JP2008274221A - Inorganic powder-containing resin composition, transfer film and method for producing flat panel display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inorganic powder-containing resin composition which can form a FPD panel member being high in characteristics after backing, such as permeability, reflectance, surface smoothness and film-thickness uniformity; to provide a transfer film being excellent in flexibility, transferability and handleability and having an inorganic powder-containing resin layer composed of the above composition; and to provide a method for producing an FPD, which can be used for forming an FPD panel member being high in permeability and reflectance, and excellent in surface smoothness and film-thickness uniformity. <P>SOLUTION: The inorganic powder-containing organic resin composition contains (A) an inorganic powder and (B) a binder resin, and the binder resin contains (B-1) a (meth)acrylic polymer having a polyoxyalkylene moiety. The method for producing the FPD comprises forming the flat panel display member, wherein the process of transferring the inorganic powder-containing resin layer of the transfer film onto a substrate and the process of baking the transferred resin layer are involved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inorganic powder-containing resin composition suitable for forming a panel member of a flat panel display, a transfer film having an inorganic powder-containing resin layer comprising the composition, and a flat panel display using the transfer film It relates to the manufacturing method.

  In recent years, flat panel displays (hereinafter also referred to as “FPD”) such as a plasma display panel (hereinafter also referred to as “PDP”) and a field emission display (hereinafter also referred to as “FED”) have attracted attention as flat-plate fluorescent displays. Has been. A PDP forms a transparent electrode, encloses an inert gas such as argon or neon between two adjacent glass plates, causes plasma discharge to light up the gas, thereby causing phosphors to emit light and display information. It is a display. On the other hand, the FED is a display that displays information by causing a phosphor to emit light by emitting electrons from a cathode into a vacuum by applying an electric field and irradiating the electrons on the anode.

  FIG. 1 is a schematic diagram showing a cross-sectional shape of an AC type PDP. In the figure, 1 and 2 are glass substrates facing each other, 3 is a partition, and cells are partitioned by the glass substrate 1, the glass substrate 2 and the partition 3. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode 4 for the purpose of reducing the resistance of the transparent electrode 4, 6 is an address electrode fixed to the glass substrate 2, and 7 is Fluorescent material held in the cell, 8 is a dielectric layer formed on the surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, 9 is a surface of the glass substrate 2 so as to cover the address electrode 6 The formed dielectric layers 10 are protective films made of, for example, magnesium oxide.

  In a color FPD, a color filter (red, green, blue) or a black matrix may be provided between the glass substrate and the dielectric layer in order to obtain a high contrast image.

As a method for manufacturing such FPD dielectric, barrier rib, electrode, phosphor, color filter, and black stripe (matrix), for example,
(1) A method of forming an inorganic powder-containing resin layer on a substrate and firing it (see Patent Document 1), (2) An inorganic powder-containing resin layer is formed on a substrate, and a resist is formed on the resin layer. A method of forming a pattern, etching the inorganic powder-containing resin layer as a mask to form a pattern, and firing the pattern (see Patent Documents 2 and 3)
(3) A method in which a photosensitive inorganic powder-containing resin layer is formed on a substrate, a pattern is formed on the substrate by irradiating the film with ultraviolet rays through a photomask, and development is performed. (See Patent Document 4).

  Among the above methods, in the step of forming the inorganic powder-containing resin layer on the substrate, the inorganic powder-containing resin layer containing the inorganic powder and the binder resin is formed on the flexible support film. A method of transferring the inorganic powder-containing resin layer onto a substrate using a transfer film can be suitably used because a panel member excellent in film thickness uniformity and surface uniformity can be formed efficiently. ing.

However, the inorganic powder-containing resin layer in the conventional transfer film does not have sufficient flexibility and transferability (heat adhesion to the substrate, the same applies hereinafter). When the flexibility is insufficient, problems such as cracks occur when the film is wound on a roll, and cracks occur on the surface of the inorganic powder-containing resin layer transferred to the substrate. Moreover, when transferability is insufficient, problems such as peeling from the substrate occur when the inorganic powder-containing resin layer is baked.

  In order to solve these problems, the flexibility and transferability can be improved by lowering the glass transition point of the binder resin constituting the inorganic powder-containing resin layer or adding a large amount of plasticizer. Although it can be considered, there is a problem that the handling property of the obtained transfer film is lowered, and it is difficult to efficiently transfer and form the inorganic powder-containing resin layer with high positional accuracy.

  The inorganic powder-containing resin layer in the conventional transfer film has low flammability of organic matter. Therefore, after forming the inorganic powder-containing resin layer on the substrate and passing through the firing process, bubbles are formed in the formed inorganic layer. Many have occurred. For this reason, there has been a problem that the strength of the member is insufficient due to the decrease in density, or the transmittance or reflectance is lowered depending on the member.

Further, in the conventional material design, poor dispersion is likely to occur when preparing the inorganic powder-containing resin paste. When the dispersion failure occurs, there are inorganic powders aggregated in the paste, which causes problems such as pinholes in the transfer film and low surface smoothness and film thickness uniformity.
JP-A-9-102273 Japanese Patent Laid-Open No. 11-162339 Japanese Patent Laid-Open No. 11-73875 Japanese Patent Laid-Open No. 11-44949

  An object of the present invention is to provide an inorganic powder-containing resin composition capable of forming an FPD panel member (inorganic layer) having high transmittance, reflectance, surface smoothness and film thickness uniformity after firing. To do.

Another object of the present invention is to provide a transfer film that is excellent in flexibility, transferability and handling properties and has an inorganic powder resin layer made of the above composition.
In addition, the present invention provides an FPD panel member (dielectric layer, electrode, partition wall, phosphor, resistor, color filter, black matrix, etc.) having high transmittance and reflectivity and excellent surface smoothness and film thickness uniformity. ) Can be efficiently formed with high positional accuracy.

Inorganic powder-containing resin composition of the present invention,
(A) inorganic powder;
(B) a (meth) acrylic polymer having a weight average molecular weight of 10,000 to 50,000 having a (B-1) polyoxyalkylene moiety in the binder resin (B). Contains,
And this polymer (B-1) is contained in the quantity of 0.01-50 weight part with respect to 100 weight part of this inorganic powder (A), It is characterized by the above-mentioned.

The polymer (B-1) is
5 to 30% by weight of a structural unit derived from a (meth) acrylate compound having a polyoxyalkylene moiety;
30 to 50% by weight of a structural unit derived from a (meth) acrylate compound having no polyoxyalkylene moiety;
It is preferable to contain 30 to 50% by weight of a structural unit derived from an aromatic vinyl compound.

  The (meth) acrylate compound having a polyoxyalkylene moiety includes polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol ( At least one (meth) acrylate compound selected from meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate and nonylphenoxypolypropylene glycol (meth) acrylate It is preferable that

The inorganic powder-containing resin composition of the present invention preferably further contains a plasticity-imparting substance (C).
The inorganic powder-containing resin composition of the present invention preferably further contains (D-1) a polyfunctional (meth) acrylate and (D-2) a radiation polymerization initiator as the photosensitive component (D).

The transfer film of the present invention has an inorganic powder-containing resin layer obtained from an inorganic powder-containing resin composition on a support film.
The transfer film of the present invention is characterized by having a laminate including a resist layer and an inorganic powder-containing resin layer obtained from an inorganic powder-containing resin composition on a support film.

The first flat panel display member manufacturing method of the present invention (hereinafter also referred to as “FPD manufacturing method (I)”) is as follows.
Transferring the inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition formed on the support film onto the substrate;
And baking the inorganic powder-containing resin layer.

The method for producing a second flat panel display member of the present invention (hereinafter also referred to as “FPD production method (II)”) is as follows.
Transferring the inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition formed on the support film onto the substrate;
Forming a resist layer on the inorganic powder-containing resin layer;
A step of exposing the resist layer to form a latent image of a resist pattern;
Developing the resist layer to reveal the resist pattern; and
Etching the inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern;
And a step of baking the pattern.

The third flat panel display member manufacturing method of the present invention (hereinafter also referred to as “FPD manufacturing method (III)”) is as follows.
A step of transferring a laminate of a resist layer formed on a support film and an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition onto a substrate;
A step of exposing a resist layer constituting the laminate to form a latent image of a resist pattern; and
Developing the resist layer to reveal the resist pattern; and
Etching the inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern;
And a step of baking the pattern.

The fourth flat panel display member manufacturing method of the present invention (hereinafter also referred to as “FPD manufacturing method (IV)”) is as follows.
Transferring the inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition formed on the support film onto the substrate;
A step of exposing the inorganic powder-containing resin layer to form a latent image of a pattern;
Developing the inorganic powder-containing resin layer to form a pattern;
And a step of firing the pattern. A method for producing a flat panel display member.

The fifth flat panel display member manufacturing method of the present invention (hereinafter also referred to as “FPD manufacturing method (V)”) is as follows.
A step of transferring an inorganic powder-containing resin layer obtained from the described inorganic powder-containing resin composition formed on a support film onto a substrate;
Baking the inorganic powder-containing resin layer to form an inorganic film;
Forming a resist pattern on the inorganic film;
And a step of etching the inorganic film to form an inorganic pattern corresponding to the resist pattern.

  The flat panel display member is preferably selected from a dielectric layer, a partition, an electrode, a resistor, a phosphor, a color filter, and a black matrix.

  The transfer film of the present invention, in which the inorganic powder-containing resin layer is formed using the inorganic powder-containing resin composition of the present invention, is excellent in flexibility and transferability, and also has an excellent handling property. Therefore, by using the transfer film of the present invention, after firing, an FPD panel member (dielectric layer, electrode, partition wall, fluorescent material) having excellent surface smoothness and film thickness uniformity and having high transmittance or high reflectance. Body, resistor, color filter, black matrix, etc.) can be efficiently formed with high positional accuracy.

Hereinafter, the inorganic powder-containing resin composition, transfer film and FPD production method of the present invention will be described in detail.
[Inorganic powder-containing resin composition]
[Inorganic powder (A)]
The inorganic powder (A) used in the inorganic powder-containing resin composition of the present invention varies depending on the type of panel member to be formed. Hereinafter, it demonstrates for every kind of panel member.

Examples of the inorganic powder used for the dielectric forming material and the partition wall forming material include glass powder, preferably glass powder having a softening point of 400 to 600 ° C.
When the softening point of the glass powder is less than 400 ° C., the glass powder melts at the stage where the organic substance such as the binder resin is not completely decomposed and removed in the firing step of the inorganic powder-containing resin layer. Therefore, a part of the organic substance may remain in the formed member, and as a result of the outgas diffusing in the obtained FPD, the lifetime of the phosphor may be reduced. On the other hand, when the softening point of the glass powder exceeds 600 ° C., the inorganic powder-containing resin layer needs to be baked at a temperature higher than 600 ° C. May occur.

Preferable specific examples of the glass powder include lead oxide, boron oxide, silicon oxide and calcium oxide (PbO—B ₂ O ₃ —SiO ₂ —CaO) system;
Zinc oxide, boron oxide and silicon oxide (ZnO—B ₂ O ₂ —SiO ₂ ) systems;
Lead oxide, boron oxide, silicon oxide and aluminum oxide (PbO—B ₂ O ₃ —SiO ₂ —
Al ₂ O ₃ ) system;
Lead oxide, zinc oxide, boron oxide and silicon oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ )
system;
Lead oxide, zinc oxide, boron oxide, silicon oxide and titanium oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ —TiO ₂ ) system;
Examples thereof include bismuth oxide, boron oxide, and silicon oxide (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ ).

