JP2003051250A - Manufacturing method of plasma display panel and transfer film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a plasma display panel where manufacturing efficiency and workability is superior, adhesiveness in a developing treatment is superior and patterning property is superior, and to provide a new transfer film superior in the manufacturing efficiency, the patterning property and the workability. SOLUTION: The manufacturing method of the plasma display panel is provided, where the calcining treatment is carried out after a laminated layer of a non-photosensitive inorganic powder containing resin layer and of a photosensitive inorganic powder containing resin layer is formed on a substrate, and exposure/development processing of the photosensitive inorganic powder resin layer is carried out to form a pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a high manufacturing efficiency and an excellent patterning property in forming a panel material constituting a plasma display panel. The present invention relates to a method for manufacturing a plasma display panel and a transfer film that can improve workability.

[0002]

2. Description of the Related Art Plasma display panel (PDP)
Is a flat panel display technology that is easy to manufacture even though it is a large panel, has a wide viewing angle, and is a self-luminous type with high display quality. Display panels are expected to become mainstream in the future as display devices for wall-mounted TVs of 20 inches or more. Color PDP
The color display becomes possible by irradiating the phosphor with ultraviolet rays generated by gas discharge. Generally, in a color PDP, a phosphor portion for red light emission, a phosphor portion for green light emission, and a phosphor portion for blue light emission are formed on a substrate, so that light emitting display cells of each color are entirely formed. It is configured in a uniformly mixed state. Specifically, a partition made of an insulating material called a barrier rib is provided on the surface of a substrate made of glass or the like, and a large number of display cells are partitioned by this partition, and the inside of the display cell is affected by plasma action. Become a space. Further, a phosphor portion is provided in the plasma action space, and an electrode that causes a plasma to act on the phosphor portion is provided, so that a plasma display panel having each display cell as a display unit is configured.

FIG. 1 is a schematic view showing the cross-sectional shape of an AC PDP. In the figure, 1 and 2 are glass substrates which are arranged opposite to each other, 3 is a partition wall, and cells are defined by the glass substrate 1, the glass substrate 2 and the partition wall 3. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode for the purpose of lowering the resistance of the transparent electrode,
6 is an address electrode fixed to the glass substrate 2, 7 is a phosphor held in the cell, 8 is a dielectric layer formed on the surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, Reference numeral 9 is a dielectric layer formed on the surface of the glass substrate 2 so as to cover the address electrodes 6, and 10 is a protective film made of, for example, magnesium oxide. In addition, DC type PD
In P, a resistor is usually provided between the electrode terminal (anode terminal) and the electrode lead (anode lead). Also PD
In order to improve the P contrast, red, green, and blue color filters or a black matrix may be provided between the dielectric layer 8 and the protective film 10 or the like.

As a method of manufacturing a panel material in such a plasma display panel, (1) a method such as an ion sputtering method or an electron beam evaporation method, or (2) an inorganic powder-containing resin layer formed by a screen printing method or the like is used. Known methods include firing and removing organic substances.
Each panel material usually has the above (1) or (2).
It is formed by repeating the above method.

[0005]

However, the above method (1) has the problems that a large vacuum facility is required and the throughput in the process is slow. Therefore, the method (2) is usually used for most panel materials. However, even in the method (2), at least the formation of the inorganic powder-containing resin layer and the firing are repeated, so that the manufacturing efficiency is improved. In terms of, it was not enough. Further, in forming a high-definition pattern, a patterning method of an inorganic powder-containing resin layer by a photolithography method including exposure and development treatment is known. There is a problem that the pattern is easily peeled off. A first object of the present invention is to provide a method of manufacturing a plasma display panel which is excellent in manufacturing efficiency in forming a panel material having an inorganic pattern on an inorganic layer. The second object of the present invention is to
It is an object of the present invention to provide a method for manufacturing a plasma display panel, which has good adhesiveness during development processing and is excellent in patterning properties. A third object of the present invention is to provide a method of manufacturing a plasma display panel with excellent workability. A fourth object of the present invention is to provide a novel transfer film excellent in manufacturing efficiency, patterning property and workability.

[0006]

A method of manufacturing a plasma display panel according to the present invention is characterized in that a pattern is formed on an inorganic film by a method including the following steps (i) to (iii). (I) A non-photosensitive first inorganic powder-containing resin layer is formed on a substrate, and a photosensitive second inorganic powder-containing resin layer is formed on the first inorganic powder-containing resin layer. Process. (Ii) exposing and developing the second inorganic powder resin layer,
A step of forming a pattern of the second resin layer containing inorganic powder. (Iii) A step of firing the patterns of the first inorganic powder-containing resin layer and the second inorganic powder-containing resin layer formed on the first inorganic powder-containing resin layer. Further, the transfer film of the present invention comprises a support film, a photosensitive inorganic powder-containing resin layer containing an alkali-soluble resin component, and a non-photosensitive inorganic powder containing an alkali-insoluble or sparingly soluble resin component. A laminated film including a body-containing resin layer is formed.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below. <Plasma Display Panel Manufacturing Method> In the plasma display panel manufacturing method of the present invention,
[1] First inorganic powder-containing resin layer forming step, [2] Second inorganic powder-containing resin layer forming step, [3] Exposure step,
A pattern is formed on the inorganic film by a method including a developing step [4] and a baking step [5]. According to the method for manufacturing a plasma display panel of the present invention, it is particularly preferable to form a panel material having a pattern such as partition walls, electrodes, resistors, phosphors, color filters, and black matrix formed on the dielectric layer. it can.

[1] Step of forming first inorganic powder-containing resin layer The first inorganic powder-containing resin layer has a structure in which a non-photosensitive inorganic powder-containing resin layer is formed on a support film. It is preferably formed by using a transfer film and transferring the inorganic powder-containing resin layer onto the substrate. According to such a forming method, the first inorganic powder-containing resin layer having excellent film thickness uniformity can be easily formed, and the film thickness of the formed pattern can be made uniform. Furthermore, by repeating transfer n times using the above transfer film,
You may form the laminated body which has the 1st inorganic powder containing resin layer of a layer (n shows an integer greater than or equal to 2). Alternatively, the laminate may be formed by collectively transferring the laminate including the n-layer first resin layer containing the inorganic powder onto a substrate using a transfer film formed on a support film. An example of the transfer process is as follows. After peeling off the protective film layer of the transfer film used as necessary, the transfer film is superposed on the surface of the substrate so that the surface of the resin layer containing the inorganic powder is in contact, and the transfer film is heated by a heating roller. After thermocompression bonding by, for example, the support film is peeled off from the inorganic powder-containing resin layer. As a result, the resin layer containing the inorganic powder is transferred to the surface of the substrate to be in close contact with it. Here, as the transfer conditions, for example, the surface temperature of the heating roller is 40 to 140 ° C., the roll pressure by the heating roller is 0.1 to 10 kg / cm, and the moving speed of the heating roller is 0.1 to 10 m / min. be able to. The substrate may be preheated, and the preheating temperature is, for example, 40 to
It can be 140 ° C. In addition, a method of coating a non-photosensitive inorganic powder-containing resin composition on a substrate by various methods such as a screen printing method, a roll coating method, a spin coating method, a cast coating method, and then drying the coating film. Thus, the first inorganic powder-containing resin layer can also be formed. In addition, you may form the laminated body of n layers by repeating the said process n times.

