TWI273624B - Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process - Google Patents

Abstract

An inorganic particle-containing composition comprising: (A) inorganic particles; (B) a binder resin; and (C) a compound represented by the following formula (I), wherein R1 represents a group represented by -CO-A, wherein A represents an alkyl group having 5-20 carbon atoms or an alkenyl group having 5-20 carbon atoms, and n is an integer of 2-20. A transfer film and a plasma display panel production process using the composition are also described.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition containing inorganic particles, a transfer film comprising the composition, and a method of manufacturing a plasma display panel. [Prior Art] In recent years, plasma displays have received much attention as flat-panel fluorescent display systems. Fig. 1 is a view showing the sectional shape of an AC type plasma display panel (hereinafter referred to as "P D P" for the sake of simplicity). In the figure, 1 and 2 indicate glass substrates opposed to each other, and 3 indicates barrier ribs. The unit (c e 1 1 ) is partitioned and formed by the glass substrate 1, the glass substrate 2, and the barrier ribs 3. 4 denotes a transparent electrode fixed to the glass substrate 1; 5 denotes a bus bar electrode formed on the transparent electrode 4 for lowering the resistance of the transparent electrode; 6 denotes an address electrode fixed to the glass substrate 2; and 7 denotes a fluorescent material retained inside the unit; 8 denotes a dielectric layer formed on the surface of the glass substrate 1, thus covering the transparent electrode 4 and the bus bar electrode 5; 9 denotes a dielectric layer formed on the surface of the glass substrate 2 so as to cover the address electrode 6; and 10 represents, for example, magnesium oxide A protective film made. In color PDPs, color filters (red, green or blue) or black matrices can be placed between the glass substrate and the dielectric layer in order to obtain a high contrast image. As for the method of manufacturing such a PDP dielectric material, a barrier rib, an electrode, a fluorescent material, a color filter or a black stripe (black matrix), it is suitable to adopt a lithography method, and to form a photosensitive resin layer containing inorganic particles. On the substrate, the film is irradiated with ultraviolet light through a photomask, and the resulting film is developed to retain a pattern on the substrate to dry the pattern. The above-mentioned lithography method is theoretically excellent in pattern accuracy, and the use of the transfer film is excellent, and the thickness can be formed with excellent thickness and surface. 5 312 / invention specification (supplement) / 93-05 /93103730 1273624 Pattern of uniformity. However, the film-forming material layer formed on the base film by coating the composition containing the inorganic particles containing the acrylic resin is not sufficiently flexible, and the transfer ability is also insufficient. In order to solve such problems, studies have been conducted to include a plasticizer, a dispersant, and the like in the film-forming material layer. However, such inorganic materials may remain in the pattern after being baked to cause coloring or the like. Particularly when a sintered glass material such as a dielectric layer is formed, there is a problem that the light transmittance of the obtained sintered glass material is easily lowered. In the foregoing case, the present invention has been completed. SUMMARY OF THE INVENTION A first object of the present invention is to provide a composition containing inorganic particles suitable for providing PDP constituent elements having excellent surface flatness (for example, barrier ribs, electrodes, resistors, dielectric layers, phosphors) , color filters and black matrix). A second object of the present invention is to provide a composition containing inorganic particles which can form a sintered glass material having a high light transmittance (e.g., a dielectric layer constituting a PDP). A third object of the present invention is to provide a composition containing inorganic particles which can produce a transfer film having excellent flexibility in a film-forming material layer. A fourth object of the present invention is to provide a composition containing inorganic particles which is excellent in transferability (thermal adhesion to a substrate) in the case of producing a film-forming material layer. A fifth object of the present invention is to provide a transfer film which can effectively form constituent elements of a PDP having excellent surface flatness. A sixth object of the present invention is to provide a composition containing inorganic particles 6 312 / invention specification (supplement) / 93-05/93103730 1273624, which has excellent flexibility in terms of a film-forming material layer. A seventh object of the present invention is to provide a composition containing inorganic particles which has excellent transferability (thermal adhesion to a substrate) in terms of a film-forming material layer. An eighth object of the present invention is to provide a PDP manufacturing method which can effectively form a constituent element of a PDP having excellent surface flatness. A ninth object of the present invention is to provide a PDP manufacturing method which can effectively form a PDP having high positional accuracy in terms of constituent elements. A tenth object of the present invention is to provide a PDP manufacturing method which can effectively form a dielectric layer having a large thickness. An eleventh object of the present invention is to provide a PDP manufacturing method which can effectively form a dielectric layer required for a large-sized panel. A twelfth object of the present invention is to provide a method of manufacturing a PDP having a dielectric layer of excellent thickness uniformity. A thirteenth object of the present invention is to provide a method of manufacturing a PDP having a dielectric layer excellent in surface flatness. The inorganic particle-containing composition of the present invention comprises (A) inorganic particles; (B) a binder resin; and (C) a compound represented by the following formula (I) (this compound is hereinafter referred to as "specific compound" ):

0H

IR^-C-OT-CH-CHi-O-VH (I) wherein R1 represents a group represented by -C0-A, wherein A represents an alkyl group having 5-20 carbon atoms or contains 5-20 carbons The alkenyl group of the atom, and 2_ is an integer of 2 - 2 0. The composition containing the non-organic particles of the present invention may be a composition of a 7 312 / invention specification (supplement) / 93-05 / 93103730 1273624 step comprising (D) a radiation-sensitive component (such a composition It is hereinafter referred to as "a composition containing inorganic particles of radiation sensitivity"). The transfer film of the present invention comprises a film-forming material layer obtained through the aforementioned composition containing inorganic particles. The first production method of the present invention (hereinafter referred to as "PDP production method (1)")) comprises transferring a film-forming material layer obtained from the inorganic particle-containing composition according to the present invention to a substrate surface, and baking it. The step of transferring the thin film-forming material layer to form a dielectric layer on the substrate. The second manufacturing method of the present invention (hereinafter referred to as "PDP manufacturing method (2)") comprises the steps of: transferring a film-forming material layer obtained by the inorganic particle-containing composition of the present invention to a substrate surface; Forming a photoresist film on the film-forming material layer after the transfer; exposing the photoresist film to form a latent image of the photoresist pattern; developing the photoresist film to form a photoresist pattern; etching the film-forming material layer to form a corresponding a pattern layer of the photoresist pattern; and baking the pattern layer to form a constituent element selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, a color filter, and a black matrix. The third manufacturing method of the present invention (hereinafter referred to as "PDP manufacturing method (3)") comprises the steps of forming a photoresist film and a film-forming material layer obtained from the composition containing the inorganic particles of the present invention. a laminated film on the base film; transferring the laminated film formed on the base film to the surface of the substrate; exposing the photoresist film forming the laminated film to form a latent image of the photoresist pattern; developing the photoresist film to form a photoresist a pattern; etching a film-forming material layer to form a pattern layer corresponding to the photoresist pattern; and baking the pattern layer to form a layer selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, a color filter, and The constituent elements in the black matrix. 