  The average particle size of the glass powder is preferably 0.5 to 2.5 μm. The glass powder may be used by mixing inorganic oxides such as aluminum oxide, chromium oxide, manganese oxide, titanium oxide, zirconium oxide, silicon oxide, cerium oxide and cobalt oxide. The content of the inorganic oxide to be mixed is preferably 40% by weight or less of the total amount of the inorganic powder (glass powder + inorganic oxide).

Examples of the inorganic powder used for the electrode forming material include Ag, Au, Al, Ni, Ag—Pd alloy, Cu, Cr, and Co.
Examples of the inorganic powder used for the resistor forming material include RuO ₂ .

As an inorganic powder used for the phosphor forming material, for example,
Y ₂ O ₃ : Eu ³⁺ , Y ₂ SiO ₅ : Eu ³⁺ , Y ₃ Al ₅ O ₁₂ : Eu ³⁺ , YVO ₄ : Eu ³⁺ , (Y, Gd) BO ₃ : Eu ³⁺ , Zn ₃ (PO ₄ ) ₂ : red phosphor such as Mn;
Zn ₂ SiO ₄ : Mn, BaAl ₁₂ O ₁₉ : Mn, BaMgAl ₁₄ O ₂₃ : Mn, LaPO ₄ :
Green phosphors such as (Ce, Tb), Y ₃ (Al, Ga) ₅ O ₁₂ : Tb;
Y ₂ SiO ₅ : Ce, BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , BaMgAl ₁₄ O ₂₃ : Eu ²⁺ , (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ C ₁₂ : Eu ²⁺ , (Zn, Cd) Examples thereof include blue phosphors such as S: Ag.

As an inorganic powder used for the color filter forming material, for example,
Red pigments such as Fe ₂ O ₃ , Pb ₃ O ₄ , CdS, CdSe, PbCrO ₄ , PbSO ₄ , Fe (NO ₃ ) ₃ ;
Green pigments such as Cr ₂ O ₃ , TiO ₂ —CoO—NiO—ZnO, CoO—CrO—TiO ₂ —Al ₂ O ₃ , Co ₃ (PO ₄ ) ₂ , CoO—ZnO;
In addition to blue pigments such as 2 (Al ₂ Na ₂ Si ₃ O ₁₀ ) · Na ₂ S ₄ ) and CoO—Al ₂ O _3, as inorganic pigments for color correction,
PbCrO ₄ —PbSO ₄ , PbCrO ₄ , PbCrO ₄ —PbO, CdS, TiO ₂ —NiO—
Yellow pigments such as Sb ₂ O ₃ ;
Orange pigments such as Pb (Cr—Mo—S) O ₄ ;
Mention may be made of purple pigments such as Co ₃ (PO ₄ ) ₂ .

[Binder resin (B)]
The binder resin (B) constituting the inorganic powder-containing resin composition of the present invention is a (meth) acrylic polymer (B) having a polyoxyalkylene moiety and a weight average molecular weight (Mw) of 10,000 to 50,000. -1).

<Polymer (B-1)>
The polymer (B-1) used in the present invention is a (meth) acrylic polymer having a polyoxyalkylene moiety and a weight average molecular weight (Mw) of 10,000 to 50,000. When the polymer (B-1) is contained, the transfer film of the present invention having an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition of the present invention has excellent flexibility and transferability. become. This is because the polymer (B-1) functions as a plasticizer. Therefore, even when the inorganic powder-containing resin film is folded, the surface of the resin layer is not cracked, and the storage stability is good even when wound in a roll. is there.

  Moreover, when the inorganic powder-containing resin composition contains the polymer (B-1), the thermal decomposability of the inorganic powder-containing resin paste is improved, and after the inorganic powder-containing resin layer is fired, The number of bubbles remaining in the gas can be reduced. And since a polymer (B-1) is decomposed | disassembled and removed easily with a heat | fever, the function of the inorganic layer obtained by baking the said inorganic powder containing resin layer does not fall.

  Further, when the polymer (B-1) is contained, the dispersibility and the storage stability of the inorganic powder-containing resin paste are improved, and the inorganic powder-containing resin layer and the inorganic powder-containing resin layer obtained by firing The surface smoothness of the layer is improved.

  The polymer (B-1) constituting the binder resin of the present invention is derived from a structural unit derived from a (meth) acrylate compound having a polyoxyalkylene moiety and a (meth) acrylate compound not having a polyoxyalkylene moiety. It is preferable to contain a structural unit and a structural unit derived from an aromatic vinyl compound.

  The polymer (B-1) includes a homopolymer of a (meth) acrylate compound having a polyoxyalkylene moiety (hereinafter also referred to as “specific (meth) acrylate compound”), and the specific (meth) acrylate compound. (Meth) acrylate compounds having no polyoxyalkylene moiety represented by the following general formula (1) (hereinafter also referred to as “(meth) acrylate compound (1)”), aromatic vinyl compounds and other co-polymers The copolymer with at least 1 sort (s) chosen from a coalescing monomer is mentioned.

(In formula (1), R ¹ represents a hydrogen atom or a methyl group, and R ² represents a monovalent organic group.)
Below, the compound which forms the unit which comprises a polymer (B-1) is each demonstrated.

  In the inorganic powder-containing resin composition of the present invention, the polymer (B-1) is an acrylic polymer having a weight average molecular weight (Mw) of 10,000 to 50,000, preferably 20,000 to 40,000. Containing.

Specific (meth) acrylate compounds that are constituents of the specific (meth) acrylate compound polymer (B-1) include polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, Phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, nonylphenoxypolypropylene glycol (meth) acrylate, etc. Is mentioned.

(Meth) acrylate compound (1)
As the (meth) acrylate compound (1) which is a constituent component of the polymer (B-1), alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, phenoxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, Examples thereof include cycloalkyl (meth) acrylate, benzyl (meth) acrylate, and tetrahydrofurfuryl (meth) acrylate.

  Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl. (Meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) ) Acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl Meth) acrylate, stearyl (meth) acrylate and isostearyl (meth) acrylate.

  Examples of the hydroxyalkyl (meth) acrylate include hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl. Examples include (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

  Examples of the phenoxyalkyl (meth) acrylate include phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate.

  Examples of the alkoxyalkyl (meth) acrylate include 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate and 2- And methoxybutyl (meth) acrylate.

  Examples of the cycloalkyl (meth) acrylate include cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentadienyl ( Examples include meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl (meth) acrylate.

  Preferable examples of the (meth) acrylate compound (1) include butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate. .

The aromatic vinyl compound as a constituent component of the aromatic vinyl compound polymer (B-1) is an aromatic compound having an ethylenically unsaturated bond, and the specific (meth) acrylate compound and the (meth) acrylate compound ( It refers to compounds that do not fall under 1). The compound is not particularly limited as long as it is a compound copolymerizable with the specific (meth) acrylate compound or (meth) acrylate compound (1). For example, styrene, α-methylstyrene, vinylbenzoic acid, vinylphthalic acid, vinylbenzyl methyl ether And aromatic vinyl compounds such as vinyltoluene; polystyrene having a (meth) acryloyl group at the terminal. These may be used alone or in combination of two or more.

Preferable examples of the aromatic vinyl compound include vinyl benzoic acid, vinyl benzyl methyl ether, styrene, and α-methyl styrene.
Other copolymerizable monomer The polymer (B-1) is a copolymerizable monomer other than the specific (meth) acrylate compound, (meth) acrylate compound (1) and aromatic vinyl compound (hereinafter referred to as It may also be reacted with “other copolymerizable monomers”. Other copolymerizable monomers include unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate; unsaturated carboxylic acid glycidyl esters such as glycidyl (meth) acrylate; carboxylic acids such as vinyl acetate and vinyl propionate Vinyl esters; vinyl cyanide compounds such as (meth) acrylonitrile and α-chloroacrylonitrile; aliphatic conjugated dienes such as 1,3-butadiene and isoprene; unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid Acids; unsaturated dicarboxylic acids such as itaconic acid, maleic acid and fumaric acid; other unsaturated carboxylic acids; vinyl ethers such as vinylbenzyl methyl ether and vinyl glycidyl ether; polymethyl (meth) acrylate, polybutyl Meth) macromonomers such as acrylates and polysilicone, and the like.

Preferable examples of other copolymerizable monomers include (meth) acrylic acid, maleic acid, vinyl glycidyl ether, butadiene and isoprene.
Polymer (B-1)
As described above, as the polymer (B-1), the specific (meth) acrylate homopolymer, the specific (meth) acrylate, the (meth) acrylate compound (1), the aromatic vinyl compound, and Examples thereof include a copolymer containing at least one selected from other copolymerizable monomers as a constituent component. Preferable specific examples of the copolymer include a copolymer of the specific (meth) acrylate, the (meth) acrylate compound (1), and an aromatic vinyl compound.

  The composition ratio of the copolymer is usually 5 to 30% by weight of the specific (meth) acrylate and 30 to 50% by weight of the (meth) acrylate compound (1) with respect to 100% by weight of the polymer (B-1). The aromatic vinyl compounds are 30 to 50% by weight, the specific (meth) acrylate is 10 to 25% by weight, the (meth) acrylate compound (1) is 35 to 45% by weight, and the aromatic vinyl compounds are 35 to 45% by weight. More preferred. Moreover, when it contains another copolymer monomer, it is contained in a composition ratio of 1 to 20% by weight, more preferably 5 to 15% by weight with respect to 100% by weight of the polymer (B-1). It is preferable to further improve the flexibility and transferability of the inorganic powder-containing resin transfer film.

Examples of the polymer (B-1) used in the present invention include polymethylene glycol (meth) acrylate-polybutyl methacrylate copolymer, polyethylene glycol (meth) acrylate-polybutyl methacrylate copolymer, polypropylene glycol (meth) acrylate. -Polybutyl methacrylate copolymer, polyethylene glycol poly (meth) acrylate-methyl methacrylate-butyl methacrylate copolymer, polyethylene glycol poly (meth) acrylate-methyl methacrylate-butyl (meth) acrylate-styrene copolymer, polyethylene glycol poly (Meth) acrylate- (meth) acrylic acid-styrene copolymer, polypropylene glycol poly (meth) acrylate-2-ethoxyethyl (meth) acrylate To-styrene copolymer, polymethylene glycol (meth) acrylate-2-ethylhexyl acrylate-styrene copolymer polyethylene glycol (meth) acrylate-2-ethylhexyl acrylate-styrene copolymer and polyprolene glycol (meth) acrylate-2 -Ethylhexyl acrylate-styrene copolymer and the like.

  The polymer (B-1) is obtained by polymerizing the specific (meth) acrylate compound and, if necessary, the (meth) acrylate compound (1) and other copolymerizable monomers by a known method. . The molecular weight of the polymer (B-1) can be adjusted by appropriately adjusting the amount of the polymerization initiator, the polymerization temperature and the polymerization time.

  The preferred molecular weight of the polymer (B-1) is 10,000 to 10,000 in terms of polystyrene-reduced weight average molecular weight (hereinafter also simply referred to as “weight average molecular weight” or “Mw”) by gel permeation chromatography (GPC). It is 50,000, More preferably, it is 20,000-40,000.

<Polymer (B-2)>
As long as the polymer (B-2) used in the present invention is other than the polymer (B-1), resins other than those described above can be used without particular limitation. Of these, a (meth) acrylate polymer having no polyoxyalkylene moiety (hereinafter also simply referred to as “acrylic resin”) is preferable. When the inorganic powder-containing resin composition of the present invention contains an acrylic resin as the polymer (B-2), the inorganic powder-containing resin layer formed from the inorganic powder-containing resin composition is Exhibits excellent (heating) adhesion. Therefore, the transfer film produced by applying the inorganic powder-containing resin composition of the present invention on the support film is excellent in the transferability (heat adhesion to the substrate) of the inorganic powder-containing resin layer.

