000-500,000 normally, Preferably it is 10,000-200,000.

Mw of alkali-soluble resin can be controlled by the ratio of a monomer and a polymerization initiator, for example.

As content of alkali-soluble resin in a composition (a1), it is 1-500 weight part normally with respect to 100 weight part of inorganic powders, Preferably it is 5-100 weight part, Especially preferably, it is 15-40 weight part.

(3) dissolution accelerator

In the case of the above production method I (iii), the dissolution accelerator is further included in the composition (a1). When a dissolution accelerator is included in the composition (a1), the development speed of the A1 layer containing the composition (a1) can be increased. In addition, also in any of the said manufacturing methods I (i) and I (ii), a dissolution accelerator can be contained in composition (a1) as an arbitrary component.

Although it does not specifically limit as such a dissolution promoter,

Polyalkylene glycols such as polyethylene glycol, polypropylene glycol and polybutylene glycol;

Celluloses such as ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, carboxymethyl cellulose, and carboxymethyl ethyl cellulose;

Amphipathic compounds such as polyvinyl alcohol, starch, dextran, dextrin, chitosan, collagen, gelatin and bromelain;

Higher fatty acids such as oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid and lauryl acid;

Polyoxyethylene alkyl ether, polyoxyalkylene alkyl ether, polyoxyalkylene nonylphenyl ether, alcohol ethoxylate, glycerin fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene hardened castor oil, polyoxyethylene alkylamine, alkyl And nonionic surfactants such as alkanolamides and sorbitan fatty acid esters.

Among these, amphiphilic compounds and nonionic surfactants are preferable, and among them, polyalkylene glycols are preferred from the viewpoint of combustibility of the member-forming material layer when the transfer film is formed, and in particular, polyethylene glycol and polypropylene glycol are particularly preferred. desirable.

(4) solvent

The solvent constituting the composition (a1) is included to impart fluidity or plasticity to the composition (a1) or to form a good film.

The solvent constituting the composition (a1) is not particularly limited, and examples thereof include ethers, esters, ether esters, ketones, ketone esters, amides, amide esters, lactams, lactones and sulfoxides. , Sulfones, hydrocarbons, halogenated hydrocarbons, and the like.

Specific examples of such solvents include tetrahydrofuran, anisole, dioxane, ethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, acetic acid esters, Hydroxyacetic acid esters, alkoxyacetic acid esters, propionic acid esters, hydroxypropionic acid esters, alkoxypropionic acid esters, lactic acid esters, ethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ether acetates, alkoxy acetic acid esters , Cyclic ketones, acyclic ketones, acetoacetic acid esters, pyruvic acid esters, N, N-dialkylformamides, N, N-dialkylacetamides, N-alkylpyrrolidones, γ-lactones, di Alkyl sulfoxides, dialkyl sulfones, terpineol, N-methyl-2-pyrrolidone, etc. are mentioned. These may be used alone or in combination of two or more thereof.

As content of the solvent in a composition (a1), it can select suitably within the range from which favorable film formation property (fluidity or plasticity) is obtained.

The composition (a1) may contain various additives such as plasticizers, adhesive preparations, antihalation agents, storage stabilizers, antifoam agents, antioxidants, ultraviolet absorbers, fillers, and low melting glass as optional components.

B1 floor

The B1 layer is coated with a photosensitive composition (hereinafter also referred to as "composition (b1)") in the form of a paste containing an inorganic powder, an alkali-soluble resin, a solvent, and a photosensitive component as essential components, and the coating film is dried to part or all of the solvent. It can form by removing.

The inorganic powder and solvent which comprise a composition (b1) can use the thing similar to what was described as a structural component of the said composition (a1).

(1) alkali soluble resin

As alkali-soluble resin used for a composition (b1), various resin can be used and it has a role of binding resin. As this alkali-soluble resin, it can use according to the conditions (i)-(iii) which A1 layer and B1 layer must satisfy in the manufacturing method I of a PDP member.

(1-a) In the case of production method I (i)

As alkali-soluble resin used for composition (b1) in manufacturing method I (i), the thing similar to what was described as a component of the composition (a1) used for manufacturing method I (i) mentioned above can be used.

However, Mw of alkali-soluble resin used for composition (b1) in manufacturing method I (i) needs to be larger than Mw of alkali-soluble resin which comprises composition (a1). Moreover, in order to make the effect of this invention more remarkable, it is preferable that the difference between Mw of alkali-soluble resin which comprises composition (b1), and Mw of alkali-soluble resin which comprises composition (a1) is 5,000-60,000, and 10,000-10,000. It is more preferable that it is 40,000. Mw can be controlled by the method similar to the case of alkali-soluble resin which comprises a composition (a1).

The Mw of the alkali-soluble resin used in the composition (b1) in the production method I (i) is usually 5,000 to 500,000, preferably 10,000 to 200,000.

As content of the said alkali-soluble resin in a composition (b1), it is 1-500 weight part normally with respect to 100 weight part of inorganic powders, Preferably it is 5-100 weight part, Especially preferably, it is 15-40 weight part.

