1272638 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種導電性糊組成物、形成電極用轉錄 薄膜及電漿顯示面板用電極，更詳細地，係關於可適用於 電漿顯示面板的電極形成之導電性糊組成物、形成電極用 轉錄薄膜以及使用該物質所得之電漿顯示面板用電極。 【先前技術】 電漿顯示面板（PDP )，由於製造製程容易、廣視 角、自發光式，顯示品質高等理由，平面顯示面板技術 中，頗受矚目，特別是彩色電漿顯示面板，作爲20吋以 上的大型顯示器，期待在壁掛電視等的用途成爲主流。 彩色PDP，藉由氣體放電所產生之紫外線照射於螢光 體上，可彩色顯示。因此，一般彩色PDP中，藉由紅色 發光用的螢光體部位、綠色發光用的螢光體部位、藍色發 光用的螢光體部位形成於基板上，各色發光顯示單元全部 均勻混合存在的狀態下構成。具體而言，由玻璃等組成之 基板的表面上，設置稱爲阻隔壁之絕緣性材料所構成之隔 牆，藉由該隔牆，區隔多數的顯示單元，該顯示單元的內 部成爲電漿作用的空間。於是，在該電漿作用的空間，設 置螢光體部位的同時，藉由在該螢光體部位設置產生電漿 作用之電極，以各顯示單元作爲顯示單位而構成PDP。 圖1表示交流型PDP的剖面形狀的模型化圖。於圖 中，1與2爲相對向配置之玻璃基板，3爲隔牆，藉由玻 -5- (2) 1272638 璃基板1、玻璃基板2以及隔牆3，形成區隔單元。4爲 固定於玻璃基板1的透明電極，5係爲了降低透明電極的 阻抗，於透明電極上形成之匯流電極，6爲固定於玻璃基 板2之位址電極，7爲保持於單元內之螢光體，8爲形成 於玻璃基板1的表面上爲覆蓋透明電極4與傳遞電極5之 介電層，1 0爲例如氧化鎂組成之保護膜。然而，直流型 PDP中，通常在電極端子（陽極端子）與電極導線（陽極 導線）之間設置阻抗體。而且，爲了提高PDP的對比， 於上述介電層8與保護膜1 〇之間等，亦有設置紅色、綠 色、藍色之彩色濾光板、黑色矩陣的情況。 作爲如此之PDP的電極圖形的製造方法，已知（1 ) 以濺鍍、蒸鍍等形成金屬薄膜，塗布光阻、曝光、顯影 後，藉由蝕刻液形成金屬薄膜圖形之蝕刻法；（2 )將含 有非感先性的無機粉末之樹脂組成物網版印刷於基板上， 獲得圖形，將其燒成之網版印刷法；（3 )含有感光性的 無機粉末之樹脂組成物的膜形成於基板上，於該膜隔著光 罩照射紫外線，藉由顯像，圖形殘留於基板上，將其燒成 之黃光微影法等。 但是’上述蝕刻法，有需要大型的真空設備，步驟上 的產出太慢等的問題。 而且’上述網版印刷法，隨面板的大型化以及高精細 化’圖形的位置精度的要求非常嚴苛，以一般的印刷無法 對準的問題。 更進一步’上述黃光微影法，形成5 μιη以上膜厚的 -6 - (3) 1272638 圖形時’含無機粉末之樹脂組成物的膜在深度方向上感度 不足’顯像時圖形易從基板界面剝離的問題。 於此’爲解決上述鈾刻法、網版印刷法以及黃光微影 法可見之問題，本發明人等，揭露藉由包含形成光阻膜與 含無機粉末之樹脂層的疊層膜於支持膜上，支持膜上所形 成之疊層膜再轉錄至基板上，使構成該疊層膜之光阻膜進 行曝光處理，形成光阻圖形的潛像，顯像該光阻膜，光阻 圖形顯現，蝕刻處理含無機粉末之樹脂層，形成對應光阻 圖形的含無機粉末之樹脂層的圖形，燒成該圖形步驟，包 含形成電極於上述基板表面的步驟之製造方法（以下稱爲 「乾膜法」）（參照日本專利特開平1 1 - 1 6 2 3 3 9與特開平 11-283495) ° 但是，如此之製造方法，雖可簡便的形成高精細圖 型，具關於導電性等的電極性能不足的問題。 【發明內容】 發明所欲解決之問題 本發明的課題，在於提供一種可形成具優良導電性以 及良好密合性的電極圖型之導電性糊組成物、形成電極用 轉錄薄膜以及利用該等而得之PDP用電極。 解決課題之手段 本發明的導電性糊組成物5包含：（A )比表面積 1 · 5〜5.0 m 2 / g之導電性粉末；（B )玻璃原料混合物；以 -7- (4) 1272638 及（C )接合樹脂。 又本發明的導電性糊組成物，包含：（A )至少含Ag 粉末作爲導電性粉末較佳。而且，（B )作爲玻璃原料混 合物，至少含軟化點400〜600 °C的無鉛玻璃原料混合物較 佳。更進一步，（C )作爲接合樹脂，至少含羧基之甲基 丙烯酸酯樹脂較佳。 本發明的形成電極用轉錄薄膜，包含藉由塗布本發明 的導電性糊組成物所獲得之導電性樹脂層。 本發明的P D P用電極，使用本發明的導電性糊組成 物以及本發明的形成電極用轉錄薄膜而形成該電極。 【實施方式】 以下，針對本發明的導電性糊組成物、形成電極用轉 錄薄膜以及PDP用電極，加以詳細說明。 