  As said acrylic resin, it has moderate adhesiveness, can bind inorganic powder (A), and is completely oxidized and removed by the baking process (400-600 degreeC) of an inorganic powder containing resin layer. A (co) polymer is preferred.

  As such an acrylic resin, a homopolymer of the (meth) acrylate compound (1), a copolymer containing two or more types of the (meth) acrylate compound (1), and the (meth) acrylate compound (1) Copolymers with other copolymerizable monomers are included.

  As the (meth) acrylate compound (1) used for the polymer (B-2), the same compound as the (meth) acrylate compound (1) used as the constituent unit of the polymer (B-1) described above is used. Used. For example, alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, phenoxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, cycloalkyl (meth) acrylate, benzyl (meth) acrylate, and tetrahydrofurfuryl (meth) acrylate Is mentioned. Specific examples will be shown below.

Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl. (Meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) ) Acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl Meth) acrylate, stearyl (meth) acrylate and isostearyl (meth) acrylate.

  Examples of the hydroxyalkyl (meth) acrylate include hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl. Examples include (meth) acrylate and 4-hydroxybutyl (meth) acrylate.

  Examples of the phenoxyalkyl (meth) acrylate include phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate.

  Examples of the alkoxyalkyl (meth) acrylate include 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate and 2- And methoxybutyl (meth) acrylate.

  Examples of the cycloalkyl (meth) acrylate include cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentadienyl ( Examples include meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl (meth) acrylate.

  Among these, alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate and cycloalkyl (meth) acrylate are preferably used, more preferably alkyl (meth) acrylate is used, and particularly preferably. Butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate are used.

  Examples of the other copolymerizable monomers are not particularly limited as long as they are compounds that can be copolymerized with the (meth) acrylate compound (1), but (meth) acrylic acid, vinylbenzoic acid, malein Examples thereof include unsaturated carboxylic acids such as acid and vinyl phthalic acid; vinyl group-containing radical polymerizable compounds such as vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methyl styrene, butadiene and isoprene.

  In the polymer (B-2) constituting the inorganic powder-containing resin composition of the present invention, the copolymer component derived from the (meth) acrylate compound represented by the general formula (1) is usually 70% by weight or more, Preferably it is 90 weight% or more.

  Specific examples of preferable acrylic resins include polymethyl methacrylate, polybutyl methacrylate and methyl methacrylate-butyl methacrylate copolymer, butyl methacrylate-2-ethylhexyl methacrylate-2-hydroxypropyl methacrylate copolymer, and the like.

  The molecular weight of the polymer (B-2) constituting the inorganic powder-containing resin composition of the present invention is 4,000 to 300,000, preferably 10,000 to 200 in terms of polystyrene-equivalent weight average molecular weight (Mw). , 000.

<Binder resin (B) content>
The polymer (B-1) is usually 0.01 to 50 parts by weight, preferably 0.05 to 30 parts by weight, more preferably 0.1 to 10 parts by weight based on 100 parts by weight of the inorganic powder (A). Part by weight is used. When the amount of the polymer (B-1) is less than the above range, the handling property at room temperature of the inorganic powder-containing resin layer and the transferability (heat adhesion to the substrate) of the inorganic powder-containing resin layer are poor. There is. Moreover, when there are more amounts of a polymer (B-1) than the said range, the adhesiveness and transferability at the time of transcription | transfer of the inorganic powder containing resin layer formed will become excessive, and it will become difficult to peel a support film. The handling property of the transfer film having the inorganic powder-containing resin layer may be inferior.

The binder resin (B-2) is used in an amount of 5 to 80 parts by weight, preferably 10 to 50 parts by weight, based on 100 parts by weight of the inorganic powder (A). If the amount of the binder resin (B-2) is too small, the inorganic powder may not be securely bound and held. Meanwhile, binder resin (B-2)
If the amount is too large, the firing process may take a long time, or the formed sintered body (for example, the dielectric layer) may not have sufficient strength and film thickness.

[Plasticity-imparting substance (C)]
The composition of the present invention may contain a plasticity-imparting substance (C) as an auxiliary agent for the binder resin (B) in order to give good flexibility to the transfer film. The inorganic powder-containing resin layer formed from the composition containing the plasticity-imparting substance (C) has sufficient flexibility.

  Examples of the plasticity-imparting substance (C) include a compound represented by the following general formula (2), a plasticizer selected from the group consisting of compounds represented by the following general formula (3), polypropylene glycol, ) A copolymerizable monomer such as an acrylate compound and a solvent which will be described later. Among them, those having a boiling point of 150 ° C. or higher are preferable. Such plasticity-imparting substances (C) may be used singly or in combination of two or more.

(In Formula (2), R ³ and R ⁶ each independently represent a monovalent chain hydrocarbon group having 1 to 30 carbon atoms, and R ⁴ and R ⁵ each independently represents a methylene group or A divalent chain hydrocarbon group having 2 to 30 carbon atoms is shown, s is an integer of 0 to 5, and t is an integer of 1 to 10.)
In the general formula (2), the monovalent chain hydrocarbon group represented by R ³ or R ⁶ is a linear or branched alkyl group (saturated group) or alkenyl group (unsaturated group), The chain hydrocarbon group has 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, and more preferably 4 to 10 carbon atoms. When the number of carbon atoms of the chain hydrocarbon group exceeds the above range, the solubility in a solvent described later is lowered, and it may be difficult to give good flexibility to the inorganic powder-containing resin layer.

The divalent chain hydrocarbon group represented by R ⁴ or R ⁵ is a linear or branched alkylene group (saturated group) or alkenylene group (unsaturated group).
Examples of the compound represented by the general formula (2) include dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2-ethylhexyl azelate, dibutyl sebacate and dibutyl diglycol adipate.

(In formula (3), R ⁷ represents a monovalent chain hydrocarbon group having 1 to 30 carbon atoms.)
In the general formula (3), the monovalent chain hydrocarbon group represented by R ⁷ is a linear or branched alkyl group (saturated group) or alkenyl group (unsaturated group). The carbon number of the hydrogen group is 1-30, preferably 2-20, more preferably 10-18.

Examples of the compound represented by the general formula (3) include propylene glycol monolaurate and propylene glycol monooleate.
When polypropylene glycol is used as the plasticizing substance (C), the weight average molecular weight (Mw) of the polypropylene glycol is preferably in the range of 200 to 3,000, and in the range of 300 to 2,000. It is particularly preferred. When Mw is less than 200, it may be difficult to form an inorganic powder-containing resin layer having high film strength on the support film, and in the step of transferring the resin layer from the support film to the glass substrate. When the support film is peeled from the resin layer that is heat-bonded to the glass substrate, the resin layer may cause cohesive failure. On the other hand, when Mw exceeds 3,000, an inorganic powder-containing resin layer having good heat adhesiveness with a glass substrate as a transfer target may not be obtained.

  Further, when the inorganic powder-containing resin layer is etched by sandblasting using the composition of the present invention in the FPD production method (II), a long chain having 10 or 12 carbon atoms is used as the plasticity-imparting substance (C). It is preferable to use an alkyl (meth) acrylate. When the plasticity-imparting substance (C) is used, sufficient flexibility as a dry film can be imparted, and since it can be easily decomposed or volatilized by post-baking described later, brittleness, which is an essential property for sandblasting, can be imparted. It is.

  Examples of the long-chain alkyl (meth) acrylate include isodecyl (meth) acrylate and lauryl (meth) acrylate, with isodecyl methacrylate and lauryl methacrylate being particularly preferred.

  The plasticity-imparting substance (C) is used in an amount of 3% by weight or more, preferably 4 to 15% by weight, based on all components excluding the solvent from the composition of the present invention. When the content of the plasticity-imparting substance (C) is too small, it may be difficult to give good flexibility to the transfer film to be formed.

[Photosensitive component (D)]
The composition of the present invention may be a photosensitive composition containing a polyfunctional (meth) acrylate (D-1) and a radiation polymerization initiator (D-2) as the photosensitive component (D). The polyfunctional (meth) acrylate (D-1) has a property of being polymerized by exposure to make the exposed part insoluble in alkali or hardly soluble in alkali.

<Multifunctional (meth) acrylate (D-1)>
Examples of the polyfunctional (meth) acrylate (D-1) include di (meth) acrylates of alkylene glycol such as ethylene glycol and propylene glycol;
Di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol;
Di (meth) acrylates of both terminal hydroxylated polymers such as both terminal hydroxy polybutadiene, both terminal hydroxy polyisoprene and both terminal hydroxy polycaprolactone;
Poly (meth) acrylates of trihydric or higher polyhydric alcohols such as glycerin, 1,2,4-butanetriol, trimethylolalkane, tetramethylolalkane, pentaerythritol and dipentaerythritol;
Poly (meth) acrylates of polyalkylene glycol adducts of trihydric or higher polyhydric alcohols;
Poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediol;
Mention of oligo (meth) acrylates such as polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate and spiraline resin (meth) acrylate Can do. These may be used alone or in combination of two or more. Among these, trimethylolpropane triacrylate, tripropylene glycol diacrylate and the like are particularly preferably used.

  The molecular weight of the polyfunctional (meth) acrylate (D-1) is preferably 100 to 2,000. The polyfunctional (meth) acrylate (D-1) is usually used in an amount of 5 to 50 parts by weight, preferably 10 to 40 parts by weight, based on 100 parts by weight of the inorganic powder (A).

<Radiation polymerization initiator (D-2)>
Examples of the radiation polymerization initiator (D-2) that can be used in the present invention include benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and 1-hydroxy. Cyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- [4 ′-(methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4 -Morpholinophenyl) -butan-1-one and 1- [9-ethyl-6- (2-methylbenzoyl) -9.H.-carbazol-3-yl] -ethane-1-one oxime-O-acetate, etc. A carbonyl compound of
Azo compounds such as azoisobutyronitrile and 4-azidobenzaldehyde, and azide compounds;
Organic sulfur compounds such as mercaptan disulfide;
Organic peroxides such as benzoyl peroxide, di-t-butyl peroxide, t-butyl hydroperoxide, cumene hydroperoxide and paraffin hydroperoxide;
1,3-bis (trichloromethyl) -5- (2'-chlorophenyl) -1,3,5-triazine and 2- [2- (2-furanyl) ethylenyl] -4,6-bis (trichloromethyl)- Trihalomethanes such as 1,3,5-triazine;
Examples include imidazole dimers such as 2,2′-bis (2-chlorophenyl) 4,5,4 ′, 5′-tetraphenyl 1,2′-biimidazole. These may be used alone or in combination of two or more.

  The radiation polymerization initiator (D-2) is usually 0.1 to 50.0 parts by weight, preferably 1.0 to 30 parts per 100 parts by weight of the polyfunctional (meth) acrylate (D-1). 0.0 part by weight is used.

<Solvent>
The composition of the present invention usually contains a solvent. As such a solvent, the affinity with inorganic powder and the solubility of the binder resin are good, and an appropriate viscosity can be imparted to the composition, and it can be easily removed by evaporation. It is preferable that it is possible.

  Particularly preferred solvents include ketones, alcohols and esters (hereinafter referred to as “specific solvents”) having a normal boiling point (boiling point at 1 atm) of 60 to 200 ° C.

Examples of the specific solvent include ketones such as methyl ethyl ketone, diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone;
alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol;
Ether based alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether;
Saturated aliphatic monocarboxylic acid alkyl esters such as n-butyl acetate and amyl acetate; lactic esters such as ethyl lactate and n-butyl lactate;
Mention may be made of ether esters such as methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate and ethyl 3-ethoxypropionate. Among these, methyl butyl ketone, cyclohexanone, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate and ethyl 3-ethoxypropionate are preferable. These specific solvents may be used alone or in combination of two or more.