(1-b) In the case of preparation method I (ii)

Although various resin can be used as alkali-soluble resin used for composition (b1) in manufacturing method I (ii), it is resin which has a structural unit derived from methacrylic acid, ie, resin obtained by (co) polymerizing methacrylic acid. It is necessary. In addition, the alkali-soluble resin of the structural unit derived from methacrylic acid, as described above, of 5 to 50% by weight, preferably 10 to 40% by weight, particularly preferably 15 to 30% by weight of all the repeating units It contains in the range.

When copolymerizing methacrylic acid and another monomer, as the copolymerization component of methacrylic acid, a monomer selected from monomers (A ') to (C') used in the composition (a1) in the above-mentioned production method I (ii) is preferable. Especially, monomer (B ') is preferable.

The Mw of the alkali-soluble resin used in the composition (b1) in the production method I (ii) is usually 5,000 to 500,000, preferably 10,000 to 200,000.

As content of the said alkali-soluble resin in a composition (b1), it is 1-500 weight part normally with respect to 100 weight part of inorganic powders, Preferably it is 5-100 weight part, Especially preferably, it is 15-40 weight part.

(1-c) in the case of production method I (iii)

As alkali-soluble resin used for composition (b1) in manufacturing method I (iii), the same thing as what was described as a component of the composition (a1) used by manufacturing method I (iii) mentioned above can be used.

The Mw of the alkali-soluble resin used in the composition (b1) in the production method I (iii) is usually 5,000 to 500,000, preferably 10,000 to 200,000.

As content of the said alkali-soluble resin in a composition (b1), it is 1-500 weight part normally with respect to 100 weight part of inorganic powders, Preferably it is 5-100 weight part, Especially preferably, it is 15-40 weight part.

(2) photosensitive component

As a photosensitive component which comprises a composition (b1), the combination of (A) a polyfunctional monomer and a radiation polymerization initiator, and (B) a melamine resin and the photoacid generator which forms an acid by irradiation, for example, As a combination of said (A), the combination of a polyfunctional (meth) acrylate and a radiation polymerization initiator is especially preferable.

As a specific example of the polyfunctional (meth) acrylate which comprises the photosensitive component, Di (meth) acrylates of alkylene glycol, such as ethylene glycol and propylene glycol;

Di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; Di (meth) acrylates of both terminal hydroxylated polymers such as both terminal hydroxypolybutadiene, both terminal hydroxypolyisoprene and both terminal hydroxypolycaprolactone;

Poly (meth) acrylates of trivalent or higher polyhydric alcohols such as glycerin, 1,2,4-butane triol, trimethylol alkane, tetramethylol alkane, pentaerythritol, dipentaerythritol;

Poly (meth) acrylates of polyalkylene glycol adducts of trivalent or higher polyhydric alcohols; Poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediols;

Oligos, such as polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spiran resin (meth) acrylate ( Meth) acrylates and the like. These can be used individually or in combination of 2 or more types.

Specific examples of the radiation polymerization initiator constituting the photosensitive component include benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one and 1-hydroxycyclohexyl Phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- [4 '-(methylthio) phenyl] -2-morpholino-1-propaneone, 2-benzyl-2-dimethylamino Carbonyl compounds such as -1- (4-morpholinophenyl) -butan-1-one;

Azo compounds or azide compounds such as azoisobutyronitrile and 4-azide benzaldehyde; Organic sulfur compounds such as mercaptan disulfide;

Organic peroxides such as benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide and paramethane hydroperoxide;

1,3-bis (trichloromethyl) -5- (2'-chlorophenyl) -1,3,5-triazine, 2- [2- (2-furanyl) ethylenyl] -4,6-bis Trihalo methanes such as (trichloromethyl) -1,3,5-triazine;

And imidazole dimers such as 2,2'-bis (2-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1,2'-biimidazole. These can be used individually and in combination of 2 or more types.

Content of the photosensitive component in a composition (b1) is 10-60 weight part normally with respect to 100 weight part of inorganic powder, Preferably it is 20-40 weight part. In particular, when using a combination of a polyfunctional monomer and a radiation polymerization initiator as the photosensitive component, the polyfunctional monomer is usually 5 to 40 parts by weight, preferably 10 to 30 parts by weight, based on 100 parts by weight of the inorganic powder, and the radiation polymerization. The initiator is usually 1 to 20 parts by weight, preferably 5 to 15 parts by weight based on 100 parts by weight of the multifunctional monomer.

(3) other ingredients such as dissolution accelerator

In the case of the above production method I (iii), the dissolution accelerator is not usually included in the composition (b1), but may be included as an optional component. However, even if a dissolution accelerator is contained in the composition (b1), the content of the dissolution accelerator relative to the total weight of the composition (a1) is higher than the content of the dissolution accelerator contained in the composition (a1). Need to be small.

Moreover, also in the case of the said manufacturing method I (i) and I (ii), although a dissolution promoter is not normally contained in a composition (b1), it can also be included as an arbitrary component. However, since the difference in solubility with respect to the developing solution of B1 layer and A1 layer containing a composition (b1) becomes small when the content rate of a dissolution promoter increases, it may not be preferable. Therefore, it is more preferable that the content ratio of the dissolution accelerator contained in the composition (b1) to the total weight of the composition (b1) is smaller than the content ratio of the total amount of the composition (a1) of the dissolution accelerator contained in the composition (a1). have.