[2] Step of forming second inorganic powder-containing resin layer The second inorganic powder-containing resin layer has a structure in which a photosensitive inorganic powder-containing resin layer is formed on a support film. It is preferably formed by transferring a second inorganic powder-containing resin layer onto the first inorganic powder-containing resin layer using a film. Further, by repeating transfer n times using the above transfer film, n layers (n represents an integer of 2 or more)
You may form the laminated body which has the said 2nd inorganic powder containing resin layer. Alternatively, the laminate may be formed by collectively transferring the laminate including the n-layer second inorganic powder-containing resin layer onto a substrate using a transfer film formed on a support film. As the transfer condition of the second inorganic powder-containing resin layer, the same condition as in the step [1] of forming the first inorganic powder-containing resin layer can be used. Further, after coating the photosensitive inorganic powder-containing resin composition on the first inorganic powder-containing resin layer by various methods such as screen printing, roll coating, spin coating, and cast coating. ,
The second inorganic powder-containing resin layer can also be formed by a method of drying the coating film. In addition, you may form the laminated body of n layers by repeating the said process n times.

Further, in the step of forming the resin layer in the above [1] and [2], a laminated film of the second inorganic powder-containing resin layer and the first inorganic powder-containing resin layer is formed on the support film. It is more preferable that the laminated film is transferred onto a substrate by using the transfer film thus formed to collectively form the resin layer and the second inorganic powder-containing resin layer. According to such a forming method, the inorganic powder-containing resin layer having excellent film thickness uniformity can be formed more easily, the pattern shape can be improved, and the process can be simplified. In addition, the above laminated body is obtained by collectively transferring onto a substrate a laminated body composed of independent n-layer first and / or second inorganic powder-containing resin layers using a transfer film formed on a support film. May be formed. In addition,
The transfer conditions may be the same as those in the step [1] of forming the first inorganic powder-containing resin layer.

[3] Exposure Step In this step, the surface of the photosensitive second inorganic powder-containing resin layer is selectively irradiated (exposed) with radiation such as ultraviolet rays through an exposure mask, Form a latent image of the pattern. Here, as the radiation irradiation device, an ultraviolet irradiation device used in the photolithography method, an exposure device used when manufacturing a semiconductor and a liquid crystal display device, and the like are used, but are not particularly limited. Absent.

[4] Development Step In this step, the exposed second inorganic powder-containing resin layer is subjected to a development treatment to form a second inorganic powder-containing resin layer on the first inorganic powder-containing resin layer. A pattern of the resin layer is formed. Here, as the development processing conditions, depending on the type of the second inorganic powder-containing resin layer, the type / composition / concentration of the developer,
The developing time, the developing temperature, the developing method (for example, the dipping method, the rocking method, the shower method, the spray method, the paddle method, etc.), the developing device and the like can be appropriately selected.

[5] Baking Step In this step, the first inorganic powder-containing resin layer and the second inorganic powder-containing resin layer pattern formed on the first inorganic powder-containing resin layer are collectively packaged. The organic substance in the first and second inorganic powder-containing resin layers (residual part) is burned off by firing to form an inorganic pattern on the inorganic film. Here, the temperature of the firing treatment needs to be a temperature at which the organic substance in the inorganic powder-containing resin layer (residual portion) is burned off, and is usually 400 to 600 ° C. Also,
The firing time is usually 10 to 90 minutes.

The materials used in the above steps and various conditions will be described below. <Substrate> Examples of the substrate material include glass, silicone, polycarbonate, polyester, aromatic amide,
A plate-shaped member made of an insulating material such as polyamide-imide or polyimide may be used. If necessary, the surface of the plate-shaped member may be subjected to chemical treatment with a silane coupling agent or the like; plasma treatment; thin film formation treatment such as ion plating, sputtering, vapor phase reaction, or vacuum deposition. Such an appropriate pretreatment may be performed.
In the present invention, it is preferable to use glass having heat resistance as the substrate. As a glass substrate,
For example, PD200 manufactured by Asahi Glass Co., Ltd. can be mentioned as a preferable example.

<First Inorganic Powder-Containing Resin Layer> The first inorganic powder-containing resin layer used in the production method of the present invention is a paste-like inorganic material containing inorganic powder, a binder resin and a solvent. It can be formed by applying the powder-containing resin composition and drying the coating film to remove a part or all of the solvent. The transfer film preferably used in the production method of the present invention is obtained by applying the above-mentioned inorganic powder-containing resin composition on a support film and drying it to form a first inorganic powder-containing resin layer. A protective film layer may be provided on the surface of the inorganic powder-containing resin layer. The first inorganic powder-containing resin layer used in the manufacturing method of the present invention is preferably a dielectric material layer.

(1) First Inorganic Powder-Containing Resin Composition The first inorganic powder-containing resin composition of the present invention comprises a non-photosensitive material containing inorganic powder, a binder resin and a solvent as essential components. It is a composition.

(A) Inorganic powder The inorganic powder used in the first resin composition containing an inorganic powder contains a glass frit for forming a dielectric layer, although it depends on the type of pattern material to be formed. Preferably. Examples of the composition of the glass frit include lead oxide, boron oxide, and silicon oxide (PbO-B).
₂ O ₃ -SiO ₂ based mixture, zinc oxide, boron oxide, silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ based) mixture, lead oxide, boron oxide, silicon oxide, aluminum oxide (PbO-B ₂ Examples thereof include a mixture of O ₃ —SiO ₂ —Al ₂ O ₃ system), a mixture of lead oxide, zinc oxide, boron oxide, and silicon oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ system). In addition to the above, a glass frit having a composition suitable for forming a dielectric layer of a plasma display can be used.

The softening point of glass frit is usually
It is in the range of 400 to 600 ° C. When the softening point of the glass frit is lower than 400 ° C., the organic material such as the binder resin contained in the first inorganic powder-containing resin layer is completely removed in the firing step of the plasma display panel manufacturing method of the present invention. Since the glass frit melts at a stage where it is not decomposed and removed, part of the organic substance remains in the formed dielectric layer, and as a result, the dielectric layer is colored and its light transmittance is reduced. Tend. On the other hand, when the softening point of the glass frit exceeds 600 ° C, 600
Since it is necessary to bake at a temperature higher than ℃, the glass substrate is likely to be distorted. The softening point of the glass frit is preferably 450 to 550 ° C. in order to form a dielectric layer having a high light transmittance.

Average particle diameter of glass frit (median diameter)
Usually, those having a thickness of 0.1 to 10 μm are used, but the thickness is preferably 1.0 to 3.0 μm. When the average particle size of the glass frit is less than 1.0 μm, the plasticity of the first inorganic powder-containing resin layer in the transfer film, which is preferably used in the production method of the present invention formed by using the obtained composition, is improved. It cannot be improved enough. If the average particle size of the glass frit exceeds 3.0 μm, the uniformity of the formed dielectric layer may be impaired. The average particle size of the glass frit is more preferably 1.5 to 3.0 μm. Here, the “average particle size of the glass frit” refers to a value obtained from the particle size measured by the laser diffraction scattering method.

