KR20050045842A - Inorganic Particle―Containing Resin Composition, Transfer Film and Plasma Display Panel Production Process - Google Patents

Abstract

TECHNICAL FIELD This invention relates to the manufacturing method of an inorganic powder containing resin composition, a transfer film, and a plasma display panel. Specifically, it contains (a) an inorganic powder containing at least one metal selected from the group consisting of copper, iron and nickel, (b) a binder resin, (c) a photopolymerizable monomer and (d) a photopolymerization initiator. The inorganic powder containing resin composition, the transfer film in which the layer containing this composition was formed on the support film, and the manufacturing method of the plasma display panel using the said composition.

Description

Production method of inorganic powder-containing resin composition, transfer film and plasma display panel {Inorganic Particle-Containing Resin Composition, Transfer Film and Plasma Display Panel Production Process}

TECHNICAL FIELD This invention relates to the manufacturing method of an inorganic powder containing resin composition, a transfer film, and a plasma display panel. Specifically, the present invention relates to a method for producing a plasma display panel having high manufacturing efficiency and excellent patterning property, and a composition and a transfer film, which are preferably used in the formation of a black matrix and an electrode constituting the plasma display panel.

Plasma display panel (PDP) is attracting attention among flat panel display technologies due to its large panel size, easy manufacturing process, wide viewing angle, and high display quality due to its self-luminous type. It is expected to become the mainstream in the future as a display device for wall-mounted TVs larger than inches.

In color PDP, color display becomes possible by irradiating the fluorescent substance with the ultraviolet-ray generate | occur | produced by gas discharge. In general, in a color PDP, a phosphor portion for red light emission, a phosphor portion for green light emission, and a phosphor portion for blue light emission are formed on a substrate, whereby light-emitting display cells of each color are uniformly mixed throughout. Consists of Specifically, a partition wall including an insulating material called barrier rib is provided on a surface of a substrate including glass or the like, and a plurality of display cells are partitioned by the partition wall, so that the inside of the display cell has a plasma working space. do. In addition, a phosphor portion is provided in the plasma working space, and an electrode for applying a plasma to the phosphor portion is provided to form a plasma display panel in which each display cell is a display unit. The electrode is usually composed of a laminated pattern having a white conductive layer containing silver and the like and a black layer serving as a light shielding layer under the white conductive layer. Moreover, in order to improve the contrast of a PDP normally, a black matrix and a color filter are provided between electrode patterns.

 As a method for producing a panel material in such a plasma display panel, (1) an ion sputtering method, an electron beam deposition method, or the like, or (2) an inorganic powder-containing resin layer pattern formed by a photolithography method, a screen printing method, or the like is fired. And a method for removing organic matters are known. Especially, the method of patterning an inorganic powder containing resin layer by the photolithographic method is used suitably as a method with high manufacturing efficiency.

<Patent Document 1>

Japanese Patent Publication No. 11-162339

<Patent Document 2>

Japanese Patent Laid-Open No. 2001-84833

<Patent Document 3>

Japanese Patent Publication No. 2002-245932

<Patent Document 4>

Japanese Patent Publication No. 2003-51250

In the prior art, after forming an electrode pattern when forming a black matrix, it was necessary to form a black matrix between electrode patterns using the black inorganic powder containing resin from which the composition differs from the black conductive layer of the said electrode pattern. Therefore, since the development and the baking process were required twice each when forming the black matrix and the electrode pattern, a manufacturing method with better manufacturing efficiency was desired.

The 1st objective of this invention is providing the inorganic powder containing resin composition suitable for simultaneously forming a black matrix and the light shielding layer in an electrode.

A second object of the present invention is to form a transfer film suitable for simultaneously forming a black matrix and a light shielding layer in an electrode.

A third object of the present invention is to provide a method of manufacturing a plasma display panel which is excellent in manufacturing efficiency in forming a black matrix and an electrode.

The inorganic powder-containing resin composition of the present invention comprises (a) an inorganic powder containing at least one metal selected from the group consisting of copper, iron and nickel, (b) a binder resin, (c) a photopolymerizable monomer and (d) It is characterized by containing a photoinitiator.

The transfer film of the present invention is characterized in that a layer containing the inorganic powder-containing resin composition of the present invention is formed on a supporting film.

The method of manufacturing the plasma display panel of the present invention (hereinafter also referred to as "manufacturing method (I) of PDP") forms a black matrix and an electrode at the same time by a method comprising the following steps (i) to (vi). It is characterized by.

(i) Process of forming inorganic powder containing resin layer A on the board | substrate using the inorganic powder containing resin composition of Claim 1.

(ii) A step of exposing the inorganic powder-containing resin layer A to form a latent image of the pattern of the inorganic powder-containing resin layer A.

(iii) Process of forming photosensitive electroconductive inorganic powder containing resin layer B on said inorganic powder containing resin layer A.

(iv) Exposing the said conductive inorganic powder containing resin layer B, and forming the latent image of the pattern of the conductive inorganic powder containing resin layer B.

(v) The inorganic powder-containing resin layer A and the conductive inorganic powder-containing resin layer B are developed to simultaneously form a pattern of the inorganic powder-containing resin layer A and a lamination pattern of the inorganic powder-containing resin layer A / conductive inorganic powder-containing resin layer B. Process.

(vi) The process of baking the pattern of the inorganic powder containing resin layer A, and the laminated pattern of the inorganic powder containing resin layer A / conductive inorganic powder containing resin layer B.

The method for manufacturing a plasma display panel of the present invention (hereinafter also referred to as "manufacturing method (II) of PDP") simultaneously forms a black matrix and an electrode by a method comprising the following steps (vii) to (xii). It is characterized by.

(vii) Process of forming inorganic powder containing resin layer A on the board | substrate using the inorganic powder containing resin composition of Claim 1.

(viii) A process of exposing the said inorganic powder containing resin layer A and forming the latent image of the pattern of the inorganic powder containing resin layer A.

(ix) Process of forming non-photosensitive electroconductive inorganic powder containing resin layer C on said inorganic powder containing resin layer A, and forming a resist layer on said electroconductive inorganic powder containing resin layer C.

(x) The process of exposing and developing a resist layer and forming the pattern of a resist layer on the conductive inorganic powder containing resin layer C.