In addition, the composition (b1) may contain various additives such as plasticizer, adhesive preparation, antihalation agent, storage stabilizer, antifoaming agent, antioxidant, ultraviolet absorber, filler, low melting point glass as optional components.

A2 floor

The A2 layer is coated with a non-photosensitive composition (hereinafter referred to as "composition (a2)") in the form of a paste containing an inorganic powder, an alkali-soluble resin, a solvent, and a dissolution accelerator to be included if necessary, and the coating film is dried. It can form by removing one part or all part of a solvent.

The inorganic powder and the solvent which comprise a composition (a2) can use the thing similar to what was described as a structural component of the said composition (a1).

(1) alkali soluble resin

As alkali-soluble resin used for a composition (a2), various resin can be used and it has a role of binding resin. As this alkali-soluble resin, it can use according to the conditions (iv)-(vi) which A2 layer and A3 layer must satisfy in the manufacturing method II of a PDP member.

If it is necessary to satisfy condition (iv) in the production method II of the PDP member (hereinafter also referred to as "manufacturing method II (iv)"), the alkali-soluble resin used in the composition (a2) may be prepared in the production method I (i). It is the same as alkali-soluble resin used for the composition (a1) of the. Likewise, in the case of preparation method II (v), the alkali-soluble resin used in the composition (a2) is the same as the alkali-soluble resin used in the composition (a1) of the preparation method I (ii), and in the case of the preparation method II (vi) The alkali-soluble resin used in the composition (a2) is the same as the alkali-soluble resin used in the composition (a1) of the production method I (iii).

(2) dissolution accelerator

In the case of preparation method II (vi), the dissolution accelerator is further included in the composition (a2). When a dissolution accelerator is included in the composition (a2), the development speed of the A2 layer containing the composition (a2) can be increased. The dissolution accelerator used in this production method II (vi) is the same as the dissolution promoter used in the composition (a1) of the production method I (iii).

Moreover, also in any of the said manufacturing method II (iv) and II (v), a dissolution accelerator can be contained in a composition (a2) as an arbitrary component.

The composition (a2) may contain various additives such as plasticizers, adhesive preparations, antihalation agents, storage stabilizers, antifoaming agents, antioxidants, ultraviolet absorbers, fillers, low melting glass, and the like as optional components.

A3 floor

The A3 layer is formed by applying a non-photosensitive composition (hereinafter also referred to as "composition (a3)") in the form of a paste containing an inorganic powder, an alkali-soluble resin and a solvent, and drying the coating film to remove some or all of the solvent. can do.

The inorganic powder and solvent which comprise a composition (a3) can use the thing similar to what was described as a structural component of the said composition (a1).

(1) alkali soluble resin

As alkali-soluble resin used for a composition (a3), various resin can be used and it has a role of binding resin. As this alkali-soluble resin, it can be used according to the said conditions (iv)-(vi) which A2 layer and A3 layer must satisfy in the manufacturing method II of a PDP member.

In the case of preparation method II (iv), the alkali-soluble resin used in the composition (a3) is the same as the alkali-soluble resin used in the composition (b1) in the preparation method I (i). Likewise, in the case of preparation method II (v), the alkali-soluble resin used in the composition (a3) is the same as the alkali-soluble resin used in the composition (b1) of the preparation method I (ii), and in the case of the preparation method II (vi) The alkali-soluble resin used in the composition (a3) is the same as the alkali-soluble resin used in the composition (b1) of the production method I (iii).

(2) other ingredients such as dissolution accelerator

In the case of the above production method II (vi), the dissolution accelerator is not usually included in the composition (a3), but may be included as an optional component. However, even when a dissolution accelerator is contained in the composition (a3), the content of the dissolution accelerator relative to the total weight of the composition (a2) is higher than the content of the dissolution accelerator contained in the composition (a2). Need to be small.

In addition, in the case of the above production methods II (iv) and I (v), the dissolution accelerator is not usually included in the composition (a3), but may be included as an optional component. However, since the difference of solubility with respect to the developing solution of A3 layer and A2 layer containing a composition (a3) becomes small when the content rate of a dissolution promoter increases, it may not be preferable. Therefore, it is preferable that the content rate with respect to the total weight of the composition (a3) of the dissolution accelerator contained in a composition (a3) is smaller than the content rate with respect to the total weight of the composition (a2) of the dissolution promoter contained in a composition (a2). have.

In addition, the composition (a3) may contain various additives such as plasticizers, adhesive preparations, antihalation agents, storage stabilizers, antifoaming agents, antioxidants, ultraviolet absorbers, fillers, low melting point glass, and the like as optional components.

Resist layer

A resist layer can be formed by apply | coating the resist composition containing alkali-soluble resin, a polyfunctional monomer, a radiation polymerization initiator, and a solvent, and drying a coating film and removing a part or all of a solvent.

Each component used for a resist composition can use the same thing as what was described as a component of the said composition (b1).

Formation Method of Transfer Film

The transfer film which concerns on this invention can be manufactured by apply | coating the composition used by this invention, and repeating removing a part or all of a solvent by drying a coating film. At this time, drying of the coating film is preferably performed one by one, but in some cases, the laminated coating film may be dried at one time. In addition, a resist composition may be applied onto the support film as needed, the coating film may be dried to form a resist layer, and the composition may be applied and dried on the resist layer to produce a transfer film.

