KR20080075828A - Process for preparing a plasma display panel and transfer film - Google Patents

Abstract

A method for manufacturing a plasma display panel and a transfer film are provided to improve the throughput and a close adhesion property by forming inorganic powder containing resin pattern on an inorganic powder containing resin layer. A first inorganic powder containing resin layer of a non-photoresist property is formed on a substrate. A second inorganic powder containing resin layer of a photoresist property is formed on a corresponding first inorganic powder containing resin layer. The inorganic powder containing resin layer is exposed and developed to form a pattern of the inorganic powder containing resin layer between the first inorganic powder containing resin layer and the corresponding first inorganic powder containing resin layer. The pattern of the second inorganic powder containing resin layer is hardened. At least one portion of the first inorganic powder containing resin layer and the second inorganic powder containing resin layer is formed by using a manner including a transfer process for transferring an inorganic powder containing resin layer formed on a support film.

Description

Process for Preparing a Plasma Display Panel and Transfer Film

The present invention provides a plasma display which can substantially improve workability in comparison with a conventional method by forming a panel material constituting the plasma display panel, which has high manufacturing efficiency, excellent patterning properties, and a transfer film. A method for producing a panel and a transfer film.

Plasma display panel (PDP) is attracting attention among flat panel display technologies due to its large panel size, easy manufacturing process, wide viewing angle, and high display quality due to self-luminous type. It is expected to become the mainstream in the future as a display device for wall-mounted TVs larger than inches.

The color PDP is capable of color display by irradiating the phosphor with ultraviolet rays generated by gas discharge. In general, in the color PDP, a phosphor region for red light emission, a phosphor region for green light emission, and a phosphor region for blue light emission are formed on a substrate, whereby light emitting display cells of each color are uniformly mixed in the whole. have. Specifically, a partition wall made of an insulating material called a barrier rib is provided on a surface of a substrate made of glass or the like, and a plurality of display cells are partitioned by the partition walls, and the inside of the display cell becomes a plasma working space. . A phosphor portion is provided in the plasma working space, and an electrode for applying a plasma to the phosphor portion is provided to form a plasma display panel in which each display cell is a display unit.

1 is a schematic diagram showing a cross-sectional shape of an AC PDP. In this figure, (1) and (2) are the glass substrates which oppose, (3) are partition walls, and a cell is partitioned by the glass substrate 1, the glass substrate 2, and the partition wall 3. In FIG. (4) is a transparent electrode fixed to the glass substrate (1), (5) is a bus electrode formed on the transparent electrode for the purpose of lowering the resistance of the transparent electrode, (6) is an address electrode fixed to the glass substrate (2) (7) is a phosphor retained in the cell, (8) a dielectric layer formed on the surface of the glass substrate (1) to cover the transparent electrode (4) and the bus electrode (5), (9) the address electrode (6) The dielectric layer 10 formed on the surface of the glass substrate 2 so as to be coated is a protective film made of, for example, magnesium oxide. In the direct current type PDP, a resistor is usually provided between the electrode terminal (anode terminal) and the electrode lead (anode lead). In addition, in order to improve the contrast of the PDP, a red, green or blue color filter or black matrix may be provided between the dielectric layer 8 and the protective film 10 or the like.

In such a plasma display panel, a method for producing a panel material includes (1) an ion sputtering method, an electron beam vapor deposition method, or the like, and (2) a method of firing an inorganic powder-containing resin layer formed by a screen printing method and removing an organic substance. Etc. are known, and each panel material is usually formed by repeating the above method (1) or (2).

However, the method of said (1) has a problem that a large vacuum installation is needed, and the process throughput in a process is slow. For this reason, although the method of said (2) is normally used for most panel materials, it is sufficient in terms of manufacturing efficiency from repeating formation and baking of an inorganic powder containing resin layer at least also in the method of said (2). Couldn't say Moreover, in the formation of a high precision pattern, although the patterning method of the inorganic powder containing resin layer by the photolithographic method containing exposure and image development is known, the pattern of an inorganic powder containing resin layer is easy to peel off from an inorganic layer at the time of image development processing. Had a problem.

A first object of the present invention is to provide a method for manufacturing a plasma display panel which is excellent in manufacturing efficiency in forming a panel material having an inorganic pattern on an inorganic layer.

The 2nd object of this invention is to provide the manufacturing method of the plasma display panel which is excellent in patterning property with favorable adhesiveness at the time of image development processing.

It is a third object of the present invention to provide a method of manufacturing a plasma display panel having excellent workability.

A fourth object of the present invention is to provide a novel transfer film excellent in production efficiency, patterning property and workability.

In the present invention, a method of manufacturing a first plasma display panel (hereinafter also referred to as manufacturing method I) is to form a pattern on an inorganic film by a method including the following steps (i) to (iv). It is done.

(i) forming a non-photosensitive first inorganic powder-containing resin layer on the substrate, and forming a photosensitive second inorganic powder-containing resin layer on the first inorganic powder-containing resin layer;

(Ii) exposing and developing the second inorganic powder resin layer to form a pattern of the second inorganic powder-containing resin layer;

(Iii) The process of baking the 2nd inorganic powder containing resin layer pattern formed on the 1st inorganic powder containing resin layer and this 1st inorganic powder containing resin layer.

In the present invention, the method of manufacturing the second plasma display panel (hereinafter also referred to as "manufacturing method II") forms a pattern on the inorganic film by a method comprising the following steps (i) to (iii). It is done.

(i) forming a first inorganic powder-containing resin layer on the substrate, forming a second inorganic powder-containing resin layer on the first inorganic powder-containing resin layer, and forming a resist film on the second inorganic powder-containing resin layer. Forming process,

(Ii) exposing and developing the resist film and forming a resist pattern on the second inorganic powder-containing resin layer;

(Iii) etching the second inorganic powder resin layer and forming a second inorganic powder-containing resin layer pattern corresponding to the resist pattern on the first inorganic powder-containing resin layer,

(Iii) The process of baking the 2nd inorganic powder containing resin layer pattern formed on the 1st inorganic powder containing resin layer and this 1st inorganic powder containing resin layer.

In addition, in this invention, the 1st transfer film (henceforth "transfer film I") is the inorganic powder containing water which contains the resist layer containing alkali-soluble resin component, and alkali-soluble resin component on a support film. The laminated film which consists of an inorganic powder containing resin layer containing a ground layer and alkali-insoluble or poorly soluble resin component is formed, It is characterized by the above-mentioned.

In addition, in this invention, the 2nd transfer film (henceforth "transfer film II") is a photosensitive inorganic powder containing resin layer containing alkali-soluble resin component, and alkali insoluble or poorly soluble on a support film. A laminated film comprising a non-photosensitive inorganic powder-containing resin layer containing a resin component is formed.

According to the present invention, the following effects are exerted.

(1) The manufacturing method of the plasma display panel which is excellent in manufacturing efficiency in forming a panel material which has a pattern on an inorganic layer can be provided.

(2) The manufacturing method of the plasma display panel which is favorable in the adhesiveness at the time of image development processing, and excellent in patterning property can be provided.

(3) The manufacturing method of the plasma display panel excellent in workability can be provided.

(4) A novel transfer film excellent in manufacturing efficiency, patterning property and workability can be provided.

<Embodiment of the Invention>

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

<Method of manufacturing plasma display panel>

In the manufacturing method I of the plasma display panel of this invention, [1] the formation process of a 1st inorganic powder containing resin layer, [2] the formation process of a 2nd inorganic powder containing resin layer, [3] an exposure process, [4] 2nd A pattern is formed on an inorganic film by the method containing the image development process of an inorganic powder containing resin layer, and a [5] baking process. In the plasma display panel manufacturing method II of the present invention, after the step [2] of forming the second inorganic powder-containing resin layer, the step of forming the [2 '] resist film is performed, and the [4] second inorganic powder is further applied. The developing process of a containing resin layer becomes the developing process of a [4-1] resist film, and the etching process of a [4-2] 2nd inorganic powder containing resin layer. According to the method of manufacturing the plasma display panel of the present invention, a panel material having a pattern such as a partition wall, an electrode, a resistor, a phosphor, a color filter, a black matrix and the like can be formed particularly preferably on a dielectric layer.

[1] Formation process of first inorganic powder-containing resin layer

It is preferable to form the 1st inorganic powder containing resin layer by using the transfer film which has a structure in which the inorganic powder containing resin layer was formed on the support film, and transferring the said inorganic powder containing resin layer on a board | substrate. According to such a formation method, the 1st inorganic powder containing resin layer excellent in film thickness uniformity can be formed easily, and the film thickness uniformity of the pattern formed can be aimed at. Moreover, by repeating n times transfer using the said transfer film, the laminated body which has the 1st inorganic powder containing resin layer of n layer (n represents an integer greater than or equal to 2) can be formed. Moreover, the said laminated body can be formed by carrying out collective transfer on a board | substrate using the transfer film which formed the laminated body which consists of n layer of 1st inorganic powder containing resin layers on the support film.