(A) The content of the glass frit in the inorganic powder is usually 80 to 1 in 100 parts by mass of the inorganic powder.
In addition to glass frit, the inorganic powder may contain any inorganic powder such as metal, inorganic pigment, ceramics, etc.

(B) Binder Resin The binder resin in the first resin layer containing inorganic powder is preferably an acrylic resin. By containing the acrylic resin as the binder resin, the transfer film preferably used in the production method of the present invention has excellent (heat) adhesion to the substrate. Therefore, when the transfer film is produced by applying the first inorganic powder-containing resin composition onto the support film, the obtained transfer film has a transfer property of the first inorganic powder-containing resin layer (to the substrate). It has excellent heat adhesion). As the acrylic resin constituting the first inorganic powder-containing resin composition, the inorganic powder can be bound with appropriate adhesiveness, and the film-forming material is baked (400 ° C to 600 ° C). Selected from among the (co) polymers which are completely oxidised and removed by. The acrylic resin is preferably an alkali-insoluble or sparingly alkali-soluble resin. The term "alkali-insoluble or sparingly alkali-soluble" as used herein means that under the developing conditions of the second inorganic powder-containing resin layer in the present invention, only the acrylic resin is used instead of the second inorganic powder-containing resin layer. When the used coating is developed, it means that 50% or more, particularly preferably 90% or more of the initial film thickness of the coating remains after development. The acrylic resin includes a homopolymer of a (meth) acrylate compound represented by the following general formula (1), a copolymer of two or more kinds of (meth) acrylate compounds represented by the following general formula (1), And a copolymer of a (meth) acrylate compound represented by the following general formula (1) and a copolymerizable monomer.

[0022]

[In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents a monovalent organic group. ]

Specific examples of the (meth) acrylate compound represented by the above general formula (i) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl ( (Meth) acrylate, isobutyl (meth)
Acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) Acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) Alkyl (meth) acrylates such as acrylate and isostearyl (meth) acrylate; hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3 Hydroxyalkyl (meth) acrylates such as hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate; phenoxyethyl (meth) acrylate, 2 Phenoxyalkyl (meth) acrylates such as -hydroxy-3-phenoxypropyl (meth) acrylate; 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxy. Alkoxyalkyl (meth) acrylates such as ethyl (meth) acrylate and 2-methoxybutyl (meth) acrylate; polyethylene glycol mono (meth) acrylate and ethoxydiethylene. Recall (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (Meth) acrylate,
Polyalkylene glycol (meth) acrylates such as nonylphenoxy polypropylene glycol (meth) acrylate; cyclohexyl (meth) acrylate, 4
-Butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, tricyclodeca Examples thereof include cycloalkyl (meth) acrylates such as nyl (meth) acrylate; benzyl (meth) acrylate and tetrahydrofurfuryl (meth) acrylate.

Of these, in the above general formula (1), R ²
The group represented by is preferably a group containing an alkyl group or an alkoxyalkyl group, and particularly preferable (meth) acrylate compounds are butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and lauryl (meth) acrylate. , Isodecyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate. The other copolymerizable monomer is not particularly limited as long as it is a compound copolymerizable with the (meth) acrylate compound, and examples thereof include (meth)
Unsaturated carboxylic acids such as acrylic acid, vinyl benzoic acid, maleic acid, vinyl phthalic acid; vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-
Examples thereof include vinyl group-containing radically polymerizable compounds such as methylstyrene, butadiene, and isoprene. In the acrylic resin constituting the first inorganic powder-containing resin composition,
The copolymerization component derived from the (meth) acrylate compound represented by the general formula (i) is usually 70% by mass or more, preferably 90% by mass or more. In the general formula (1),
An acrylic resin containing 50% or more, particularly preferably 80% or more, of a copolymerization component derived from a (meth) acrylate compound in which the group represented by R ² is a group containing an alkyl group or an oxyalkylene group is more preferable. Specific examples of particularly preferable acrylic resins include polymethylmethacrylate, polybutylmethacrylate, and methylmethacrylate-butylmethacrylate copolymer.

The molecular weight of the acrylic resin constituting the first resin composition containing inorganic powder is the weight average molecular weight in terms of polystyrene by GPC (hereinafter, also referred to as "Mw").
Is preferably 4,000 to 300,000, and more preferably 10,000 to 200,000. The content ratio of the binder resin in the first inorganic powder-containing resin composition is as follows:
The amount is preferably 5 to 50 parts by mass, more preferably 5 to 25 parts by mass. If the proportion of the binder resin is too small, the inorganic powder cannot be securely bound and held, while if the proportion is too large, it becomes difficult to remove the organic component during firing. Become.

(C) Solvent As the solvent constituting the first resin composition containing inorganic powder, the solvent having good affinity with inorganic powder such as glass frit and good solubility of binder resin and containing inorganic powder is included. It is preferable that the resin composition can impart appropriate viscosity to the resin composition and can be easily evaporated and removed by being dried.
Further, as particularly preferable solvents, ketones, alcohols and esters having a normal boiling point (boiling point at 1 atmosphere) of 100 to 200 ° C. (hereinafter, these are “specific solvents”)
Say. ) Can be mentioned.

Specific examples of the specific solvent include ketones such as diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone; n-pentanol, 4
-Alcohols such as methyl-2-pentanol, cyclohexanol and diacetone alcohol; ether type alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether Saturated aliphatic monocarboxylic acid alkyl esters such as acetic acid-n-butyl and amyl acetate; Lactic acid esters such as ethyl lactate and lactate-n-butyl; methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, Examples thereof include ether esters such as ethyl-3-ethoxypropionate. Of these, methyl butyl ketone and Rohekisanon, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate, propylene glycol monomethyl ether acetate, ethyl 3-ethoxypropionate are preferred. These specific solvents may be used alone or in combination of two or more. Specific examples of the solvent other than the specific solvent include turpentine oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, and benzyl alcohol.

From the viewpoint of maintaining the viscosity of the first inorganic powder-containing resin composition in a suitable range, the content ratio of the solvent in the first inorganic powder-containing resin composition is an inorganic powder such as glass frit. The amount is preferably 1 to 50 parts by mass, and more preferably 5 to 40 parts by mass with respect to 100 parts by mass. The content ratio of the specific solvent to all the solvents is preferably 50% by mass or more, more preferably 70% by mass or more.

In addition to the above components, the first inorganic powder-containing resin composition may contain a silyl group-containing compound for the purpose of improving the dispersion stability of the inorganic powder. As the silyl group-containing compound, a silyl group-containing compound represented by the following general formula (2) [saturated alkyl group-containing (alkyl) alkoxysilane] is preferable.