It is preferable that the method of apply | coating each composition efficiently is a method which can form a coating film with a uniform film thickness. For example, the coating method with a roll coater, the coating method with a doctor blade, the coating method with a curtain coater, and the coating method with a wire coater are mentioned.

Drying conditions of a coating film are about 50 to 150 minutes at 50-150 degreeC, for example, and the residual rate (content rate in a partition formation material layer) of the solvent after drying is normally 2 weight% or less.

Although the thickness of each material layer formed on a support film as mentioned above also changes with content of an inorganic powder, the kind and size of a member, etc., For example, the thickness of A1 layer or A2 layer is 10-150 micrometers, B1. The thickness of the layer or A3 layer is 10 to 150 mu m. In addition, the thickness of a resist layer is 5-50 micrometers normally.

Moreover, although the transfer film may have a protective film on the surface, such a protective film is a polyethylene film and a polyvinyl alcohol-type film.

In addition, the transfer film of the present invention is formed by applying a composition on a support film and a protective film, respectively, to form a material layer (or resist layer), and overlapping and crimping the surface of each material layer (or resist layer). It can form preferably. As such a formation method, the following examples are mentioned, for example.

The method of forming a B1 layer on a <1> support film, forming an A1 layer on a protective film, overlapping the surface of A1 layer, and the surface of B1 layer, and crimping | bonding.

<2> A method of forming a resist layer and an A3 layer on a supporting film, forming an A2 layer on a protective film, and overlapping the surface of the A3 layer with the surface of the A2 layer and pressing them.

A method of forming a resist layer on a <3> support film, forming a layer of an A2 layer and an A3 layer on a protective film, and overlapping the surface of the resist layer with the surface of the A3 layer and compressing them.

<Example>

Hereinafter, although the Example of this invention is described, this invention is not limited by these. In addition, below, "part" and "%" represent "weight part" and "weight%", respectively.

In addition, Mw is the polystyrene conversion weight average molecular weight measured by the Tosoh Corporation gel permeation chromatography (GPC) (brand name: HLC-8220 GPC). GPC measurement conditions are as follows.

GPC column: (TSK guardcolumn Super HZ-L, manufactured by Tosoh Kabukishi Kaisha)

Solvent: THF

Measuring temperature: 40 ℃

Synthesis Example 1

When 200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methacrylate, 30 parts of methacrylic acid and 2 parts of azobisisobutyronitrile are placed in an autoclave equipped with a stirrer and become uniform at room temperature under a nitrogen atmosphere. Stir until. Then, it superposed | polymerized at 80 degreeC for 3 hours, and after continuing a polymerization reaction at 100 degreeC for 1 hour, it cooled to room temperature and obtained the polymer solution. The polymerization rate was 98% and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as "polymer (1)") was 40,000.

Synthesis Example 2

A polymer solution was obtained in the same manner as in Synthesis Example 1 except that 200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methacrylate, 30 parts of methacrylic acid and 1 part of azobisisobutyronitrile were placed in an autoclave. The polymerization rate was 97% and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as "polymer (2)") was 70,000.

Synthesis Example 3

200 parts of propylene glycol monomethyl ether acetate, 70 parts of n-butyl methacrylate, 30 parts of acrylic acid and 1 part of azobisisobutyronitrile were placed in an autoclave equipped with a stirrer and stirred until uniform at room temperature under a nitrogen atmosphere. After that, the polymerization was carried out at 80 ° C for 3 hours, and the polymerization reaction was further continued at 100 ° C for 1 hour, and then cooled to room temperature to obtain a polymer solution. The polymerization rate was 98% here, and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as "polymer (3)") was 70,000.

<Manufacture example 1>

100 parts of glass frit (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ system; hereinafter simply referred to as "glass frit") as inorganic powder, 30 parts of polymer (1) as alkali-soluble resin, as a plasticizer A paste-like non-photosensitive composition (hereinafter referred to as "non-photosensitive composition (a-1)) was prepared by kneading 2 parts of di-2-ethylhexyl azelate and 50 parts of propylene glycol monomethyl ether acetate as a solvent.

<Manufacture example 2>

Paste non-photosensitive composition by kneading 100 parts of glass frit as inorganic powder, 30 parts of polymer (2) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer and 50 parts of propylene glycol monomethyl ether acetate as a solvent ( Hereinafter, "non-photosensitive composition (a-2)" was prepared.

<Manufacture example 3>

Paste non-photosensitive composition by kneading 100 parts of glass frit as inorganic powder, 30 parts of polymer (3) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, and 50 parts of propylene glycol monomethyl ether acetate as solvent. (Hereinafter referred to as "non-photosensitive composition (a-3)") was prepared.

<Manufacture example 4>

100 parts of glass frit as inorganic powder, 30 parts of polymer (2) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 5 parts of polypropylene glycol (molecular weight 400) as dissolution accelerator and propylene glycol mono as solvent By kneading 50 parts of methyl ether acetate, a paste-like non-photosensitive composition (hereinafter referred to as "non-photosensitive composition (a-4)") was prepared.