An example of the transfer process is as follows. After peeling the protective film layer of the transfer film used as needed, after superimposing a transfer film so that the surface of an inorganic powder containing resin layer may contact the surface of a board | substrate, and heat-compression-bonding this transfer film with a heating roller etc., The support film is peeled off from an inorganic powder containing resin layer. As a result, the inorganic powder-containing resin layer is transferred to and adhered to the surface of the substrate. Here, as transfer conditions, for example, the surface temperature of the heating roller may represent 40 to 14 ° C., the roll pressure by the heating roller is 0.1 to 10 kg / cm, and the moving speed of the heating roller is 0.1 to 10 m / min. have. In addition, the substrate may be preheated, and the preheating temperature may be 40 to 140 ° C, for example.

Furthermore, after apply | coating a non-photosensitive inorganic powder containing resin composition on the board | substrate by various methods, such as the screen printing method, the roll coating method, the rotary coating method, the flexible coating method, and containing a 1st inorganic powder by the method of drying a coating film. A resin layer can be formed. In addition, an n-layer laminate can be formed by repeating the above steps n times.

[2] formation process of second inorganic powder-containing resin layer

The second inorganic powder-containing resin layer is formed by transferring a second inorganic powder-containing resin layer onto the first inorganic powder-containing resin layer by using a transfer film having a configuration in which the inorganic powder-containing resin layer is formed on the supporting film. desirable. Moreover, by repeating n times transfer using the said transfer film, the laminated body which has a 2nd inorganic powder containing resin layer of n layers (n represents an integer greater than or equal to 2) can be formed. Moreover, the said laminated body can also be formed by carrying out the collective transfer of the laminated body which consists of n layers of 2nd inorganic powder containing resin layers on a board | substrate using the transfer film formed on the support film.

In addition, as transfer conditions of a 2nd inorganic powder containing resin layer, the conditions similar to the formation process of said [1] 1st inorganic powder containing resin layer can be used.

Moreover, after apply | coating an inorganic powder containing resin composition on a 1st inorganic powder containing resin layer in accordance with various methods, such as a screen printing method, a roll coating method, a rotary coating method, and a flexible coating method, it is made by the method of drying a coating film. 2 inorganic powder containing resin layer can be formed. In addition, the laminate of n layers can be formed by repeating the above steps n times.

In addition, in the said [1] and [2], the formation process of a resin layer is applicable by using the transfer film in which the laminated film of a 2nd inorganic powder containing resin layer and a 1st inorganic powder containing resin layer is formed on a support film. It is more preferable to transfer a laminated film on a board | substrate and to collectively form a resin layer and a 2nd inorganic powder containing resin layer. According to such a formation method, the inorganic powder containing resin layer excellent in the film thickness uniformity can also be easily formed, and the pattern shape can be improved and a process can be simplified. Moreover, the said laminated body can also be formed by carrying out the collective transfer of the laminated body which consists of independent n-layer 1st and / or 2nd inorganic powder containing resin layer on a board | substrate using the transfer film formed on the support film. have.

Moreover, the said transfer conditions are the same conditions as the formation process of the said [1] 1st inorganic powder containing resin layer.

[2 '] forming process of resist film

It is preferable to form the resist film used by the manufacturing method II by using the transfer film which has a structure in which the resist film was formed on the support film, and transferring a resist film on a 2nd inorganic powder containing resin layer.

In addition, as transfer conditions of a resist film, the conditions similar to the formation process of said [1] 1st inorganic powder containing resin layer can be used.

The resist film can be formed on the second inorganic powder-containing resin layer by applying a resist composition in accordance with various methods such as screen printing, roll coating, rotary coating, and cast coating, and then drying the coating film. .

In the above-mentioned [1], [2] and [2 '], the resin layer forming step includes forming a laminated film of a resist film, a second inorganic powder-containing resin layer and a first inorganic powder-containing resin layer on a support film. By using the transfer film which consists of these, it is more preferable to transfer this laminated film on a board | substrate, and to collectively form a 1st inorganic powder containing resin layer, a 2nd inorganic powder containing resin layer, and a resist film. According to this formation method, an inorganic powder-containing resin layer and a resist film having excellent film thickness uniformity can be easily formed, and the pattern shape can be improved, and the process can be simplified.

Moreover, the said transfer conditions are the same conditions as the formation process of the said [1] 1st inorganic powder containing resin layer.

[3] exposure steps

In this step, selective exposure of radiation such as ultraviolet rays (exposure) is performed on the surface of the photosensitive second inorganic powder-containing resin layer in Manufacturing Method I and on the surface of the resist film in Manufacturing Method II through exposure mask to expose the latent image of the pattern. To form.

Although the ultraviolet irradiation device used by the said photolithographic method, the exposure apparatus used when manufacturing a semiconductor, and a liquid crystal display device, etc. are used here, it is not specifically limited.

When the second inorganic powder-containing resin layer or the resist film is formed by transfer, the supporting film on the second inorganic powder-containing resin layer or the resist film is exposed without being peeled off, and the supporting film can be peeled off after the exposure. . By exposing a support film without peeling, it can prevent contamination of the mask for exposure, and can also prevent the fall of the hardening rate of the binder resin by oxygen interference at the time of exposure.

[4] Process for developing second inorganic powder-containing resin layer (Manufacturing Method I)

In this step, a pattern of the second inorganic powder-containing resin layer is formed on the first inorganic powder-containing resin layer by developing the exposed second inorganic powder-containing resin layer.

Here, as the developing treatment conditions, depending on the type of the second inorganic powder-containing resin layer, the type, composition, and concentration of the developing solution, the developing time, the developing temperature, the developing method (for example, the dipping method, the shaking method, the shower method, the spray method, Puddle method), a developing apparatus, etc. can be selected suitably.

[4-1] Development process of resist film (Manufacturing Method II)

In this step, the exposed resist film is developed to form a resist pattern on the second inorganic powder-containing resin layer.

Here, as the developing treatment conditions, the type, composition, and concentration of the developing solution, the developing time, the developing temperature, the developing method (for example, the dipping method, the shaking method, the shower method, the spray method, the puddle method, and the like) according to the type of the resist film, the developing apparatus Etc. can be selected as appropriate.

[4-2] Etching Step of Second Inorganic Powder-Containing Resin Layer (Manufacturing Method II)

In this step, the second inorganic powder-containing resin layer is etched to form a second inorganic powder-containing resin layer pattern corresponding to the resist pattern on the first inorganic powder-containing resin layer.

That is, the part corresponding to the resist removal part of a resist pattern among a 2nd inorganic powder containing resin layer melt | dissolves in an etching liquid, and is selectively removed. Then, if the etching process is continued, the surface of the first inorganic powder-containing resin layer is exposed at the portion corresponding to the resist removing portion in the second inorganic powder-containing resin layer.

Here, as the etching treatment conditions, the type, composition, and concentration of the etching liquid, the treatment time, the treatment temperature, the treatment method (for example, the dipping method, the shaking method, the shower method, the spray method, and the puddle, depending on the type of the second inorganic powder-containing resin layer, etc. Method), a processing apparatus, etc. can be selected suitably.

In addition, by selecting the type of the resist film and the second inorganic powder-containing resin layer so that the same solution as that used in the developing step can be used as the etching solution, the developing step and the etching step can be carried out continuously. The manufacturing efficiency can be improved.

Here, it is preferable that the resist residual part which comprises a resist pattern is melt | dissolved gradually at the time of an etching process, and is completely removed by the step (end time of an etching process) in which the 2nd inorganic powder containing resin layer was formed.

In addition, even if some or all of the resist remaining portion remains after the etching treatment, the resist remaining portion is removed in the next firing step.

[5] firing processes

In this step, the first inorganic powder-containing resin layer and the second inorganic powder-containing resin layer pattern formed on the first inorganic powder-containing resin layer are collectively baked, and the first and second inorganic powder-containing resin layers (residual part) The organic substance in the inside is lost, and an inorganic pattern is formed on an inorganic film.

Here, as the temperature of the baking treatment, it is necessary to be a temperature at which the organic substance in the inorganic powder-containing resin layer (residual portion) disappears, and is usually 400 to 600 ° C. In addition, baking time is 10 to 90 minutes normally.

Hereinafter, the material used for each said process, various conditions, etc. are demonstrated.

<Substrate>

As a board | substrate material, the plate-shaped member which consists of insulating materials, such as glass, silicone, polycarbonate, polyester, aromatic amide, polyamideimide, polyimide, is mentioned, for example. About the surface of this plate-shaped member, Chemical treatment with a silane coupling agent etc. as needed; Plasma treatment; Suitable pretreatment such as thin film formation treatment by ion plating method, sputtering method, vapor phase reaction method, vacuum deposition method or the like can be performed.

In addition, in this invention, it is preferable to use glass which has heat resistance as a board | substrate. As a glass substrate, Asahi Glass Co., Ltd. product PD200 is mentioned as a preferable thing, for example.

<1st inorganic powder containing resin layer>

The 1st inorganic powder containing resin layer used for the manufacturing method of this invention apply | coats the paste-type inorganic powder containing resin composition containing inorganic powder, binder resin, and a solvent, and dries a coating film, and removes some or all of a solvent. It can form by doing. The transfer film used for the manufacturing method of this invention is obtained by apply | coating and drying the said inorganic powder containing resin composition on a support film, and forming a 1st inorganic powder containing resin layer, and of the said 1st inorganic powder containing resin layer A protective film layer can be provided on the surface.

Moreover, it is preferable that the 1st inorganic powder containing resin layer used for the manufacturing method of this invention is a dielectric formation material layer.