[0031]

[Chemical 1]

(In the formula, p is an integer of 3 to 20, m is 1 to 3)
, N is an integer of 1 to 3, and a is an integer of 1 to 3. )

In the above general formula (2), p representing the carbon number of the saturated alkyl group is an integer of 3 to 20, preferably 4 to 16. Even if the saturated alkyl group-containing (alkyl) alkoxysilane having p of less than 3 is contained, sufficient flexibility may not be exhibited in the obtained layer-forming material layer. On the other hand, a saturated alkyl group-containing (alkyl) alkoxysilane having a p value of more than 20 has a high decomposition temperature, and the organic substance (the silane derivative) is not completely decomposed and removed in the firing step of the plasma display manufacturing method of the present invention. In this state, a part of the organic substance remains in the formed inorganic layer such as the dielectric layer, and as a result, the light transmittance may decrease in the case of the dielectric layer.

Specific examples of the silyl group-containing compound represented by the above general formula (2) include n-propyldimethylmethoxysilane, n-butyldimethylmethoxysilane, n-decyldimethylmethoxysilane and n-hexadecyldimethylmethoxy. Saturated alkyldimethylmethoxysilanes such as silane and n-eicosyldimethylmethoxysilane (a
= 1, m = 1, n = 1); n-propyldiethylmethoxysilane, n-butyldiethylmethoxysilane, n-decyldiethylmethoxysilane, n-hexadecyldiethylmethoxysilane, n-eicosyldiethylmethoxysilane, etc. Saturated alkyldiethylmethoxysilanes (a
= 1, m = 1, n = 2); n-butyldipropylmethoxysilane, n-decyldipropylmethoxysilane, n-
Saturated alkyldipropylmethoxysilanes such as hexadecyldipropylmethoxysilane and n-eicosyldipropylmethoxysilane (a = 1, m = 1, n = 3); n
Saturated alkyl dimethyl ethoxysilanes such as -propyl dimethyl ethoxy silane, n-butyl dimethyl ethoxy silane, n-decyl dimethyl ethoxy silane, n-hexadecyl dimethyl ethoxy silane, and n-eicosyl dimethyl ethoxy silane (a = 1, m = 2, n = 1);
Saturated alkyldiethylethoxysilanes (a = 1, m) such as n-propyldiethylethoxysilane, n-butyldiethylethoxysilane, n-decyldiethylethoxysilane, n-hexadecyldiethylethoxysilane, and n-eicosyldiethylethoxysilane. = 2, n = 2);
Saturated alkyldipropylethoxysilanes such as n-butyldipropylethoxysilane, n-decyldipropylethoxysilane, n-hexadecyldipropylethoxysilane and n-eicosyldipropylethoxysilane (a
= 1, m = 2, n = 3); n-propyldimethylpropoxysilane, n-butyldimethylpropoxysilane, n
Saturated alkyldimethylpropoxysilanes (a = 1, m = 3, n = 1) such as decyldimethylpropoxysilane, n-hexadecyldimethylpropoxysilane, and n-eicosyldimethylpropoxysilane; n-propyldiethylpropoxysilane, n-butyldiethylpropoxysilane, n-decyldiethylpropoxysilane, n-
Saturated alkyldiethylpropoxysilanes such as hexadecyldiethylpropoxysilane and n-eicosyldiethylpropoxysilane (a = 1, m = 3, n = 2); n
-Butyldipropylpropoxysilane, n-decyldipropylpropoxysilane, n-hexadecyldipropylpropoxysilane, n-eicosyldipropylpropoxysilane and other saturated alkyldipropylpropoxysilanes (a = 1, m = 3 n = 3);

N-propylmethyldimethoxysilane, n
Saturated alkylmethyldimethoxysilanes such as -butylmethyldimethoxysilane, n-decylmethyldimethoxysilane, n-hexadecylmethyldimethoxysilane, and n-eicosylmethyldimethoxysilane (a = 2, m =
1, n = 1); n-propylethyldimethoxysilane,
Saturated alkylethyldimethoxysilanes such as n-butylethyldimethoxysilane, n-decylethyldimethoxysilane, n-hexadecylethyldimethoxysilane, and n-eicosylethyldimethoxysilane (a = 2, m =
1, n = 2); n-butylpropyldimethoxysilane,
Saturated alkylpropyldimethoxysilanes such as n-decylpropyldimethoxysilane, n-hexadecylpropyldimethoxysilane, and n-eicosylpropyldimethoxysilane (a = 2, m = 1, n = 3) n-propylmethyldiethoxysilane Saturated alkylmethyldiethoxysilanes such as n-butylmethyldiethoxysilane, n-decylmethyldiethoxysilane, n-hexadecylmethyldiethoxysilane, and n-eicosylmethyldiethoxysilane (a = 2, m = 2, n = 1);
Saturated alkylethyldiethoxysilanes such as n-propylethyldiethoxysilane, n-butylethyldiethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane, and n-eicosylethyldiethoxysilane. (A = 2, m = 2, n = 2);
Saturated alkylpropyldiethoxysilanes such as n-butylpropyldiethoxysilane, n-decylpropyldiethoxysilane, n-hexadecylpropyldiethoxysilane, and n-eicosylpropyldiethoxysilane (a
= 2, m = 2, n = 3); n-propylmethyldipropoxysilane, n-butylmethyldipropoxysilane, n
Saturated alkylmethyldipropoxysilanes such as -decylmethyldipropoxysilane, n-hexadecylmethyldipropoxysilane, and n-eicosylmethyldipropoxysilane (a = 2, m = 3, n = 1); n-propyl Ethyldipropoxysilane, n-butylethyldipropoxysilane, n-decylethyldipropoxysilane, n
-Saturated alkylethyldipropoxysilanes such as hexadecylethyldipropoxysilane and n-eicosylethyldipropoxysilane (a = 2, m = 3, n = 2);
Saturated alkylpropyldipropoxysilanes such as n-butylpropyldipropoxysilane, n-decylpropyldipropoxysilane, n-hexadecylpropyldipropoxysilane, and n-eicosylpropyldipropoxysilane (a = 2, m = 3) , N = 3);

Saturated alkyltrimethoxysilanes such as n-propyltrimethoxysilane, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane and n-eicosyltrimethoxysilane (a = 3, m = 1); saturated alkyltriethoxysilane such as n-propyltriethoxysilane, n-butyltriethoxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, and n-eicosyltriethoxysilane. Class (a = 3, m = 2); n
-Propyltripropoxysilane, n-butyltripropoxysilane, n-decyltripropoxysilane, n-
Examples thereof include saturated alkyltripropoxysilanes (a = 3, m = 3) such as hexadecyltripropoxysilane and n-eicosyltripropoxysilane.
These can be used alone or in combination of two or more.

Among these, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, n-
Butyltriethoxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane, n-butyltripropoxysilane, n
-Decyltripropoxysilane, n-hexadecyltripropoxysilane and the like are particularly preferable.

The content ratio of the silyl group-containing compound in the first inorganic powder-containing resin composition is preferably 5 parts by mass or less, more preferably 100 parts by mass of the inorganic powder such as glass frit. Is 3 parts by mass or less. When the ratio of the silyl group-containing compound is too large, the viscosity increases with time when the first inorganic powder-containing resin composition obtained is stored, or a reaction occurs between the silyl group-containing compounds, This may cause the organic substance to remain after firing.