8 312/Invention Manual (Supplement)/93-05/93103730 1273624 The fourth manufacturing method of the present invention (hereinafter referred to as "PDP manufacturing method (4)")) comprises the following steps: transfer is contained by the present invention a film-forming material layer obtained from the composition of the inorganic particles onto the surface of the substrate; exposing the film-forming material layer to form a pattern latent image; developing the film-forming material layer to form a pattern layer; and baking the pattern layer to form A component selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, a color filter, and a black matrix. [Embodiment] The composition containing inorganic particles of the present invention (hereinafter simply referred to as "composition") will be described later. The composition of the present invention contains inorganic particles, a binder resin, and a specific compound as main components. (Inorganic Particles) The inorganic material composition of the inorganic particles of the composition of the invention is not particularly limited, but is selected depending on the application of the sintered material formed by the composition (the type of P D P component). The inorganic particles contained in the composition are used to form a "dielectric layer" or a "barrier rib" constituting the PDP, and the inorganic particles have, for example, a softening point falling to 3 5 0 - 70 ° C, and preferably 40 Glass powder in the range of 0 - 6 2 0 °C. When the softening point of the glass frit is lower than 305 ° C, the glass frit is melted in a stage in which an organic substance such as a binder resin has not been completely decomposed in the baking step of the film-forming material layer made of the composition. And is removed, so part of the organic matter remains in the dielectric layer to be formed. As a result, the dielectric layer is easily colored, and its light transmittance is easily lowered. On the contrary, when the softening point of the glass powder exceeds 700 ° C, since the glass powder must be baked at a temperature higher than 700 ° C, the glass substrate is easy 312 / invention specification (supplement) / 93-05 /93103730 9 1273624 Distorted. Specific examples of glass powders suitable for use include (1) lead oxide, a mixture of boron oxide and cerium oxide (P b 0 - B 2 0 3 - S i 0 2), (2) a mixture of zinc oxide, boron oxide and cerium oxide ( η η 0 - B 2 0 3 - S i 0 2), (3) a mixture of lead oxide, boron oxide, oxidized stone and oxidized (PbO_B2〇3-Si〇2-AI2O3), and (4) lead oxide a mixture of zinc oxide, boron oxide and cerium oxide (?13〇-211〇-62〇3-Sith). The glass frits may be contained in a composition for forming constituent elements other than the dielectric layer and the barrier ribs (e.g., electrodes, resistors, phosphors, color filters, and black matrices). The content of the glass frit to the inorganic particle-containing composition for obtaining the panel material is usually 90% by weight or less based on the total weight of the inorganic particles, and preferably 50 to 90% by weight. The inorganic particles contained in the composition for forming the "electrode" constituting the PDP are, for example, metal particles containing Ag, An, Al, Ni, Ag-Pd alloy, Cu, Cr or the like. These metal particles may be combined with a glass frit to be contained in a composition for forming a dielectric layer. The content of the glass particles in the dielectric layer-forming composition is usually 10% by weight or less based on the total weight of the inorganic particles, and preferably 0.1 to 5 ° / 重量 by weight. The inorganic particles contained in the composition for forming a "resistor" constituting the PDP are, for example, particles containing Ru〇2. The inorganic particles contained in the "phosphor" forming composition constituting the PDP include, for example, red camping material particles (for example, Y 2 0 3 : EU 3 +, Y 2 S i 0 5 : EU 3 4, Y : 3 A 1") Ο 12 : E u 3 +, YV 0 4 : E u <3 +, ( Y, G d ) B 0 3 : E u 3 + and Z η 3 ( P 0,丨) 2 : Μ η ), particles containing green fluorescent material (for example, Z η 2 S i 0 /丨:Μ η, 10 312/invention specification (supplement)/93-05/93103730 1273624

BaAl12〇l9: Mn, BaMgAlH〇23: Mn, LaP(h:(Ce, Tb), and Ys(Al, G a ) 5 Ο ! 2 ·· T b ), particles containing blue fluorescent materials (such as Y 2 S i 0 r C e, BaMgAli〇Oi7: Eu2+, B a M g A 1 i 0 2 a : E u 2 + ^ (C a , S r , BahJPOOGChJun and (Zn, Cd)S: Ag), etc. Composition PDP The inorganic particles contained in the "color filter"-forming composition include, for example, red materials (such as F e 2 0 3 and P b 3 0 4 ), and green materials (such as C r 2 0 〇, blue materials (such as 2 ( A 12 N a 2 S i 3 0 I ◦) · N a 2 S 4) Particles of the type. The inorganic particles contained in the composition for forming a "black matrix" of the composition PDP include, for example, Μη, F e, C r particles of this type (adhesive resin) The binder resin of the composition of the invention is preferably an acrylic resin. When an acrylic resin is used as the binder resin, the resulting film-forming material layer is absolutely excellent for the substrate. Good (thermal) adhesion. When the composition of the present invention is applied to a base film to produce a transfer film, the resulting transfer film has excellent transfer ability (thermal adhesion to the substrate) in terms of the film-forming material layer. ). The acrylic resin of the composition of the invention is selected from the group consisting of having an appropriate adhesive property, capable of bonding inorganic particles, and being completely oxidized and removed by baking a film-forming material (at 400 to 6 2 (TC baking)). The acrylic acid includes a homopolymer of a (meth)acrylic acid compound represented by the following formula (II), and two or more (indenyl)acrylic acid compounds represented by the following formula (II). a copolymer, and a copolymer of a (fluorenyl)acrylic compound represented by the following formula (II) and a copolymerizable monomer. h2c=c-r2

I 00 (II) 1 0

I H2C-R3 11 312 / Inventive Specification (Supplement) / 93-05/93103730 1273624 wherein R 2 represents a hydrogen atom or a methyl group; and R 3 represents a monovalent organic group. Specific examples of the (meth)acrylic compound represented by the formula (II) include: alkyl (mercapto) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (mercapto) acrylate , (isopropyl) (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) Acrylate, (amyl (meth)acrylate), (meth)isoamyl acrylate, hexyl acrylate, heptyl (meth)acrylate, (methyl) Octyl acrylate, isooctyl (decyl) acrylate, 2-ethylhexyl (decyl) acrylate, decyl (decyl) acrylate, decyl acrylate, isodecyl acrylate Undecyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth) acrylate and isostearyl (meth) acrylate; hydroxyalkyl (fluorenyl) acrylates such as hydroxyethyl (meth) acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate; 3-hydroxybutyl (meth) acrylate and 4-hydroxyl (meth) acrylate Butyl ester. Phenoxyalkyl (meth) acrylates such as phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate; alkoxyalkyl (methyl) Acrylates such as 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-propoxyethyl (meth)acrylate, 2-(meth)acrylate 2 - Butoxyethyl ester and 2-methoxybutyl (meth)acrylate; polyalkylene glycol (meth) acrylates such as polyglycol mono(meth) acrylate, ethoxy diethylene glycol (Meth) acrylate, methoxypolyethylene 2 12 312 / invention specification (supplement) / 93-05/93103730 1273624 alcohol (mercapto) acrylate, phenoxy polyethylene glycol (fluorenyl) acrylate , nonylphenoxypolyethylene glycol (mercapto) acrylate, polypropylene glycol (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate and Nonylphenoxypolypropylene glycol (meth) acrylate; cycloalkyl (meth) acrylates such as (meth) acrylate , 4-butylcyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentadienyl (mercapto)acrylate, ) borneol acrylate, isobornyl (meth) acrylate and tricyclodecyl (meth) acrylate; and (mercapto) acrylate and tetrahydrofurfuryl (meth) acrylate. The (mercapto) acrylate compound represented by the formula (II), wherein R3 represents a group containing an alkyl group or an alkyloxy group. Particularly preferred (meth) acrylate compounds are (butyl) butyl acrylate, ethyl (hexyl) hexyl acrylate, (decyl) decyl acrylate, isodecyl (mercapto) acrylate and (fluorenyl) 2-ethoxyethyl acrylate. The other copolymerizable monomer is not particularly limited as long as it is a compound copolymerizable with the (mercapto) acrylate compound. Other copolymerizable monomers include unsaturated carboxylic acids such as (meth)acrylic acid, vinyl benzoic acid, maleic acid, and vinyl phthalic acid; and vinyl group-containing polymerizable compounds such as vinyl Narrow-based methyl ether, vinyl glycidyl ether, styrene, α-mercaptostyrene, butadiene, and isoprene. The proportion of the comonomer derived from the (fluorenyl)acrylic compound represented by the formula (II) in the acrylic resin of the composition of the invention is usually 70% by weight or more, and preferably 90% by weight or more. . Specific examples of preferred acrylic resins include polydecyl methacrylate, polyfluorenyl 13 312 / invention specification (supplement) / 93-05/93103730 1273624 butyl acrylate and decyl methacrylate - butyl methacrylate copolymer . When the constituent elements of the PDP are formed by the photoresist method described later, when the film-forming material layer must be subjected to the solubility test, it is preferable to contain a monomer containing a Wei group as the other copolymerizable monomer (co-formation). body). Specific examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, and one (2-(indenyl) group. Ethyl decyloxyethyl) succinate and ω-carboxy-polycaprolactone mono(meth) acrylate. Among them, methacrylic acid is particularly preferred. Specific examples of the preferred solvent-soluble resin include: alkyl mercapto acrylates such as hydrazine acrylate S, methacrylic acid methacrylate, methacrylic acid propyl methacrylate, isopropyl isopropyl acrylate, butyl methacrylate, Isobutyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, amyl methacrylate, isoamyl thioglycolate, Mercaptopropionate, hexyl methacrylate, octyl methacrylate, isooctyl methacrylate, 2-ethylhexyl methacrylate, decyl methacrylate, decyl methacrylate, A Isodecyl acrylate, undecyl methacrylate, dodecyl methacrylate, lauryl methacrylate, stearyl methacrylate and isostearyl methacrylate; hydroxyalkyl methacrylate Such as hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate; 3-hydroxybutyl methacrylate and thiol acrylate 4- Hydroxybutyl ester. Phenoxyalkyl methacrylates such as phenoxyethyl methacrylate and 2-hydroxy-3-phenoxypropyl methacrylate; 14 312 / invention specification (supplement) / 93-05/93103730 1273624 Alkoxyalkyl methacrylates such as 2-methoxyethyl methacrylate, 2-ethoxyethyl methacrylate, 2-propoxyethyl methacrylate, methacrylic acid 2 - Butoxyethyl ester and 2-methoxybutyl methacrylate; polyalkylene glycol methacrylates such as polyethylene glycol monomethacrylate, ethoxy diethylene glycol methacrylate, hydrazine Oxypolyethylene glycol methacrylate, phenoxy polyethylene glycol methacrylate, nonyl phenoxy polyethylene glycol methacrylate, polypropylene glycol methacrylate, methoxy polypropylene glycol oxime Acrylate, ethoxypolypropylene glycol methacrylate and nonylphenoxy polypropylene glycol acrylate; cycloalkyl methacrylates such as thioglycolcyclohexanyl, methacrylic acid 4-butylcyclohexane Ester, dicyclopentyl methacrylate, dicyclopentenyl methacrylate, methacrylic acid Cyclopentadiene methacrylate, isobornyl methacrylate, isobornyl acrylate group Yue and Yue acrylate, tricyclodecane acrylate group; and benzyl methacrylate, and tetrahydrofurfuryl acrylate Yue group. The molecular weight of the acrylic resin of the composition of the invention is represented by polystyrene by gel permeation chromatography (hereinafter referred to as "GPC"), preferably 4,000 to 300,000. More preferably, it is 1 0,0 0 0 - 2 0 0,0 0 0 (this molecular weight is hereinafter referred to as "weight average molecular weight"). The proportion of the binder resin of the composition of the present invention is preferably from 5 to 80 parts by weight, and more preferably from 10 to 50 parts by weight, per 100 parts by weight of the inorganic particles. When the proportion of the binder resin is too small, the binder resin cannot bond and retain inorganic particles. Conversely, when the ratio is too large, the baking step takes a long time, and the formed sintered material (e.g., dielectric layer) does not have sufficient strength or thickness. (Specific compound) 15 312/Invention specification (supplement)/93-05/93103730 1273624 A specific compound is used as an additive having a dual effect of a plasticizer and a dispersant. The composition of the present invention containing a specific compound showed excellent surface flatness. Even when the resulting transfer film is bent, the surface of the film-forming material layer can be finely cracked, and the transfer film has excellent flexibility and is easily rolled up. Further, since the specific compound is not easily decomposed and removed by heat, the panel material obtained by baking the film-forming material layer is not colored, and the light transmittance of the dielectric layer is not lowered. In the formula (I) representing a specific compound, R1 represents a group represented by -CO-A, wherein A represents an alkyl group having 5 to 20 carbon atoms or a rare group having 5 to 20 carbon atoms, and i Is an integer from 2 - 2 0. The alkyl or alkenyl group represented by A has 5 to 20 carbon atoms and preferably 9 to 18 carbon atoms. When the number of carbon atoms is less than 5, the function as an additive becomes insufficient. When the number of carbon atoms exceeds 20, the solubility in the additive solvent constituting the composition containing the inorganic particles is lowered, and good flexibility cannot be obtained. Specific examples of alkyl groups include n-pentyl, n-hexyl, n-heptyl, n-octyl, n-decyl, n-decyl, n-decyl, n-decyl, n-decyl, n-hexadecane Base, n-heptadecyl, n-octadecyl, n-nonadecyl and n-decyl. Specific examples of the fine base include 2-indenyl, 2-hexyl, 2-hexyl, 2-octenyl, 2-nonenyl, 10-undecenyl, 9-octadecene Base and 9 - 18 carbon base. Among them, n-octyl and n-decyl; (: complete, n-octadecyl and 9-octadecyl are preferred) and 9-h eight-carbon dilute is preferred. R1 in formula (I) Represents a group represented by -CO-A; and [is an integer of 2 - 2 0. 16 312 / invention specification (supplement) / 93-05/93103730 1273624 Specific examples of specific compounds include monolauric acid diglyceride, a hard a diglyceride fatty acid, a monoglyceride monooleate and a diglyceride monocaprylate, wherein a monooleic acid diglycerin S is particularly preferred. The proportion of the specific compound in the composition of the present invention is preferably relative to one part per serving. The weight ratio of the inorganic particles is from 0.1 to 20 parts by weight, and more preferably from 0.5 to 10 parts by weight. When the ratio of the specific compound is too small, the film formation property by using the obtained composition cannot be sufficiently improved. The surface flatness and flexibility of the material layer. Conversely, when the ratio is too high, the adhesiveness (viscosity) of the film-forming material layer formed using the obtained composition becomes too high, so that the film-forming material layer is included. The handling property of the transfer film is inferior. (radiation-sensitive component) The inorganic particle-containing material of the present invention The composition may be a radiation-sensitive composition containing inorganic particles containing a radiation-sensitive component. The sensitizing-sensitive component preferably includes, for example, (a) a combination of a polyfunctional monomer and a radiation polymerization initiator; and (b) a melamine resin and A combination of acid photoacid generators can be formed when irradiated