(1) 1st inorganic powder containing resin composition

In this invention, a 1st inorganic powder containing resin composition is a normal non-photosensitive composition which uses an inorganic powder, a binder resin, and a solvent as an essential component.

(a) inorganic powder

Although the inorganic powder used for a 1st inorganic powder containing resin composition changes with kinds of pattern material to form, it is preferable to contain the glass frit for forming a dielectric layer.

Examples of the composition of the glass frit include (1) a mixture of lead oxide, boron oxide, and silicon oxide (PbO-B ₂ O ₃ -SiO ₂ based), (2) zinc oxide, boron oxide, and silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ system), (3) lead oxide, boron oxide, silicon oxide, a mixture of aluminum oxide (PbO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ system), (4) lead oxide And a mixture of zinc oxide, boron oxide, and silicon oxide (PbO-ZnO-B ₂ O ₃ -SiO _{2 type} ). In addition to the above, a glass frit having a composition suitable for forming a dielectric layer of a plasma display can be used.

As a softening point of a glass frit, it exists in the range of 400-600 degreeC normally. When the softening point of the glass frit is less than 400 ° C., the glass is formed at a step in which organic substances such as binder resins contained in the first inorganic powder-containing resin layer are not completely decomposed and removed in the firing step by the method for manufacturing a plasma display panel of the present invention. Since the frit melts, a part of the organic material remains in the dielectric layer formed, and as a result, the dielectric layer tends to be colored and the light transmittance tends to be lowered. On the other hand, when the softening point of a glass frit exceeds 600 degreeC, since it needs to bake at higher temperature than 600 degreeC, distortion etc. are easy to generate | occur | produce in a glass substrate. Moreover, since the dielectric layer which has a high light transmittance is formed, it is preferable that it is 450-550 degreeC as a softening point of a glass frit.

As an average particle diameter (median diameter) of a glass frit, the thing of 0.1-10 micrometers is used normally, Preferably it is 1.0-3.0 micrometers. When the average particle diameter of glass frit is less than 1.0 micrometer, the plasticity of the 1st inorganic powder containing resin layer cannot fully be improved in the transfer film used preferably for the manufacturing method of this invention formed using the composition obtained. . Moreover, when the average particle diameter of a glass frit exceeds 3.0 micrometers, there exists a possibility that the uniformity of the dielectric layer formed may be impaired. In addition, the average particle diameter of the glass frit is more preferably 1.5 to 3.0 mu m. Here, "the average particle diameter of a glass frit" shall refer to the value calculated | required from the particle diameter measured by the laser diffraction method.

The inorganic powder used for the first inorganic powder-containing resin composition may contain glass frit and any other inorganic powder such as metals such as Cr, inorganic pigments and ceramics. (a) In an inorganic powder, content of a glass frit is 80-100 mass parts normally in 100 mass parts of inorganic powders.

(b) binder resin

In the first inorganic powder-containing resin layer, the binder resin is preferably an acrylic resin. Since an acrylic resin is contained as a binder resin, the transfer film used preferably for the manufacturing method of this invention becomes what has the outstanding (heating) adhesiveness to a board | substrate. Therefore, when apply | coating a 1st inorganic powder containing resin composition on a support film and manufacturing a transfer film, the transfer film obtained becomes what is excellent in the transfer property (heat adhesiveness to a board | substrate) of a 1st inorganic powder containing resin layer.

As an acrylic resin which comprises a 1st inorganic powder containing resin composition, it can bind an inorganic powder with appropriate adhesiveness, and is in the (co) polymer completely oxidized and removed by the baking process (400 degreeC-600 degreeC) of a film formation material. Is selected.

Moreover, it is preferable that the said acrylic resin is alkali insoluble or alkali poorly soluble resin. The term &quot; alkali insoluble or alkali poorly soluble &quot; used herein refers to developing a film using only the acrylic resin in place of the second inorganic powder-containing resin layer under development or etching conditions of the second inorganic powder-containing resin layer. Means a property in which 50% or more, particularly preferably 90% or more of the initial film thickness of the coating film remains after development.

Such acrylic resins include homopolymers of (meth) acrylate compounds represented by the following formula (1), two or more copolymers of (meth) acrylate compounds represented by the following formula (1), and (meth) acryl represented by the following formula (1): Copolymers of late compounds and copolymerizable monomers are included.

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents a monovalent organic group.

Specific examples of the (meth) acrylate compound represented by Formula 1 include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, and butyl (meth) acrylate. , Isobutyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth ) Acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate Alkyl (meth) acrylates such as undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, and isostearyl (meth) acrylate;

Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) Hydroxyalkyl (meth) acrylates such as acrylate and 4-hydroxybutyl (meth) acrylate;

Phenoxyalkyl (meth) acrylates such as phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate;

2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, 2-methoxybutyl ( Alkoxyalkyl (meth) acrylates such as meth) acrylate;

Polyethylene glycol mono (meth) acrylate, ethoxy diethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, Polyalkylene glycols such as polypropylene glycol mono (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate, and nonylphenoxy polypropylene glycol (meth) acrylate ( Meth) acrylates;

Cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, bor Cycloalkyl (meth) acrylates such as niel (meth) acrylate, isobornyl (meth) acrylate and tricyclodecanyl (meth) acrylate;

Benzyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, etc. are mentioned.

Of these, the group represented by R ² in the above formula (1) is preferably a group containing an alkyl group or an alkoxyalkyl group, and butyl (meth) acrylate and 2-ethylhexyl (meth) as particularly preferred (meth) acrylate compounds Acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate, and 2-ethoxyethyl (meth) acrylate. As another copolymerizable monomer, if it is a compound copolymerizable with the said (meth) acrylate compound, there will be no restriction | limiting in particular, For example, Unsaturated carboxylic acids, such as (meth) acrylic acid, vinylbenzoic acid, maleic acid, vinylphthalic acid; And vinyl group-containing radically polymerizable compounds such as vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methyl styrene, butadiene and isoprene.

In the acrylic resin which comprises a 1st inorganic powder containing resin composition, the copolymerization component derived from the (meth) acrylate compound represented by the said General formula (1) is 70 mass% or more normally, Preferably it is 90 mass% or more. Moreover, the acrylic resin which contains 50 mass% or more, especially preferably 80 mass% or more of copolymerization components derived from the (meth) acrylate compound in which the group represented by R <^2> contains an alkyl group or an oxyalkylene group in the said General formula (1). Is more preferable.

Specific examples of particularly preferable acrylic resins include polymethyl methacrylate, polybutyl methacrylate, methyl methacrylate-butyl methacrylate copolymer, and the like.

As a molecular weight of the acrylic resin which comprises a 1st inorganic powder containing resin composition, it is preferable that it is 4,000-300,000 as a weight average molecular weight (henceforth "Mw") in polystyrene conversion by GPC, More preferably, it is 10,000-200,000. .

As a content rate of binder resin in 1st inorganic powder containing resin composition, it is preferable that it is 5-50 mass parts with respect to 100 mass parts of inorganic powder, More preferably, it is 5-25 mass parts. When the ratio of the binder resin is too small, the inorganic powder cannot be reliably bound and maintained. On the other hand, when this ratio is excessive, it is difficult to remove the organic component during firing.

(c) solvent

As a solvent which comprises a 1st inorganic powder containing resin composition, it has favorable affinity with inorganic powders, such as glass frit, and solubility of a binder resin, can impart moderate viscosity to an inorganic powder containing resin composition, and is easy to dry. It is desirable to be able to evaporate off.

Moreover, ketones, alcohols, and esters (hereinafter, these are called "a specific solvent") whose standard boiling point (boiling point at 1 atmosphere) are 100-200 degreeC as an especially preferable solvent are mentioned.

Specific examples of such specific solvents include ketones such as diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone; alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol; Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether; Saturated aliphatic monocarboxylic acid alkyl esters such as acetic acid-n-butyl and amyl acetate; Lactic acid esters such as ethyl lactate and n-butyl lactate; Ether esters such as methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, and ethyl-3-ethoxypropionate; and the like, among them, methyl butyl ketone and cyclohexanone Preferred are diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate, propylene glycol monomethyl ether acetate, ethyl-3-ethoxypropionate and the like. These specific solvents can be used individually or in combination of 2 or more types.

Specific examples of solvents other than the specific solvents include terebin oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, benzyl alcohol, and the like.

It is preferable that it is 1-50 mass parts with respect to 100 mass parts of inorganic powders, such as glass frit, from a viewpoint of maintaining the viscosity of a 1st inorganic powder containing resin composition in a suitable range as a content rate of a solvent in a 1st inorganic powder containing resin composition. More preferably, it is 5-40 mass parts.

Moreover, it is preferable that the content rate of the specific solvent with respect to all the solvents is 50 mass% or more, More preferably, it is 70 mass% or more.

In addition to the above components, the first inorganic powder-containing resin composition may contain a silyl group-containing compound for the purpose of improving the dispersion stability of the inorganic powder. As the silyl group-containing compound, a silyl group-containing compound [saturated alkyl group-containing (alkyl) alkoxysilane] represented by the following formula (2) is preferable.

In formula, p is an integer of 3-20, m is an integer of 1-3, n is an integer of 1-3, and a is an integer of 1-3.

In the said Formula (2), p which shows the carbon number of a saturated alkyl group is an integer of 3-20, Preferably it is an integer of 4-16.