(xi) The development process of the inorganic powder containing resin layer A and the etching process of the electroconductive inorganic powder containing resin layer C are performed, and the inorganic powder containing resin layer A / electroconductivity corresponding to the pattern of the inorganic powder containing resin layer A, and the resist layer pattern is performed. The process of simultaneously forming the lamination pattern of the inorganic powder containing resin layer C.

(xii) The process of baking the pattern of the inorganic powder containing resin layer A and the lamination pattern of the inorganic powder containing resin layer A / conductive inorganic powder containing resin layer C.

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

<Inorganic powder containing resin composition>

The inorganic powder-containing resin composition of the present invention comprises (a) an inorganic powder containing at least one metal selected from the group consisting of copper, iron and nickel, (b) a binder resin, (c) a photopolymerizable monomer and (d) The photoinitiator is an essential component and usually has photosensitivity.

(a) inorganic powder

Copper, iron, nickel particles are mentioned as an inorganic powder used for the inorganic powder containing resin composition of this invention. When the inorganic powder-containing composition of the present invention is used in the production method of the PDP of the present invention, the inorganic powder is usually oxidized in the firing step, but the inorganic powder contained in the black matrix and the light shielding layer of the electrode obtained by using the metal particles are used. The degree of oxidation (the progress of oxidation) can be different, and it is possible to simultaneously form the black matrix having no conductivity and the light shielding layer of the electrode having conductivity.

 The average particle diameter of the said inorganic powder becomes like this. Preferably it is 0.01-10 micrometers, More preferably, it is 0.05-5 micrometers. When the average particle diameter of an inorganic powder is less than 0.01 micrometer, since the specific surface area of an inorganic powder becomes large, aggregation of particle | grains will occur easily in a composition, and it will become difficult to obtain a stable dispersion state. On the other hand, when the average particle diameter of an inorganic powder is 10 micrometers or more, it becomes difficult to obtain a high precision pattern.

In addition, the glass powder frit may be contained in the inorganic powder containing resin composition of this invention other than each inorganic powder mentioned above. As the composition of the glass frit, for example, 1. a mixture of lead oxide, boron oxide, silicon oxide (PbO-B ₂ O ₃ -SiO _{2 type} ), 2. zinc oxide, boron oxide, silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ based), 3. Mixture of lead oxide, boron oxide, silicon oxide, aluminum oxide (PbO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ based), 4. Lead oxide, zinc oxide And a mixture of boron oxide and silicon oxide (PbO-ZnO-B ₂ O ₃ -SiO _{2 type} ). As a softening point of these glass frits, it is preferable to exist in the range of 400-600 degreeC. Content of the glass frit in the inorganic powder containing resin composition of this invention is 80 mass% or less with respect to inorganic powder whole quantity, Preferably it is 50 mass% or less.

(b) binding resin

Although various resin can be used as binder resin which comprises the inorganic powder containing resin composition of this invention, it is preferable to use resin which contains alkali-soluble resin in the ratio of 30-100 mass%. Here, "alkali-soluble" means the property which melt | dissolves with alkaline developing solution and has solubility to the extent that a desired image development process is performed.

As a specific example of such alkali-soluble resin, (meth) acrylic-type resin, hydroxy styrene resin, a novolak resin, a polyester resin etc. are mentioned, for example.

Among these alkali-soluble resins, acrylic resins such as copolymers of the following monomers (A) and monomers (C), copolymers of monomers (A), monomers (B) and monomers (C) are mentioned.

Monomer (A): Carboxyl group-containing monomers

Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) acryloyloxyethyl), ω-carboxy-polycaprolactone mono (Meth) acrylates and the like.

Monomer (B): OH-containing monomers

Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 3-hydroxypropyl (meth) acrylate; Phenolic hydroxyl group containing monomers, such as o-hydroxy styrene, m-hydroxy styrene, and p-hydroxy styrene.

Monomer (C): Other copolymerizable monomers

Methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-lauryl (meth) acrylate, benzyl (meth) acrylate, glycy (meth) acrylate (Meth) acrylic acid esters other than monomer (a), such as dill and dicyclopentanyl (meth) acrylate; Aromatic vinyl monomers such as styrene and α-methylstyrene; Conjugated dienes such as butadiene and isoprene; Macromonomers having a polymerizable unsaturated group such as a (meth) acryloyl group at one end of a polymer chain such as polystyrene, methyl poly (meth) acrylate, poly (meth) acrylate, and benzyl poly (meth) acrylate.

The copolymer of the monomer (A) and the monomer (C), or the copolymer of the monomer (A), the monomer (B) and the monomer (C) has alkali solubility due to the presence of a copolymerization component derived from the monomer (A). It is to have. Especially, the copolymer of a monomer (A), a monomer (B), and a monomer (C) is especially preferable from a viewpoint of the dispersion stability of (A) inorganic particle and the solubility to the alkali developing solution mentioned later. The content rate of the copolymerization component derived from the monomer (a) in this copolymer becomes like this. Preferably it is 5 to 60 mass%, Especially preferably, it is 10 to 40 mass%, and the content rate of the copolymerization component derived from a monomer (b) is preferable. Preferably it is 1-50 mass%, Especially preferably, it is 5-30 mass%.

As molecular weight of the said alkali-soluble resin, it is preferable that Mw is 5,000-5,000,000, More preferably, it is 10,000-300,000.

Moreover, as content ratio of the binder resin in the inorganic powder containing resin composition of this invention, it is 1-200 mass parts normally with respect to 100 mass parts of inorganic powder, Preferably it is 5-100 mass parts, Especially preferably, it is 10- 80 parts by mass.

(c) photopolymerizable monomer

As a photopolymerizable monomer which comprises the inorganic powder containing resin composition of this invention, a polyfunctional (meth) acrylate is mentioned as a preferable thing, for example.