  Examples of usable solvents other than the specific solvent include turpentine oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, and benzyl alcohol.

  From the viewpoint of maintaining the viscosity of the composition in a suitable range, the solvent is used in an amount of 5 to 50 parts by weight, preferably 10 to 40 parts by weight, based on 100 parts by weight of the inorganic powder (A). Moreover, the ratio of the specific solvent with respect to all the solvents is 50 weight% or more, Preferably it is 70 weight% or more. Moreover, it is preferable that the viscosity of the inorganic powder-containing resin composition is usually in the range of 2,000 to 200,000 cps (2-200 Pa · s).

[Various additives]
The composition of the present invention includes, as optional components, a dispersant, a development accelerator, an adhesion assistant, an antihalation agent, a leveling agent, a storage stabilizer, an antifoaming agent, an antioxidant, an ultraviolet absorber, a sensitizer and / or Alternatively, various additives such as a chain transfer agent may be contained.

[Preparation method of resin composition containing inorganic powder]
The inorganic powder-containing resin composition of the present invention comprises the inorganic powder (A), the binder resin (B), and, if necessary, a plasticizer (C), a polyfunctional (meth) acrylate (D-1). ), A radiation polymerization initiator (D-2), a solvent, and other components can be prepared by kneading using a kneading and dispersing machine such as a roll kneader, a mixer, a homomixer, or a sand mill.

In addition, it is preferable that the viscosity of the composition of this invention prepared as mentioned above is 0.3-30 Pa.s.
[Transfer film]
The transfer film of the present invention has an inorganic powder-containing resin layer obtained from an inorganic powder-containing resin composition containing an inorganic powder (A) and a binder resin (B) on a support film. And The inorganic powder-containing resin composition may be a photosensitive transfer film further containing a polyfunctional (meth) acrylate (D-1) and a radiation polymerization initiator (D-2). Moreover, the said inorganic powder containing resin composition may contain the plasticity provision substance (C).

The transfer film of the present invention may be one having a laminated film of a resist film and the above-mentioned inorganic powder-containing resin layer on a support film (laminated transfer film).
Moreover, you may have a cover film on the surface of an inorganic powder containing resin layer as needed.

Hereinafter, each component of the transfer film will be specifically described.
(1) Support film The transfer film of this invention has a support film which supports an inorganic powder containing resin layer. The support film is preferably a resin film having heat resistance and solvent resistance and flexibility. When the support film has flexibility, the inorganic powder-containing resin composition can be applied to the surface of the support film by a roll coater or a blade coater, and the resulting transfer film is wound into a roll. Can be stored or supplied in.

  Examples of the resin forming the support film include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, and other fluorine-containing resins, nylon, and cellulose.

  The thickness of the support film is 20 to 100 μm. Moreover, it is preferable that the surface of the support film is subjected to a mold release treatment, whereby the support film can be easily peeled off in the transfer step to the glass substrate.

(2) Cover film In the transfer film of the present invention, a cover film may be provided on the surface of the resin layer in order to protect the surface of the inorganic powder-containing resin layer. This cover film is preferably a flexible resin film, whereby the obtained transfer film can be stored or supplied in a rolled state.

  Examples of the resin constituting the cover film include a polyethylene terephthalate film, a polyethylene film, and a polyvinyl alcohol film.

  The cover film has a thickness of 20 to 100 μm. Moreover, the surface of the cover film may be subjected to a release treatment, and the adhesion with the inorganic powder-containing resin layer is preferably smaller than that of the support film.

(3) Inorganic powder-containing resin layer In general, the inorganic powder-containing resin layer is formed by applying an inorganic powder-containing resin composition onto a support film, drying the resulting coating film, and removing all or part of the solvent. It is formed by removing.

  As a method of applying the inorganic powder-containing resin composition on the support film, a method that can form a coating film with high film thickness uniformity and a large film thickness (for example, 10 μm or more) with high efficiency. Preferably, there are a coating method using a roll coater, a coating method using a blade coater, a coating method using a curtain coater, a coating method using a wire coater, and the like. The film thickness of the inorganic powder-containing resin layer is usually 10 to 300 μm although it depends on the height of the panel member to be formed.

  The drying condition of the coating film is, for example, about 50 to 150 ° C. for about 0.5 to 30 minutes, and the residual ratio of the solvent after drying (content in the inorganic powder-containing resin layer) is usually 2 wt. %.

(4) Resist layer The resist film used in the laminated transfer film of the present invention is usually formed by applying a resist composition containing a binder polymer, a polyfunctional monomer and a radiation polymerization initiator on a support film. The

  In the case of an alkali development type, the binder polymer used in the resist composition must be an alkali-soluble resin, and contains an ethylenically unsaturated carboxyl group-containing monomer having at least one carboxyl group in the molecule. And a carboxyl group-containing copolymer obtained by polymerizing a monomer composition containing a copolymer and a copolymerizable monomer copolymerizable with the carboxyl group-containing monomer.

  The copolymerization ratio of the carboxyl group-containing monomer in the binder polymer is 5 to 50% by weight, preferably 10 to 40% by weight, based on the total amount of the monomers. If the copolymerization ratio of the carboxyl group-containing monomer is lower than the above range, the resulting resist composition tends to be less soluble in an alkaline developer. On the other hand, when the copolymerization ratio of the carboxyl group-containing monomer exceeds the above range, the resist pattern tends to fall off from the inorganic powder paste layer during development.

  A copolymer having a constitutional unit derived from the carboxyl group-containing monomer has alkali solubility, and in particular, a copolymer having the constitutional unit in an amount within the above range has excellent solubility in an alkali developer. Showing gender. Therefore, by using such a copolymer as a binder polymer in the resist composition, the amount of undissolved material in the alkaline developer is essentially reduced, and the background is stained in places other than the resist pattern forming portion of the substrate in the development process. Moreover, generation | occurrence | production of a film residue etc. can be reduced.

  In addition, a resist pattern obtained from a resist composition containing the above copolymer as a binder polymer does not excessively dissolve in an alkaline developer, and has excellent adhesion to an inorganic powder-containing resin layer. , And hardly fall off from the resin layer.

Examples of the carboxyl group-containing monomer include (i) unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid, (ii) unsaturated dicarboxylic acids such as itaconic acid, maleic acid and fumaric acid, and ( iii) Other unsaturated carboxylic acids. These may be used alone or in combination of two or more.

Further, as the copolymerizable monomer, for example,
Aromatic vinyl compounds such as styrene, α-methylstyrene and vinyltoluene;
Such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, benzyl (meth) acrylate and cyclohexyl (meth) acrylate. Saturated carboxylic acid alkyl esters;
Unsaturated alkylaminoalkyl esters such as aminoethyl acrylate;
Unsaturated carboxylic acid glycidyl esters such as glycidyl (meth) acrylate;
Carboxylic acid vinyl esters such as vinyl acetate and vinyl propionate;
Vinyl cyanide compounds such as (meth) acrylonitrile and α-chloroacrylonitrile;
Aliphatic conjugated dienes such as 1,3-butadiene and isoprene;
Examples thereof include macromonomers such as polystyrene having a (meth) acryloyl group at the terminal, polymethyl (meth) acrylate, polybutyl (meth) acrylate, and polysilicone. These can be used alone or in combination of two or more.

  The binder polymer has an Mw of 3,000 to 300,000, preferably 5,000 to 200,000. By using a binder polymer having such a molecular weight, a highly developable resist composition can be obtained, whereby a resist pattern having sharp pattern edges can be formed, and a panel member having a uniform pattern Can be formed.

  As the polyfunctional monomer used in the resist composition, the polyfunctional (meth) acrylate (D-1) described above is preferably used. The polyfunctional monomer is usually used in an amount of 5 to 100 parts by weight, preferably 10 to 70 parts by weight, based on 100 parts by weight of the binder polymer. If the amount of the polyfunctional monomer is lower than the above range, the resist pattern strength tends to be insufficient, and if it exceeds the above range, the alkali resolution is lowered or the portion other than the resist pattern forming portion. Soiling and film residue may occur.

The radiation polymerization initiator (D-2) mentioned above is mentioned as a radiation polymerization initiator used for the said resist composition.
The resist composition usually contains a solvent in order to impart appropriate fluidity or plasticity or good film-forming properties. Such a solvent is not particularly limited, and the above-described specific solvents are preferably used.

  In addition, the resist composition includes, as optional components, a development accelerator, an adhesion assistant, an antihalation agent, a storage stabilizer, an antifoaming agent, an antioxidant, an ultraviolet absorber, a filler, a phosphor, a pigment, and / or Various additives such as dyes may be contained.

  The laminated transfer film is formed by applying a resist composition on a support film or an inorganic powder-containing resin layer to form a resist film, and applying the composition of the present invention on the resist film to contain an inorganic powder. It is obtained by forming a resin layer. In addition, the laminated transfer film has an inorganic powder-containing resin layer formed on a support film or an inorganic powder-containing resin layer, and a resist film is formed on a protective film separately from the resin film surface. It can also be suitably formed by a method in which the resist film surface is superimposed and pressure-bonded.

As a method of applying and drying the resist composition, the above-described method of applying and drying the inorganic powder-containing resin composition can be used.
The thickness of the resist film to be formed is preferably 5 to 15 μm.

The transfer film of the present invention is usually stored in a rolled state.
[Method of manufacturing FPD]
The following aspects are mentioned as a manufacturing method of FPD of this invention.
[1] A dielectric that is a panel member by a method comprising a step of transferring the inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate and a step of firing the transferred inorganic powder-containing resin layer. A method of forming a layer (FPD manufacturing method (I)).
[2] A step of transferring the inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate, a step of forming a resist pattern on the transferred inorganic powder-containing resin layer, and an inorganic powder-containing resin layer A dielectric layer, an electrode, a barrier rib, a phosphor, a resistor, and a color filter, which are panel members, by a method including a step of etching the substrate to form a pattern corresponding to the resist pattern and a step of baking the pattern And a method of forming at least one selected from a black matrix (FPD production method (II)).
[3] A step of transferring the laminated film of the laminated transfer film onto the substrate so that the inorganic powder-containing resin layer is in contact with the substrate, and exposing the resist film in the transferred laminated film to expose the latent resist pattern. A step of forming an image, a step of developing a resist film to reveal a resist pattern, a step of etching an inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern, and baking the pattern A method of forming at least one selected from a dielectric layer, an electrode, a partition, a phosphor, a resistor, a color filter, and a black matrix as a panel member (FPD production method (III)) .
[4] A step of transferring an inorganic powder-containing resin layer of a photosensitive transfer film onto a substrate, a step of exposing the transferred inorganic powder-containing resin layer to form a latent image of a pattern, and the inorganic A dielectric layer, an electrode, a partition, a phosphor, a resistor, and a color filter, which are panel members, by a method including a step of developing a powder-containing resin layer to form a pattern and a step of firing the pattern And a method of forming at least one selected from black matrices (FPD production method (IV)).
[5] A step of transferring the inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate, a step of baking the transferred inorganic powder-containing resin layer to form an inorganic film, and the inorganic film A dielectric layer, an electrode, a partition, a phosphor, a resistor, which are panel members, by a method including a step of forming a resist pattern on the substrate and a step of etching the inorganic film to form a pattern corresponding to the resist pattern. A method of forming at least one selected from a color filter and a black matrix (FPD production method (V)).

Hereinafter, each aspect will be described.
<Method for manufacturing FPD (I)>
An example of the transfer step in the FPD manufacturing method (I) is as follows.

(1) The transfer film wound in a roll shape is cut into a size corresponding to the area of the substrate.
(2) The cover film is peeled off as necessary from the surface of the inorganic powder-containing resin layer in the cut transfer film, and then the transfer film is overlaid so that the surface of the inorganic powder-containing resin layer is in contact with the surface of the substrate.