〈導電性糊組成物〉1272638 (1) Technical Field of the Invention The present invention relates to a conductive paste composition, a transcription film for forming an electrode, and an electrode for a plasma display panel, and more particularly to a plasma applicable to plasma. A conductive paste composition formed by electrodes of the display panel, a transcription film for forming an electrode, and an electrode for a plasma display panel obtained by using the same. [Prior Art] Plasma display panel (PDP), due to the ease of manufacturing process, wide viewing angle, self-illumination, high display quality, etc., has attracted attention in flat panel display technology, especially color plasma display panels, as 20吋The above large-sized displays are expected to become mainstream in the use of wall-mounted televisions and the like. The color PDP is irradiated onto the phosphor by ultraviolet rays generated by gas discharge, and can be displayed in color. Therefore, in the general color PDP, the phosphor portion for red light emission, the phosphor portion for green light emission, and the phosphor portion for blue light emission are formed on the substrate, and the respective color light-emitting display units are uniformly mixed. In the state of the composition. Specifically, a partition wall made of an insulating material called a barrier wall is provided on a surface of a substrate made of glass or the like, and the partition wall is divided into a plurality of display units, and the inside of the display unit becomes a plasma. The space of action. Then, in the space in which the plasma acts, a phosphor portion is provided, and an electrode for generating a plasma action is provided in the phosphor portion, and each display unit is used as a display unit to constitute a PDP. Fig. 1 is a model diagram showing the cross-sectional shape of an alternating current type PDP. In the figure, 1 and 2 are glass substrates arranged opposite each other, and 3 is a partition wall, and a partition unit is formed by a glass substrate of 5 - (2) 1272638, a glass substrate 2, and a partition wall 3. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode to reduce the impedance of the transparent electrode, 6 is an address electrode fixed to the glass substrate 2, and 7 is a fluorescent light held in the cell. The body 8 is a dielectric layer formed on the surface of the glass substrate 1 to cover the transparent electrode 4 and the transfer electrode 5, and 10 is a protective film composed of, for example, magnesium oxide. However, in a DC type PDP, a resistor body is usually provided between the electrode terminal (anode