Further, in the first inorganic powder-containing resin composition, a plasticizer is contained in order to make the first inorganic powder-containing resin layer formed have good flexibility and flammability. It may have been done. As the plasticizer, a plasticizer made of a compound represented by the following general formula (3) or (4) or polypropylene glycol is preferable.

[0040]

[Chemical 2]

(In the formulae, R ³ and R ⁶ are the same or different and each represents an alkyl group having 1 to 30 carbon atoms;
⁴ and R ⁵ are the same or different methylene groups or alkylene groups having 2 to 30 carbon atoms, and s is 0.
Is a number of 5 and t is a number of 1-10. )

[0042]

[Chemical 3]

(In the formula, R ⁷ represents an alkyl group or an alkenyl group having 1 to 30 carbon atoms.)

According to the transfer film provided with the first resin layer containing the inorganic powder containing the plasticizer, even if the transfer film is bent, minute cracks (cracks) are formed on the surface of the film forming material layer.
Does not occur, and the transfer film has excellent flexibility and can be easily wound into a roll. In particular, since the plasticizer made of the compound represented by the general formula (3) or (4) is easily decomposed and removed by heat, the plasticizer in the inorganic layer obtained by firing the first inorganic powder-containing resin Will not be adversely affected.

In the above general formula (3), R³ Or R
⁶ And an alkyl group represented by ^Four Or R^Five Indicated by
The alkylene group represented by
And may be a saturated group or an unsaturated group.
Yes.

The alkyl group represented by R ³ or R ⁶ has 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, and more preferably 4 to 10 carbon atoms. When the number of carbon atoms of the alkyl group exceeds 30, the solubility of the plasticizer in the solvent may decrease, and good flexibility may not be obtained.

Specific examples of the compound represented by the above structural formula (3) include dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2-ethylhexyl azelate, dibutyl sebacate, dibutyl diglycol adipate. Can be mentioned. Preferably, n is a compound represented by 2 to 6.

In the above general formula (4), R ⁷ represents an alkyl group or an alkenyl group having 1 to 30 carbon atoms, and R ⁷
The alkyl group and alkenyl group represented by may be linear or branched, and may be a saturated group or an unsaturated group. The alkyl group or alkenyl group represented by R ⁷ has 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, and more preferably 10 to 18 carbon atoms.

Specific examples of the compound represented by the above general formula (4) include propylene glycol monolaurate and propylene glycol monooleate.

When polypropylene glycol is used as the plasticizer, the polypropylene glycol has a weight average molecular weight (Mw) of preferably 200 to 3,000, more preferably 300 to 2,000. Particularly preferred. Polypropylene glycol M
When w is less than 200, it may be difficult to form the first inorganic powder-containing resin layer having high film strength on the support film. In the transfer process performed by using the transfer film provided, when the support film is peeled from the first inorganic powder-containing resin heat-bonded to the glass substrate, the first inorganic powder-containing resin is cohesively destroyed. May occur. On the other hand, when Mw exceeds 3,000, the first inorganic powder-containing resin layer having good heat adhesion to the glass substrate may not be obtained.

The content of the plasticizer in the first resin layer containing inorganic powder is 100 parts by mass of the inorganic powder.
The amount is preferably 0.5 to 10 parts by mass, more preferably 2 to 7 parts by mass. If the amount of the plasticizer added is increased, the strength of the transfer film suitably used in the method for producing the plasma display panel of the present invention may not be maintained.

In addition to the above components, various additives such as tackifiers, surface tension regulators, stabilizers, defoamers and dispersants are optional components in the first inorganic powder-containing resin composition. It may be contained as. A fatty acid is preferably used as the dispersant. Particularly, fatty acids having 8 to 30 carbon atoms are preferable. Preferred specific examples of the above fatty acids include octanoic acid, undecyl acid, lauric acid, myristic acid, palmitic acid, pentadecanoic acid, stearic acid, arachidic acid and other saturated fatty acids; elaidic acid, oleic acid, linoleic acid, linolenic acid, arachidone. Examples thereof include acids and unsaturated fatty acids such as carboxypolycaprolactone (n = 2) monoacrylate, and these can be used alone or in combination of two or more kinds. The content ratio of the dispersant in the first inorganic powder-containing resin composition,
It is preferably 5 parts by mass or less, more preferably 3 parts by mass or less, relative to 100 parts by mass of the inorganic powder. The first inorganic powder-containing resin composition is usually a roll kneader, mixer, homomixer, or sand mill containing the above-mentioned (a) inorganic powder, (b) binder resin, (c) solvent and other organic components. It can be prepared by kneading using a kneading / dispersing machine such as. The viscosity of the first inorganic powder-containing resin composition is 100 to 10,000 m.
Pa · s ⁻¹ is preferable.

<Second Inorganic Powder-Containing Resin Layer> The second inorganic powder-containing resin layer used in the production method of the present invention contains inorganic powder, a binder resin, a solvent and a photosensitive component as essential components. It can be formed by applying the pasty inorganic powder-containing resin composition, and drying the coating film to remove a part or all of the solvent. The transfer film preferably used in the production method of the present invention is obtained by applying the above-mentioned inorganic powder-containing resin composition on a support film and drying it to form a second inorganic powder-containing resin layer. A protective film layer may be provided on the surface of the inorganic powder-containing resin layer.

(1) Second resin composition containing inorganic powder The second inorganic powder-containing resin composition in the present invention is an inorganic
Powder, binder resin, solvent and photosensitive component are essential components
It (A) Inorganic powder Inorganic used in the second inorganic powder-containing photosensitive resin composition
The powder varies depending on the type of pattern material to be formed.
As the inorganic powder used for the electrode forming material, Ag, A
Grains of u, Al, Ni, Ag-Pd alloy, Cu, Cr, etc.
I can name a child. Partition forming material and dielectric forming material
As the inorganic powder used in the material, the above-mentioned first inorganic powder
Examples of the glass frit in the body-containing resin composition include
To be As an inorganic powder used as a resistor forming material
Is RuO_TwoAnd so on. Phosphor forming material
Inorganic powder used for materials, Y for red
₂O₃:EU³⁺, Y ₂SiO_Five:EU³⁺, Y₃Al_FiveO₁₂:EU³⁺, YVO_Four:EU³⁺,
(Y, Gd) BO₃:EU³⁺, Zn₃(PO_Four)₂: For green such as Mn
Is Zn₂SiO_Four: Mn, BaAl₁₂O₁₉: Mn, BaMgAl₁₄O_{twenty three}: Mn, LaPO_Four:
(Ce, Tb), Y₃(Al, Ga)_FiveO₁₂: Y for blue, such as Tb
₂SiO_Five: Ce, BaMgAl_TenO₁₇:EU²⁺, BaMgAl₁₄O_{twenty three}:EU²⁺, (C
a, Sr, Ba)_Ten(PO_Four)₆Cl₂:EU²⁺, (Zn, Cd) S: Ag, etc.
You can get it. Used as a color filter forming material
For inorganic powders, Fe for red ₂O₃, Pb₃O_FourNa
But for green, Cr₂O₃For blue, 2 (Al₂N
a₂Si₃O_Ten) ・ Na₂S_FourAnd so on. Black
As an inorganic powder used as a matrix forming material
Is a metal such as Ni, Ti, Cu, Mn, Fe, Cr, Co, metal oxide
Products, Cu-Cr, Cu-Fe-Mn, Cu-Cr-Mn, Co-Cr-Fe, Co-Fe-Mn
Such as complex metal oxides, carbon black, etc.
be able to. As the average particle size of these inorganic powders,
Preferably 0.01-10 μm, more preferably 0.0
It is 5 to 5 μm. The average particle size of the inorganic powder is 0.01 μm
If it is less than, the specific surface area of the inorganic powder may be large.
Et al., The aggregation of particles in the second photosensitive resin composition containing inorganic powder
Is likely to occur, making it difficult to obtain a stable dispersed state.
Become On the other hand, when the average particle size of the inorganic powder is 10 μm or more,
In that case, it becomes difficult to obtain a high-definition pattern. Also,
Poles, resistors, phosphors, color filters, black mats
In addition to the above-mentioned inorganic powders, the lix forming material includes
Contains glass frit used for barrier ribs and dielectric layers
May be done. Inorganic powder for obtaining these panel materials
The content of the glass frit in the body-containing resin composition,
80% by mass or less based on the total amount of the inorganic powder, preferably 50
It is not more than mass%.