As a specific example of polyfunctional (meth) acrylate, Di (meth) acrylates of alkylene glycol, such as ethylene glycol and propylene glycol; Di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; Di (meth) acrylates of both terminal hydroxylated polymers such as both terminal hydroxypolybutadiene, both terminal hydroxypolyisoprene and both terminal hydroxypolycaprolactone;

Poly (meth) acrylates of trivalent or higher polyhydric alcohols such as glycerin, 1,2,4-butanetriol, trimethylolalkane, tetramethylolalkane, pentaerythritol, dipentaerythritol, etc .; Poly (meth) acrylates of polyalkylene glycol adducts of trivalent or higher polyhydric alcohols; Poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediols; Oligos, such as polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spiran resin (meth) acrylate ( And meth) acrylates. These may be used alone or in combination of two or more thereof.

As a molecular weight of the said polyfunctional (meth) acrylate, it is preferable that it is 100-2,000.

As a content rate of the photopolymerizable monomer in the inorganic powder containing resin composition of this invention, it is 30-70 mass parts with respect to 100 mass parts of inorganic powders normally, Preferably it is 40-60 mass parts.

(d) photoinitiator

As a specific example of the photoinitiator which comprises the inorganic powder containing resin composition of this invention, benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydride Oxycyclohexylphenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propaneone, 2-benzyl-2- Carbonyl compounds such as dimethylamino-1- (4-morpholinophenyl) -butan-1-one; Azo compounds or azide compounds such as azoisobutyronitrile and 4-azide benzaldehyde; Organic sulfur compounds such as mercaptan disulfide; Organic peroxides such as benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide and paramethane hydroperoxide; 1,3-bis (trichloromethyl) -5- (2'-chlorophenyl) -1,3,5-triazine, 2- [2- (2-furanyl) ethylenyl] -4,6-bis Trihalo methanes such as (trichloromethyl) -1,3,5-triazine; And imidazole dimers such as 2,2'-bis (2-chlorophenyl) -4,5,4 'and 5'-tetraphenyl-1,2'-biimidazole. These can be used individually or in combination of 2 or more types.

As a content rate of the photoinitiator in the inorganic powder containing resin composition of this invention, it is 10-50 mass parts normally with respect to 100 mass parts of photopolymerizable monomers, Preferably it is 15-35 mass parts.

The inorganic powder-containing resin composition of the present invention usually contains a solvent in order to impart proper fluidity or plasticity and good film formability. As the solvent to be used, it is preferable that the affinity with the inorganic powder and the solubility of the binding resin are good, the appropriate viscosity can be imparted to the inorganic powder-containing resin composition, and the evaporation can be easily removed by drying.

Moreover, as a particularly preferable solvent, ketones, alcohols, and esters (hereinafter, these are referred to as "specific solvents") whose standard boiling point (boiling point at 1 atmosphere) are 100-200 degreeC.

As a specific example of such a specific solvent, Ketones, such as a diethyl ketone, a methyl butyl ketone, a dipropyl ketone, cyclohexanone; alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol; Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether; Saturated aliphatic monocarboxylic acid alkyl esters such as acetic acid-n-butyl and amyl acetate; Lactic acid esters such as ethyl lactate and lactic acid-n-butyl; And ether esters such as methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, and ethyl-3-ethoxypropionate, and the like. And diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate, propylene glycol monomethyl ether acetate, ethyl-3-ethoxypropionate, and the like. These specific solvents can be used individually or in combination of 2 or more types.

Specific examples of solvents other than the specific solvents include terebin oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, benzyl alcohol, and the like.

As a content rate of the solvent in the inorganic powder containing resin composition of this invention, it can select suitably within the range from which favorable film formation property (fluidity or plasticity) is obtained.

Moreover, in the inorganic powder containing resin composition of this invention, as an arbitrary component, a plasticizer, a dispersing agent, a development promoter, an adhesion | attachment adjuvant, an antihalation agent, a leveling agent, a storage stabilizer, an antifoamer, antioxidant, a ultraviolet absorber, a sensitizer, a chain transfer agent, etc. Various additives may be contained.

The inorganic powder-containing resin composition of the present invention comprises the above-mentioned inorganic powder, a binder resin, a photopolymerizable monomer, a photopolymerization initiator and a solvent, and optionally the above-mentioned optional components in a roll kneader, mixer, homo mixer, ball mill, bead mill, etc. It can manufacture by kneading using the kneading machine of.

The inorganic powder-containing resin composition prepared as described above is a paste-like composition having fluidity suitable for application, and its viscosity is usually 100 to 1,000,000 cp, preferably 500 to 300,000 cp.

<Transfer film>

The transfer film of this invention apply | coats the inorganic powder containing resin composition of this invention on a support film, and the layer obtained by drying a coating film is formed. It is preferable that the support film which comprises a transfer film is a resin film which has heat resistance and solvent resistance, and has flexibility. Since a support film has flexibility, a paste composition can be apply | coated by a roll coater, and an inorganic powder containing resin layer can be preserve | saved and supplied in the state wound up to roll shape. Examples of the resin forming the support film include fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, nylon, cellulose, and the like. Can be mentioned. As thickness of a support film, it is 20-100 micrometers, for example.

As a method of apply | coating an inorganic powder containing resin composition on a support film, it is necessary to be able to form a thick film thickness (for example, 10 micrometers or more) excellent in the uniformity of film thickness efficiently, and specifically, a roll The coating method with a coater, the coating method with a doctor blade, the coating method with a curtain coater, the coating method with a die coater, the coating method with a wire coater, etc. are mentioned as a preferable thing.

Moreover, it is preferable that the mold release process is given to the surface of the support film to which an inorganic powder containing resin composition is apply | coated. Thereby, peeling operation of a support film can be performed easily in the transfer process mentioned later.

As drying conditions of a coating film, it is about 0.5 to 30 minutes at 50-150 degreeC, for example, and the residual ratio (content rate in an inorganic powder containing resin layer) of a solvent after drying is normally 2 mass% or less.

As thickness of the inorganic powder containing resin layer formed on a support film as mentioned above, although it changes also with content rate, size, etc. of an inorganic powder, it is 5-500 micrometers, for example.

Moreover, a polyethylene film, a polyvinyl alcohol-type film, etc. are mentioned as a protective film layer provided in the surface of an inorganic powder containing resin layer.