Production Example 5

100 parts of glass frit as inorganic powder, 30 parts of polymer (1) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 50 parts of propylene glycol monomethyl ether acetate as solvent, trimethylol as radiation sensitive component By kneading 10 parts of propane triacrylate and 2 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, a paste-like photosensitive composition (hereinafter referred to as "photosensitive composition (b- 1) ").

<Manufacture example 6>

100 parts of glass frit as inorganic powder, 30 parts of polymer (2) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 50 parts of propylene glycol monomethyl ether acetate as solvent, trimethylolpropane as radioactive component By kneading 10 parts of triacrylate and 2 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, a paste-like photosensitive composition (hereinafter referred to as "photosensitive composition (b-2) ) ").

<Manufacture example 7>

100 parts of glass frit as inorganic powder, 30 parts of polymer (3) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 100 parts of propylene glycol monomethyl ether acetate as solvent and trimethylolpropane tri as photosensitive component By kneading 10 parts of acrylate and 2 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, a paste-like photosensitive composition (hereinafter referred to as "photosensitive composition (b-3) "Was prepared.

<Manufacture example 8>

100 parts of glass frit as inorganic powder, 30 parts of polymer (2) as alkali-soluble resin, 2 parts of di-2-ethylhexyl azelate as plasticizer, 5 parts of polypropylene glycol (molecular weight 400) as dissolution accelerator, and propylene glycol mono as solvent By kneading 100 parts of methyl ether acetate and 10 parts of trimethylolpropane triacrylate and 2 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one as radiation-sensitive components, A paste-shaped photosensitive composition (hereinafter referred to as "photosensitive composition (b-4)") was prepared.

<Manufacture example 9>

100 parts of polymer (1) as alkali-soluble resin, 50 parts of trimethylolpropane triacrylate as a polyfunctional monomer, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane- as a radiation polymerization initiator 15 parts of 1-one and 150 parts of propylene glycol monomethyl ether acetate were kneaded as a solvent to prepare a composition for a resist layer (hereinafter referred to as "resist composition (r-1)").

Production Example 10

50 parts of polymer (1) as alkali-soluble resin, 40 parts of pentaerythritol tetraacrylate as polyfunctional monomer, 10 parts by weight of 1-hydroxycyclohexylphenyl ketone as a radiation polymerization initiator, and ethyl 3-ethoxypropionate as a solvent By kneading 150 parts, a composition for resist layers (hereinafter referred to as "resist composition (r-2)") was prepared.

(Development speed evaluation method)

A barrier coating material was applied to the surface of a soda glass substrate (15 cm side, 1.1 mm thick) using a bar coater, and dried at 110 ° C. for 5 minutes to completely remove the solvent to form a partition forming material having a thickness of 100 μm. A test piece with a layer was produced.

The obtained test piece was immersed in 0.2 weight% of potassium hydroxide aqueous solution, and the surface of the test piece was observed, stirring the solution using a magnetic stirrer. By dissolving the partition formation material layer of the test piece surface, the time which half of the board | substrate surface was exposed was measured by the dissolution time, and the melt rate was computed by the following formula (1). The calculation results are shown in Table 1 below.

Dissolution Rate (µm / sec) = Film Thickness (µm) / Dissolution Time (sec)

<Example 1>

(Manufacture of Transfer Film)

The obtained photosensitive composition (b-2) was apply | coated by the roll coater on the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of a polyethylene terephthalate (PET) film which carried out the mold release process previously, and forms a coating film, The solvent was removed by drying the formed coating film at 110 degreeC for 5 minutes, and the photosensitive layer (b) of thickness 100micrometer was formed. Subsequently, a non-photosensitive composition (a-1) is applied onto the photosensitive layer (b) by a roll coater to form a coating film, and the formed coating film is dried at 110 ° C. for 5 minutes to remove the solvent to thereby give a non-photosensitive layer having a thickness of 100 μm. (a) was formed. Thereby, the partition formation material layer which consists of two layers of 200 micrometers in thickness was formed, and the transfer film (henceforth "transfer film 1") of this invention was manufactured.

(Manufacture of bulkhead for PDP)

<Transfer process>

The transfer film 1 was superposed so that the surface of the non-photosensitive layer (a) might contact the surface of the glass substrate for 6-inch panels, and this transfer film 1 was thermocompression-bonded with the heating roller. In the crimping conditions, the surface temperature of the heating roller was 120 ° C, the roll pressure was 4 kg / cm 2, and the moving speed of the heating roller was 0.5 m / min. Thereby, the transfer layer was transferred and adhered to the surface of the glass substrate. When the thickness of this transfer layer (non-photosensitive layer (a) + photosensitive layer (b)) was measured, it was in the range of 200 µm ± 5 µm.

<Exposure Step of Photosensitive Layer (b)>

The photosensitive layer (b) was irradiated with i-rays (ultraviolet light having a wavelength of 365 nm) with an ultrahigh pressure mercury lamp through an exposure mask (40 탆 wide striped pattern). The irradiation amount was 400 mJ / cm 2.