Even if p contains a saturated alkyl group-containing (alkyl) alkoxysilane having less than 3, sufficient plasticity may not be expressed in the resulting film-forming material layer. On the other hand, saturated alkyl group-containing (alkyl) alkoxysilanes having a p value of more than 20 have a high decomposition temperature, and organic materials (the silane derivatives) are not completely decomposed and removed in the firing process by the method for producing a plasma display of the present invention. In a non-existent state, a part of organic substance remains in inorganic layers, such as a dielectric layer formed, and as a result, light transmittance may fall in the case of a dielectric layer.

Specific examples of the silyl group-containing compound represented by the formula (2) include n-propyldimethylmethoxysilane, n-butyldimethylmethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, n-ecosil Saturated alkyldimethylmethoxysilanes such as dimethylmethoxysilane (a = 1, m = 1, n = 1);

saturated alkyl di such as n-propyldiethylmethoxysilane, n-butyldiethylmethoxysilane, n-decyldiethylmethoxysilane, n-hexadecyldiethylmethoxysilane, n-ecosyldiethylmethoxysilane Ethylmethoxysilanes (a = 1, m = 1, n = 2);

saturated alkyldipropyl methoxysilanes such as n-butyldipropylmethoxysilane, n-decyldipropylmethoxysilane, n-hexadecyldipropylmethoxysilane and n-ecosyldipropylmethoxysilane (a = 1 , m = 1, n = 3);

Saturated alkyl dimethyl ethoxysilane, such as n-propyl dimethyl ethoxysilane, n-butyl dimethyl ethoxy silane, n-decyl dimethyl ethoxy silane, n-hexadecyl dimethyl ethoxy silane, n-eicosyl dimethyl ethoxy silane, etc. The class (a = 1, m = 2, n = 1);

Saturated alkyl di, such as n-propyldiethylethoxysilane, n-butyldiethylethoxysilane, n-decyldiethylethoxysilane, n-hexadecyldiethylethoxysilane, and n-eicosyldiethylethoxysilane Ethyl ethoxysilanes (a = 1, m = 2, n = 2);

saturated alkyldipropylethoxysilanes such as n-butyldipropylethoxysilane, n-decyldipropylethoxysilane, n-hexadecyldipropylethoxysilane and n-ecosyldipropylethoxysilane (a = 1 , m = 2, n = 3);

Saturated alkyl dimethyl propoxy silanes, such as n-propyl dimethyl propoxy silane, n-butyl dimethyl propoxy silane, n-decyl dimethyl propoxy silane, n-hexadecyl dimethyl propoxy silane, n-eicosyl dimethyl propoxy silane, etc. (a = 1, m = 3, n = 1);

Saturated alkyl di, such as n-propyl diethyl propoxy silane, n-butyl diethyl propoxy silane, n-decyl diethyl propoxy silane, n-hexadecyl diethyl propoxy silane, and n-ecosyl diethyl propoxy silane Ethyl propoxysilanes (a = 1, m = 3, n = 2);

Saturated alkyl dipropyl propoxy silanes, such as n-butyl dipropyl propoxy silane, n-decyl dipropyl propoxy silane, n-hexadecyl dipropyl propoxy silane, and n-eicosyl dipropyl propoxy silane (a = 1 , m = 3, n = 3);

Saturated alkyl methyl dimethoxy silanes, such as n-propylmethyldimethoxysilane, n-butylmethyldimethoxysilane, n-decylmethyldimethoxysilane, n-hexadecylmethyldimethoxysilane, and n-eicosylmethyldimethoxysilane (a = 2, m = 1, n = 1);

Saturated alkyl ethyl dimethoxy silane, such as n-propyl ethyl dimethoxy silane, n-butyl ethyl dimethoxy silane, n-decyl ethyl dimethoxy silane, n-hexadecyl ethyl dimethoxy silane, and n-ecosyl ethyl dimethoxy silane The class (a = 2, m = 1, n = 2);

Saturated alkyl propyl dimethoxy silanes, such as n-butyl propyl dimethoxy silane, n-decyl propyl dimethoxy silane, n-hexadecyl propyl dimethoxy silane, and n-eicosyl propyl dimethoxy silane (a = 2, m = 1). , n = 3)

Saturated alkylmethyl diethoxysilane, such as n-propylmethyl diethoxysilane, n-butylmethyl diethoxysilane, n-decylmethyl diethoxysilane, n-hexadecylmethyl diethoxysilane, and n-eicosylmethyl diethoxysilane ( a = 2, m = 2, n = 1);

Saturated alkyl ethyl diethoxysilanes, such as n-propyl ethyl diethoxy silane, n-butyl ethyl diethoxy silane, n-decyl ethyl diethoxy silane, n-hexadecyl ethyl diethoxy silane, and n-eicosyl ethyl diethoxy silane. (a = 2, m = 2, n = 2);

Saturated alkyl propyl diethoxysilanes, such as n-butyl propyl diethoxysilane, n-decyl propyl diethoxy silane, n-hexadecyl propyl diethoxy silane, and n- ethoxy propyl diethoxy silane (a = 2, m = 2) , n = 3);

saturated alkyls such as n-propylmethyldipropoxysilane, n-butylmethyldipropoxysilane, n-decylmethyldipropoxysilane, n-hexadecylmethyldipropoxysilane, n-ecosylmethyldipropoxysilane Methyldipropoxysilanes (a = 2, m = 3, n = 1);

saturated alkyls such as n-propylethyldipropoxysilane, n-butylethyldipropoxysilane, n-decylethyldipropoxysilane, n-hexadecylethyldipropoxysilane, n-ecosylethyldipropoxysilane Ethyldipropoxysilanes (a = 2, m = 3, n = 2);

Saturated alkyl propyl dipropoxy silanes, such as n-butyl propyl dipropoxy silane, n-decyl propyl dipropoxy silane, n-hexadecyl propyl dipropoxy silane, and n- ecoxy propyl dipropoxy silane (a = 2, m = 3, n = 3);

Saturated alkyl trimethoxysilanes, such as n-propyl trimethoxysilane, n-butyl trimethoxysilane, n-decyl trimethoxysilane, n-hexadecyl trimethoxysilane, and n-eicosyl trimethoxysilane (a = 3, m = 1);

Saturated alkyl triethoxysilanes, such as n-propyl triethoxysilane, n-butyl triethoxysilane, n-decyl triethoxysilane, n-hexadecyl triethoxysilane, and n-eicosyl triethoxysilane (a = 3, m = 2);

Saturated alkyl tripropoxy silanes, such as n-propyl tripropoxy silane, n-butyl tripropoxy silane, n-decyl tripropoxy silane, n-hexadecyl tripropoxy silane, and n-eicosyl tripropoxy silane (a = 3, m = 3), etc. These can be used individually or in combination of 2 or more types.

Among them, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, n-butyltrie Oxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, n-decylethyl diethoxysilane, n-hexadecylethyl diethoxysilane, n-butyl tripropoxysilane, n-decyl triprop Foxysilane, n-hexadecyl tripropoxysilane, etc. are especially preferable.

It is preferable that it is 5 mass parts or less with respect to 100 mass parts of inorganic powders, such as glass frit, as a content rate of a silyl group containing compound in a 1st inorganic powder containing resin composition, More preferably, it is 3 mass parts or less. When the proportion of the silyl group-containing compound is excessive, the viscosity increases over time when the first inorganic powder-containing resin composition obtained is stored, or the silyl group-containing compounds react with each other to cause organic substances to remain after firing. There is a case.

Moreover, in a 1st inorganic powder containing resin composition, a plasticizer may be contained in order to express favorable flexibility and combustibility in the 1st inorganic powder containing resin layer formed. As a plasticizer, the plasticizer which consists of a compound represented by following formula (3) or 4 or polypropylene glycol is preferable.

In the formula, R ³ and R ⁶ each represent the same or different alkyl group having 1 to 30 carbon atoms, R ⁴ and R ⁵ each represent the same or different methylene group or the alkylene group having 2 to 30 carbon atoms, and s is 0 to 5 And t is a number from 1 to 10.

In formula, R <^7> represents a C1-C30 alkyl group or alkenyl group.

According to the transfer film provided with the 1st inorganic powder containing resin layer containing a plasticizer, even if this is bent and folded, a small crack (cracking and cracking) does not generate | occur | produce on the surface of the said film formation material layer, and the said transfer film It is excellent in flexibility, and it can also make it easy to wind up in roll shape.

In particular, since the plasticizer composed of the compound represented by the above formula (3) or (4) is easily decomposed and removed by heat, it does not adversely affect the inorganic layer obtained by firing the first inorganic powder-containing resin.

In Chemical Formula 3, R ³ Or an alkyl group represented by R ⁶ and R ⁴ Or an alkylene group represented by R ⁵ may be linear or branched, and may also be a saturated or unsaturated group.

Carbon number of the alkyl group represented by R <^3> or R <^6> is 1-30, Preferably it is 2-20, More preferably, it is 4-10.

When carbon number of the said alkyl group exceeds 30, solubility of a plasticizer with respect to a solvent may fall and favorable flexibility may not be obtained.

Specific examples of the compound represented by the above formula (3) include dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2-ethylhexyl acetate, dibutyl sebacate, dibutyl diglycol adipate Etc. can be mentioned. Preferably, n is a compound represented by 2-6.