<Production Method of PDP (I)>

In the manufacturing method (I) of the PDP of this invention, (i) formation process of inorganic powder containing resin layer A, (ii) exposure process of inorganic powder containing resin layer A, and (iii) electroconductive inorganic powder containing resin layer B A black matrix and an electrode can be formed simultaneously by the method including a formation process, the (iv) exposure process of the conductive inorganic powder containing resin layer B, the (v) developing process, and the (vi) baking process.

1 is a schematic cross-sectional view showing a series of steps for forming a black matrix and an electrode in the manufacturing method (I) of a PDP.

(i) Formation Process of Inorganic Powder-Containing Resin Layer A

In this step, as shown in FIG. 1 (i), the inorganic powder-containing resin layer A 11 is formed on the substrate 10. Inorganic powder containing resin layer A can be formed by apply | coating the inorganic powder containing resin composition of this invention on a board | substrate, or transferring the said inorganic powder containing resin layer on a board | substrate using the transfer film of this invention. According to the method using a transfer film, the inorganic powder containing resin layer A excellent in film thickness uniformity can be formed easily, and the film thickness uniformity of the pattern formed can be aimed at. Moreover, by repeating n times transfer using the said transfer film, you may form the laminated body which has an inorganic powder containing resin layer of n layer (n represents an integer of 2 or more). Moreover, the said laminated body can also be formed by carrying out the collective transfer of the laminated body containing n-layered inorganic powder containing resin layer on a board | substrate using the transfer film formed on the support film.

As a coating method of an inorganic powder containing resin composition, various methods, such as the screen printing method, the roll coating method, the rotary coating method, the flexible coating method, are mentioned, and after apply | coating the inorganic powder containing resin composition of this invention, drying a coating film The inorganic powder containing resin layer A can be formed by the method. In addition, an n-layer laminate can be formed by repeating the above steps n times.

Moreover, when an example of the transfer process using a transfer film is shown, it is as follows. After peeling the protective film layer of the transfer film used as needed, after laminating | stacking a transfer film so that the surface of an inorganic powder containing resin layer may contact the board | substrate surface, and heat-compression-bonding this transfer film with a heating roller etc., an inorganic powder The support film is peeled off from the containing resin layer. As a result, the inorganic powder-containing resin layer is transferred to and adhered to the substrate surface. Here, as transfer conditions, the surface temperature of a heating roller can show 40-140 degreeC, the roll pressure by a heating roller is 0.1-10 kg / cm, and the moving speed of a heating roller can show 0.1-10 m / min, for example. . In addition, the board | substrate may be preheated and can be 40-140 degreeC as preheating temperature, for example.

(ii) Exposure process of inorganic powder containing resin layer A

In this step, as shown in Fig. 1 (ii), the surface of the photosensitive inorganic powder-containing resin layer A (11) is subjected to selective irradiation (exposure) of radiation such as ultraviolet rays through the exposure mask M to expose the latent image of the pattern. To form. In the same figure, MA and MB are the light transmission part and the light shielding part in the exposure mask M, respectively. In addition, 11a is a photosensitive part (pattern latent image part) of inorganic powder containing resin layer A, and 11b is a non-photosensitive part.

Here, although the ultraviolet irradiation apparatus, the semiconductor, and the exposure apparatus used when manufacturing a liquid crystal display device generally used by the photolithographic method are used as a radiation irradiation apparatus, it is not specifically limited.

Moreover, when inorganic powder containing resin layer A is formed by transcription | transfer, it is preferable to perform exposure in the state which does not peel the support film coat | covered on the said resin layer.

(iii) Formation process of conductive inorganic powder containing resin layer B

In this step, as shown in FIG. 1 (iii), the conductive inorganic powder-containing resin layer B 12 is formed on the inorganic powder-containing resin layer 11. The conductive inorganic powder containing resin layer B applies the photosensitive conductive inorganic powder containing resin composition mentioned later on the inorganic powder containing resin layer A, or uses the transfer film which has a structure in which the conductive inorganic powder containing resin layer was formed on the support film. It can form by transferring a conductive inorganic powder containing resin layer on inorganic powder containing resin layer A. The coating method of the electroconductive inorganic powder containing resin composition, the transfer method of a transfer film, and transfer conditions can be made the same as each method and conditions in the above-mentioned process (i).

The conductive inorganic powder-containing resin composition is a composition having the same composition as the inorganic powder-containing resin composition of the present invention, except that (a ') conductive powder is used instead of (a) inorganic powder, and can be obtained by the same forming method. As (a ') electroconductive powder which comprises the said composition, particle | grains, such as Ag, Au, Al, Ag-Pd alloy, Cr, are mentioned. Moreover, the said glass frit may be contained in the said composition other than electroconductive powder.

The transfer film which has a conductive inorganic powder containing resin layer can be formed similarly to the transfer film of this invention except having used the said conductive inorganic powder containing resin composition instead of the inorganic powder containing resin composition of this invention.

(iv) Exposure process of conductive inorganic powder containing resin layer B

In this step, as shown in Fig. 1 (iv), the surface of the photosensitive conductive inorganic powder-containing resin layer B 12 is subjected to selective irradiation (exposure) of radiation such as ultraviolet rays (exposure) through a mask m for exposure to obtain the pattern. Forms a latent image. In the same figure, mA and mB are a light transmitting part and a light shielding part in the exposure mask m, respectively. In addition, 12a is a photosensitive part (pattern latent image part) of the conductive inorganic powder containing resin layer B, and 12b is a non-photosensitive part. At this time, as shown to Fig.1 (iv), the part 12a in which the electroconductive inorganic powder containing resin layer B remains by the image development process mentioned later is the part in which the inorganic powder containing resin layer A remains by image development process ( 11a).

Here, although the ultraviolet irradiation device used by the said photolithographic method, the exposure apparatus used when manufacturing a semiconductor, and a liquid crystal display device etc. are used as a radiation irradiation apparatus, it is not specifically limited.

Moreover, when electroconductive inorganic powder containing resin layer B is formed by transcription | transfer, it is preferable to perform exposure in the state which does not peel the support film coat | covered on the said resin layer.

(v) developing process

In this step, as shown in Fig. 1 (v), the exposed inorganic powder-containing resin layer A and the conductive inorganic powder-containing resin layer B are developed, and the pattern 11a and the inorganic powder-containing water of the inorganic powder-containing resin layer A are developed. The laminated pattern of the ground layer A pattern 11a / conductive inorganic powder containing resin layer B pattern 12a is simultaneously formed.