Development Process

After the completion of the exposure step, the supporting film is peeled off from the photosensitive layer (b) and then developed by a shower method in which a 0.2 wt% aqueous potassium hydroxide solution (25 ° C.) is used as a developer with respect to the exposed photosensitive layer (b). Was performed. Thereby, the part of the uncured photosensitive layer (b) which was not irradiated with the ultraviolet-ray was removed, and the non-photosensitive layer (a) was continuously developed using it as a pattern. Subsequently, washing with water and drying treatment with ultrapure water were performed. Thereby, the pattern of the partition wall formation layer was formed.

<Firing process>

The glass substrate which has a patterned layer was baked by baking for 30 minutes in the baking furnace in the temperature atmosphere of 600 degreeC. Thereby, the panel material in which the partition is formed in the surface of a glass substrate was obtained.

The cross-sectional shape of the partition wall was observed with the scanning electron microscope in the obtained panel material, and the width and height of the bottom face of the cross-sectional shape were measured. As a result, it was found that the bottom surface had a width of 40 µm ± 3 µm, a height of 200 µm ± 5 µm, a very high dimensional accuracy, and a sharp edge pattern of the partition wall. In addition, peeling and deformation | transformation of the remainder, a pattern, were not observed. The evaluation results are shown in Table 1.

<Example 2>

A transfer film was produced in the same manner as in Example 1 except that the non-photosensitive composition (a-1) used was changed to the non-photosensitive composition (a-3), and the barrier layer was formed on the glass substrate using the obtained transfer film. Was formed, and exposure, development, and baking were performed. Thereby, the panel material in which the partition is formed in the surface of a glass substrate was obtained.

The cross-sectional shape of the partition wall was observed with the scanning electron microscope in the obtained panel material, and the width and height of the bottom face of the cross-sectional shape were measured. As a result, it was found that the bottom surface had a width of 40 µm ± 3 µm, a height of 200 µm ± 5 µm, a very high dimensional accuracy, and a sharp edge pattern of the partition wall. In addition, peeling and deformation | transformation of the remainder and the pattern were not observed. The evaluation results are shown in Table 1.

<Example 3>

A transfer film was produced in the same manner as in Example 1 except that the non-photosensitive composition (a-1) used was changed to a non-photosensitive composition (a-4), and the barrier layer was formed on the glass substrate using the obtained transfer film. Was formed, and exposure, development, and baking were performed. Thereby, the panel material in which the partition is formed in the surface of a glass substrate was obtained.

The cross-sectional shape of the partition wall was observed with the scanning electron microscope in the obtained panel material, and the width and height of the bottom face of the cross-sectional shape were measured. As a result, it was found that the bottom surface had a width of 40 µm ± 3 µm, a height of 200 µm ± 5 µm, a very high dimensional accuracy, and a sharp edge pattern of the partition wall. In addition, peeling and deformation | transformation of the remainder, a pattern, were not observed. The evaluation results are shown in Table 1.

<Comparative Examples 1 to 9>

As a comparative example, except for the combination of the composition used for each of two layers, the transfer film was produced like Example 1, the barrier film forming layer was formed on the glass substrate using the obtained transfer film, and exposure, image development, and baking were performed. . The used composition and the evaluation result are shown in Table 1.

<Example 4>

(Manufacture of Transfer Film)

A coating film was formed by applying a roll coater onto a support film (200 mm in width, 30 m in length, 38 μm in thickness) made of a PET film in which the resist composition (r-1) was previously released. The solvent was removed by drying for 5 minutes at to form a resist layer having a thickness of 15 µm.

Subsequently, a non-photosensitive composition (a-2) is applied on a resist layer by a roll coater to form a coating film, and the formed coating film is dried at 100 ° C. for 5 minutes to remove the solvent to form a layer (a ′) having a thickness of 100 μm. It was.

Further, the non-photosensitive composition (a-1) was applied onto the layer (a ') by a roll coater to form a coating film, and the formed coating film was dried at 100 ° C. for 5 minutes to remove the solvent, thereby obtaining a layer having a thickness of 100 μm. ") Was formed. Thus, the transfer film (hereinafter referred to as" transfer film 2 ") of the present invention was produced by forming a partition forming material layer consisting of three layers having a thickness of 215 mu m.

(Manufacture of bulkhead for PDP)

<Transfer process>

The transfer film 2 was superposed so that the surface of the layer (a ") might contact the surface of the glass substrate for 6-inch panels, and this transfer film 2 was thermocompression-bonded with the heating roller. As a result, the transfer layer was transferred to and adhered to the surface of the glass substrate, and the thickness of the transfer layer (resist layer + layer (a ') + layer (a ") was measured. It was in the range of 5 μm.

<Exposure Step of Resist Layer>

I-line (ultraviolet light of 365 nm wavelength) was irradiated to the resist layer with the ultrahigh pressure mercury lamp through the exposure mask (40 micrometers wide stripe pattern). The irradiation amount was 400 mJ / cm 2.

Development Process

After peeling off the support film from the resist layer after completion | finish of an exposure process, the image development process by the shower method which made 25 degreeC of 0.3 weight% potassium hydroxide aqueous solution into a developing solution was performed with respect to the exposed resist layer. Thereby, the part of the uncured resist layer which was not irradiated with ultraviolet rays was removed, and the pattern (a ') and the partition formation material layer (a' ') were continuously developed by using it as a pattern, followed by ultrapure water. Water washing treatment and drying treatment were performed. Thereby, the pattern of the partition formation material layer which consists of a material layer remainder and a material layer removal part was formed.