In Formula 4, R ⁷ represents an alkyl group or alkenyl group having 1 to 30 carbon atoms, and the alkyl group and alkenyl group represented by R ⁷ may be linear or branched, and may also be saturated or unsaturated.

Carbon number of the alkyl group or alkenyl group represented by R <^7> is 1-30, Preferably it is 2-20, More preferably, it is 10-18.

Specific examples of the compound represented by the formula (4) include propylene glycol monolaurate, propylene glycol monooleate and the like.

Moreover, when using polypropylene glycol as a plasticizer, it is preferable that the weight average molecular weight (Mw) of such polypropylene glycol exists in the range of 200-3,000, and it is especially preferable to exist in the range of 300-2,000. When Mw of polypropylene glycol is less than 200, it may become difficult to form the 1st inorganic powder containing resin layer with a large film strength on a support film, and the transfer film provided with this 1st inorganic powder containing resin layer is carried out. In the transfer process using, when the support film is to be peeled from the first inorganic powder-containing resin heat-bonded to the glass substrate, the first inorganic powder-containing resin may cause cohesive failure. On the other hand, when Mw exceeds 3,000, the 1st inorganic powder containing resin layer with favorable heat adhesiveness with a glass substrate may not be obtained.

As content of a plasticizer in a 1st inorganic powder containing resin layer, it is preferable that it is 0.5-10 mass parts with respect to 100 mass parts of inorganic powder, More preferably, it is 2-7 mass parts. When the addition amount of a plasticizer increases, there exists a possibility that the intensity | strength of the transfer film used suitably for the manufacturing method of the plasma display panel of this invention obtained may not be maintained.

The first inorganic powder-containing resin composition may contain, in addition to the above components, various additives such as a tackifier, a surface tension regulator, a stabilizer, an antifoaming agent, and a dispersant as an optional component. As the dispersant, fatty acids are preferably used. In particular, fatty acids having 8 to 30 carbon atoms are preferred. Preferable specific examples of the fatty acids include saturated fatty acids such as octanoic acid, undecyl acid, lauric acid, myristic acid, palmitic acid, pentadecanoic acid, stearic acid, and arachnic acid; Unsaturated fatty acids such as elicic acid, oleic acid, linoleic acid, linolenic acid, arachidonic acid, carboxypolycaprolactone (n = 2) monoacrylate, and the like, and these may be used alone or in combination of two or more thereof. have.

As a content rate of a dispersing agent in a 1st inorganic powder containing resin composition, it is preferable that it is 5 mass parts or less with respect to 100 mass parts of inorganic powders, More preferably, it is 3 mass parts or less.

The first inorganic powder-containing resin composition usually contains the above-mentioned (a) inorganic powder, (b) binder resin, (c) solvent and other organic components in a mixing / dispersing group such as a roll kneader, a mixer, a homo mixer, and a sand mill. It can manufacture by kneading using. As a viscosity of the said 1st inorganic powder containing resin composition, it is preferable that it is 100-10, OOmPa * s- ¹ .

<2nd inorganic powder containing resin layer>

The 2nd inorganic powder containing resin layer used for the manufacturing method of this invention apply | coats the paste-like inorganic powder containing resin composition which consists of an inorganic powder, a binder resin, and a solvent as an essential component, dries a coating film, and part or all of a solvent is carried out. It can form by removing. In addition, the 2nd inorganic powder containing resin layer used for the manufacturing method I also contains the photosensitive component as an essential component. Although the 2nd inorganic powder containing resin layer used for the manufacturing method II is non-photosensitive normally, it may have a photosensitive property in whole or in part (for example, only one layer in the resin layer which consists of n layers).

The transfer film used for the manufacturing method of this invention is obtained by apply | coating and drying the said inorganic powder containing resin composition on a support film, and forming a 2nd inorganic powder containing resin layer, and of the said 2nd inorganic powder containing resin layer A protective film layer may be provided on the surface.

(1) 2nd inorganic powder containing resin composition

In the present invention, the second inorganic powder-containing resin composition includes an inorganic powder, a binder resin, and a solvent as essential components, and when used in the production method I, the photosensitive component is also an essential component.

(a) inorganic powder

The inorganic powder used for a 2nd inorganic powder containing photosensitive resin composition changes with kinds of pattern materials to form.

Examples of the inorganic powder used for the electrode forming material include particles such as Ag, Au, Al, Ni, Ag-Pd alloys, Cu, Cr, and the like.

As an inorganic powder used for a partition formation material and a dielectric formation material, the glass frit in the said 1st inorganic powder containing resin composition etc. are mentioned.

As the inorganic powder used in the resistor forming material, RuO ₂ Etc. can be mentioned.

The inorganic powder used for forming the phosphor material for red as _{^{Y 2 O 3: Eu 3 +}} , Y 2 SiO 5: Eu 3+, Y 3 Al 5 O 12: Eu 3 +, YVO 4: Eu 3 +, (Y ^{_{, Gd) BO 3: Eu 3}} +, Zn 3 (PO 4) 2: Mn , etc., as for green _{Zn 2 SiO 4: Mn, BaAl} 12 O 19: Mn, BaMgAl 14 O 23: Mn, LaPO 4: (Ce _{, Tb), Y 3 (Al} , Ga) 5 O 12: Tb , etc., as for blue _{Y 2 SiO 5: Ce, BaMgAl} 10 O 17: Eu 2 +, BaMgAl 14 O 23: Eu 2 +, (Ca, Sr , Ba) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ , (Zn, Cd) S: Ag and the like.

As the inorganic powder used for the color filter forming material, Fe ₂ O ₃ , Pb ₃ O ₄ , and the like for red are used, and Cr ₂ O _{3 is} used for green. Examples of the blue color include 2 (Al ₂ Na ₂ Si ₃ O ₁₀ ), Na ₂ S ₄ , and the like.

As inorganic powders used for the black matrix forming material, metals such as Ni, Ti, Cu, Mn, Fe, Cr, Co, metal oxides, Cu-Cr, Cu-Fe-Mn, Cu-Cr-Mn, and Co-Cr- Composite metal oxides, such as Fe and Co-Fe-Mn, carbon black, etc. are mentioned.

As average particle diameter of these inorganic powders, Preferably it is 0.01-10 micrometers, More preferably, it is 0.05-5 micrometers. When the average particle diameter of an inorganic powder is less than 0.01 micrometer, the specific surface area of an inorganic powder becomes large, and particle | grains generate | occur | produce easily in the 2nd inorganic powder containing photosensitive resin composition, and it becomes difficult to obtain a stable dispersion state. On the other hand, when the average particle diameter of an inorganic powder is 100 micrometers or more, it becomes difficult to obtain a high precision pattern.

The electrodes, resistors, phosphors, color filters, and black matrix forming materials may contain, in addition to the inorganic powders described above, glass frits used for partitions and dielectric layers. In the inorganic powder-containing resin composition for obtaining such a panel material, the content of the glass frit is 80 mass% or less, preferably 50 mass% or less with respect to the inorganic powder whole quantity.

(b) binder resin

Although various resin can be used as binder resin which comprises a 2nd inorganic powder containing photosensitive resin composition, it is preferable to use resin containing alkali-soluble resin in the ratio of 30 to 100weight%. "Alkali solubility" means here the property which has solubility to the extent which it melt | dissolves with alkaline etching liquid (developer) and the target etching process is performed.

As a specific example of such alkali-soluble resin, (meth) acrylic-type resin, hydroxy styrene resin, a novolak resin, a polyester resin etc. are mentioned, for example.

Among these alkali-soluble resins, acrylic resins such as copolymers of the following monomers (A) and monomers (C), monomers (A), monomers (B) and copolymers of monomers (C) are mentioned.

Monomer (A): Carboxyl group-containing monomers

Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) acryloyloxyethyl), ω-carboxy-polycaprolactone mono (Meth) acrylates and the like.

Monomer (B): OH-containing monomers

Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 3-hydroxypropyl (meth) acrylate; Phenolic hydroxyl group containing monomers, such as o-hydroxy styrene, m-hydroxy styrene, and p-hydroxy styrene.

Monomer (C): Other copolymerizable monomers

Methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-lauryl (meth) acrylate, benzyl (meth) acrylate, and glycid (meth) acrylate (Meth) acrylic acid esters other than monomer (a), such as dill and dicyclopentanyl (meth) acrylate; Aromatic vinyl monomers such as styrene and α-methylstyrene; Conjugated dienes such as butadiene and isoprene; Macromonomers which have polymerizable unsaturated groups, such as a (meth) acryloyl group, in one terminal of polymer chains, such as polystyrene, methyl poly (meth) acrylate, poly (meth) acrylate, and benzyl poly (meth) acrylate.

The copolymer of the monomer (A) and the monomer (C), or the copolymer of the monomer (A), the monomer (B) and the monomer (C) has alkali solubility by the presence of a copolymerization component derived from the monomer (A). It becomes. Especially, the copolymer of monomer (A), monomer (B), and monomer (C) is especially preferable from a viewpoint of the dispersion stability of (A) inorganic particle and the solubility to the alkali developing solution mentioned later. In this copolymer, the content rate of the copolymerization component derived from monomer (a) becomes like this. Preferably it is 5 to 60 mass%, Especially preferably, it is 10 to 40 mass%, and the content rate of the copolymerization component derived from monomer (b) is preferable. Preferably it is 1-50 mass%, Especially preferably, it is 5-30 mass%.