terminal) and the electrode lead (anode lead). Further, in order to improve the contrast of the PDP, there may be a case where a red, green, or blue color filter or a black matrix is provided between the dielectric layer 8 and the protective film 1A. As a method for producing an electrode pattern of such a PDP, (1) an etching method in which a metal thin film is formed by sputtering, vapor deposition, or the like, and a photoresist is formed by exposure, development, and development, and a metal thin film pattern is formed by an etching solution; a screen printing method in which a resin composition containing a non-sensitive inorganic powder is screen-printed on a substrate to obtain a pattern and baked, and (3) a film formation of a resin composition containing a photosensitive inorganic powder On the substrate, the film is irradiated with ultraviolet rays through a mask, and the pattern is left on the substrate by the development, and the yellow lithography method is performed by firing the pattern. However, in the above etching method, there is a problem that a large vacuum apparatus is required, and the output on the step is too slow. Further, the above-described screen printing method has a problem that the size of the panel is increased and the positional accuracy of the pattern is extremely high, and the general printing cannot be aligned. Further, the above yellow photolithography method forms a film of -6 - (3) 1272638 having a film thickness of 5 μm or more. When the film of the resin composition containing the inorganic powder is insufficient in the depth direction, the pattern is easily peeled off from the substrate interface. The problem. In order to solve the problems of the above-described uranium engraving method, screen printing method, and yellow light lithography method, the present inventors have revealed that a laminate film including a photoresist film and a resin layer containing an inorganic powder is formed on a support film. And the laminated film formed on the support film is transcribed onto the substrate, and the photoresist film constituting the laminated film is subjected to exposure treatment to form a latent image of the photoresist pattern, and the photoresist film is developed, and the photoresist pattern is visualized. a method of etching