<Firing process>

The glass substrate which has a layer in which the pattern was formed was baked in the baking furnace over 30 minutes in the temperature atmosphere of 560 degreeC. Thereby, the panel material in which the partition is formed in the surface of a glass substrate was obtained.

The cross-sectional shape of the partition wall was observed with the scanning electron microscope in the obtained panel material. As a result, the width and height of the bottom face of the cross-sectional shape were measured. The bottom face had a width of 40 µm ± 3 µm and a height of 150 µm ± 3 µm, very high dimensional accuracy, and a sharp edge pattern of the partition wall. I could see that I could. In addition, peeling and deformation | transformation of the remainder, a pattern, were not observed. The evaluation results are shown in Table 2 below.

Example 5

Transfer was carried out in the same manner as in Example 4 except that the resist composition (r-1) to be used was changed to the resist composition (r-2) and the non-photosensitive composition (a-1) to be used. The film was manufactured, the barrier film forming layer was formed on the glass substrate using the obtained transfer film, and exposure, image development, and baking were performed. Thereby, the panel material in which the partition is formed in the surface of a glass substrate was obtained.

The cross-sectional shape of the partition in the obtained panel material was observed with a scanning electron microscope. As a result, the width and height of the bottom face of the cross-sectional shape were measured, and the bottom face had a width of 40 μm ± 3 μm, a height of 150 μm ± 5 μm, very high dimensional accuracy, and a sharp edge pattern of the partition. I could see that I could. In addition, peeling and deformation | transformation of the remainder, a pattern, were not observed. The evaluation results are shown in Table 2.

<Example 6>

Transfer was carried out in the same manner as in Example 4 except that the resist composition (r-1) to be used was changed to the resist composition (r-2) and the non-photosensitive composition (a-1) to be used. The film was manufactured, the barrier film forming layer was formed on the glass substrate using the obtained transfer film, and exposure, image development, and baking were performed. Thereby, the panel material in which the partition is formed in the surface of a glass substrate was obtained.

The cross-sectional shape of the partition wall was observed with the scanning electron microscope in the obtained panel material. As a result, the width and height of the bottom face of the cross-sectional shape were measured, and the bottom face had a width of 40 μm ± 3 μm, a height of 150 μm ± 5 μm, very high dimensional accuracy, and a sharp edge pattern of the partition. I could see that I could. In addition, peeling and deformation | transformation of the remainder, a pattern, were not observed. The evaluation results are shown in Table 2.

<Comparative Examples 10 to 12>

As a comparative example, except for the combination of the composition used for each layer, the transfer film was produced like Example 4, the layer for partition formation was formed on the glass substrate using the obtained transfer film, and exposure, image development, and baking were performed. The used composition and the evaluation result are shown in Table 2.

According to the manufacturing method of the PDP member of this invention, the member excellent in the pattern shape can be formed. In addition, when the transfer film of the present invention is used, the PDP member having a uniform film thickness can be formed, and since the number of steps is substantially reduced, the work efficiency is improved.

1 is a cross-sectional view illustrating a general PDP.

<Brief description of symbols for the main parts of the drawings>

1, 2 glass substrate

3 bulkhead

4 transparent electrodes

5 bus electrode

6 address electrode

7 phosphor

8, 9 dielectric layers

10 Shield

Claims (17)