(3) A heating roller is moved on the transfer film superimposed on the substrate and thermocompression bonded.
(4) The support film is peeled and removed from the inorganic powder-containing resin layer fixed to the substrate by thermocompression bonding.

By the operation as described above, the inorganic powder-containing resin layer on the support film is transferred onto the substrate. As transfer conditions at this time, for example, the surface temperature of the heating roller is 60 to 120 ° C., the roll pressure by the heating roller is 1 to 5 kg / cm ^2, and the moving speed of the heating roller is 0.2 to 1.
0.0 m / min. Such an operation (transfer process) can be performed by a laminator apparatus. In addition, the board | substrate may be preheated and can be 40-100 degreeC as preheating temperature, for example.

The inorganic powder-containing resin layer transferred and formed on the surface of the substrate is fired to form an inorganic sintered body (dielectric layer). Examples of the firing method include a method in which the substrate on which the inorganic powder-containing resin layer is transferred and formed is placed in a high-temperature atmosphere. By the baking treatment, the organic substance contained in the inorganic powder-containing resin layer is decomposed and removed, and the inorganic powder is melted and sintered. The firing temperature varies depending on the melting temperature of the substrate and the constituent materials in the inorganic powder-containing resin layer, but is, for example, 300 to 800 ° C, preferably 400 to 620 ° C.

<Method for Producing FPD (II)>
The FPD production method (II) includes a step of transferring the inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate, and a step of forming a resist pattern on the transferred inorganic powder-containing resin layer. And a step of etching the inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern, and a step of baking the pattern.

  Hereinafter, a method of forming “partition walls” which are constituent elements of the FPD on the surface of the back substrate will be described. In this method, (1) an inorganic powder-containing resin layer transfer step, (2) a resist pattern forming step, (3) an inorganic powder-containing resin layer etching step, and (4) an inorganic powder-containing step A partition wall is formed on the surface of the substrate by a process including a resin pattern baking process.

In the present invention, the mode of transferring the inorganic powder-containing resin layer onto the substrate is not limited to the mode of transferring onto the surface of the glass substrate, but also the mode of transferring onto the surface of the dielectric layer. included.
(1) Transfer process of inorganic powder-containing resin layer The transfer process of the inorganic powder-containing resin layer is the same as the transfer process in the FPD manufacturing method (I) described above.
(2) Resist pattern formation step The method for forming a resist pattern on the inorganic powder-containing resin layer is not particularly limited, but preferably the resist pattern is formed through steps of resist film formation, exposure and development. The

  The resist film may be formed by applying the above-described resist composition on the inorganic powder-containing resin layer and drying it, or by applying the resist composition on a support film and drying it. A transfer film may be used to transfer and form a resist film on the inorganic powder-containing resin layer. However, considering the simplicity of the process, formation by transfer is preferred.

  In the exposure of the resist film, the surface of the formed resist film is selectively irradiated (exposed) with radiation such as ultraviolet rays through an exposure mask to form a latent image of the resist pattern. The ultraviolet irradiation apparatus used in the exposure is not particularly limited, and an ultraviolet irradiation apparatus generally used in a photolithography method, an exposure apparatus used in manufacturing a semiconductor and a liquid crystal display device, and the like. Can be mentioned. Further, exposure may be performed by drawing laser light or the like without using an exposure mask. In addition, it is preferable to perform an exposure process in the state which does not peel the support film coat | covered on the resist film, and to peel after exposure.

  The development of the resist film is a process for revealing a resist pattern (latent image) in the exposed resist film. As development processing conditions, depending on the type of resist film, etc., the type of developer, composition, concentration, development time, development temperature, development method (eg, dipping method, rocking method, shower method, spray method or paddle method) ) Or a developing device can be selected as appropriate. By this development process, a resist pattern (pattern corresponding to an exposure mask) composed of a resist remaining portion and a resist removal portion is formed.

This resist pattern acts as an etching mask in the next step (etching step of the inorganic powder-containing resin layer), and the constituent material (photocured resist) of the resist residual portion is the inorganic powder-containing resin layer. It is necessary that the dissolution rate in the developer used in the next step is lower than that of the constituent material.
(3) Inorganic powder-containing resin layer etching step In this step, the inorganic powder-containing resin layer is etched to form a partition pattern layer corresponding to the resist pattern. That is, the part corresponding to the resist removal part of a resist pattern is selectively removed among inorganic powder containing resin layers. And the predetermined part in an inorganic powder containing resin layer is removed completely, and a dielectric material layer is exposed. Thereby, the inorganic powder containing resin pattern comprised from the resin layer residual part and the resin layer removal part is formed.

The etching method can be appropriately selected according to the type of the inorganic powder-containing resin layer, but alkali development or sand blasting is preferably used.
When the alkali development treatment is performed, it is preferable to continuously develop the resist film and the inorganic powder-containing resin layer under the same development conditions using the developer used for developing the resist film. The type, composition, concentration, processing time, processing temperature, processing method (for example, dipping method, rocking method, shower method, spraying method or paddle method) or processing apparatus of the developing solution can be selected as appropriate. The resist residual portion constituting the resist pattern is gradually dissolved during the development process and may be completely removed at the stage where the inorganic powder-containing resin pattern is formed (at the end of the development process). preferable. Even if a part or all of the remaining resist portion remains after the etching (development) process, the remaining resist portion is removed in the next baking step.

When performing the sandblasting treatment, the inorganic powder-containing resin layer is transferred to the inorganic powder-containing resin layer using a transfer film containing plasticity-imparting substance (C), in particular, a long-chain alkyl (meth) acrylate, A post-bake treatment is preferably performed after the transfer. By performing post-baking, the residual solvent and plasticity-imparting substance (C) in the resin layer can be removed, and sandblasting (brittleness) can be imparted to the resin layer. Here, the post-bake treatment conditions are, for example, a treatment temperature of 100 to 300 ° C. and a treatment time of 15 to 120 minutes. Thereafter, a resist pattern is formed on the resin layer, and a pattern of a desired form is formed by sandblasting and removing the exposed portion of the inorganic powder-containing resin layer mainly after the post-baking process with a sandblasting apparatus. To do. Even if a part or all of the remaining resist portion remains after the etching process, the remaining resist portion is removed in the next baking step.
(4) Inorganic powder-containing resin pattern firing step In this step, the inorganic powder-containing resin pattern is fired to form partition walls. As a result, in the panel material in which the organic material in the resin layer remaining portion is burned out to form the partition and the partition is formed on the surface of the dielectric layer, the space defined by the partition (derived from the resin layer removal portion) Space) is a plasma action space.

The temperature for the baking treatment needs to be a temperature at which the organic substance is burned off, and is usually 400 to 600 ° C. The firing time is usually 10 to 90 minutes.
<Method for producing FPD (III)>
The FPD production method (III) is a preferred embodiment in the FPD production method (II), particularly a preferred embodiment in the case where the resist film and the inorganic powder-containing resin layer are etched by alkali development.

In the FPD manufacturing method (III), a laminated film of a resist film and an inorganic powder-containing resin layer is transferred onto a substrate. An example of the transfer process is as follows.
After the cover film of the transfer film is peeled off, the transfer film is superposed on the surface of the dielectric layer so that the surface of the inorganic powder-containing resin layer is in contact, and this transfer film is thermocompression bonded with a heating roller or the like. As a result, the laminated film of the inorganic powder-containing resin layer and the resist film is transferred and adhered to the surface of the dielectric layer. As the transfer conditions, for example, the surface temperature of the heating roller is 80 to 140 ° C., the roller pressure by the heating roller is 1 to 5 kg / cm ^2, and the moving speed of the heating roller is 0.1 to 10.0 m / min. Moreover, the glass substrate may be preheated and can be 40-100 degreeC as preheat temperature, for example.

  The process after the laminated film transfer in the FPD manufacturing method (III) is performed in steps (2) to (4) in the FPD manufacturing method (II) (particularly, both the resist film and the inorganic powder-containing resin layer are alkali-developed. ).

<Method for producing FPD (IV)>
In the FPD production method (IV), an inorganic powder-containing resin layer constituting the photosensitive transfer film of the present invention is transferred onto a substrate, and the resin layer is exposed to form a latent image of a pattern. The layer is developed to form a pattern, and the pattern is fired to form a panel member selected from a dielectric layer, barrier ribs, electrodes, resistors, phosphors, color filters, and a black matrix. .

  In this method, for example, when a partition wall is formed, after the “transfer process of the inorganic powder-containing resin layer” in the FPD manufacturing method (II), the “resist film exposure process” and the “resist film development process” Then, the inorganic powder-containing resin pattern is formed by the method and conditions according to the above, and then the partition wall is formed on the surface of the substrate by the “calcination step of the inorganic powder-containing resin pattern”.

<Method for manufacturing FPD (V)>
In the FPD manufacturing method (V), the inorganic powder-containing resin layer constituting the transfer film of the present invention is transferred onto a substrate, the resin layer is baked to form an inorganic film, and a resist is formed on the inorganic film. A panel material such as a partition is formed by forming a pattern and etching the inorganic film to form an inorganic film pattern corresponding to the resist pattern.

  In this method, for example, when a partition wall is formed, after the “transfer process of the inorganic powder-containing resin layer” in the FPD manufacturing method (II), the “firing process of the inorganic powder-containing resin pattern” is performed first. An inorganic film is formed, and a resist pattern is formed on the inorganic film under the conditions in accordance with the “resist pattern forming step”. Thereafter, the inorganic film is etched using the resist pattern as a mask, thereby the surface of the substrate. A partition wall is formed. Note that the resist remaining on the surface of the partition wall is usually removed using a remover or the like.

  As the etching solution for the inorganic film, an acid solution such as nitric acid, hydrochloric acid and sulfuric acid is usually used, and nitric acid is particularly preferably used. As a density | concentration of etching liquid, it is 0.1 to 10 weight% normally, Preferably it is 0.2 to 2 weight%. The etching step is preferably performed by spraying an etching solution onto the inorganic film by spraying or the like. For example, the etching step is performed at a spray pressure of 1 to 5 MPa, a temperature of 20 to 60 ° C., and an etching time of 5 to 20 minutes.

〔Example〕
EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not limited to these Examples. In the following, “part” means “part by weight”.

<Synthesis Example 1>
40 parts of polyethylene glycol methacrylate (hereinafter also referred to as “PEGMA”), 40 parts of 2-ethylhexyl acrylate (hereinafter also referred to as “EHA”), 20 parts of styrene (hereinafter also referred to as “ST”) and N, N 0.75 part of '-azobisisobutyronitrile was charged into an autoclave equipped with a stirrer and stirred at room temperature in a nitrogen atmosphere until uniform. After stirring, the mixture is polymerized at 80 ° C. for 3 hours, further added with 0.25 part of N, N′-azobisisobutyronitrile and polymerized for 1 hour, and the polymerization reaction is continued at 100 ° C. for 1 hour, and then to room temperature. Upon cooling, a polymer solution was obtained. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the polymer (B-1) (hereinafter referred to as “resin (1)”) precipitated from the polymer solution was 30,000.