(B) Binder Resin Various resins can be used as the binder resin constituting the second inorganic powder-containing photosensitive resin composition, and the alkali-soluble resin is 30 to 100% by weight. It is preferable to use a resin contained in a ratio. Here, "alkali-soluble" is dissolved by an alkaline etching solution,
It means the property of being soluble to the extent that the intended etching treatment is performed. Specific examples of such alkali-soluble resins include (meth) acrylic resins, hydroxystyrene resins, novolac resins, polyester resins and the like. Among such alkali-soluble resins, particularly preferable are copolymers of the following monomers (a) and (c), monomers (a), (b) and (c): Acrylic resins such as

Monomer (a): Carboxyl group-containing monomers Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth)) Acryloyloxyethyl), ω-carboxy-polycaprolactone mono (meth) acrylate and the like. Monomer (b): OH-containing monomers Hydroxy group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 3-hydroxypropyl (meth) acrylate;
o-hydroxystyrene, m-hydroxystyrene, p
-Phenolic hydroxyl group-containing monomers such as hydroxystyrene. Monomer (c): Other copolymerizable monomers methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylic acid (meth) acrylic acid esters other than the monomer (a) such as n-lauryl, benzyl (meth) acrylate, glycidyl (meth) acrylate, and dicyclopentanyl (meth) acrylate; styrene, α-methylstyrene, etc. Aromatic vinyl monomers; conjugated dienes such as butadiene and isoprene; polystyrene, methyl poly (meth) acrylate,
Macromonomers having a polymerizable unsaturated group such as a (meth) acryloyl group at one end of a polymer chain such as poly (meth) acrylate, benzyl poly (meth) acrylate, etc.

The above-mentioned copolymer of the monomer (a) and the monomer (c), or the copolymer of the monomer (a), the monomer (b) and the monomer (c) is a copolymer component derived from the monomer (a). Due to the presence of, it becomes alkali-soluble. Among them, the copolymers of the monomer (a), the monomer (b) and the monomer (c) are particularly preferable from the viewpoint of dispersion stability of the inorganic particles (A) and solubility in an alkaline developer described later. The content of the copolymerization component derived from the monomer (a) in this copolymer is preferably 5 to 60% by mass, particularly preferably 10 to 40% by mass, and the content of the copolymerization component derived from the monomer (B) is The content is preferably 1
˜50% by mass, particularly preferably 5 to 30% by mass.

As the molecular weight of the alkali-soluble resin, Mw is preferably 5,000 to 5,000,000, more preferably 10,000 to 300,
000. The content ratio of the binder resin in the second inorganic powder-containing photosensitive resin composition is usually 1 to 200 parts by mass, preferably 5 to 100 parts by mass, relative to 100 parts by mass of the inorganic powder. Parts by mass, particularly preferably,
It is set to 10 to 80 parts by mass.

(C) Solvent The solvent constituting the second inorganic powder-containing photosensitive resin composition provides the inorganic powder-containing photosensitive resin composition with appropriate fluidity or plasticity and good film-forming property. The same kind as the solvent in the above-mentioned (1) first inorganic powder-containing resin composition contained for imparting can be used. The content ratio of the solvent in the second inorganic powder-containing photosensitive resin composition can be appropriately selected within a range where good film forming property (fluidity or plasticity) can be obtained. (D) Photosensitive component Examples of the photosensitive component that constitutes the second inorganic powder-containing resin composition include (a) a combination of a polyfunctional monomer and a photopolymerization initiator, and (b) a melamine resin and a light. A combination with a photoacid generator that forms an acid upon irradiation can be exemplified as a preferable example, and among the combinations of (a) above, a combination of a polyfunctional (meth) acrylate and a photopolymerization initiator is particularly preferable. preferable.

Specific examples of the polyfunctional (meth) acrylate constituting the photosensitive component include alkylene glycol di (meth) acrylates such as ethylene glycol and propylene glycol; polyalkylene glycols such as polyethylene glycol and polypropylene glycol. Di (meth) acrylates; both-end hydroxypolybutadiene, both-end hydroxypolyisoprene, both-end hydroxylated polymer di (meth) acrylates such as both-end hydroxypolycaprolactone; glycerin,
Poly (meth) acrylates of trivalent or higher polyhydric alcohols such as 1,2,4-butanetriol, trimethylolalkane, tetramethylolalkane, pentaerythritol, and dipentaerythritol; polyalkylenes of trivalent or higher polyhydric alcohols Poly (meth) acrylates of glycol adducts; poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediol; polyester (meth) acrylate, epoxy (meth) acrylate, Examples thereof include oligo (meth) acrylates such as urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spirane resin (meth) acrylate. These may be used alone or in combination of two or more. Combination Not to be able to use.