with radiation. As for the combination (a), a combination of a polyfunctional (meth) acrylate and a radiation polymerization initiator is particularly preferred. Specific examples of mercapto acrylates include bis(indenyl) acrylates of alkanediols (such as ethylene glycol and propylene glycol); di(meth)acrylates of polyalkylene glycols (such as polyglycol and polypropylene glycol). a di(meth)acrylate having a hydroxyl group polymer (for example, a dihydroxy hydroxypolybutadiene, a dihydroxy hydroxy polyisoprene, and a dihydroxy hydroxy polycaprolactone); a poly(alkyl) acrylate having a valence of 3 or more or more (for example, glycerin, 1,2,4-butanetriol, trimethylolane, tetramethylolane, pentaerythritol, and dipentaerythritol); Polyol (such as 1,4 - ring Glycol and 17 312 / invention specification (supplement) / 93-05 / 93103730 1273624 1,4 - benzenediol cyclic polyol); and oligo (meth) acrylate such as polyester (fluorenyl) acrylate , epoxy resin (fluorenyl) acrylate, amine phthalate resin (fluorenyl) acrylate, alkyd resin (mercapto) acrylate, polyoxyl resin (meth) acrylate and spiral hydrocarbon tree (spiranresi η ) (fluorenyl) acrylate. These polyfunctional (fluorenyl) acrylates may be used singly or in combination of two or more. Specific examples of the radiation polymerization initiator constituting the radiation-sensitive component include a carbonyl compound such as Biphenyl hydrazine, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-mercapto-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl fluorenone, 2, 2-dimethoxy Benzyl-2-phenylacetophenone, 2-methyl-[4'-(methylthio)phenyl]-2-morphinyl-1-propane 8 and 2-meryl-2-phenylene Amino- 1 -( 4 -morphinylphenyl)-butan-1-one; azo compound or azide compound such as azoisobutyronitrile and 4-azidobenzyl aldehyde; organic sulfur compound such as Mercaptan; organic peroxides such as benzamidine peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide and p-decane hydroperoxide; trihalodecane Classes such as 1,3 - fluorene (trichloromethyl)-5-(2,-chlorophenyl)-1,3,5-three tillage and 2-[2-(2-furyl)extended ethyl]- 4,6-贰(trichloroindenyl)-1,3,5-three tillage and imidazole binary such as 2,2 '-C (2-chlorophenyl)-4,5,4 ',5 ' - Tetraphenyl-1,2'-linked mesozole. These radiation polymerization initiators may be used singly or in combination of two or more. (Solvent) The composition of the present invention usually contains a solvent. The preferred solvent is a solvent which has good affinity for inorganic particles and good solubility to the binder resin, provides appropriate viscosity to the obtained composition, and is easily vaporized and removed upon drying. Specific examples of the solvent include ketones such as diethyl ketone, methyl butyl ketone dipropyl 18 312 / invention specification (supplement) / 93-05 / 93103730 1273624 ketone and cyclohexanone; alcohols such as n-pentanol, 4 - mercapto-2-pentanol, and diacetone alcohol; ether-based alcohols such as ethylene glycol monoterpene ether, ethyl bethane & |, ethylene glycol monobutylene, propylene glycol monopropene and propylene glycol-B Saturated aliphatic monocarboxylic acid alkyl esters such as n-butyl acetate and valerate acetates such as ethyl lactate and n-butyl lactate; and ether-based such as methyl cellosolve acetate, ethyl acetate cellosolve , propylene glycol acetate and ethyl 3-ethoxypropionate. These solvents may be used singly or in combination of two or more. The ratio of the solvent to the composition of the present invention is from 5 to 30 parts by weight, relative to the weight ratio of the inorganic particles per 100 parts by weight of the inorganic particles, from the viewpoint of maintaining the viscosity of the composition. The composition of the present invention may contain, in addition to the above-mentioned main components, a plurality of agents as optional components, such as a tackifier, a surface control agent, a stabilizer, and an antifoaming agent. The composition for forming a dielectric layer as a composition containing inorganic particles preferably comprises, for example, a composition comprising 100 parts by weight of a mixture comprising 50 to 80% by weight of oxidized weight, boron oxide by weight. , 0 - 20% by weight of zinc oxide, 0 - 10% by weight and 0 - 10% by weight of cerium oxide as inorganic particles (glass powder); 10-30 parts by weight of butyl methacrylate / methyl 2 - decyl acrylate / hydroxypropyl methacrylate copolymer as a binder resin; 0 · 1 - 10 parts by weight of diglyceride oleate as a specific compound; 5-30 parts by weight of propylene glycol monoterpene ether and / or 3-ethoxypropionic acid is a solvent. The composition of the present invention may be via the use of a kneader such as a roll kneader, 312/invention specification (supplement)/93-05/93103730 cyclohexanol diol; a non-ester; a lactone type oxime ether, two or more Jiajia prepares 40 kinds of surface tension examples 5 - 30% alumina; base and ethyl acetate as mixer 19 1273624 or homomixer, mixes the above inorganic particles, binder resin, specific name solvent and selective components to prepare . The composition of the present invention thus prepared is a flowable paste composition suitable for coating, and generally has a viscosity of 1,000 to 10,000 cp and is 3,0 0 - 1 0, 0 0 0 cp °. The composition can be used particularly advantageously for the production of a transfer film (the present invention), which will be described later in detail. The composition of the present invention is also preferably used in a conventional method for forming a film-forming material, in other words, a method of directly coating a composition on a substrate surface by a screen printing method or the like, and drying the coating film to form a film-forming material. (Transfer film) The transfer film of the present invention is a composite film which can be advantageously used in the steps of manufacturing a constituent element, in particular, a step of manufacturing a dielectric layer by coating a composition on a base film and drying the coating The film forms a film-forming layer. In other words, the transfer film of the present invention has a film-forming material layer formed thereon from a base film, and contains inorganic particles, a binder resin, and a specific composition. The transfer film of the present invention may be a film (stack) prepared by forming a back-resist film on a base film, coating the composition of the present invention on a photoresist film, and drying the film. Further, the transfer film of the present invention may be a radiation-sensitive transfer film composed of a composition containing a radiation-sensitive inorganic substance. (1) The structure of the transfer film:

2A is a schematic cross-sectional view of a transfer film of the present invention, showing a cross-section E 312/invention specification (supplement)/93-05/93103730, and a layer of a preferred layer 3 is thinned by a PDP. The light and dry particles 20 1273624 and FIG. 2B are cross-sectional views showing the transfer film structural layer (detailed view of the portion (X)). The transfer film shown in Fig. 2 is a composite film which can be used to form a dielectric layer constituting a PDP as an example of the transfer film of the present invention. Usually, the composition of the transfer film is a base film F 1 ; a film-forming material layer F 2 which is formed on the surface of the base film F 1 and which can be peeled off; and a cover film F 3 . The film-forming material layer F 2 is on the surface and is easily peeled off. The cover film F 3 may not be used depending on the properties of the film-forming material layer F 2 . The base film F 1 constituting the transfer film is preferably a resin film having heat resistance and solvent resistance and having flexibility. When the base film F 1 has flexibility, the paste composition (the composition of the present invention) can be applied by a roll coater, a knife coater or the like, so that a film-forming material layer having a uniform thickness can be formed and formed. The film-forming material layer is stored and supplied in the form of a roll. The resin constituting the base film F 1 includes, for example, polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimine, polyvinyl alcohol, polyvinyl chloride, fluorine-containing resin. Such as polyvinyl fluoride, nylon and cellulose. The thickness of the base film F 1 is, for example, 20 