Resins (2) to (8) were synthesized in the same manner as in Synthesis Example 1 except that the monomer was used in the amount shown in Table 1 in Synthesis Example 1.
<Synthesis Example 2>
20 parts of PEGMA, 40 parts of EHA, 40 parts of ST and 1.5 parts of N, N′-azobisisobutyronitrile were charged into an autoclave equipped with a stirrer and stirred at room temperature in a nitrogen atmosphere until uniform. After stirring, the mixture is polymerized at 90 ° C. for 3 hours, 0.5 part of N, N′-azobisisobutyronitrile is further added for polymerization for 1 hour, and the polymerization reaction is continued at 100 ° C. for 1 hour, and then to room temperature. Upon cooling, a polymer solution was obtained. The obtained polymer solution had a polymerization rate of 96%, and the Mw of the resin (9) precipitated from this polymer solution was 10,000.
<Synthesis Example 3>
20 parts of PEGMA, 40 parts of EHA, 40 parts of ST and 0.5 part of N, N′-azobisisobutyronitrile were charged into an autoclave equipped with a stirrer and stirred at room temperature in a nitrogen atmosphere until uniform. After stirring, the mixture is polymerized at 75 ° C. for 4 hours, further added with 0.25 part of N, N′-azobisisobutyronitrile, polymerized for 2 hours, and the polymerization reaction is continued at 100 ° C. for 1 hour. Upon cooling, a polymer solution was obtained. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the resin (10) precipitated from this polymer solution was 50,000.

  The results are shown in Table 1.

[Example 1]
(1) Preparation of glass paste composition (inorganic powder-containing resin composition) As glass powder (inorganic powder) (A), a composition of 70% by weight of lead oxide, 10% by weight of boron oxide, and 20% by weight of silicon oxide was prepared. PbO—B ₂ O ₃ —SiO ₂ based mixture (softening point 5
100 parts at 100 ° C., 10 parts of resin (1) as polymer (B-1), and butyl methacrylate / 2-ethylhexyl methacrylate / 2-hydroxypropyl methacrylate copolymer (weight ratio) as polymer (B-2) : 30/60/10 and Mw: 100,000) 20 parts, as plasticizer (C), bis (2-ethylhexyl) azelate (hereinafter referred to as “
Also referred to as “DOAz”. ) 3 parts and 35 parts of propylene glycol monomethyl ether (hereinafter also referred to as “PGME”) as a solvent were kneaded using a disperser to prepare a composition having a viscosity of 3 Pa · s.
(2) Production and evaluation of transfer film (flexibility and handleability)
The composition prepared in (1) above was applied by using a blade coater on a support film (width 400 mm, length 30 m, thickness 38 μm) made of polyethylene terephthalate (PET) that had been subjected to release treatment in advance. The coating film was dried at 100 ° C. for 5 minutes to remove the solvent, thereby forming an inorganic powder-containing resin layer having a thickness of 50 μm on the support film. Next, a cover film (width 400 mm, length 30 m, thickness 25 μm) made of PET that has been subjected to mold release treatment is pasted on the inorganic powder-containing resin layer, thereby having a configuration as shown in FIG. A transfer film of the present invention was produced.

  The obtained transfer film was flexible and could be easily wound up into a roll. Moreover, even if this transfer film was bent, the surface of the inorganic powder-containing resin layer was not cracked (bent crack), and the resin layer had excellent flexibility.

Further, after peeling the cover film from the transfer film and overlaying the transfer film without applying pressure so that the surface of the inorganic powder-containing resin layer is in contact with the surface of the glass substrate, the transfer film is I peeled it off the surface of the glass substrate. As a result, the resin layer exhibits moderate adhesiveness to the glass substrate, and the transfer film can be peeled off without causing cohesive failure of the resin layer. Property) was good.
(3) Transfer of inorganic powder-containing resin layer After peeling the cover film from the transfer film obtained in (2) above, the inorganic powder is applied to the surface of the glass substrate for 20-inch panels (fixing surface of the bus electrode). The transfer film was overlaid so that the surface of the containing resin layer was in contact, and the transfer film was thermocompression bonded with a heating roll. As the pressure bonding conditions, the surface temperature of the heating roll is 110 ° C., and the roll pressure is 3 kg / cm ^2.
The moving speed of the heating roll was 1 m / min.

After completion of the thermocompression treatment, the support film was peeled and removed from the inorganic powder-containing resin layer fixed (heat bonded) to the surface of the glass substrate to complete the transfer of the resin layer.
In this transfer step, the inorganic powder-containing resin layer did not cause cohesive failure when the support film was peeled off, and the resin layer had a sufficiently large film strength. Furthermore, the transferred inorganic powder-containing resin layer had good adhesion to the surface of the glass substrate.
(4) Baking process of inorganic powder-containing resin layer As described above, the inorganic powder-containing resin fixed (heat bonded) to the surface of the glass substrate is baked in a baking furnace in a temperature atmosphere of 590 ° C. for 20 minutes. Processed. As a result, a panel material in which a dielectric having a thickness of 40 μm was formed on the surface of the glass substrate could be obtained.

[Examples 2 to 12]
In Example 1, a composition was prepared in the same manner as in Example 1 except that the polymer (B-1) was used in the amounts and amounts shown in Table 2, and a transfer film and a panel material were produced.

[Comparative Example 1]
In Example 1, an inorganic powder-containing resin composition was prepared in the same manner as in Example 1 except that the polymer (B-1) was not used, and a transfer film was produced, baked, and evaluated.

[Comparative Example 2]
20 parts of polyethylene glycol methacrylate, 40 parts of 2-ethylhexyl acrylate, 40 parts of styrene and 0.40 part of N, N′-azobisisobutyronitrile are charged into an autoclave equipped with a stirrer until uniform at room temperature in a nitrogen atmosphere. Stir. After stirring, the mixture is polymerized at 75 ° C. for 5 hours. Further, 0.25 part of N, N′-azobisisobutyronitrile is added and polymerized for 3 hours. The polymerization reaction is continued at 100 ° C. for 1 hour, and then to room temperature. Upon cooling, a polymer solution was obtained. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as “resin (11)”) was 70,000.

  In Example 1, an inorganic powder-containing resin composition was prepared in the same manner as in Example 1 except that instead of the resin (1), the resin (11) was used as the polymer (B-1). The transfer film was prepared, baked and evaluated.

[Comparative Example 3]
40 parts of polyethylene glycol methacrylate, 40 parts of 2-ethylhexyl acrylate, 20 parts of styrene and 5.0 parts of N, N′-azobisisobutyronitrile are charged into an autoclave equipped with a stirrer until uniform at room temperature in a nitrogen atmosphere. Stir. After stirring, the mixture is polymerized at 90 ° C. for 1 hour, 1.0 part of N, N′-azobisisobutyronitrile is further added for polymerization for 1 hour, and the polymerization reaction is continued at 100 ° C. for 1 hour. Upon cooling, a polymer solution was obtained. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as “resin (12)”) was 1,000.

  In Example 1, an inorganic powder-containing resin composition was prepared in the same manner as in Example 1 except that instead of the resin (1), the resin (12) was used as the polymer (B-1). The transfer film was prepared, baked and evaluated.

[Comparative Example 4]
40 parts of polyethylene glycol methacrylate, 40 parts of 2-ethylhexyl acrylate, 20 parts of styrene and 0.20 part of N, N′-azobisisobutyronitrile are charged into an autoclave equipped with a stirrer until uniform at room temperature in a nitrogen atmosphere. Stir. After stirring, polymerization is carried out at 75 ° C. for 8 hours, and further, 0.25 part of N, N′-azobisisobutyronitrile is added for polymerization for 3 hours. The polymerization reaction is continued at 100 ° C. for 1 hour, and then to room temperature. Upon cooling, a polymer solution was obtained. The resulting polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter referred to as “resin (13)”) was 200,000.

  In Example 1, an inorganic powder-containing resin composition was prepared in the same manner as in Example 1 except that instead of the resin (1), the resin (13) was used as the polymer (B-1). The transfer film was prepared, baked and evaluated.

[Comparative Example 5]
In Example 1, an inorganic powder-containing resin composition was prepared in the same manner as in Example 1 except that 0.005 parts by weight of the resin (1) was used as the polymer (B-1). Fabrication, firing and evaluation were performed.

[Comparative Example 6]
In Example 1, an inorganic powder-containing resin composition was prepared in the same manner as in Example 1 except that 100 parts by weight of the resin (1) was used as the polymer (B-1). Firing and evaluation were performed.

<Evaluation method of transfer film>
The method for evaluating the transfer film of the present invention is shown below.
(1) Flexibility When the transfer film was folded, the surface of the inorganic powder-containing resin layer where no cracks (bending cracks) occurred was marked with ◯, and when the cracked film was marked with x.
(2) Storage stability The paste before film coating was stored at 5 ° C., and what was not phase-separated even after 30 days or more was passed, and what was phase-separated after 10 days or more but less than 30 days was Δ, Those that were phase-separated in less than 10 days were marked with x.
(3) Transparency The linear transmittance (measurement wavelength 550 nm) of the dielectric layer formed on the fired panel was measured with a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation). A sample having a transmittance of 70% or more was evaluated as “◯”, a sample having a transmittance of more than 65% and less than 70% was evaluated as “Δ”, and a sample having a transmittance of less than 65% was evaluated as “X”.
(4) Transparency (stability)
When 10 panels are fired, the difference between the maximum value and the minimum value of the above linear transmittance is less than 2%, more than 2%, less than 10%, more than 10% X.
(5) Surface smoothness Measured using a non-contact three-dimensional shape measuring device (model number: NH-3 Mitaka Kogyo Co., Ltd.) under the conditions of a measurement range of 500 μm × 500 μm and a measurement pitch of 10 μm. Rz) was defined as the surface roughness. The surface roughness was performed based on the following evaluation criteria.
○: Less than 0.01 μm Δ: 0.01 μm or more and less than 0.1 μm x: 0.1 μm or more The results of Examples 1-12 and Comparative Examples 1-6 are shown in Tables 2-3.

[Example 13]
(1) Preparation of glass paste composition (inorganic powder-containing composition) As glass powder (inorganic powder) (A), a PbO—B ₂ O ₃ —SiO ₂ mixture (softening point 455 ° C., average particle diameter) 2.6 μm) 100 parts, binder resin (B-1) as resin (1) 10 parts, binder resin (B-2) as butyl methacrylate / 2-ethylhexyl methacrylate / 2-hydroxypropyl methacrylate copolymer ( Using a disperser, 20 parts by weight: 30/60/10, Mw: 100,000), 3 parts of bis (2-ethylhexyl) azelate as plasticizing substance (C), and 35 parts of propylene glycol monomethyl ether as solvent A composition having a viscosity of 3 Pa · s was prepared by kneading.
(2) Production and evaluation of transfer film (flexibility and handling)
In the same manner as in Example 1, a transfer film was produced and evaluated for flexibility and handleability. (3) Transfer of inorganic powder-containing resin layer The inorganic powder-containing resin layer was transferred in the same manner as in Example 1 except that the surface temperature of the heating roll was 90 ° C when the transfer film was thermocompression bonded. It was.
(4) Baking process of inorganic powder-containing resin layer The inorganic powder-containing resin layer was baked in the same manner as in Example 1 except that the temperature in the baking furnace was set to 520 ° C. The obtained dielectric layer had high transparency and high surface smoothness.

[Example 14]
(1) Preparation of glass paste composition (inorganic powder-containing composition) As glass powder (inorganic powder) (A), a PbO—B ₂ O ₃ —SiO ₂ mixture (softening point 455 ° C., average particle diameter) A composition was prepared in the same manner as in Example 1 except that 3.9 μm) was used. The viscosity of this composition was 3 Pa · s.

  When the same operations as in (2) to (4) of Example 13 were performed, the transfer film of the inorganic powder-containing organic composition showed sufficient transferability with respect to the glass substrate, and also in handleability. It was good. The obtained dielectric layer had high transmittance and high surface smoothness.

[Example 15]
(1) Preparation of glass paste composition (inorganic powder-containing composition) As glass powder (inorganic powder) (A), a PbO—B ₂ O ₃ —SiO ₂ mixture (softening point 455 ° C., average particle diameter) A composition was prepared in the same manner as in Example 1 except that 2.0 μm) was used. The viscosity of this composition was 3 Pa · s.