As molecular weight of the said alkali-soluble resin, it is preferable that Mw is 5,000-55,000,000, More preferably, it is 10,000-300,000.

In addition, in the 2nd inorganic powder containing photosensitive resin composition, as content rate of binder resin, it is 1-200 mass parts normally with respect to 100 mass parts of inorganic powder, Preferably it is 5-100 mass parts, Especially preferably, it is 10-80 mass It is wealth.

(c) solvent

The solvent which comprises a 2nd inorganic powder containing photosensitive resin composition is contained in order to provide moderate fluidity, plasticity, and favorable film formation property to the said inorganic powder containing photosensitive resin composition, and (1) 1st inorganic powder containing resin composition mentioned above The solvent and the same kind can be used.

As a content rate of a solvent in a 2nd inorganic powder containing photosensitive resin composition, it can select suitably within the range from which favorable film formation property (fluidity or plasticity) is obtained.

(d) photosensitive components

Examples of the photosensitive component constituting the second inorganic powder-containing resin composition include (a) a combination of a polyfunctional monomer and a photopolymerization initiator, (b) a combination of a melamine resin and a photoacid generator that forms an acid by light irradiation, and the like. It can illustrate as a preferable thing and the combination of a polyfunctional (meth) acrylate and a photoinitiator is especially preferable among the combination of said (A).

As a specific example of the polyfunctional (meth) acrylate which comprises the photosensitive component, Di (meth) acrylates of alkylene glycol, such as ethylene glycol and propylene glycol; Di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; Di (meth) acrylates of sock end hydroxylated polymers such as sock end hydroxy polybutadiene, sock end hydroxy polyisoprene and sock end hydroxy polycaprolactone;

Poly (meth) acrylates of trivalent or higher polyhydric alcohols such as glycerin, 1,2,4-butanetriol, trimethylolalkane, tetramethylolalkane, pentaerythritol, dipentaerythritol, etc .; Poly (meth) acrylates of polyalkylene glycol adducts of trivalent or higher polyhydric alcohols; Poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediols; Oligos, such as polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spiran resin (meth) acrylate ( And meth) acrylates. These may be used alone or in combination of two or more thereof.

In addition, specific examples of the photopolymerization initiator constituting the photosensitive component include benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- [4 '-(methylthio) phenyl] -2-morpholino-1-propaneone, 2-benzyl-2-dimethylamino-1- Carbonyl compounds such as (4-morpholinophenyl) -butan-1-one; Azo compounds or azide compounds such as azoisobutylonitrile and 4-azidobenzaldehyde; Organic sulfur compounds such as mercaptan disulfide; Organic peroxides such as benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide and paramethane hydroperoxide; 1,3-bis (trichloromethyl) -5- (2'-chlorophenyl) -1,3,5-triazine, 2- [2- (2-furanyl) ethylenyl] -4,6-bis Trihalo methanes such as (trichloromethyl) -1,3,5-triazine; And imidazole dimers such as 2,2'-bis (2-chlorophenyl) 4,5,4 ', 5'-tetraphenyl 1,2-biimidazole. These can be used individually or in combination of 2 or more types.

As a content rate of the photosensitive component in the 2nd inorganic powder containing resin composition used for the manufacturing method I, it is 1-500 mass parts normally with respect to 100 mass parts of inorganic powder, Preferably it is 5-100 mass parts.

In addition, the second inorganic powder-containing resin composition may include, as an optional component, a plasticizer, a dispersant, a development accelerator, an adhesion aid, an antihalation agent, a leveling agent, a storage stabilizer, an antifoaming agent, an antioxidant, an ultraviolet absorber, an increasing agent, a chain transfer agent, and the like. Various additives may be contained.

Moreover, the plasticizer which consists of a silyl group containing compound represented by said Formula (2), the compound represented by Formula (3) or 4, or polypropylene glycol can be contained like (1) 1st inorganic powder containing resin composition.

The second inorganic powder-containing resin composition is prepared by kneading the inorganic powder, the binder resin, the solvent, the photosensitive component and, if necessary, the above-mentioned optional components using a kneader such as a roll kneader, a mixer, a homo mixer, a ball mill, a bead mill, or the like. can do.

The second inorganic powder-containing resin composition prepared as described above is a paste-like composition having fluidity suitable for application, and its viscosity is usually 100 to 1,000,000 cp, preferably 500 to 300,000 cp.

<Resist Film>

The resist film used in the manufacturing method II of this invention can be formed by apply | coating the paste-form resist composition which consists of resin, the photosensitive component, and a solvent as an essential component, and dries a coating film and removes one part or all part of a solvent. The transfer film preferably used in Manufacturing Method II of the present invention is obtained by applying and drying the resist composition on a support film to form a resist film, and a protective film layer may be provided on the surface of the resist film.

(1) resist composition

As a resist composition used for forming a resist film, although an alkali developing radiation sensitive resist composition, an organic solvent developing radiation sensitive resist composition, an aqueous developing radiation sensitive resist composition, etc. can be illustrated, Preferably it is an alkali developing sense Radioactive resist compositions are used. In addition, "radiation-sensitive" as used in the present invention includes visible rays, ultraviolet rays, far ultraviolet rays, electron beams, X-rays and the like.

An alkali developing resist composition contains alkali-soluble resin and a radiation sensitive component as an essential component.

As alkali-soluble resin which comprises an alkali developing resist composition, alkali-soluble resin illustrated as what comprises the binder resin component of a 2nd inorganic powder containing resin composition is mentioned.

Examples of the components constituting the alkali developing resist composition include (a) a combination of a polyfunctional monomer and a photopolymerization initiator, (b) a combination of a melamine resin and a photoacid generator that forms an acid by irradiation, and (c) irradiation. It is possible to exemplify a compound in which the alkali poorly soluble compound becomes alkali-soluble, and a combination of a polyfunctional (meth) acrylate and a photoinitiator is particularly preferable among the combinations of (a) above. As an example of a polyfunctional (meth) acrylate and a photoinitiator, what was illustrated as what comprises the photosensitive component of the 2nd inorganic powder containing resin composition used for the manufacturing method I is mentioned.

As a content rate of a radiation sensitive component in this alkali developing resist composition, it is 1-200 weight part normally per 100 weight part of alkali-soluble resin, Preferably it is 5-100 weight part.

In addition, a solvent is contained suitably in order to provide favorable film formation property about an alkali image development radiation sensitive resist composition. As such a solvent, the solvent illustrated as what comprises a 1st inorganic powder containing resin composition is mentioned.

The resist composition used in the present invention may contain various additives such as a development accelerator, an adhesion aid, an antihalation agent, a storage stabilizer, an antifoaming agent, an antioxidant, an ultraviolet absorber, a filler, a phosphor, a pigment, and a dye as an optional component.

<Transfer film>

The transfer film I of this invention consists of a laminated film containing a 2nd inorganic powder containing resin layer and a 1st inorganic powder containing resin layer on a support film. Moreover, as another transfer film used suitably for the manufacturing method I of this invention, a 1st inorganic powder containing resin layer is formed on a support film, and a 2nd inorganic powder containing resin layer is formed on a support film. These resin layers can be a laminated body which consists of n layers, respectively.

Moreover, the transfer film II of this invention contains the resist layer containing alkali-soluble resin component, the inorganic powder containing resin layer containing alkali-soluble resin component, and alkali-insoluble or poorly soluble resin component on a support film. A laminated film containing an inorganic powder-containing resin layer is formed. Moreover, as another transfer film used suitably for the manufacturing method II of this invention, a 1st inorganic powder containing resin layer is formed on a support film, and a 2nd inorganic powder containing resin layer is formed on a support film. A resist film is formed on a support film, a second inorganic powder-containing resin layer and a first inorganic powder-containing resin layer are laminated on a support film, and a resist film and a second inorganic powder are contained on a support film The resin layer laminated | stacked, etc. are mentioned, These inorganic powder containing resin layers may be a laminated body which consists of n layers, respectively.

It is preferable that the support film which comprises a transfer film is a resin film which has heat resistance and solvent resistance, and has flexibility. When a support film has flexibility, a paste composition can be apply | coated by a roll coater, and an inorganic powder containing resin layer can be preserve | saved and supplied in the state wound up to roll shape. Examples of the resin forming the support film include fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, nylon, cellulose, and the like. Can be. As thickness of a support film, it is 20-100 micrometers, for example.

As a method of apply | coating an inorganic powder containing resin composition and a resist film on a support film, it is necessary that a coating film with a large film thickness (for example, 10 micrometers or more) excellent in the uniformity of film thickness can be formed efficiently, specifically, The coating method with a roll coater, the coating method with a doctor blade, the coating method with a curtain coater, the coating method with a die coater, the coating method with a wire coater, etc. are mentioned as a preferable thing.

Moreover, it is preferable that the mold release process is given to the surface of the support film to which an inorganic powder containing resin composition and a resist film are apply | coated. Thereby, peeling operation of a support film can be performed easily in the transfer process mentioned later.

As drying conditions of a coating film, it is about 0.5 to 30 minutes at 50-150 degreeC, for example, and the residual ratio (content rate in an inorganic powder containing resin layer or a resist film) of the solvent after drying is usually 2 mass% or less.