Specific examples of the photopolymerization initiator constituting the photosensitive component include benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one and 1-hydroxy. Cyclohexyl phenyl ketone, 2,2-dimethoxy-2
-Phenylacetophenone, 2-methyl- [4 '-(methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4-
Carbonyl compounds such as morpholinophenyl) -butan-1-one; azo compounds or azide compounds such as azoisobutyronitrile and 4-azidobenzaldehyde; organic sulfur compounds such as mercaptan disulfide;
Organic peroxides such as benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide and parametric hydroperoxide; 1,3-bis (trichloromethyl) -5- (2'- Chlorophenyl) -1,3,3
5-triazine, 2- [2- (2-furanyl) ethylenyl] -4,6-bis (trichloromethyl) -1,3,5
-Trihalomethanes such as triazine; imidazole dimers such as 2,2'-bis (2-chlorophenyl) 4,5,4 ', 5'-tetraphenyl 1,2'-biimidazole. These can be used alone or in combination of two or more. The content ratio of the photosensitive component in the second inorganic powder-containing photosensitive resin composition is usually 1 to 500 parts by mass, preferably 5 to 100 parts by mass with respect to 100 parts by mass of the inorganic powder. It

In the second resin composition containing inorganic powder, a plasticizer, a dispersant, a development accelerator, and
Various additives such as an adhesion aid, an antihalation agent, a leveling agent, a storage stabilizer, a defoaming agent, an antioxidant, an ultraviolet absorber, a sensitizer and a chain transfer agent may be contained. In addition,
The silyl group-containing compound represented by the general formula (2), the plasticizer comprising the compound represented by the general formula (3) or (4), or polypropylene glycol is (1) the first inorganic powder-containing resin composition. It may be contained similarly to the thing. The second inorganic powder-containing photosensitive resin composition, the inorganic powder, the binder resin, the solvent, the photosensitive component and optionally the above optional components, roll kneader, mixer, homomixer, ball mill, bead mill It can be prepared by kneading using a kneader such as. The second inorganic powder-containing photosensitive resin composition prepared as described above,
It is a paste-like composition having fluidity suitable for coating, and its viscosity is usually 100 to 1,000,000 c.
p, preferably 500 to 300,000 cp.

<Transfer film> The transfer film of the present invention comprises a support film, a second inorganic powder-containing resin layer, and
A laminated film including a first inorganic powder-containing resin layer is formed. Further, as the other transfer film preferably used in the production method of the present invention, one having a first inorganic powder-containing resin layer formed on a support film, containing a second inorganic powder on the support film Examples thereof include those having a resin layer formed thereon, and each of these resin layers may be a laminate including n layers. The support film forming the transfer film is preferably a resin film having heat resistance and solvent resistance and flexibility. Since the support film has flexibility, the paste composition can be applied by a roll coater, and the inorganic powder-containing resin layer can be stored and supplied in a rolled state. As the resin forming the support film, for example, polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide,
Examples thereof include polyvinyl alcohol, polyvinyl chloride, fluorine-containing resins such as polyfluoroethylene, nylon, and cellulose. As the thickness of the support film,
For example, it is 20 to 100 μm.

The method for applying the resin composition containing the inorganic powder on the support film is one that can efficiently form a large-thickness (for example, 10 μm or more) coating film having excellent uniformity in film thickness. It is required that there is a specific example, and specific examples thereof include a coating method using a roll coater, a coating method using a doctor blade, a coating method using a curtain coater, a coating method using a die coater, and a coating method using a wire coater. In addition, it is preferable that the surface of the support film to which the resin composition containing an inorganic powder is applied is subjected to a release treatment. Thereby, the peeling operation of the support film can be easily performed in the transfer step described later.

The conditions for drying the coating film are, for example, 50 to
The residual ratio of the solvent after drying at 150 ° C. for about 0.5 to 30 minutes (content in the inorganic powder-containing resin layer)
Is usually within 2% by mass. The thickness of the inorganic powder-containing resin layer formed on the support film as described above varies depending on the content of the inorganic powder, the type and size of the member, etc., but is, for example, 5 to 500 μm. The protective film layer which may be provided on the surface of the inorganic powder-containing resin layer may be a polyethylene film, a polyvinyl alcohol film or the like.

<Exposure Mask> The exposure pattern of the exposure mask used in the exposure step according to the manufacturing method of the present invention varies depending on the material, but is generally 10 to 5.
It is a stripe with a width of 00 μm.

<Developer> As the developer used in the developing step according to the production method of the present invention, an alkali developer can be preferably used. Incidentally, since the inorganic powder contained in the second inorganic powder-containing resin layer is uniformly dispersed by the alkali-soluble resin, by dissolving the alkali-soluble resin as a binder in an alkaline solution and washing, The inorganic powder is also removed at the same time. Examples of the active ingredient of the alkaline developer include lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate. , Potassium dihydrogen phosphate, sodium dihydrogen phosphate,
Lithium silicate, sodium silicate, potassium silicate,
Inorganic alkaline compounds such as lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate, and ammonia; tetramethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, mono Ethylamine, diethylamine, triethylamine, monoisopropylamine,
Examples thereof include organic alkaline compounds such as diisopropylamine and ethanolamine. The alkaline developer used in the step of developing the second resin layer containing inorganic powder can be prepared by dissolving one or more of the alkaline compounds in water or the like. The concentration of the alkaline compound in the alkaline developer is usually 0.001 to 10% by weight, preferably 0.01 to 5% by weight. Incidentally, after the development processing with the alkaline developer, a washing treatment is usually carried out.

[0068]

EXAMPLES Examples of the present invention will be described below.
The present invention is not limited to these. In the following, "part" means "part by mass".

Example 1 (1) Preparation of First Inorganic Powder-Containing Resin Composition (Dielectric Forming Composition): (a) PbO-B ₂ O ₃ as Inorganic Powder
-SiO ₂ glass frit (softening point 570 ° C., average particle size 1.5 μm) 100 parts, (b) n-butyl methacrylate / n-lauryl methacrylate / 2 as binder resin
-Hydroxypropyl methacrylate = 40% by mass / 5
0% by mass / 10% by mass copolymer (weight average molecular weight: 10
20,000) 20 parts, (c) 20 parts of propylene glycol monomethyl ether as a solvent and a plasticizer,
By kneading 4 parts of propylene glycol monooleate using a disperser, the viscosity is 4,000 mPa · s ^−1.
Was prepared to prepare a first resin composition containing an inorganic powder. (2) Preparation of second photosensitive resin composition containing inorganic powder (photosensitive composition for black stripe formation): (a) Cu-Cr-based complex oxide black pigment (average particle size of 0. 3 μm) 60 parts, Bi ₂ O ₃ —O—B ₂ O ₃ —Si
O ₂ type glass frit (softening point 560 ° C., average particle size 2.
0 μm) 40 parts, (b) 2-ethylhexyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid as a binder resin = 60% by mass / 25% by mass / 15
Mass% copolymer (weight average molecular weight: 50,000) 20
Parts, (c) 20 parts of propylene glycol monomethyl ether as a solvent and (d) 20 parts of tripropylene glycol diacrylate (polyfunctional acrylate) as a photosensitive component, 2-benzyl-2-dimethylamino-1-
By mixing 5 parts of (4-morpholinophenyl) -butan-1-one (photopolymerization initiator) with a disperser, a second inorganic powder containing a viscosity of 4,000 mPa · s ⁻¹ is contained. A photosensitive resin composition was prepared. (3) Production of transfer film: A support film (width 200 mm, length 30) made of a PET film obtained by previously subjecting the first inorganic powder-containing resin composition prepared in (1) to a release treatment.
m, thickness 38 μm) with a roll coater and the coating film is dried at 100 ° C. for 5 minutes to completely remove the solvent and support the first inorganic powder-containing resin layer with a thickness of 50 μm. It was formed on the film (hereinafter referred to as "transfer film (1)"). Similarly, the second inorganic powder-containing photosensitive resin composition prepared in (2) above is subjected to a release treatment in advance to form a support film made of a PET film (width 200 mm, length 30 m,
(Thickness 38 μm) with a roll coater, the coating film is dried at 100 ° C. for 5 minutes to completely remove the solvent, and a second inorganic powder-containing resin layer having a thickness of 15 μm is formed on the support film. Formed (hereinafter referred to as "transfer film (2)").