to 1000 μm. The film-forming material layer F 2 constituting the transfer film is a layer (dielectric layer) which becomes a sintered glass material when baked, and contains glass frit (inorganic particles), a binder resin, and a specific compound as main components. The thickness of the film-forming material layer F 2 is determined depending on the glass powder content and the type and size of the panel, but is usually 5 - 200 μm thick and preferably 10 - 10 μm thick. When the thickness is less than 5 μm, the thickness of the dielectric layer finally formed becomes too small to secure the dielectric properties of the inclusion. Generally, when the thickness is from 10 0 to 100 μm, the dielectric layer thickness required for a large-sized panel can be sufficiently ensured 21 312 / invention specification (supplement) / 93-05 / 93103730 1273624 degrees. The cover film F 3 constituting the transfer film is a protective film on the surface (contact surface with the glass substrate) of the film-forming material layer F 2 . This cover film F 3 is preferably a flexible resin film. The resin which forms the cover film F3 is, for example, the above-mentioned resin which forms the base film F1. The thickness of the cover film F 3 is, for example, 20 to 1000 μm. (2) Manufacturing method of transfer film: The method for producing a transfer film of the present invention can form a film-forming material layer (F 2 ) on the base film (F 1 ), and provide a (pressure-bonded) cover film. (F 3 is prepared on the film-forming material layer (F 2 ). A method of forming a film-forming material layer is, for example, coating the composition of the present invention containing inorganic particles, a binder resin, a specific compound, and a solvent on a substrate. a method of removing some or all of the solvent on the film, and drying the coating film. The invention is coated from the viewpoint that the thickness becomes large (for example, 20 μm or more), and the coating film having an excellent uniform thickness can be effectively formed. The method of constituting the composition on the base film preferably includes, for example, a coating method using a roll coater, a coating method using a knife coater such as a doctor blade, a coating method using a curtain coater, and a coating method using a wire coater. It is preferred that the surface of the base film coated with the composition of the present invention is subjected to a release treatment. Thus, after the transfer of the film-forming material layer, the base film is easily peeled off by the film-forming material layer. The coating film on the base film is dried to remove part or all of the solvent, and is converted into a film-forming material layer constituting the transfer film. Conditions for drying the coating film made of the composition of the present invention include 4 0 - 15 0 °C temperature and about 1 - 30 minutes. Appropriate shape retention is shown on the film-forming material layer by the adhesion of the substrate and on the 312/invention manual (supplement)/93-05/93103730 22 1273624 The viewpoint of the residual solvent after drying (the content of the solvent in the film-forming material layer) is usually 1% by weight or less, and preferably 0.1 to 5% by weight. It is preferably set (usually heated) The surface of the cover film on the film-forming material layer thus formed is also subjected to release treatment. Before the transfer of the film-forming material layer, the cover film is easily peeled off by the film-forming material layer. (3) Film formation property Transfer of material layer (use of transfer film) The film-forming material layer on the base film is transferred onto the entire surface of the substrate. According to the transfer film of the present invention, the film-forming material layer can be precisely operated by such a simple operation. shape Formed on a glass substrate. This not only improves the steps of forming a PDP component (such as a dielectric layer), but also improves the quality of the resulting component (for example, the dielectric layer exhibits stable dielectric properties). PDP Process (1) (Formation of Dielectric Layer) The PDP process (1) of the present invention comprises the steps of: transferring a film-forming material layer constituting the transfer film of the present invention to a substrate surface, and baking the transferred The film-forming material layer is printed to form a dielectric layer on the surface of the substrate. The step of transferring the film-forming material layer having the transfer film of the composition shown in Fig. 2 is, for example, followed by (1) in the form of a roll. The transfer film is cut into a corresponding substrate area size. (2) After the cover film (F 3 ) is peeled off from the surface of the film-forming material layer (F 2 ) of the transfer film obtained by cutting, the transfer film is spread on the surface of the substrate The surface of the film-forming material layer (F 2 ) is brought into contact with the substrate. (3) The heating roller is moved over the transfer film laid on the substrate, and the transfer film is bonded by heating and pressing. 23 312/Invention Manual (Supplement)/93-05/93103730 1273624 (4) The base film (F 1 ) is peeled off, and the film-forming material layer (F 2 ) fixed to the substrate by heat and pressure bonding is removed from the substrate. Film (F 1). The film-forming material layer (F 2 ) on the base film (F 1 ) is transferred to the substrate by the aforementioned operation. The transfer conditions include a heating roller surface temperature of 6 0 - 1 2 0 ° C, a heating report pressure of 1 - 5 kg / cm 2 and a heating report moving speed of 0. 2 - 1 0 . 0 m / min. This operation (transfer step) can be performed using a laminator. The substrate is preheated and the preheating temperature is set to, for example, 4 〇 - 1 0 0 °C. The film-forming material layer (F 2 ) transferred to the surface of the substrate is converted into a sintered inorganic material (dielectric layer) by baking. The baking method is, for example, a method of placing a substrate on which the film-forming material layer (F 2 ) has been transferred in a high-temperature atmosphere. Thus, the organic material (e.g., binder resin, residual solvent, specific compound, and various additives) contained in the film-forming material layer (F 2 ) is decomposed and removed, and the inorganic particles are melted and sintered. The sintering temperature varies depending on the melting point of the substrate, the constituent elements of the film-forming material layer, and the like, but the sintering temperature is, for example, 300 to 800 ° C, and preferably 4 0 0 to 6 2 0 °C. PDP Process (2) (Formation of Component by Photoresist Method) The PDP process (2) of the present invention comprises the steps of: transferring a film-forming material layer constituting the transfer film of the present invention to a substrate; forming a photoresist film thereon a film on the film-forming material after the transfer; exposing the photoresist film to form a latent image of the photoresist pattern; developing the photoresist film to form a photoresist pattern; etching the film-forming material layer to form a pattern corresponding to the photoresist pattern a layer; and baking the pattern layer to form a constituent element selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, a color filter, and a black matrix. Further, the process (2) of the present invention comprises the steps of: forming a photoresist film and a film-forming property obtained from the composition containing the inorganic particles of the present invention 24 312 / invention specification (supplement) / 93-05/93103730 1273624 a laminated film of a material layer on a base film; transferring the laminated film formed on the base film to the surface of the substrate; exposing the photoresist film constituting the laminated film to form a latent image of the photoresist pattern; developing the photoresist film Forming a photoresist pattern; etching the film-forming material layer to form a pattern layer corresponding to the photoresist pattern; and baking the pattern layer to form a layer selected from the group consisting of barrier ribs, electrodes, resistors, dielectric layers, phosphors, and color filters The components in the light sheet and the black matrix. A method of forming a "barrier rib" as a component of a PDP on the back surface of a substrate will be described later. The method comprises (1) a step of transferring a film-forming material layer, (2) a step of forming a photoresist film, (3) a step of exposing the photoresist film, (4) a step of developing a photoresist film, and (5) an etch film formation property. The material layer step, and (6) the step of baking the barrier rib pattern, thereby forming barrier ribs on the surface of the substrate. 