As thickness of the inorganic powder containing resin layer formed on a support film as mentioned above, although it changes also with content rate of an inorganic powder, the kind and size of a member, etc., it is 5 to 500 micrometers, for example.

In addition, as thickness of the resist film formed on a support film as mentioned above, it is 1-20 micrometers, for example.

Moreover, as a protective film layer which may be provided in the surface of an inorganic powder containing resin layer, a polyethylene film, a polyvinyl alcohol-type film, etc. are mentioned.

Exposure mask

Although the exposure pattern of the exposure mask used in the exposure process which concerns on the manufacturing method of this invention changes with materials, it is generally 10-500 micrometers stripe.

<Development amount>

As a developing solution used in the developing process by the manufacturing method of this invention, an alkaline developing solution can be used preferably. In the production method II, the developer can be appropriately selected depending on the kind of the resist film (resist composition).

In addition, in the production method I, since the inorganic powder contained in the second inorganic powder-containing resin layer is uniformly dispersed by the alkali-soluble resin, the inorganic powder is also simultaneously removed by dissolving and washing the alkali-soluble resin as a binder in an alkaline solution. .

As an active ingredient of alkaline developing solution, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate, silicic acid Inorganic alkaline compounds such as lithium, sodium silicate, potassium silicate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate and ammonia; Tetramethylammonium Hydroxide, Trimethylhydroxyethylammonium Hydroxide, Monomethylamine, Dimethylamine, Trimethylamine, Monoethylamine, Diethylamine, Triethylamine, Monoisopropylamine, Diisopropylamine, Ethanolamine Organic alkaline compounds, such as these, etc. are mentioned.

The alkaline developer used in the developing step of the second inorganic powder-containing resin layer or the resist film can be produced by dissolving one or two or more kinds of the alkaline compounds in water or the like. Here, the concentration of the alkaline compound in the alkaline developer is usually 0.001 to 10% by weight, preferably 0.01 to 5% by weight. In addition, after the development process by alkaline developing solution is performed, the water washing process is normally performed.

<Etching liquid>

In the manufacturing method II, it is preferable that it is alkaline solution as an etching liquid used at the etching process of a 2nd inorganic powder containing resin layer. Thereby, alkali-soluble resin contained in a 2nd inorganic powder containing resin layer can be easily dissolved and removed.

In addition, since the inorganic powder contained in the second inorganic powder-containing resin layer is uniformly dispersed by the alkali-soluble resin, the inorganic powder is also removed simultaneously by dissolving and washing the alkali-soluble resin which is the organic binder in the alkaline solution.

Here, as an alkaline solution used as an etching solution, it is more preferable that it is a solution of the same composition as a developing solution.

By setting the etching solution to be the same solution as the alkaline developer used in the development process of the resist film, the development process and the etching process of the resist film can be carried out continuously, and the process can be simplified.

Moreover, after the etching process by alkaline solution is performed, a water washing process is normally performed.

<Example>

Hereinafter, although the Example of this invention is described, this invention is not limited by these. In addition, "part" represents a "mass part" below.

Example 1 (Manufacturing Method I)

(1) Preparation of 1st inorganic powder containing resin composition (composition for dielectric formation):

(a) 100 parts of PbO-B ₂ O ₃ -SiO ₂ -based glass frit (softening point 570 ° C., average particle diameter 1.5 μm) as the inorganic powder, (b) n-butyl methacrylate / n-lauryl methacryl as binder resin Rate / 2-hydroxypropyl methacrylate = 40 mass% / 50 mass% / 10 mass% copolymer (weight average molecular weight: 100,000) 20 parts, (c) propylene glycol monomethyl ether as a solvent, 20 parts and propylene as a plasticizer 4 parts of glycol monooleates were kneaded using a disperser to prepare a first inorganic powder-containing resin composition having a viscosity of 4,000 mPa · s ⁻¹ .

(2) Preparation of 2nd inorganic powder containing resin composition (photosensitive composition for black stripe formation):

(a) an inorganic powder Cu-Cr composite oxide black pigment (mean particle size 0.3 ㎛) 60 _{part, Bi 2 O 3 -OB 2 O} 3 -SiO 2 based glass frit (softening point 560 ℃, average particle size 2.0 ㎛) 40 parts and (b) 20 parts by weight of 2-ethylhexyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid as a binder resin (60 mass% / 25 mass% / 15 mass% copolymer (weight average molecular weight: 50,000)) (c) 20 parts of propylene glycol monomethyl ether as a solvent and (d) 20 parts of tripropylene glycol diacrylate (polyfunctional acrylate) as a photosensitive component, 2-benzyl-2-dimethylamino-1- (4-mor By mixing 5 parts of polynophenyl) -butan-1-one (photoinitiator) using a dispersing machine, the 2nd inorganic powder containing resin composition which has a viscosity of 4,000 mPa * s <^-1> was manufactured.

(3) Preparation of the transfer film:

Applying the 1st inorganic powder containing resin composition manufactured by said (1) to the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET films which carried out the mold release process previously, using a roll coater, and apply | coats a coating film It dried at 100 degreeC for 5 minutes, remove | eliminating a solvent completely, and formed the 1st inorganic powder containing resin layer of thickness 50micrometer on the support film (henceforth "transfer film (I-1)").

Similarly, the 2nd inorganic powder containing resin composition manufactured by said (2) is apply | coated using a roll coater on the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET films which carried out the mold release process previously, and apply | coats The film is dried at 100 ° C. for 5 minutes to completely remove the solvent to form a second inorganic powder-containing resin layer having a thickness of 15 μm on the support film (hereinafter referred to as "transfer film (I-2)").

(4) transfer process of film:

The transfer film (I-1) was superposed | superposed on the surface of the glass substrate for 6-inch panels so that the surface of an inorganic powder containing resin layer might contact, and this transfer film (I-1) was thermocompression-bonded with the heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After completion of the thermocompression treatment, the support film was peeled off. As a result, the first inorganic powder-containing resin layer was transferred to and adhered to the surface of the glass substrate.

Then, the transfer film (I-2) was superimposed on the 1st inorganic powder containing resin layer so that the surface of the 2nd inorganic powder containing resin layer might contact, and this transfer film (I-2) was thermocompression-bonded with the heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(5) Exposure process of 2nd inorganic powder containing resin layer:

I-rays (ultraviolet light having a wavelength of 365 nm) were irradiated to the second inorganic powder-containing resin layer formed on the first inorganic powder-containing resin layer by using an ultra-high pressure mercury lamp on a support film through a mask for exposure (200 μm wide stripe pattern). It was. Irradiation amount was 400 mJ / cm <^2> here.

(6) The developing process of a 2nd inorganic powder containing resin layer:

After peeling a support film from the 2nd inorganic powder containing resin layer, the development process by the shower method which makes 1.0 mass% aqueous sodium carbonate aqueous solution (30 degreeC) a developing solution with respect to the 2nd inorganic powder containing resin layer exposed to exposure was performed for 30 second. In this manner, the uncured second inorganic powder-containing resin layer, which was not irradiated with ultraviolet rays, was removed, thereby obtaining a pattern of the second inorganic powder-containing resin layer on the first inorganic powder-containing resin layer.

(7) firing process:

The glass substrate in which the pattern of the 2nd inorganic powder containing resin layer was formed on the 1st inorganic powder containing resin layer was calcined for 30 minutes in the baking furnace in the temperature atmosphere of 590 degreeC. Thereby, the panel material by which the black stripe of pattern width 200 micrometers and height 6 micrometers was formed on the 25-micrometer-thick dielectric layer on the surface of a glass substrate was obtained.

<Example 2>

In the manufacture of the transfer film of (3) in Example 1, the support film which consists of PET film which prerelease-released the 2nd inorganic powder containing resin composition manufactured by said (2) (200 mm in width, 30 m in length, thickness 38). (Micrometer) was apply | coated using a roll coater, the coating film was dried at 100 degreeC for 5 minutes, the solvent was completely removed, and the 2nd inorganic powder containing resin layer of thickness 15micrometer was formed on the support film.

Furthermore, the 1st inorganic powder containing resin composition manufactured by said (1) is apply | coated on a 2nd inorganic powder containing resin layer using a roll coater, a coating film is dried at 100 degreeC for 5 minutes, a solvent is completely removed, The transfer film (henceforth "transfer film (I-3)") of this invention in which the 1st inorganic powder containing resin layer of thickness 50micrometer was formed on the 2 inorganic powder containing resin layer was obtained.

In Example 1, (4) the transfer film (I-3) is superposed so that the surface of a 1st inorganic powder containing resin layer may contact the surface of the glass substrate for 6-inch panels in the film transfer process, and this transfer film ( I-3) was thermocompressed with a heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

In the same manner as in Example 1, an exposure step, a developing step, and a baking step of the second inorganic powder-containing resin layer were performed. Thereby, the panel material by which the black stripe of pattern width 200 micrometers and height 6 micrometers was formed on the 25-micrometer-thick dielectric layer on the surface of a glass substrate was obtained.

<Example 3>

(1) Preparation of 1st inorganic powder containing resin composition (composition for dielectric formation):

Example 1 It carried out similarly to (1), and manufactured the 1st inorganic powder containing resin composition.