Here, as the development treatment conditions, depending on the type of the inorganic powder-containing resin layer, the type, composition, and concentration of the developing solution, the developing time, the developing temperature, the developing method (for example, the dipping method, the shaking method, the shower method, the spray method, the puddle method, and the like) ), A developing device and the like can be appropriately selected.

(vi) firing process

In this step, the pattern of the inorganic powder-containing resin layer A and the lamination pattern of the inorganic powder-containing resin layer A / the conductive inorganic powder-containing resin layer B are subjected to batch firing, and the inorganic powder-containing resin layer A and the conductive inorganic powder-containing resin layer B The organic substance in the remainder of the layer disappears. By this step, the black matrix 21 is formed from the pattern of the inorganic powder-containing resin layer A from the laminated pattern of the inorganic powder-containing resin layer A / the conductive inorganic powder-containing resin layer B by the electrode 24 (light-shielding layer 22 / The conductive layer laminate 23 is formed at the same time.

In the present invention, in the pattern of only the inorganic powder-containing resin layer A (pattern in which the conductive inorganic powder-containing resin layer B does not exist in the upper part) and the laminated pattern of the inorganic powder-containing resin layer A / conductive inorganic powder-containing resin layer B, Since the amount of oxygen supplied to the inorganic powder-containing resin layer A in the firing step is usually different, the degree of oxidation (the progress of oxidation) of the inorganic powder contained in the inorganic powder-containing resin layer A is different. Therefore, the black matrix which does not have electroconductivity from the pattern of the inorganic powder containing resin layer A has electroconductivity in the inorganic powder containing resin layer A in the lamination pattern of the inorganic powder containing resin layer A / conductive inorganic powder containing resin layer B. It becomes possible to form a light shielding layer, respectively

Here, as a temperature of baking process, it is necessary to be the temperature which the organic substance in an inorganic powder containing resin layer (residual part) disappears, and is 400-600 degreeC normally. In addition, baking time is 10 to 90 minutes normally.

<Production Method of PDP (II)>

In the manufacturing method (II) of the PDP of this invention, (vii) the inorganic powder containing resin layer A formation process, (viii) the inorganic powder containing resin layer A exposure process, (ix) electroconductive inorganic powder containing resin layer C, and The black matrix and the electrode can be formed simultaneously by a method including a step of forming a resist layer, (x) an exposure and development step of a resist layer, a (xi) development and etching step, and a (xii) firing step.

In each step, (vii) the inorganic powder-containing resin layer A forming step, (viii) the inorganic powder-containing resin layer A exposure step, and (xii) the firing step are described in ( i) It is performed similarly to the formation process of inorganic powder containing resin layer A, (ii) exposure process of inorganic powder containing resin layer A, and (xii) baking process.

(ix) Formation process of conductive inorganic powder containing resin layer C and resist layer

The electroconductive inorganic powder containing resin layer C applies the non-photosensitive electroconductive inorganic powder containing resin composition mentioned later on inorganic powder containing resin layer A, or has the transfer film which has a structure in which the conductive inorganic powder containing resin layer was formed on the support film. It can form by transferring an electroconductive inorganic powder containing resin layer on inorganic powder containing resin layer A using it. The coating method of the electroconductive inorganic powder containing resin composition, the transfer method of a transfer film, and transfer conditions can be made the same as each method and conditions in the above-mentioned process (i).

The non-photosensitive conductive inorganic powder-containing resin composition is a composition having the same composition as the photosensitive conductive inorganic powder-containing resin composition described above, except that (c) the photopolymerizable monomer and (d) the photopolymerization initiator are not used. It can be obtained by the method.

The transfer film which has a non-photosensitive electroconductive inorganic powder containing resin layer is formed like the transfer film of this invention except having used the said non-photosensitive electroconductive inorganic powder containing resin composition instead of the inorganic powder containing resin composition of this invention. can do.

In this step, a resist layer is formed on the non-photosensitive conductive inorganic powder-containing resin layer C. As a resist which comprises this resist layer, any of a positive type resist and a negative type resist may be sufficient, For example, the resist composition containing the above-mentioned (c) photopolymerizable monomer and (d) photoinitiator is used preferably. .

The resist layer can be formed by applying a resist by various methods such as a screen printing method, a roll coating method, a rotary coating method, a flexible coating method, and then drying the coating film. The drying temperature of a coating film is about 60-130 degreeC here normally.

Moreover, it can also form by transferring the resist layer formed on the support film on the electroconductive inorganic powder containing resin layer C. According to such a formation method, since the film thickness uniformity of the resist obtained becomes excellent, the image development process of the said resist layer and the etching process of a film formation material layer are performed uniformly, and the height and shape of the partition formed are made uniform.

As a film thickness of a resist layer, it is 0.1-40 micrometers normally, Preferably it is 0.5-20 micrometers.

In addition, in this step, the laminated film is transferred onto a substrate by using a transfer film in which a laminated film of a resist layer and a non-photosensitive conductive inorganic powder-containing resin layer is formed on a support film, thereby transferring the laminated inorganic film to a conductive inorganic powder-containing resin layer. It is more preferable to collectively form C and a resist layer. According to such a formation method, the lamination | stacking which is excellent in film thickness uniformity can be formed more easily, and a process can be simplified while improving a pattern shape. In addition, the said transfer method and transfer conditions can be made the same as each method and conditions in the above-mentioned process (i).

(x) Process of exposing and developing resist layer

In this step, the surface of the resist layer formed on the conductive inorganic powder-containing resin layer C is selectively irradiated (exposed) with radiation such as ultraviolet rays through an exposure mask to form a latent image of the resist pattern, and the exposed resist layer is exposed. The development process makes the resist pattern (latent image) present.

Here, as an ultraviolet irradiation device, it does not specifically limit, such as the ultraviolet irradiation device used by the said photolithographic method, the semiconductor, and the exposure apparatus used when manufacturing a liquid crystal display device.

Moreover, when forming a resist layer by transfer, it is preferable to perform an exposure process in the state which did not peel the support film coat | covered on the resist layer.