3 and 4 are each a schematic cross-sectional view showing a series of steps of generating barrier ribs. In Figs. 3 and 4, 1 1 denotes a glass substrate on which plasma is calibrated at equal intervals, and a dielectric layer 13 is formed on the surface of the glass substrate 11 so as to cover the substrate 12. In the present invention, specific examples of the "transfer film-forming material layer to the substrate" include not only a specific example of transferring the film-forming material layer to the surface of the glass substrate 11, but also a transfer film-forming material layer to dielectric. Specific examples of the surface of layer 13. (1) Transfer film-forming material layer step: An example of the step of transferring the film-forming material layer is shown as follows. As shown in FIG. 3B, after the cover film (not shown) of the transfer film is peeled off, the transfer film 20 is laid on the surface of the dielectric layer 13 to make the surface of the film-forming material layer 2 1 contact. The surface of the electric layer 13 , the transfer film 20 is heated and pressure bonded by a heating roller or the like, and the base film 2 2 is subsequently peeled off by the film-forming material layer 25 312 / invention specification (supplement) / 93-05 /93103730 1273624 2 1 removed. Thus, as shown in Fig. 3C, the film-forming material layer 21 is transferred and adhered to the surface of the dielectric layer 13. The transfer conditions include a heating roll surface temperature of 80 - 1 40 ° C, a heating roll pressure of 1 - 5 kg / cm 2 and a heating roll moving speed of 0.1 - 1 0 . 0 m / min. The glass substrate 11 can be preheated, and the preheating temperature can be set to, for example, 40 - 1 0 0 °C. (2) Step of producing a photoresist film: In this step, as shown in Fig. 3D, a photoresist film 31 is formed on the surface of the transferred film-forming material layer 2 1 . The photoresist constituting the photoresist film 31 may be any of a positive photoresist and a negative photoresist. The photoresist film 31 can be formed by coating a photoresist by a plurality of methods including screen printing, roll coating, spin coating, and cast coating, and drying the coated film. The drying temperature of the coated film is usually from about 60 to 130 °C. The photoresist film formed on the base film can be formed by transferring onto the surface of the film-forming material layer 21. According to this formation method, not only the number of forming steps of the photoresist film can be reduced, but also the obtained photoresist also has excellent thickness uniformity. Thus, the development of the photoresist film and the etching of the film-forming material layer can be performed in unison, so that the height and shape of the barrier ribs formed are uniform. The photoresist film 3 1 is usually from 0.1 to 40 μm thick and preferably from 0.5 to 20 μm. (3) Photoresist film exposure step In this step, as shown in FIG. 3E, the surface of the photoresist film 31 formed on the film-forming material layer 2 1 is selectively irradiated with radiation such as ultraviolet light through an exposure mask ( Exposure) to form a photoresist pattern latent image. In the figure, Μ Α and Μ Β respectively indicate a light transmitting portion and a light blocking portion which are formed by the exposure cover. The ultraviolet light irradiation device is not particularly limited, but may be an ultraviolet light irradiation device for lithography, and a semiconductor 312/invention specification (supplement) for manufacturing semiconductors and liquid crystal display devices/93-05/93103730 1273624 Exposure device. When the photoresist film is formed by transfer, it is preferred to carry out the exposure step in a state where the base film overlying the photoresist film is not peeled off. (4) Photoresist film development step In this step, the exposed photoresist film is developed to form a photoresist pattern (latent image). Regarding development conditions, types of developing solutions, formulations and concentrations, development time, development temperature, development methods (for example, immersion method, rocking method, spray method, spray method, and pulverization method), developing devices, etc. may be based on the photoresist film The category of 3 1 is appropriately selected. The photoresist pattern 35 (corresponding to the pattern of the exposure mask 由) composed of the remaining portion of the photoresist 35 A and the photoresist removing portion 3 5 B is formed by the development step, as shown in Fig. 4F. The photoresist pattern 35 is used as an etching mask for the subsequent step (etching step), and the constituent material (photohardening photoresist) of the remaining portion of the photoresist must have a more etching material than the constituent material of the thin film-forming material layer 2 1 . Low dissolution rate. (5) Film-forming material layer etching step: In this step, the film-forming material layer is etched to form a barrier rib pattern layer corresponding to the photoresist pattern. In other words, as shown in Fig. 4G, the portion of the photoresist-removing portion 35 corresponding to the photoresist-removing material 35 of the film-forming material layer 2 is dissolved in the etching solution and selectively removed. Figure 4G shows the state during etching. When the etch is further continued, as shown in Fig. 4, a predetermined portion of the film-forming material layer 21 is completely removed, thereby exposing the dielectric layer 13. Thus, a barrier rib pattern layer 25 is formed by the remaining portion of the material layer 2 5 Α and the material layer removing portion 2 5 Β 27 312 / invention specification (supplement) / 93-05 / 93103730 1273624. The etching conditions, the type of the etching solution, the formulation and concentration, the processing time, the processing temperature, the treatment method (for example, immersion method, rocking method, spray method, spray method, and pulverization method), processing device, etc. may be based on film formation property. The type of the material layer 2 1 and the like are appropriately selected. The photoresist film 3 1 type and the film-forming material layer 2 1 are selected such that the same solution of the developing solution used in the development step is used as an etching solution. Thus, the developing step and the etching step can be continuously performed, and the manufacturing step can be reduced. Improve manufacturing efficiency. Preferably, the remaining portion of the photoresist constituting the photoresist pattern 35 is gradually dissolved by etching, and is completely removed when the barrier rib pattern layer 25 is formed (when etching is completed). Even if the remaining part or all of the remaining portion of the photoresist is 3 5 A after the engraving, the remaining portion of the photoresist is removed in the subsequent drying step. (6) Barrier rib pattern layer baking step: In this step, the barrier ribs are formed by baking the barrier rib pattern layer 25. The organic material of the remaining portion of the material layer 2 5 A is burned off to form a barrier rib. As shown in FIG. 4I, the panel material 50 having the barrier ribs 40 formed on the surface of the dielectric layer 13 is formed by the barrier ribs 40 (the barrier ribs derived from the material layer removing portions 2 5 B). It is used as a plasma working space. The drying temperature shall be the temperature at which the organic matter of the remaining portion of the material layer of 25 A is burned off, and is usually from 4 0 0 to 60 ° C. The drying time is usually 1 0 - 90 minutes. P D P Production Method (3) (Best Specific Example Using Photoresist Method) The P D P production method (3) of the present invention is not limited to the methods shown in Figs. 3 and 4. Other preferred methods of forming the P D P constituent element (P D P production method (3)) are, for example, 