a resin layer containing an inorganic powder to form a pattern of a resin layer containing an inorganic powder corresponding to a photoresist pattern, and firing the pattern to include a step of forming an electrode on the surface of the substrate (hereinafter referred to as a "dry film method" (see Japanese Patent Laid-Open No. Hei 1 1 - 1 6 2 3 3 9 and JP-A 11-283495). However, in such a manufacturing method, it is easy to form a high-definition pattern and has electrode properties with respect to conductivity and the like. Insufficient problems. DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION An object of the present invention is to provide a conductive paste composition which can form an electrode pattern having excellent conductivity and good adhesion, a transcription film for forming an electrode, and the like. The electrode for PDP is obtained. Means for Solving the Problem The conductive paste composition 5 of the present invention comprises: (A) a conductive powder having a specific surface area of 1 · 5 to 5.0 m 2 /g; (B) a glass raw material mixture; -7-(4) 1272638 and (C) a bonding resin. Further, the conductive paste composition of the present invention contains (A) at least an Ag powder as a conductive powder. Further, (B) as a glass raw material mixture, a lead-free glass raw material mixture having a softening point of at least 400 to 600 ° C is preferred. Further, (C) as the bonding resin, a methacrylate resin containing at least a carboxyl group is preferred. The transcription film for forming an electrode of the present invention comprises a conductive resin layer obtained by applying the conductive paste composition of the present invention. The electrode for P D P of the present invention is formed by using the conductive paste composition of the present invention and the transcription film for forming an electrode of the present invention. [Embodiment] Hereinafter, the conductive paste composition, the electrode-forming transfer film, and the PDP electrode of the present invention will be described in detail. <Conductive paste composition>