(4) Transferring film: The transfer film (1) was superposed on the surface of the glass substrate for a 6-inch panel so that the surface of the resin layer containing the inorganic powder was brought into contact with the transfer film (1). ) Was thermocompression bonded with a heating roller. Here, as the pressure bonding condition, the surface temperature of the heating roller is 12
The temperature was 0 ° C., the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After the thermocompression bonding treatment was completed, the support film was peeled off. As a result, the first inorganic powder-containing resin layer was transferred and brought into close contact with the surface of the glass substrate. Then, the transfer film (2) is overlaid on the first inorganic powder-containing resin layer so that the surface of the second inorganic powder-containing resin layer is in contact, and the transfer film (2) is heated with a heating roller. It was thermocompression bonded. Here, as the pressure bonding conditions, the surface temperature of the heating roller is 120 ° C. and the roll pressure is 4 kg / c.
and the moving speed of the heating roller was 0.5 m / min.

(5) Exposure step of second resin layer containing inorganic powder: An exposure mask (for the second resin layer containing inorganic powder formed on the first resin layer containing inorganic powder) 200 μm
The i-line (ultraviolet ray having a wavelength of 365 nm) was irradiated from above the support film through a stripe pattern of width) by an ultra-high pressure mercury lamp. Here, the irradiation dose is 400 mJ / cm ²
And

(6) Step of developing second inorganic powder-containing resin layer: After peeling the supporting film from the second inorganic powder-containing resin layer, the second inorganic powder-containing resin layer which has been exposed to light is formed. On the other hand, 1.0 mass% sodium carbonate aqueous solution (30 ° C)
Is carried out for 30 seconds by a shower method, whereby the uncured second inorganic powder-containing resin layer not irradiated with ultraviolet rays is removed, and the first inorganic powder-containing resin A pattern of the second inorganic powder-containing resin layer could be obtained on the layer.

(7) Firing step: A glass substrate on which the pattern of the second inorganic powder-containing resin layer was formed on the first inorganic powder-containing resin layer was placed in a firing furnace at a temperature of 590 ° C. for 3 days.
Baking treatment was performed for 0 minutes. As a result, the pattern width of 2
A panel material having a black stripe of 00 μm and a height of 6 μm was obtained.

Example 2 (3) In Example 1, (3) In the production of a transfer film, the second inorganic powder-containing photosensitive resin composition prepared in (2) above is formed of a PET film which is pre-release treated. Support film (width 200mm, length 30
m, thickness 38 μm) with a roll coater and the coating film is dried at 100 ° C. for 5 minutes to completely remove the solvent and support a second inorganic powder-containing resin layer having a thickness of 15 μm. Formed on film. Furthermore, the first inorganic powder-containing resin composition prepared in (1) above was applied onto the second inorganic powder-containing resin layer using a roll coater, and the coating film was dried at 100 ° C. for 5 minutes. The transfer film of the present invention in which the solvent is completely removed and the first inorganic powder-containing resin layer having a thickness of 50 μm is formed on the second inorganic powder-containing resin layer (hereinafter, “transfer film (3)”). I got). In the film transfer step (4) in Example 1, the transfer film (3) was superposed on the surface of the glass substrate for a 6-inch panel so that the surface of the first inorganic powder-containing resin layer was brought into contact with the surface. The transfer film (3) was thermocompression bonded with a heating roller. Here, as the pressure bonding conditions, the surface temperature of the heating roller is 120 ° C., the roll pressure is 4 kg / cm, and the moving speed of the heating roller is 0.5 m.
/ Min. In the same manner as in Example 1, the second inorganic powder-containing resin layer was subjected to the exposure step, the development step and the baking step.
As a result, a panel material was obtained in which a black stripe having a pattern width of 200 μm and a height of 6 μm was formed on the surface of the glass substrate on the dielectric layer having a thickness of 25 μm.

[0075]

According to the present invention, the following effects are exhibited. (1) It is possible to provide a method for manufacturing a plasma display panel, which is excellent in manufacturing efficiency in forming a panel material having a pattern on an inorganic layer. (2) It is possible to provide a method of manufacturing a plasma display panel which has good adhesion during development processing and excellent patterning properties. (3) It is possible to provide a method for manufacturing a plasma display panel having excellent workability. (4) It is possible to provide a novel transfer film having excellent production efficiency, patterning property and workability.

[Brief description of drawings]

FIG. 1 is an explanatory sectional view showing a general PDP.

[Explanation of symbols]

1 Glass Substrate 2 Glass Substrate 3 Partition 4 Transparent Electrode 5 Bus Electrode 6 Address Electrode 7 Phosphor 8 Dielectric Layer 9 Dielectric Layer 10 Protective Film

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01J 11/02 H01J 11/02 ZF term (reference) 2H025 AA04 AA14 AB11 AB14 AB17 AC01 AD01 CB42 CC20 EA08 FA17 5C027 AA01 AA05 AA09 5C028 FF01 5C040 FA01 FA04 GB03 GB14 GC19 GD09 GF19 GG09 JA19

Claims (6)

[Claims] 1. A method of manufacturing a plasma display panel, comprising forming a pattern on an inorganic film by a method including the following steps (i) to (iii). (I) A non-photosensitive first inorganic powder-containing resin layer is formed on a substrate, and a photosensitive second inorganic powder-containing resin layer is formed on the first inorganic powder-containing resin layer. Process. (Ii) exposing and developing the second inorganic powder resin layer,
A step of forming a pattern of the second resin layer containing inorganic powder. (Iii) A step of firing the patterns of the first inorganic powder-containing resin layer and the second inorganic powder-containing resin layer formed on the first inorganic powder-containing resin layer. 2. A first inorganic powder-containing resin layer and / or a second inorganic powder-containing resin layer is formed by a method including a step of transferring an inorganic powder-containing resin layer formed on a support film. The method for manufacturing a plasma display panel according to claim 1, wherein: 3. A method comprising the step of transferring a laminated film of a second inorganic powder-containing resin layer and a first inorganic powder-containing resin layer formed on a supporting film onto a substrate, The method for producing a plasma display panel according to claim 1, wherein an inorganic powder-containing resin layer and a second inorganic powder-containing resin layer are formed. 4. The method of manufacturing a plasma display panel according to claim 1, wherein the first resin layer containing inorganic powder contains glass frit as the inorganic powder. 5. The first inorganic powder-containing resin layer contains an alkali-insoluble or sparingly soluble resin component, and the second inorganic powder-containing resin layer contains an alkali-soluble resin component. The method of manufacturing a plasma display panel according to claim 1. 6. A photosensitive resin layer containing a photosensitive inorganic powder containing an alkali-soluble resin component and a non-photosensitive inorganic powder-containing resin layer containing an alkali-insoluble or sparingly soluble resin component on a support film. A transfer film, comprising a laminated film including and.