28 312/invention specification (supplement)/93-05/93103730 1273624, including the formation methods of the following steps (1) to (3). (1) After the photoresist film is formed on the base film, the composition containing the inorganic particles of the present invention is coated on the photoresist film, and dried to be laminated to form a film-forming material layer. When a photoresist film and a film-forming material layer are formed, a roll coater or the like can be used, so that a laminated film having an excellent uniform thickness can be formed on the base film. (2) The laminated film composed of the photoresist film and the film-forming material layer on the base film is transferred to the substrate. The transfer conditions are the same as described above in the "film-forming material layer transfer step". (3) The same operations as described in the "Photoresist film exposure step", "Photoresist film development step", "Thin film-forming material layer etching step" and "Block rib pattern layer baking step" described above are carried out. During the operation, as described above, the development solution of the preferred photoresist film is the same as the etching solution of the film-forming material layer, and the "photoresist film development step" and the "film-forming material layer etching step" are continuously performed. According to the above method, since the film-forming material layer and the photoresist film are transferred onto the entire substrate, the manufacturing efficiency can be further improved by the simplification step. PDP Process (4) (Formation of Component Using Radiation Sensitive Transfer Film) The PDP process (4) of the present invention comprises the steps of: transferring a film-forming material layer constituting the radiation-sensitive transfer film of the present invention to a substrate; Exposing the film-forming material layer to form a pattern latent image; developing the film-forming material layer to form a pattern layer; and baking the pattern layer to form a layer selected from the group consisting of barrier ribs, electrodes, resistors, dielectric layers, and phosphors , color filters and components in the black matrix. In the method, the barrier rib forming method is taken as an example, and after the "film formation 29 312 / invention specification (supplement) / 93-05/93103730 1273624 material layer transfer step", the pattern layer is based on the "barrier film" It is formed under the conditions of the exposure step and the "photoresist film development step". Subsequently, the barrier ribs are formed on the surface of the substrate by a "blocking rib pattern baking step". The method of forming the "barrier rib" as the constituent element of the P D P has been explained in the explanation of the individual steps of the P D P method (1) to (4). According to this method, electrodes, resistors, dielectric layers, phosphors, color filters, and black matrices constituting the PDP can be formed. The details of the present invention will be described with reference to the following examples, but it should be understood that the invention is not limited thereto. In the examples and comparative examples, all "parts" are "parts by weight". (Example) (1) Preparation of a glass paste composition (containing an inorganic particle composition) The composition of the present invention having a viscosity of 3,400 ρ (measured by a B-type viscosity meter at 30 rpm) was borrowed Prepared by method: using a dispersing mixer to knead 100 parts of P b 0 - B 2 0 3 - S i 0 2 based mixture (softening point 5000 ° C) (the composition of which contains 70% by weight of oxidation Lead, 10% by weight of boron oxide and 20% by weight of cerium oxide), 15 parts of butyl methacrylate / 2 - ethylhexyl methacrylate / hydroxypropyl methacrylate copolymer (weight ratio · · 3 0 / 6 0 / 1 0, weight average molecular weight: 1 5 0, 0 0 0 ) as a binder resin, 5 parts of diglyceryl oleate as a specific compound, 8.7 parts of propylene glycol monoterpene ether as a solvent and 1 3 Prepared by adding 1 part of ethyl 3-ethoxypropionate. (2) Manufacture and evaluation of transfer film (flexibility and handling properties): The composition of the present invention prepared as described in (1) above was coated with polyethylene terephthalate (Ρ ET ) using a knife coater. Coating formed on the base film previously subjected to release treatment (width: 400 mm, length: 30 m, thickness: 38 μm) 30 312 / invention specification (supplement) / 93-05/93103730 1273624 The film was dried at 80 ° C for 5 minutes to remove the solvent. Thus, a film of a 50 μm thick film-forming material was formed on the base film. A cover film made of PET previously subjected to release treatment (width: 400 mm, length: 30 m, thickness: 38 μm) is adhered to a film-forming material layer to produce a transfer film of the present invention, having a pattern 2 construction shown. The resulting transfer film has flexibility and is easily wound up. Further, even if the transfer film is bent, the bending does not cause cracks (bending and cracking) on the surface of the film-forming material layer, and the film-forming material layer has excellent flexibility. The cover film is peeled off by the transfer film, and the transfer film (a laminate composed of the base film and the film-forming material layer) is spread on the glass substrate without pressing, so that the surface of the film-forming material layer contacts the surface of the glass substrate Then, the transfer film is peeled off from the surface of the glass substrate. As a result, the film-forming material layer showed appropriate adhesion to the glass substrate, and the transfer film could be peeled off without causing agglomeration of the film-forming material layer. Therefore, the transfer film has good handling properties. (3) Transfer of the film-forming material layer to the cover film After the transfer film obtained by the above (2) is peeled off, the transfer film (a laminate composed of the base film and the film-forming material layer) is spread on 2 On the glass substrate of the panel, the surface of the film-forming material layer is brought into contact with the surface of the glass substrate (the busbar electrode fixing surface), and is heated and bonded under heating using a heating roller. The pressure bonding conditions include a heating roller surface temperature of 90 ° C, a roller pressure of 2 kg/cm 2 , and a heating roller moving speed of 0,6 m/min. After the pressure bonding is completed by heating, the base film is peeled off, and the film-forming material layer which is fixed (heat-adhesively fixed) to the surface of the glass substrate is removed, whereby the transfer of the film-forming material layer is completed. In the present transfer step, when the base film is peeled off, the film formation property of the film layer is not caused, and the film strength of the film layer is high enough. Further, the film-forming material layer after transfer has good adhesion to the surface of the glass substrate. (4) Baking of the film-forming material layer (generation of the dielectric layer): The glass substrate on which the film-forming material layer has been transferred as shown in (3) is placed in the kiln, by raising the temperature inside the kiln to Bake dry at 6 2 ° C to form a non-colored transparent dielectric layer made of sintered glass material on the surface of the glass substrate. The thickness of the dielectric layer (average thickness and tolerance) was determined to be in the range of 30 μm ± 0.4 μm. Such a dielectric layer has excellent thickness uniformity. The surface of the obtained dielectric layer was subjected to three-dimensional measurement using a non-contact thickness gauge (N Η - 3, manufactured by R y 〇k 〇sha Co., Ltd.), and the surface roughness was measured according to JIS standard (B 0 6 0 1 ). Degree (R a, R y, R z ). As a result, the dielectric layer has R a = 0.08 μm, R y is 0.25 μm and R z = 0 , 28 μm, so that it has excellent surface flatness. Further, the light transmittance (measurement wavelength ··500 nm) of the dielectric layer thus obtained was measured and found to be 93%. This confirms that the dielectric layer has good transparency. (Comparative Example) A composition having a viscosity of 3,0 0 cp (measured using a B-type viscometer at 30 rpm) was prepared in the same manner as in the examples, except that the ratio of the binder resin was changed to 17 parts, and 4 was used. A portion of azelaic acid-di-2-ethylhexyl ester is substituted for this particular compound. Using the obtained composition, the transfer film was produced and evaluated in the same manner as in the examples. As a result, the transfer film has excellent flexibility and handling properties. However, the dielectric layer was fabricated in the same manner as in the examples, and the surface roughness (R a, R y, R z ) was measured. As a result, the dielectric layer has R a Ο . 