  When the same operations as in (2) to (4) of Example 13 were performed, the transfer film of the inorganic powder-containing organic composition showed sufficient transferability with respect to the glass substrate, and also in handleability. It was good. The obtained dielectric layer had high transmittance and high surface smoothness.

[Example 16]
(1) Preparation of glass paste composition (inorganic powder-containing composition) As glass powder (inorganic powder) (A), a PbO—B ₂ O ₃ —SiO ₂ -based mixture (softening point 505 ° C., average particle diameter) A composition was prepared in the same manner as in Example 1 except that 2.6 μm) was used. The viscosity of this composition was 3 Pa · s.

  When the same operations as in (2) to (4) of Example 13 were performed, the transfer film of the inorganic powder-containing organic composition showed sufficient transferability with respect to the glass substrate, and also in handleability. It was good. The obtained dielectric layer had high transmittance and high surface smoothness.

[Example 17]
(1) Preparation of Glass Paste Composition (Inorganic Powder-Containing Composition) As a glass powder (inorganic powder) (A), a PbO—B ₂ O ₃ —SiO ₂ type mixture (softening point 410 ° C., average particle diameter) A composition was prepared in the same manner as in Example 1 except that 2.6 μm) was used. The viscosity of this composition was 3 Pa · s.

  When the same operations as in (2) to (4) of Example 13 were performed, the transfer film of the inorganic powder-containing organic composition showed sufficient transferability with respect to the glass substrate, and also in handleability. It was good. The obtained dielectric layer had high transmittance and high surface smoothness.

[Comparative Example 7]
(1) Preparation of glass paste composition (inorganic powder-containing composition) As glass powder (inorganic powder) (A), a PbO—B ₂ O ₃ —SiO ₂ mixture (softening point 455 ° C., average particle diameter) 2.6 μm) as 100 parts, as polymer (B-2), as butyl methacrylate / 2-ethylhexyl methacrylate copolymer (weight ratio: 50/50, Mw: 100,000), as plasticizing substance (C) A composition having a viscosity of 3 Pa · s was prepared by kneading 3 parts of bis (2-ethylhexyl) azelate and 35 parts of propylene glycol monomethyl ether as a solvent using a disperser.

When the operations of (2) to (4) of Example 13 were performed, the dielectric layer obtained from the transfer film of the inorganic powder-containing organic composition had poor surface smoothness and poor transparency. there were.
[Example 18]
(1) Preparation of Inorganic Powder-Containing Resin Composition As inorganic powder (A), 100 parts of silver powder (average particle size 2.2 μm, specific surface area 0.5 cm ² / g, tap density 4.6 g / cm ³ ) Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass frit (
Average particle diameter 3 μm, irregular shape, softening point 520 ° C., thermal expansion coefficient α ³⁰⁰ = 87 × 10 ⁻⁷ / ° C. 3 parts, polymer (B-1) as resin (1) 10 parts, polymer (B -2) as methacrylic acid / succinic acid mono (2-methacryloyloxyethyl) / methacrylic acid 2-hydroxypropyl / methacrylic acid n-butyl copolymer (weight ratio 20/15/25/40 and weight average molecular weight 90). , 000) 15 parts, 10 parts of dipentaerythritol hexaacrylate as the polyfunctional monomer (D-1) and 9 parts of propylene glycol monomethyl ether acetate as the solvent are kneaded using a disperser, and the viscosity is 3,400 cp. Certain inventive compositions were prepared.
(2) Manufacture of transfer film A blade on a support film (width 400 mm, length 30 m, thickness 38 μm) made of polyethylene terephthalate (PET), which has been subjected to release treatment in advance, with the composition of the present invention prepared in (1) above. The coating was applied using a coater, and the formed coating film was dried at 80 ° C. for 5 minutes to remove the solvent, thereby forming an inorganic powder-containing resin layer having a thickness of 12 μm on the support film. Next, a transfer film was manufactured by pasting a cover film (width 400 mm, length 30 m, thickness 38 μm) made of PET, which was previously subjected to mold release treatment, on the inorganic powder-containing resin layer.
(3) Transfer of inorganic powder-containing resin layer After peeling the cover film from the transfer film obtained in (2) above, the surface of the inorganic powder-containing resin layer is applied to the surface of the glass substrate for 21-inch panels. The transfer film (a laminate of a support film and an inorganic powder-containing resin layer) was superposed so as to be in contact, and this transfer film was thermocompression bonded with a heating roll. Here, as the pressure bonding conditions, the surface temperature of the heating roll was 90 ° C., the roll pressure was 2 kg / cm ^2, and the moving speed of the heating roll was 0.6 m / min.

After completion of the thermocompression treatment, the support film was peeled and removed from the inorganic powder-containing resin layer fixed (heat bonded) to the surface of the glass substrate to complete the transfer of the inorganic powder-containing resin layer.
(4) Preparation of resist composition As binder resin, benzyl methacrylate / methacrylic acid = 75/25 (wt%) copolymer (weight average molecular weight 30,000) 60 parts, polyfunctional monomer (D-1) tri 40 parts of propylene glycol diacrylate, 20 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one as a photopolymerization initiator (D-2) and propylene glycol monomethyl ether as a solvent After kneading 100 parts of acetate, an alkali development type radiation sensitive resist composition (hereinafter referred to as “resist composition”) was prepared by filtering with a cartridge filter (2 μm diameter). (5) Production of resist film:
The resist composition prepared in (4) above is applied by using a blade coater on a support film (width 400 mm, length 30 m, thickness 38 μm) made of polyethylene terephthalate (PET) that has been subjected to release treatment in advance. The solvent was removed by drying the coated film at 80 ° C. for 5 minutes, whereby a 10 μm thick resist film was formed on the support film. Next, a resist film was manufactured by pasting a cover film (width 400 mm, length 30 m, thickness 38 μm) made of PET, which was previously subjected to mold release treatment, on the resist film.
(6) Transfer of resist film After peeling the cover film from the resist film obtained in (5) above, on the inorganic powder-containing resin layer formed on the 21-inch glass substrate prepared in (3) above, The resist films (support film and resist film) were overlapped so that the surface of the resist film was brought into contact, and this transfer film was thermocompression bonded with a heating roll. Here, as the pressure bonding conditions, the surface temperature of the heating roll is 90 ° C., the roll pressure is 2 kg / cm ^2, and the moving speed of the heating roll is 0.00.
The rate was 6 m / min.

After completion of the thermocompression treatment, the support film is peeled off from the laminated film of the inorganic powder-containing resin layer and the resist film fixed (heat bonded) to the surface of the glass substrate, and the transfer of the inorganic powder-containing resin layer is completed. did.
(7) Resist film exposure step For the laminated film of the inorganic powder-containing resin layer and the resist film formed on the glass substrate, through a striped negative exposure mask having a line width of 100 μm and a space width of 400 μm, Mixed light of g-line (436 nm), h-line (405 nm) and i-line (365 nm) was irradiated with an ultra-high pressure mercury lamp. The exposure amount at that time was 200 mJ / cm ^{2 in} terms of illuminance measured by a 365 nm sensor.
(8) Development process / etching process The exposed resist film is subjected to a development process by a shower method using a 0.3 mass% sodium carbonate aqueous solution as a developer at a liquid temperature of 30 ° C., and then continuously inorganic. The powder-containing resin layer was etched for 90 seconds. Subsequently, the water washing process by ultrapure water was performed. Thereby, a resist pattern was formed, and then an inorganic powder-containing resin pattern corresponding to the resist pattern was formed. When the obtained inorganic powder-containing resin pattern was observed with an optical microscope, no development residue was observed on the resist unexposed portion of the substrate, and no pattern chipping was observed.
(9) Firing step The glass substrate on which the inorganic powder-containing resin pattern was formed was fired in a firing furnace for 30 minutes in a temperature atmosphere of 590 ° C. Thus, a panel material in which an electrode having a pattern width of 100 μm and a thickness of 6 μm was formed on the surface of the glass substrate could be obtained.

[Example 19]
(1) Preparation of resin composition containing inorganic powder:
As the inorganic powder (A), an Ag powder 10 having a specific surface area of 0.5 m ² / g and an average particle size of 2.3 μm
0 part, 10 parts of Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass frit (indefinite shape, softening point 520 ° C.) having an average particle diameter of 3 μm, 10 parts of resin (1) as polymer (B-1), As the polymer (B-2), methacrylic acid / monosuccinic acid (2-methacryloyloxyethyl) / 2-hydroxypropyl methacrylate / n-butyl methacrylate copolymer (weight ratio 20/15/25/40 and 15 parts by weight average molecular weight 90,000), 1 part of oleic acid as a dispersant, 10 parts of pentaerythritol triacrylate as a polyfunctional monomer (D-1), and 100 parts of propylene glycol monomethyl ether as a solvent were kneaded in a bead mill. After that, by filtering with a stainless mesh (400 mesh, 38 μm diameter), an inorganic powder-containing resin composition (conductive) Paste composition) was prepared.

(2) Preparation of resist composition:
Benzyl methacrylate / methacrylic acid = 75/25 (wt%) copolymer (weight average molecular weight 30,000) as binder resin 60 parts, polyfunctional monomer (D-1) 40 parts trimethylolpropane triacrylate, light As a polymerization initiator (D-2), 2,2′-bis-2-chlorophenyl-4,4 ′, 5,5′-tetraphenylbiimidazole (compound (i)) 6 parts, 4,4′-bis ( Diethylamino) benzophenone (compound (ii)) 3 parts, 2-mercaptobenzothiazole (compound (iii)) 1.5 parts, 3, as photosensitizer
After kneading 0.5 part of 3′-carbonylbis (7-diethylamino) coumarin and 100 parts of propylene glycol monomethyl ether acetate as a solvent, the mixture is filtered with a cartridge filter (2 μm diameter) to obtain an alkali development type radiation sensitive resist. A composition (hereinafter referred to as “resist composition”) was prepared.

(3) Preparation of transfer film:
By the operations (a) to (c) below, a transfer film for forming an electrode of the present invention was produced, in which a laminated film formed by laminating a resist film and an inorganic powder-containing resin layer in this order was formed on a support film. .
(A) The resist composition prepared in (2) was applied onto a support film (I) made of a PET film with a film thickness of 38 μm using a blade coater, and the coating film was dried at 100 ° C. for 3 minutes to remove the solvent. Then, a resist film having a thickness of 8 μm was formed on the support film.
(B) The inorganic powder-containing resin composition prepared in (1) was applied on a support film (II) made of a PET film having a thickness of 38 μm using a blade coater, and the coating film was dried at 100 ° C. for 5 minutes. The solvent was removed to form an inorganic powder-containing resin layer having a thickness of 12 μm on the support film. (C) The transfer film was overlaid so that the surface of the resist film prepared in (a) and (b) and the surface of the inorganic powder-containing resin layer were brought into contact with each other, and thermocompression bonded with a heating roller. Here, as pressure bonding conditions, the surface temperature of the heating roller was 90 ° C., the roll pressure was 2.5 kg / cm, and the moving speed of the heating roller was 0.5 m / min. As a result, a transfer film in which a laminated film having a resist film and an inorganic powder-containing resin layer was formed between the support films was produced.

(4) Transfer process of laminated film:
The transfer film was superposed on the surface of the glass substrate so that the surface of the inorganic powder-containing resin layer of the transfer film prepared in (3) was in contact, and this transfer film was thermocompression bonded to a heating roller. Here, as pressure bonding conditions, the surface temperature of the heating roller was 90 ° C., the roll pressure was 2.5 kg / cm, and the moving speed of the heating roller was 0.5 m / min. As a result, the transfer film was transferred to and closely adhered to the surface of the glass substrate.