(1) forming a non-photosensitive layer (A1) containing inorganic powder and alkali-soluble resin on a substrate, (2) forming a photosensitive layer (B1) containing an inorganic powder, an alkali-soluble resin, and a radiation sensitive component on the A1 layer, (3) exposing the layer B1 to form a latent image of the pattern; (4) forming a pattern of the B1 layer by a development treatment; (5) a step of selectively dissolving the A1 layer by developing to form a pattern of the A1 layer through the pattern of the B1 layer, and (6) A method of manufacturing a plasma display panel member comprising a step of baking the obtained pattern, wherein the A1 layer and the B1 layer satisfy one or more of the conditions represented by the following (i) to (iii). The manufacturing method of a display panel member. (i) The polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A1 layer is smaller than the polystyrene reduced weight average molecular weight of alkali-soluble resin contained in B1 layer. (ii) Alkali-soluble resin contained in A1 layer is resin which has a structural unit derived from acrylic acid, and alkali-soluble resin contained in B1 layer is resin which has structural unit derived from methacrylic acid. (iii) The dissolution accelerator is further contained in the A1 layer, and the content of the dissolution accelerator contained in the A1 layer is higher than the content of the dissolution accelerator contained in the B1 layer relative to the total weight of the B1 layer. The plasma display panel member according to claim 1, wherein a difference between the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the B1 layer and the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the A1 layer is 5,000 to 60,000. Method of preparation. The manufacturing method of the plasma display panel member of Claim 1 whose dissolution promoter contained in A1 layer is polyalkylene glycol. (1) forming a non-photosensitive layer (A2) containing inorganic powder and alkali-soluble resin on a substrate, (2) Process of forming non-photosensitive layer (A3) containing inorganic powder and alkali-soluble resin on A2 layer, (3) forming a resist layer on the A3 layer; (4) exposing the resist layer to form a latent image of the pattern, (5) process of forming pattern of resist layer by developing process, (6) a step of selectively dissolving the A3 layer and the A2 layer by the development treatment through the pattern of the resist layer to form a pattern of the A3 layer and the A2 layer, and (7) A method of manufacturing a plasma display panel member comprising a step of baking the obtained pattern, wherein the A2 layer and the A3 layer satisfy at least one of the conditions represented by the following (iv) to (vi). The manufacturing method of a display panel member. (iv) The polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A2 layer is smaller than the polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A3 layer. (v) Alkali-soluble resin contained in A2 layer is resin which has a structural unit derived from acrylic acid, and alkali-soluble resin contained in A3 layer is resin which has structural unit derived from methacrylic acid. (vi) Dissolution accelerator is further contained in A2 layer, and content with respect to the total weight of A2 layer of the dissolution accelerator contained in A2 layer is more than content with respect to the total weight of A3 layer of dissolution accelerator contained in A3 layer. The plasma display panel member according to claim 4, wherein a difference between the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the A3 layer and the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the A2 layer is 5,000 to 60,000. Method of preparation. The manufacturing method of the plasma display panel member of Claim 4 whose dissolution promoter contained in A2 layer is polyalkylene glycol. The plasma display panel member according to any one of claims 1 to 6, wherein the plasma display panel member is at least one member selected from partition walls, electrodes, resistors, phosphors, color filters, and black matrices. Way. The method for manufacturing a plasma display panel member according to any one of claims 1 to 6, wherein the plasma display panel member is a partition wall. It is a transfer film in which two or more layers containing the inorganic powder, alkali-soluble resin, and the photosensitive component were formed on the support film, and satisfy | fill one or more conditions represented by following (a)-(c), It is characterized by the above-mentioned. Transfer film. (a) Polystyrene conversion of the alkali-soluble resin contained in any one layer (I) formed on the support film Polystyrene conversion of the alkali-soluble resin contained in another layer (II) formed on the said (I) layer It is larger than a weight average molecular weight. (b) Alkali-soluble resin contained in arbitrary one layer (III) formed on the support film is resin which has a structural unit derived from methacrylic acid, and is contained in another layer (IV) formed on said (III) layer. Alkali-soluble resin is resin which has a structural unit derived from acrylic acid. (c) Another layer (VI) is formed on any one layer (V) formed on the supporting film, and at least the (VI) layer further includes a dissolution accelerator and is included in the (VI) layer. Content with respect to the whole weight of the (VI) layer of the dissolution promoter used is more than content with respect to the whole weight of the (V) layer contained in the said (V) layer. On a support film, it is a transfer film which has the photosensitive layer (B1) containing an inorganic powder, alkali-soluble resin, and a radiation sensitive component, and the non-photosensitive layer (A1) containing an inorganic powder and alkali-soluble resin, and is on a B1 layer A transfer film having an A1 layer, wherein the A1 layer and the B1 layer satisfy one or more of the conditions represented by the following (i) to (iii). (i) The polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A1 layer is smaller than the polystyrene reduced weight average molecular weight of alkali-soluble resin contained in B1 layer. (ii) Alkali-soluble resin contained in B1 layer is resin which has a structural unit derived from methacrylic acid, and alkali-soluble resin contained in A1 layer is resin which has structural unit derived from acrylic acid. (iii) The dissolution accelerator is further contained in the A1 layer, and the content of the dissolution accelerator contained in the A1 layer is higher than the content of the dissolution accelerator contained in the B1 layer relative to the total weight of the B1 layer. The transfer film according to claim 10, wherein the difference between the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the B1 layer and the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the A1 layer is 5,000 to 60,000. The transfer film of Claim 10 whose dissolution promoter contained in A1 layer is polyalkylene glycol. It is a film which has a non-photosensitive layer (A3) containing an inorganic powder and alkali-soluble resin, and a non-photosensitive layer (A2) containing an inorganic powder and alkali-soluble resin on a support film, and has an A2 layer on A3 layer, The A2 layer and the A3 layer satisfy at least one of the conditions represented by the following (iv) to (vi). (iv) The polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A2 layer is smaller than the polystyrene reduced weight average molecular weight of alkali-soluble resin contained in A3 layer. (v) Alkali-soluble resin contained in A3 layer is resin which has a structural unit derived from methacrylic acid, and alkali-soluble resin contained in A2 layer is resin which has structural unit derived from acrylic acid. (vi) Dissolution accelerator is further contained in A2 layer, and content with respect to the total weight of A2 layer of the dissolution accelerator contained in A2 layer is more than content with respect to the total weight of A3 layer of dissolution accelerator contained in A3 layer. The transfer film of Claim 13 which has a resist layer between A3 layer and a support film. The difference between the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the A3 layer and the polystyrene reduced weight average molecular weight of the alkali-soluble resin contained in the A2 layer is 5,000 to 60,000. Transfer film. The transfer film of Claim 13 or 14 whose dissolution promoter contained in A2 layer is polyalkylene glycol. The transfer film according to any one of claims 9 to 14, wherein the inorganic powder is glass powder.