65 μm, R y = 2.51 μm and R z 1.7 μm, so the surface flatness is inferior. 32 312/Invention Description (Supplement)/93-05/93103730 1273624 The composition of the present invention can obtain the following effects. (1) It is suitable to form P D P constituent elements (e.g., barrier ribs, electrodes, resistors, dielectric layers, phosphors, color filters, and black matrices) having excellent surface flatness. (2) It is suitable to form a sintered frit having a high light transmittance (e.g., a dielectric layer or barrier rib constituting P D P). (3) A transfer film having excellent flexibility in terms of a film-forming material layer can be produced. (4) A transfer film having excellent transfer ability (heat-bonding to a substrate) in terms of a film-forming material layer can be produced. The transfer film of the present invention can attain the following advantages. (1) It is effective to form a constituent element (particularly a dielectric layer) having excellent surface roughness of P D P . (2) The film-forming material layer is excellent in flexibility, and the surface of the film-forming material layer does not contain a crack (crack). (3) Excellent softness and easy to take up. (4) Adhesiveness and handling properties are good for the film-forming material layer. (5) It is excellent in transferability (heat bonding to the substrate) in terms of the film-forming material layer. The production method of the present invention can obtain the following effects. (1) Effective formation of P D P constituent elements (e.g., barrier ribs, electrodes, resistors, dielectric layers, phosphors, color filters, and black matrix) having excellent surface flatness. (2) A PDP having a high positional accuracy of constituent elements can be effectively formed. (3) It is effective to form a dielectric layer having a large thickness. 33 312/Invention Manual (Supplement)/93-05/93103730 1273624 (4) The dielectric layer required for a large-sized panel can be effectively formed. (5) P D P can be effectively formed which is provided with a dielectric layer having excellent thickness uniformity and surface flatness. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the cross-sectional shape of an AC type plasma display panel. 2A is a schematic cross-sectional view showing a transfer film of the present invention; and FIG. 2B is a cross-sectional view showing a layered composition of the transfer film. 3A to E are schematic cross-sectional views showing the steps (transfer step, photoresist film forming step, and exposure step) for forming barrier ribs in the process of the present invention. Fig. 4 F to I are schematic cross-sectional views showing the steps (developing step, etching step, and baking step) for forming barrier ribs in the process of the present invention. (Description of component symbols) 1 Glass substrate 2 Glass substrate 3 Barrier rib 4 Transparent electrode 5 Bus bar electrode 6 Addressing electrode 7 Fluorescent material 8 Dielectric layer 9 Dielectric layer 10 Protective layer 11 Glass substrate 12 Electrode 13 Dielectric layer 34 312 /Invention Manual (Supplement)/93-05/93103730 1273624 20 Transfer film 2 1 Film-forming material layer 22 Base film 25 Barrier rib pattern layer 2 5 A Material layer remaining portion 25B Material layer removing portion 3 1 Photoresist film 35 photoresist pattern 3 5 A photoresist remaining portion 35B photoresist removal portion 4 0 barrier rib 5 0 panel material F1 base film F 2 film-forming material layer F3 cover film 曝光 exposure cover Α 透光 light transmitting portion MB light shielding portion 35 312 /Invention manual (supplement)/93-05/93103730

Claims (1)

t 94. 12. 2 6 Replacement, patent application scope: 1. A composition containing inorganic particles, comprising: (A) 1000 parts by weight of inorganic particles; (B) 5 to 80 parts by weight Acrylic resin; and (C) from 0 to 20 parts by weight of the compound represented by the formula (I): OH I WO+CHrCH-CIVO-VH (I) Wherein R1 represents a group represented by -C0-A, wherein A represents an alkyl group having 9 to 18 carbon atoms or an alkenyl group having 9 to 18 carbon atoms, and η is an integer of 2 to 20. 2. The composition containing inorganic particles according to item 1 of the patent application further contains (D) - a light-sensitive component. 3. The composition containing inorganic particles according to claim 1, wherein the compound (C) represented by the formula (I) is at least one selected from the group consisting of monolaurin monoglyceride and monostearic acid diglycerin. A group consisting of monooleic acid diglyceride and monooctanoic acid diglycerol. A transfer film comprising a film-forming material layer obtained by the composition containing inorganic particles of the first aspect of the patent application. A transfer film comprising a film-forming material layer obtained by the composition containing inorganic particles of the second aspect of the patent application. A transfer film comprising a laminate of a photoresist film and a film-forming material layer obtained by the composition containing inorganic particles of the first aspect of the patent application. 7. A method of manufacturing a plasma display panel, the method comprising the steps of: transferring a composition containing inorganic particles according to item 1 of the patent application scope 36 326\total file\93\93103730\93103730 (replacement)-1 1273624 The film-forming material layer obtained by the object is applied to the surface of the substrate, and the transferred film-forming material layer is baked to form a dielectric layer on the substrate. 8. A method of manufacturing a plasma display panel, the method comprising the steps of: transferring a film-forming material layer obtained by the composition containing inorganic particles of claim 1 of the patent application to a surface of a substrate; forming a photoresist The film is formed on the film-forming material layer after the transfer; the photoresist film is exposed to form a latent image of the photoresist pattern; the photoresist film is developed to form a photoresist pattern; and the film-forming material layer is etched to form a photoresist pattern corresponding to the photoresist pattern a pattern layer; and baking the pattern layer to form a constituent element selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, a color filter, and a black matrix. 9. A method of manufacturing a plasma display panel, the method comprising the steps of: forming a photoresist film and laminating a film of a film-forming material layer obtained from the composition containing inorganic particles of claim 1 in a base film Transferring the laminated film formed on the base film to the surface of the substrate; exposing the photoresist film constituting the laminated film to form a latent image of the photoresist pattern; developing the photoresist film to form a photoresist pattern; etching film formation property a material layer to form a pattern layer corresponding to the photoresist pattern; and baking the pattern layer to form a component selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, a color filter, and a black matrix . A manufacturing method of a plasma display panel, comprising the steps of: transferring a film-forming material layer obtained from the composition containing inorganic particles of claim 2 to the surface of the substrate; and exposing the film Forming a material layer to form a pattern latent image; developing the film-forming material layer to form a pattern layer; and baking the pattern layer to form a layer selected from the group consisting of a barrier rib, an electrode, a resistor, a dielectric layer, a phosphor, and a color filter In the light film and black matrix, 37 326\total file\93\93103730\93103730 (replace Η 1273624 to form components. 326\Total file\93\93103730\93103730 (replace)-1 38