本發明的導電性糊組成物，至少包含：（A )導電性 粉末（B )玻璃原料混合物以及（C )接合樹脂，（A )導 電性粉末的比表面積必須在1 . 5〜5.0 m 2 / g。 (A )導電性粉末 本發明的導電性糊組成物所含之導電性粉末的比表面 積在1.5〜5.0 m2/g，介於1·5〜4.0 m2/g間較佳，介於 2·〇〜3.5 m2/g間更佳。 -8- (5) 1272638 導電性粉末的比表面積不足1 · 5 m2/g的情況，使用該 導電性糊組成物所得之電極圖型的導電性不足。另一方 面，導電性粉末的比表面積超過5.〇m2/g的情況，於導電 性糊組成物中，易發生粉末凝集’難以獲得安定之分散狀 態。而且，使用該導電性糊組成物所得之電極圖型，對基 板之密合性易受損壞。 而且，於此所謂比表面積，係指藉由導電性糊組成物 中的導電性粉末的BET法，求得之平均値。 作爲本發明的導電性糊組成物中的導電性粉末，可選 擇Ag、Au、Al、Cu、Ag-Pd合金等的金屬以及合金，亦 可單獨或混合二種以上使用。該等導電性粉末中，即使於 大氣中燒成的情況下，不會產生因氧化致使導電性降低， 使用較廉價的Ag特別好。 作爲上述導電性粉末的形狀，粒狀、球狀、片狀等不 特別限定，亦可使用單獨或混合二種以上的形狀的導電性 粉末。而且，上述導電性粉末的平均粒徑，以〇·1〜5 μιη較 佳，可使用混合具相異粒徑的導電性粉末。 (Β )玻璃原料混合物 本發明的導電性糊組成物所含之玻璃原料混合物，適 合使用低融點的玻璃原料混合物。通常，使用軟化點6 5 〇 °C以下的玻璃原料混合物，使用400〜6 00艺的玻璃原料混 合物較佳。玻璃原料混合物的軟化點不足4 〇 〇 C的情況， 於燒成步驟時，在後述接合樹脂分解除去前，因玻璃原料 (6) 1272638 、混#牧/開始溶融’燒成後之圖型可能殘存有機殘渣。而 且’玻璃原料混合物的軟化點超過60(TC的情況，於燒成 步驟時’玻ί离原料混合物並不充分熔融，燒成後之圖型可 能密合性不足。 作爲玻璃原料混合物的組成，可選自例如：（1 )氧 化錯、氧化棚、氧化矽系列（Pb0-B203 -Si02系）、（2 ) 氧化鉛 '氧化硼、氧化矽、氧化鋁系列（P b 0 - B 2 0 3 - S i 0 2 -Al2〇3系）、（3 )氧化鋅、氧化硼、氧化矽系列（211〇- B2〇3-Sl〇2系）、（4)氧化鋅、氧化硼、氧化矽、氧化鋁 系列（ZnO-B2〇3-Si〇2-Al2〇3 系）、（5 )氧化鉛、氧化 鲜、氧化硼、氧化矽系列（Pb0-Zn0-B203-Si02系）、 (6 )氧化錯、氧化鋅、氧化硼、氧化矽、氧化鋁系列 (PbO-Zn〇-B2〇3-Si〇2_Al2〇3 系）、（7 )氧化鉍、氧化 棚、氧化砂系列（Bi2〇3_B2〇3-Si〇2系）、（8 )氧化鉍、 氧化棚、氧化矽、氧化鋁系列（Bi2〇3-B203-Si02-Al203 系）、（9 )氧化鉍、氧化鋅、氧化硼、氧化矽系列 (Bl203-ZnO-B2〇3-Si〇2 系）、（10)氧化鉍、氧化鋅、 氧化硼、氧化矽、氧化鋁系列（Bi2〇3_Zn〇-B2〇3_Si〇2-ai2o3系）等。該等玻璃原料混合物中，由於環境上的問 題，使用以上述（3 ) 、（ 4 ) 、 （ 7 ) 、（ 8 ) 、 （ 9 )以 及（1 〇 )中δ己載之無錯玻璃原料混合物較佳，其中，從導 電性糊組成物的歷久安定性的觀點而言，使用以（7 )、 (8 ) 、（ 9 )以及（1 0 )中記載之氧化鉍爲主成分之無鉛 玻璃原料混合物特別佳。 -10- (7) 1272638 而且，上述之玻璃原料混合物的形狀並無特別限定， 平均粒徑，以 0.1〜ΙΟμιη較佳5 0.5〜5μηι更佳。玻璃原料 混合物的平均粒徑不足0 · 1 μηι的情況，因玻璃原料混合物 的比表面積變大，於導電性糊組成物中，易發生粒子的凝 集’難以獲得安定之分散狀態，而且產生經久導電性糊組 成物增加黏度等的變化的情況。另一方面，玻璃原料混合 物的平均粒徑1 〇 μπι以上的情況，難以獲得高精細的電極 圖型。 上述玻璃原料混合物，可使用具有單獨或相異之玻璃 原料混合物組成，相異之軟化點、相異之形狀、相異之平 均粒徑之玻璃原料混合物2種以上的組合。 導電性糊組成物中的玻璃原料混合物的含有量，以導 電性粉末100質量部爲基準，1〜30質量部較佳，2〜20質 量部更佳。玻璃原料混合物不足1質量部時，所得之電極 對基板的密合性恐怕不足。而且，超過3 0質量部時，所 得之電極可能導電性低，而且導電性糊組成物保存安定性 低，歷久恐產生變化。 (C )接合樹脂 作爲本發明的導電性糊組成物所含之接合樹脂，可使 用各種樹脂，使用含鹼可溶性樹脂3 0〜1 0 〇重量％之樹脂 較佳。於此，「鹼可溶性」係指可藉由鹼性的蝕刻液溶 解，具有以完成蝕刻處理爲目的的程度之溶解性質。 作爲如此之鹼可溶性樹脂的具體例，例如，可選自甲 -11 - (8) 1272638 基丙烯酸酯系樹脂、羥基苯乙烯樹脂、諾瓦拉克酚醛樹 月旨、聚酯樹脂等。 如此之鹼可溶性樹脂中，較佳之例，可選擇以下的單 體（I)與單體（III)的共聚合體，單體（I)、單體 (II )與單體（III)的共聚合體等的含羧基的甲基丙烯酸 酯樹脂。 單體（I):含羧基的單體類 丙烯酸、甲基丙烯酸、順丁烯二酸、反-丁烯二酸、 2-丁烯酸、亞甲基丁二酸、甲基順丁烯二酸、甲基反丁烯 二酸、肉桂酸、丁二酸單2-甲基丙烯氧基乙酯、ω-羧基 聚己內酯單甲基丙烯酸酯等。 單體（II):含0Η的單體類 甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基丙酯、 甲基丙烯酸3-羥基丙酯等的含羥基的單體類；〇-羥基苯乙 烯、m-羥基苯乙烯、ρ-羥基苯乙烯等酚性含羥基的單體類 等。 