As the developing treatment conditions, the type, composition, and concentration of the developing solution, the developing time, the developing temperature, the developing method (for example, the dipping method, the shaking method, the shower method, the spray method, the puddle method), and the developing apparatus, depending on the type of the resist layer and the like. Etc. can be selected as appropriate.

The pattern of the obtained resist layer acts as an etching mask of the conductive inorganic powder containing resin layer C in the next step (etching step), and the constituent material (photocured resist) of the resist remaining portion is the conductive inorganic powder containing resin layer C. It is necessary that the dissolution rate of the etching liquid is smaller than that of the constituent material.

(xi) Developing and etching process

In this step, the developing treatment of the inorganic powder-containing resin layer A and the etching treatment of the conductive inorganic powder-containing resin layer C are performed, and the inorganic powder-containing resin layer A / corresponding to the pattern of the inorganic powder-containing resin layer A and the resist layer pattern. The laminated pattern of the electroconductive inorganic powder containing resin layer C is formed simultaneously. The image development process conditions of the inorganic powder containing resin layer A can be made the same as the conditions in process (v) mentioned above.

The etching process of the electroconductive inorganic powder containing resin layer C is a process in which the part corresponding to the resist removal part of the pattern of a resist layer is melt | dissolved in an etching liquid, and is selectively removed. Since the developing solution used for the developing process of the inorganic powder containing resin layer A is normally used for the said etching liquid, the developing process of the inorganic powder containing resin layer A and the etching process of the conductive inorganic powder containing resin layer C can be performed simultaneously.

In addition, if the type of resist layer is selected so that the same solution as that used in the development step of the resist layer can be used as the developing solution (= etching solution) used in this step, the previous step and the present step are carried out continuously. It is possible to improve the manufacturing efficiency by simplifying the process, which is preferable.

Here, it is preferable that the resist residual part which comprises the pattern of a resist layer melt | dissolves gradually at the time of an etching process, and is removed completely until the completion | finish of an etching process.

Further, even if some or all of the resist remaining portion remains after the etching process, the resist remaining portion is removed in the next firing step.

Hereinafter, the material used for each said process, various conditions, etc. are demonstrated.

<Substrate>

As a board | substrate material, the plate-shaped member containing insulating materials, such as glass, silicone, polycarbonate, polyester, aromatic amide, polyamideimide, polyimide, is mentioned, for example. About the surface of this plate-shaped member, Chemical treatment with a silane coupling agent etc. as needed; Plasma treatment; Appropriate pretreatment such as thin film formation by ion plating, sputtering, vapor phase reaction, vacuum evaporation, etc. may be performed.

Moreover, in this invention, it is preferable to use the glass which has heat resistance as a board | substrate. As a glass substrate, Asahi Glass Co., Ltd. product PD200 is mentioned as a preferable thing, for example.

<Exposure mask>

As an exposure pattern of the mask for exposure used in the exposure process by the manufacturing method of this invention, although it changes with a material, it is generally 10-500 micrometers stripe.

<Development solution, etching solution>

As a developing solution and etching liquid used at the developing process by the manufacturing method of this invention, an alkaline developing solution can be used preferably.

In addition, since the inorganic powder contained in the inorganic powder-containing resin layer is uniformly dispersed by the alkali-soluble resin, the inorganic powder is also removed simultaneously by dissolving and washing the alkali-soluble resin which is the binding resin with the alkaline solution.

Examples of the active component of the alkaline developer include lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate, Inorganic alkaline compounds such as lithium silicate, sodium silicate, potassium silicate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate and ammonia; Tetramethylammonium Hydroxide, Trimethylhydroxyethylammonium Hydroxide, Monomethylamine, Dimethylamine, Trimethylamine, Monoethylamine, Diethylamine, Triethylamine, Monoisopropylamine, Diisopropylamine, Ethanolamine Organic alkaline compounds, such as these, etc. are mentioned.

An alkaline developer can be prepared by dissolving one or two or more of the alkaline compounds in water or the like. Here, the density | concentration of the alkaline compound in alkaline developing solution is 0.001-10 mass% normally, Preferably it is 0.01-5 mass%. In addition, after the development process by alkaline developing solution is performed, the water washing process is normally performed.

<Example>

Hereinafter, although the Example of this invention is described, this invention is not limited by these. In addition, "part" represents a "mass part" below.

<Example 1>

(1) Preparation of Inorganic Powder-Containing Resin Composition:

(a) 100 parts of nickel powder as an inorganic powder (average particle diameter: _{0.2 ㎛), Bi 2 O 3} -OB 2 0 3 -SiO 2 based glass frit (softening point 560 ℃, average particle size 2.0 ㎛) 10 parts, (b) bonding resin As benzyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid = 60/25/15 (mass%) copolymer (weight average molecular weight: 50,000) 60 parts, (c) polypropylene as photopolymerizable monomer 30 parts of glycol diacrylate, 15 parts of trimethylolpropane triacrylate, (d) 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane as a photopolymerization initiator (radiation sensitive component) An inorganic powder-containing resin composition was prepared by kneading 10 parts of -1-one and 20 parts of propylene glycol monomethyl ether as a solvent using a dispersing machine.

(2) Preparation of Photosensitive Conductive Inorganic Powder-Containing Resin Composition

100 parts of silver powder (average particle diameter 2 micrometers) as electroconductive powder, and n-butyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (mass%) copolymer (as alkali-soluble resin) Mw = 60,000) 100 parts, pentaerythritol triacrylate as photopolymerizable monomer 50 parts, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one 5 as photopolymerization initiator The conductive inorganic powder-containing resin composition was prepared by kneading 20 parts of propylene glycol monomethyl ether as a solvent using a disperser.

(3) Preparation of Transfer Film

The inorganic powder-containing resin composition prepared in the above (1) was coated on a support film (200 mm in width, 30 m in length, 38 μm in thickness) containing a PET film previously released by using a roll coater, and the coating film was 100 It dried at 5 degreeC for 5 minutes, the solvent was completely removed, and the transfer film (henceforth "transfer film 1") which formed the inorganic powder containing resin layer of thickness 10micrometer on the support film was manufactured.