(2) Preparation of 2nd inorganic powder containing resin composition (composition for black matrix formation):

(a) an inorganic powder Cu-Cr composite oxide black pigment (mean particle size 0.3 ㎛) 60 _{part, Bi 2 O 3 -OB 2 O} 3 -SiO 2 based glass frit (softening point 560 ℃, average particle size 2.0 ㎛) 40 parts and (b) 20 parts by weight of 2-ethylhexyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid as a binder resin (60 mass% / 25 mass% / 15 mass% copolymer (weight average molecular weight: 50,000)) and (c) 20 parts of propylene glycol monomethyl ether as a solvent and 5 parts of propylene glycol monooleate as a plasticizer were kneaded using a disperser to prepare a second inorganic powder-containing resin composition having a viscosity of 4,000 mPa · s ⁻¹ .

(3) Preparation of alkali developing radiation sensitive resist composition:

Benzyl methacrylate / methacrylic acid = 75/25 (mass%) copolymer (Mw = 60,000) as alkali-soluble resin, 60 parts of tripropylene glycol diacrylates as a polyfunctional monomer (radiation sensitive component), photopolymerization Alkali development by kneading 5 parts of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one as an initiator (radiation sensitive component) and 100 parts of propylene glycol monomethyl ether acetate as a solvent A type radiation sensitive resist composition (hereinafter referred to as a "resist composition") was produced.

(4) Preparation of the transfer film:

Applying the 1st inorganic powder containing resin composition manufactured by said (1) to the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET films which carried out the mold release process previously, using a roll coater, and apply | coats a coating film It dried at 100 degreeC for 5 minutes, remove | eliminating a solvent completely, and formed the 1st inorganic powder containing resin layer of thickness 50micrometer on the support film (henceforth "transfer film (II-1)").

Similarly, apply | coating using the roll coater on the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET film which prerelease-released the 2nd inorganic powder containing resin composition manufactured by said (2), The coating film was dried at 100 ° C. for 5 minutes to completely remove the solvent, and a second inorganic powder-containing resin layer having a thickness of 15 μm was formed on the support film (hereinafter, referred to as "transfer film (II-2)").

Similarly, the resist composition prepared in the above (3) was applied onto a support film (200 mm in width, 30 m in length, 38 μm in thickness) made of a PET film previously released, using a roll coater, and the coating film was 100 ° C. Was dried for 5 minutes to completely remove the solvent, and a resist film having a thickness of 8 µm was formed on the support film (hereinafter referred to as "transfer film (II-3)").

(4) transfer process of film:

The transfer film (II-1) was superimposed on the surface of the glass substrate for 6-inch panels so that the surface of an inorganic powder containing resin layer might contact, and this transfer film (II-1) was thermocompression-bonded with the heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After completion of the thermocompression treatment, the support film was peeled off. As a result, the first inorganic powder-containing resin layer was transferred to and adhered to the surface of the glass substrate.

Subsequently, the transfer film (II-2) was superimposed on the 1st inorganic powder containing resin layer so that the surface of the 2nd inorganic powder containing resin layer might contact, and this transfer film (II-2) was thermocompression-bonded with the heating roller. . Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After completion of the thermocompression treatment, the support film was peeled off. As a result, the second inorganic powder-containing resin layer was transferred to and adhered to the surface of the first inorganic powder-containing resin layer.

Furthermore, the transfer film (II-3) was superimposed on the 2nd inorganic powder containing resin layer so that the surface of a resist film might contact, and this transfer film (II-3) was thermocompression-bonded with the heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(5) Exposure process of resist film:

The i-line (ultraviolet light having a wavelength of 365 nm) was irradiated to the resist film formed on the 2nd inorganic powder containing resin layer with the ultrahigh pressure mercury lamp on the support film through the exposure mask (200 micrometers wide stripe pattern). Here, the irradiation amount was 40 mJ / cm ² .

(6) Developing process of resist film:

After peeling a support film from a resist film, the developing process by the shower method which makes 0.6 mass% aqueous sodium carbonate aqueous solution (30 degreeC) a developing solution with respect to an exposed resist film for 30 second was performed, and ultraviolet light was not irradiated by this. The uncured resist film was removed, and a resist pattern was obtained on the second inorganic powder-containing resin layer.

(7) Etching Process of Second Inorganic Powder-Containing Resin Layer:

Subsequent to the development process of the resist film (6), the etching process by a shower method using 0.6 mass% sodium carbonate aqueous solution (30 ° C.) as an etching solution with respect to the second inorganic powder-containing resin layer was performed for 60 seconds, followed by ultrapure water. Washing with water and drying treatment, thereby removing the second inorganic powder-containing resin layer corresponding to the resist film removing unit to obtain a second inorganic powder-containing resin layer pattern on the first inorganic powder-containing resin layer. .

(8) firing process:

The glass substrate in which the 2nd inorganic powder containing resin layer pattern was formed on the 1st inorganic powder containing resin layer was baked in the baking furnace for 30 minutes in the temperature atmosphere of 590 degreeC. Thereby, the organic component in a resist pattern, a 2nd inorganic powder containing resin layer pattern, and a 1st inorganic powder containing resin layer was removed, and the pattern width of 200 micrometers and a height of 6 micrometers were formed on the dielectric layer of thickness 25micrometer on the surface of a glass substrate. The panel material in which the black matrix (stripe) was formed was obtained.

<Example 4>

Example 3 (4) In the manufacture of the transfer film, on the support film (200 mm in width, 30 m in length, 38 μm in thickness) consisting of a PET film in which the resist composition prepared in Example 3 (3) was released in advance. It apply | coated using the reverse roll coater, the coating film was dried at 100 degreeC for 3 minutes, the solvent was completely removed, and the 8-micrometer-thick resist film was formed on the support film.

Subsequently, the second inorganic powder-containing resin composition prepared in Example 3 (2) was applied onto the resist film using a blade coater, the coating film was dried at 100 ° C. for 5 minutes to completely remove the solvent, and the thickness was 15 μm. The second inorganic powder containing resin layer was formed on the support film.

Further, the first inorganic powder-containing resin composition prepared in Example 3 (1) was applied onto the second inorganic powder-containing resin layer using a blade coater, and the coating film was dried at 100 ° C. for 5 minutes to completely remove the solvent. And the transfer film (henceforth "transfer film (II-4)") of this invention in which the 1st inorganic powder containing resin layer of thickness 50micrometer was formed on the 2nd inorganic powder containing resin layer were obtained.

Example 3 (5) In the transfer process of a film, the transfer film (II-4) is superposed so that the surface of a 1st inorganic powder containing resin layer may contact the surface of the glass substrate for 6-inch panels, and this transfer film ( II-4) was thermally pressed with a heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

In the same manner as in Example 1, the resist film was exposed, the developing step, the etching step and the baking step of the second inorganic powder-containing resin layer were performed. As a result, a panel material obtained by forming a black matrix (stripe) having a pattern width of 200 μm and a height of 6 μm on a dielectric layer having a thickness of 25 μm on the surface of the glass substrate was obtained.

1 is a cross-sectional view illustrating a general PDP.

<Explanation of symbols for the main parts of the drawings>

1: glass substrate 2: glass substrate

3: partition 4: transparent electrode

5: bus electrode 6: address electrode

7: phosphor 8: dielectric layer

9: dielectric layer 10 protective film

Claims (6)

(i) forming a non-photosensitive first inorganic powder-containing resin layer on the substrate, and forming a photosensitive second inorganic powder-containing resin layer on the first inorganic powder-containing resin layer; (Ii) exposing and developing the second inorganic powder resin layer to form a pattern of the second inorganic powder-containing resin layer, and (Iii) Process of baking the 2nd inorganic powder containing resin layer pattern formed on the 1st inorganic powder containing resin layer and this 1st inorganic powder containing resin layer. Forming a pattern on the inorganic film by a method comprising a, The said 1st inorganic powder containing resin layer contains the resin component containing the copolymerization component derived from the compound represented by following formula (1), The said 2nd inorganic powder containing resin layer contains alkali-soluble resin component, It is characterized by the above-mentioned. , Manufacturing method of plasma display panel. <Formula 1>

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group or an alkoxyalkyl group. The method according to claim 1, wherein at least one of the first inorganic powder-containing resin layer and the second inorganic powder-containing resin layer is formed by a method including a step of transferring the inorganic powder-containing resin layer formed on the support film. The manufacturing method of a plasma display panel. The first inorganic powder-containing resin layer according to claim 1, comprising a step of transferring a laminated film of the second inorganic powder-containing resin layer and the first inorganic powder-containing resin layer formed on the support film onto a substrate. And a second inorganic powder-containing resin layer, wherein the plasma display panel is manufactured. The method of manufacturing a plasma display panel according to claim 1, wherein the first inorganic powder-containing resin layer contains a glass frit as an inorganic powder. The panel material according to claim 1, wherein a dielectric layer is formed of the first inorganic powder-containing resin layer, and at least one panel material selected from partitions, electrodes, resistors, phosphors, color filters, and black matrices by the second inorganic powder-containing resin layer. Forming a plasma display panel. The laminated film containing the photosensitive inorganic powder containing resin layer containing alkali-soluble resin component and the non-photosensitive inorganic powder containing resin layer containing alkali-insoluble or poorly soluble resin component is formed on a support film. Characterized in the transfer film.

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