(5) Exposure process / development process of resist film:
With respect to the resist film in the laminated film formed on the glass substrate in the above (4), a laser beam having a wavelength of 405 nm was irradiated onto the portion where the pattern was formed from the support film. At that time, the irradiation energy amount of the laser beam was set to 10 mJ / cm ² . After irradiation, the support film on the resist film is peeled off, and then the resist film is developed by a shower method using a 0.3% by mass sodium carbonate aqueous solution (30 ° C.) as a developing solution for the exposed resist film. Processing was carried out for 120 seconds.

Thereby, the uncured resist that was not irradiated with ultraviolet rays was removed to form a resist pattern. The resist pattern had a uniform pattern shape and a good shape with excellent pattern edge linearity.
(6) Etching process of inorganic powder-containing resin layer:
The inorganic powder-containing resin layer was etched for 60 seconds by the shower method using a 0.3% by mass sodium carbonate aqueous solution (30 ° C.) as an etching solution, following the above steps.

Next, washing with ultrapure water and a drying treatment were performed. Thereby, an inorganic powder-containing resin layer pattern was formed.
(7) Pattern firing step:
The glass substrate on which the pattern of the inorganic powder-containing resin layer was formed was fired at 560 ° C. for 10 minutes in an air atmosphere in a firing furnace. Thereby, an electrode pattern with a film thickness of 4 μm was formed on the surface of the glass substrate.
(8) Pattern evaluation:
The obtained electrode pattern had no cracks or chips and was excellent in shape.

[Example 20]
(1) Preparation of resin composition containing inorganic powder:
As the inorganic powder (A), an Ag powder 10 having a specific surface area of 0.5 m ² / g and an average particle size of 2.3 μm
0 part, 10 parts of Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass frit (indefinite shape, softening point 520 ° C.) having an average particle diameter of 3 μm, 10 parts of resin (1) as polymer (B-1), As a polymer (B-2), benzyl methacrylate / methacrylic acid / 2-hydroxypropyl methacrylate = 60/20/20 (mass%) copolymer (Mw = 50,000) 200 parts, photopolymerizable monomer (D-1) ) 200 parts of trimethylolpropane triacrylate, 5 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one as a photopolymerization initiator (D-2), silane coupling 1 part 3-methacryloxypropylmethoxysilane as an agent, 1 part oleic acid as a dispersant, and 200 parts propylene glycol monomethyl ether as a solvent. After kneading with a bead mill, an inorganic powder-containing resin composition (I) was prepared by filtering with a stainless mesh (500 mesh, 25 μm diameter).

(2) Preparation of transfer film:
The inorganic powder-containing resin composition (I) prepared in the above (1) was applied on a support film made of a PET film having a film thickness of 38 μm, which had been subjected to a release treatment in advance, using a blade coater. The transfer film of the present invention was produced by drying for 3 minutes to remove the solvent, and forming an inorganic powder-containing resin layer having a thickness of 7 μm on the support film.

(3) Transfer film transfer process:
Using the transfer film prepared in (2) above, the transfer film was superposed and thermocompression bonded with a heating roller so that the surface of the inorganic powder-containing resin layer was brought into contact with the surface of the glass substrate. Here, as the pressure bonding conditions, the surface temperature of the heating roller was 100 ° C., the roll pressure was 2.5 kg / cm, and the moving speed of the heating roller was 0.5 m / min. As a result, the transfer film was transferred to and closely adhered to the surface of the glass substrate.

(4) Inorganic powder-containing resin layer exposure process / development process:
The inorganic powder-containing resin layer formed on the glass substrate is irradiated with i-rays (ultraviolet light having a wavelength of 365 nm) through an exposure mask (5 cm × 5 cm) from the support film with an ultrahigh pressure mercury lamp, A latent pattern image was formed on the inorganic powder-containing resin layer. Here, the irradiation amount was 200 mJ / cm ² . After the exposure, the support film is peeled and removed, and then the liquid temperature is 30 ° C 0.3
The developing treatment was performed for 30 seconds by a shower method using a mass% sodium carbonate aqueous solution as a developing solution, followed by washing with ultrapure water.

Thereby, the inorganic powder containing resin of the part which was not irradiated with an ultraviolet-ray was removed, and the inorganic powder containing resin pattern was formed.
(5) Firing step:
The glass substrate on which the inorganic powder-containing resin pattern was formed was baked for 30 minutes in a temperature atmosphere of 580 ° C. As a result, an electrode pattern having a thickness of 4 μm was formed on the surface of the glass substrate. The obtained electrode pattern had no cracks or chips and was excellent in shape.

[Example 21]
(1) Preparation of resin composition containing inorganic powder 80 parts of PbO—B ₂ O ₃ —SiO ₂ —CaO glass (thermal softening point 530 ° C. and average particle size 1.6 μm) as glass powder (A), filler 20 parts of ZnO (average particle size 1.0 μm), 10 parts of resin (1) as polymer (B-1), and butyl methacrylate / 2-ethylhexyl methacrylate / hydroxypropyl methacrylate as polymer (B-2) By kneading 20 parts of a copolymer (weight ratio: 30/60/10 and Mw: 100,000), 6 parts of di-2-ethylhexyl azelate as a plasticizer and 50 parts of propylene glycol monomethyl ether as a solvent, A paste-like inorganic particle-containing resin composition was prepared.
(2) Production of transfer film The composition prepared in (1) was coated on a support film (width 200 mm, length 30 m, thickness 38 μm) made of a polyethylene terephthalate (PET) film, which had been subjected to a release treatment in advance, with a roll coater. Thus, a coating film was formed. The formed coating film was dried at 100 ° C. for 10 minutes to remove the solvent, thereby producing a transfer film in which an inorganic particle-containing resin layer having a thickness of 260 μm was formed on the support film.

(3) Transfer of Inorganic Powder-Containing Resin Composition This transfer film was thermocompression bonded with a heating roller to the surface of a 6-inch panel glass substrate on which electrodes (100 μm width) for generating plasma were arranged. Here, as the pressure bonding conditions, the surface temperature of the heating roller was 100 ° C., the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After the thermocompression treatment, the support film was peeled off from the inorganic particle-containing resin layer (1). Thereby, after the inorganic particle-containing resin layer (1) was laminated on the surface of the glass substrate, it was transferred and brought into close contact. When the film thickness of the laminated film of the inorganic particle-containing resin layer (1) was measured, it was in the range of 260 μm ± 2 μm.

(4) Firing process of inorganic powder-containing resin composition The glass substrate on which the inorganic particle-containing resin layer was formed was baked for 15 minutes in a temperature atmosphere of 560 ° C. Thereby, the glass sintered compact was formed on the glass substrate.

(5) Step of forming resist pattern A transfer film was superposed on the surface of the glass sintered body so that the surface of the resist film was in contact, and this transfer film was thermocompression bonded with a heating roller under the same pressure bonding conditions as described above. After the thermocompression treatment, the support film was peeled off from the resist film. As a result, the resist film was transferred and adhered to the surface of the glass sintered body. The film thickness of the resist film transferred to the surface of the glass sintered body was measured and found to be in the range of 20 μm ± 1 μm.

The resist film formed on the glass sintered body was irradiated with i-line (ultraviolet light having a wavelength of 365 nm) with an ultrahigh pressure mercury lamp through an exposure mask (100 μm wide stripe pattern). Here, the irradiation amount was 400 mJ / cm ² . The exposed resist film was developed for 30 seconds by a shower method using a 0.3 wt% sodium carbonate aqueous solution (30 ° C.) as a developer. Next, a water washing treatment with ultrapure water was performed, thereby removing the uncured resist that was not irradiated with ultraviolet rays and forming a resist pattern.
(6) Etching process of inorganic particle containing resin layer The etching process by the shower method which used 1 weight% nitric acid aqueous solution (40 degreeC) as an etching liquid was performed continuously for 10 minutes following said process. Next, washing with ultrapure water and a drying treatment were performed. Thereby, the partition pattern comprised from the material layer residual part and the material layer removal part was formed. Finally, a resist stripping treatment by a shower method was performed for 60 seconds using 1% (30 ° C.) sodium carbonate as a stripping solution. Subsequently, the water washing process by an ultrapure water was performed and the partition pattern was formed by this.

It is a schematic diagram which shows the cross-sectional shape of alternating current type PDP. It is the schematic of the structural example of the transfer film of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Glass substrate 3 Partition 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Fluorescent substance 8 Dielectric layer 9 Dielectric layer 10 Protective layer 11 Partition F1 Support film F2 Member formation material layer F3 Cover film

Claims (13)

(A) inorganic powder;
(B) a (meth) acrylic polymer having a weight average molecular weight of 10,000 to 50,000 having a (B-1) polyoxyalkylene moiety in the binder resin (B). Contains,
And inorganic polymer containing resin composition characterized by including this polymer (B-1) in the quantity of 0.01-50 weight part with respect to 100 weight part of this inorganic powder (A). The polymer (B-1) is
5 to 30% by weight of a structural unit derived from a (meth) acrylate compound having a polyoxyalkylene moiety;
30 to 50% by weight of a structural unit derived from a (meth) acrylate compound having no polyoxyalkylene moiety;
The inorganic powder-containing resin composition according to claim 1, comprising 30 to 50% by weight of a structural unit derived from an aromatic vinyl compound.   The (meth) acrylate compound having a polyoxyalkylene moiety is a polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol ( At least one (meth) acrylate compound selected from meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate and nonylphenoxypolypropylene glycol (meth) acrylate The inorganic powder-containing resin set according to claim 2, wherein Thing.   The inorganic powder-containing resin composition according to claim 1, further comprising (C) a plasticizing substance.   (D) The photosensitive component further contains (D-1) a polyfunctional (meth) acrylate and (D-2) a radiation polymerization initiator as a photosensitive component. Inorganic powder-containing resin composition.   A transfer film comprising an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to claim 1 on a support film.   A transfer film comprising a laminate including a resist layer and an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to claim 1 on a support film. . A step of transferring an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to any one of claims 1 to 5 formed on a support film onto a substrate;
And a step of baking the inorganic powder-containing resin layer. A method for producing a flat panel display member. A step of transferring an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to any one of claims 1 to 5 formed on a support film onto a substrate;
Forming a resist layer on the inorganic powder-containing resin layer;
A step of exposing the resist layer to form a latent image of a resist pattern;
Developing the resist layer to reveal the resist pattern; and
Etching the inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern;
And a step of firing the pattern. A method for producing a flat panel display member. The process of transferring on the board | substrate the laminated body of the resist layer formed on the support film, and the inorganic powder containing resin layer obtained from the inorganic powder containing resin composition in any one of Claims 1-5. When,
A step of exposing a resist layer constituting the laminate to form a latent image of a resist pattern; and
Developing the resist layer to reveal the resist pattern; and
Etching the inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern;
And a step of firing the pattern. A method for producing a flat panel display member. Transferring the inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to claim 5 formed on the support film onto the substrate;
A step of exposing the inorganic powder-containing resin layer to form a latent image of a pattern;
Developing the inorganic powder-containing resin layer to form a pattern;
And a step of firing the pattern. A method for producing a flat panel display member. A step of transferring an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to any one of claims 1 to 5 formed on a support film onto a substrate;
Baking the inorganic powder-containing resin layer to form an inorganic film;
Forming a resist pattern on the inorganic film;
And a step of etching the inorganic film to form an inorganic pattern corresponding to the resist pattern.   The flat panel display member according to any one of claims 8 to 12, wherein the flat panel display member is selected from a dielectric layer, a partition, an electrode, a resistor, a phosphor, a color filter, and a black matrix. Production method.

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