Similarly, the photosensitive conductive inorganic powder-containing resin composition prepared in the above (2) was applied onto a supporting film (200 mm in width, 30 m in length, 38 μm in thickness) containing a PET film previously released by using a roll coater. The transfer film (henceforth "transfer film 2") which dried the coating film at 100 degreeC for 5 minutes, remove | eliminated a solvent completely, and formed the 20-micrometer-thick photosensitive conductive inorganic powder containing resin layer on the support film. Prepared.

(4) Formation Process of Inorganic Powder-Containing Resin Layer

The transfer film 1 was laminated so that the surface of the glass substrate for 6-inch panels might contact an inorganic powder containing resin layer surface, and this transfer film 1 was thermocompression-bonded with the heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(5) Exposure process of inorganic powder containing resin layer

The inorganic powder-containing resin layer formed on the glass substrate was irradiated with an i-line (ultraviolet light having a wavelength of 365 nm) by an ultra-high pressure mercury lamp from the support film through an exposure mask (L / S = 200/200 µm stripe pattern). The latent image of a pattern was formed in the inorganic powder containing resin layer. Here, the irradiation amount was 400 mJ / cm ² . After exposure, the support film was peeled off.

(6) Formation process of conductive inorganic powder-containing resin layer

The transfer film 2 was laminated on the inorganic powder-containing resin layer formed in the above (5) so that the photosensitive conductive inorganic powder-containing resin layer was in contact, and the transfer film 2 was thermally compressed under the same conditions as in (4). .

(7) Exposure process of conductive inorganic powder containing resin layer

With respect to the conductive inorganic powder containing resin layer formed on the inorganic powder containing resin layer, i-line (wavelength of 365 nm) was made from the support film by the ultra-high pressure mercury lamp through the exposure mask (L / S = 200/600 µm stripe pattern). Ultraviolet light) and the latent image of a pattern was formed in the conductive inorganic powder containing resin layer. Here, the irradiation amount was 400 mJ / cm ² . At this time, the part in which the electroconductive inorganic powder containing resin layer remains by the image development process mentioned later was made to form on the part in which an inorganic powder containing resin layer remains by image development process. After exposure, the support film was peeled off.

(8) Development process of laminated film

With respect to the laminated film subjected to the exposure treatment in (5) and (7), a developing process by a shower method using a 0.6 mass% sodium carbonate aqueous solution (30 ° C.) as a developing solution was performed over 90 seconds, followed by ultrapure water. Water washing treatment and drying treatment were performed. Thereby, the pattern of the inorganic powder containing resin layer and the lamination pattern of the inorganic powder containing resin layer / conductive inorganic powder containing resin layer were obtained simultaneously.

(9) firing process

The glass substrate in which the pattern of the inorganic powder containing resin layer and the laminated pattern of the inorganic powder containing resin layer / electroconductive inorganic powder containing resin layer were formed was baked in the baking furnace over 30 minutes in the temperature atmosphere of 590 degreeC. Thereby, the inorganic powder containing resin layer pattern and the organic component in the conductive inorganic powder containing resin layer are removed, and the inorganic powder layer pattern (black matrix) of 2.5 micrometers in thickness, and inorganic powder layer / of 2.5 micrometers in thickness are formed on the surface of a glass substrate. The panel material in which the laminated pattern (light shielding layer / conductive layer) of the conductive inorganic powder layer of thickness 9.0micrometer was formed was obtained.

<Example 2>

(1) Preparation of non-photosensitive conductive inorganic powder-containing resin composition

100 parts of silver powder (average particle diameter 2 micrometers) as electroconductive powder, and n-butyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (mass%) copolymer (as alkali-soluble resin) Mw = 60,000) 20 parts, 10 parts of polyethyleneglycol diacrylates as a plasticizer, and 10 parts of propylene glycol monomethyl ethers as a solvent were knead | mixed using a dispersing machine, and the non-photosensitive conductive inorganic powder containing resin composition was manufactured.

(2) Preparation of alkali developable radiation sensitive resist composition:

Benzyl methacrylate / methacrylic acid = 75/25 (mass%) copolymer (Mw = 40,000) as alkali-soluble resin, 60 parts of tripropylene glycol diacrylates as a photopolymerizable monomer, 2-as photoinitiator 5 parts of benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one and 100 parts of propylene glycol monomethyl ether acetate as a solvent are kneaded to give an alkali developing radiation-sensitive resist composition (hereinafter, " Resist composition ").

(3) Preparation of Transfer Film

The resist composition prepared in the above (2) was coated on a support film (200 mm in width, 30 m in length, 38 μm in thickness) containing a PET film pre-release treated using a roll coater, and the coating film was applied at 100 ° C. 5. The solvent was completely removed by drying for a minute to form a resist composition layer having a thickness of 10 μm on the support film.

Subsequently, the non-photosensitive conductive inorganic powder-containing resin composition prepared in (1) was applied onto the resist composition layer using a roll coater, the coating film was dried at 100 ° C. for 5 minutes to completely remove the solvent, and the thickness was 20 μm. The non-photosensitive electroconductive inorganic powder containing resin layer was formed on the resist composition layer, and the transfer film (henceforth "transfer film 3") was manufactured.

(4) Formation Process of Inorganic Powder-Containing Resin Layer

The transfer film 1 was laminated so that the surface of the glass substrate for 6-inch panels might contact an inorganic powder containing resin layer surface, and this transfer film 1 was thermocompression-bonded with the heating roller. Here, as crimping | compression-bonding conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(5) Exposure process of inorganic powder containing resin layer

The inorganic powder-containing resin layer formed on the glass substrate was irradiated with an i-line (ultraviolet light having a wavelength of 365 nm) by an ultra-high pressure mercury lamp from the support film through an exposure mask (L / S = 200/200 µm stripe pattern). The latent image of a pattern was formed in the inorganic powder containing resin layer. Here, the irradiation amount was 400 mJ / cm ² . After exposure, the support film was peeled off.

(6) Formation of non-photosensitive conductive inorganic powder-containing resin composition and resist composition laminated film

The transfer film 3 is laminated on the inorganic powder-containing resin layer formed in the above (5) so that the non-photosensitive conductive inorganic powder-containing resin layer is in contact, and the transfer film 3 is thermally compressed under the same conditions as in (4). The non-photosensitive electroconductive inorganic powder containing resin composition and the resist composition laminated film were formed on the inorganic powder containing resin layer.

(7) Exposure process of resist composition layer

Subsequently, the resist composition layer formed in the above (6) was irradiated with an i-line (ultraviolet light having a wavelength of 365 nm) with an ultra-high pressure mercury lamp through an exposure mask (L / S = 200/600 µm stripe pattern). A latent image of a pattern was formed in the layer. Here, the irradiation amount was 400 mJ / cm ² . At this time, the part in which the resist composition layer remains by the development process mentioned later was made to form on the part in which an inorganic powder containing resin layer remains by the development process.

(8) Development Process of Resist Composition Layer

After peeling a support film from a resist film, the image development process by the shower method which makes 0.6 mass% aqueous sodium carbonate aqueous solution (30 degreeC) the developing solution is performed over 30 second with respect to the exposed resist film. The uncured resist film which was not irradiated was removed, and the resist pattern was obtained on the conductive inorganic powder containing resin layer.

(9) Developing and etching process

Subsequent to the developing step of the resist film of (8) above, the etching treatment by the shower method using 0.6 mass% of sodium carbonate aqueous solution (30 ° C.) as an etching solution was performed with respect to the conductive inorganic powder-containing resin layer and the inorganic powder-containing resin layer. After performing over seconds, the water washing process and the drying process by ultrapure water were subsequently performed. Thereby, the laminated pattern of the inorganic powder containing resin layer and the inorganic powder containing resin layer / conductive inorganic powder containing resin layer corresponding to the resist layer pattern was obtained simultaneously.

(10) firing process

The glass substrate in which the pattern of the inorganic powder containing resin layer and the laminated pattern of the inorganic powder containing resin layer / electroconductive inorganic powder containing resin layer were formed was baked in the baking furnace over 30 minutes in the temperature atmosphere of 590 degreeC. Thereby, the organic component in a resist pattern, an inorganic powder containing resin layer pattern, and an electroconductive inorganic powder containing resin layer is removed, and the inorganic powder layer pattern (black matrix) of 2.5 micrometers in thickness, and the inorganic 2.5 micrometers in thickness are formed on the surface of a glass substrate. The panel material in which the conductive inorganic powder layer pattern (light shielding layer / conductive layer) of powder layer pattern / thickness 9.0micrometer was formed was obtained.

According to the present invention, it is possible to obtain a method for producing a plasma display panel having high manufacturing efficiency and excellent patterning property in forming a black matrix and an electrode constituting the plasma display panel, and a composition and a transfer film which are preferably used for this.

1 is a schematic cross-sectional view showing a series of steps for forming a black matrix and an electrode in the method (I) for producing a PDP of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: Substrate

11: Inorganic powder containing resin layer A

11a: Photosensitive part (pattern latent image part) of inorganic powder containing resin layer A

11b: non-photosensitive part of inorganic powder containing resin layer A

11A: Pattern of Inorganic Powder-Containing Resin Layer A

12: conductive inorganic powder-containing resin layer B

12a: Photosensitive part (pattern latent image part) of conductive inorganic powder containing resin layer B

12b: non-photosensitive portion of conductive inorganic powder-containing resin layer B

12A: Pattern of conductive inorganic powder-containing resin layer B

21: black matrix

22: light shielding layer

23: conductive layer

24: electrode (shielding layer / conductive layer laminate)

M: exposure mask

MA: light transmitting part of the exposure mask M

MB: Light shielding part of the exposure mask M

m: exposure mask

mA: light transmitting portion of the exposure mask m

mB: Light shielding part of exposure mask m

Claims (4)

(a) Inorganic powder containing at least one metal selected from the group consisting of copper, iron and nickel, (b) binding resin, (c) photopolymerizable monomer and inorganic powder containing (d) photopolymerization initiator Resin composition. On the support film, the layer containing the inorganic powder containing resin composition of Claim 1 is formed, The transfer film characterized by the above-mentioned. (i) Process of forming inorganic powder containing resin layer A on the board | substrate using the inorganic powder containing resin composition of Claim 1, (ii) exposing the inorganic powder-containing resin layer A to form a latent image of the pattern of the inorganic powder-containing resin layer A, (iii) forming a photosensitive conductive inorganic powder-containing resin layer B on the inorganic powder-containing resin layer A, (iv) exposing the conductive inorganic powder-containing resin layer B to form a latent image of the pattern of the conductive inorganic powder-containing resin layer B, (v) The inorganic powder-containing resin layer A and the conductive inorganic powder-containing resin layer B are developed to simultaneously form a pattern of the inorganic powder-containing resin layer A and a lamination pattern of the inorganic powder-containing resin layer A / conductive inorganic powder-containing resin layer B. Process, (vi) forming a black matrix and an electrode simultaneously by a method comprising the step of firing the pattern of the inorganic powder-containing resin layer A and the lamination pattern of the inorganic powder-containing resin layer A / the conductive inorganic powder-containing resin layer B. The manufacturing method of the plasma display panel. (vii) forming an inorganic powder-containing resin layer A on the substrate by using the inorganic powder-containing resin composition according to claim 1, (viii) exposing the inorganic powder-containing resin layer A to form a latent image of the pattern of the inorganic powder-containing resin layer A, (ix) process of forming non-photosensitive electroconductive inorganic powder containing resin layer C on said inorganic powder containing resin layer A, and forming a resist layer on said electroconductive inorganic powder containing resin layer C, (x) exposing and developing the resist layer and forming a pattern of the resist layer on the conductive inorganic powder-containing resin layer C, (xi) The development process of the inorganic powder containing resin layer A and the etching process of the electroconductive inorganic powder containing resin layer C are performed, and the inorganic powder containing resin layer A / electroconductivity corresponding to the pattern of the inorganic powder containing resin layer A, and the resist layer pattern is performed. Simultaneously forming a laminated pattern of the inorganic powder-containing resin layer C, (xii) simultaneously forming a black matrix and an electrode by a method comprising the step of firing the pattern of the inorganic powder-containing resin layer A and the lamination pattern of the inorganic powder-containing resin layer A / the conductive inorganic powder-containing resin layer C. The manufacturing method of the plasma display panel.