單體（111 ):其他可能共聚合之單體類 甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁 酯、甲基丙烯酸正十二酯、甲基丙烯酸苯甲酯、甲基丙烯 酸環氧丙酯、甲基丙烯酸二環戊酯等的單體（1)以外的 甲基丙烯酸酯；苯乙烯、α -甲基苯乙烯等的芳香族乙烯基 系單體；丁二烯、異戊-間-二烯等共軛二烯類；於聚苯乙 烯、聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚甲基丙烯 酸苯甲酯等的聚合鏈的一側末端含甲基丙嫌酿基 -12 - 1272638 (9) (methacryloyl )等的聚合性不飽和基的巨單體類： 上述單體（I)與單體（ΠΙ)的共聚合體以及單體 (I)、單體（Π)與單體（111)的共聚合體，因存在由 單體（I)共聚合成分，可成爲鹼可溶性。其中單體 (I)、單體（II)與單體（ΙΠ)的共聚合體，由（A)導 電性粉末、（Β )玻璃原料混合物的分散安定性以及後述 對鹼顯影液的溶解性的觀點而言，特別佳。該共聚合體中 由單體（I )的共聚合成分的含有率，5〜60質量％較佳， 10〜40質量％特別佳，由單體（u )的共聚合成分的含有 率，1〜50質量％較佳，5〜30質量％特別佳。 作爲構成導電性糊組成物之鹼可溶性樹脂的分子量， 以GPC聚苯乙烯換算的重量平均分子量（以下稱之爲 「Mw」），5,000〜5,000,000 較佳，1〇,〇〇〇〜3 00,000 更 佳。 本發明的導電性糊組成物中（C )接合樹脂的使用比 例，以對（A)導電性粉末100質量部計，5〜5 0質量部的 比例較佳。接合樹脂的含有量，不足5質量部的情況，導 電性糊組成物中易產生粉末凝集，難以獲得安定的分散狀 態，而且，塗布該導電性糊組成物形成之電極形成用薄膜 的可撓性、轉錄性顯著降低。此外，接合樹脂的含有量， 超過5 0質量部的情況，在電極形成步驟中的燒成處理步 驟，圖形的收縮有變大的傾向，可能引起圖形的變形。 (D )溶劑 -13- (10) 1272638 本發明的導電性糊組成物，通常含有溶劑。作爲上述 溶劑，與（A )導電性粉末與（B )玻璃原料混合物的親 和性以及與（C )接合樹脂的溶解性良好，對導電性糊組 成物可具適當黏性，藉由乾燥可輕易蒸發去除較佳。 如此的溶劑的具體例，例如：3 -戊酮、2 -己酮、4 -庚 酮、環己酮等酮類；正-戊醇、4_甲基-2-戊醇、環己醇、 二丙酮醇等的醇類；2-甲氧基乙醇、2-乙氧基乙醇、丁氧 基乙醇、丙二醇單甲醚、丙二醇單乙醚等醚系醇類；乙酸 正丁酯、乙酸戊酯等的飽和脂肪族單羧酸烷酯類；乳酸乙 酯、乳酸正丁酯等的乳酸酯類；乙酸甲基乙氧基乙酯、乙 酸乙基乙氧基乙酯、乙酸甲氧基丙酯、3 -乙氧基丙酸乙酯 等的醚系酯類等。使用該等單獨或2種以上組合皆可。 導電性糊組成物中溶劑的含有比例，在可獲得良好的 膜形成性（流動性或可塑性）的範圍內，可適當選擇，通 常，以對（A)導電性粉末100質量部計，可爲1〜10,000 質量部，以10〜1，〇〇〇質量部較佳。 於導電性糊組成物，除上述成分外，其他無機粉末、 可塑劑、顯像促進劑、接合助劑、保存安定性、消泡劑、 氧化防止劑、紫外線吸收劑、分散劑、交鏈劑、光聚合起 始劑、光酸產生劑、熱聚合起始劑、熱酸產生劑等各種添 加劑，可含有任意成分。 特別是導電性糊組成物，爲了保持本發明的形成電極 用轉錄薄膜的良好的可撓性以及轉錄性，使用可塑劑較 佳。作爲用於導電性糊組成物之可塑劑，可使用各種化合 -14- (11) 1272638 物，例如：己二酸二丁酯、己二酸二異丁酯、己二酸二 2 -乙基己酯、壬二酸二2 -乙基己酯、癸二酸二丁酯、癸二 酸二丁基二乙二酯、十二酸羥丙酯、油酸羥丙酯、鄰苯二 甲酸二2 -乙基己酯的等化合物，乙二醇、丙二醇等的烷 二醇的二甲基丙烯酸酯類；聚乙二醇、聚丙二醇等的聚烷 二醇的二甲基丙烯酸酯類；丙三醇、H4-丁三醇、三羥 甲基烷類、四羥甲基烷類、異戊四醇、二異戊四醇等的三 價以上的多價醇的聚甲基丙烯酸酯類，以及該等的二羧酸 變成物；三價以上的多價醇的聚烷二醇附加物的聚甲基丙 烯酸酯類等的分子中，至少含一甲基丙烯醯基之甲基丙烯 酸酯化合物較佳。 導電性糊組成物中可塑劑的含量，以對（A )導電性 粉末100質量部計，含0.5〜30質量部的比例較佳，以 1〜20質量部更佳。 而且，本發明的導電性糊組成物，亦可含具感光性的 物質，於該情形，利用添加構成後述之鹼顯像型放射線性 光阻組成物的感放射線性成分，以賦予感光性。於導電性 糊組成物賦予感光性的情況，不利用光阻組成物，可形成 電極圖形。 導電性糊組成物，上述（A )接合樹脂以及依據需要 的上述之任意有機成分溶解成爲媒液後，與上述（A )導 電性粉末、（B )玻璃原料混合物以及依據需要的上述任 意無機粉末混合，藉由使用如滾輪捏合機、混合機、乳化 混合機、球磨機、玻璃珠磨機等的捏合機進行捏和，可調 -15- (12) !272638 製而成。 如上述調製之導電性糊組成物，具有適於塗布之流動 性的糊組成物，其黏度，通常爲100〜1 00,000 cp，以 5 00〜1 0,000 cp 較佳。 〈形成電極用轉錄薄膜〉 本發明的形成電極用轉錄薄膜，必須含有藉由塗布本 發明的導電性糊組成物所獲得之導電性樹脂層。 本發明的形成電極用轉錄薄膜，通常由支持薄膜，以 及至少含有藉由塗布本發明的導電性糊組成物所獲得之導 電性樹脂層的轉錄層所構成，係爲用於乾膜法的電極形成 步驟之複合材料。 構成本發明的形成電極用轉錄薄膜之支持薄膜，具耐 熱性以及耐溶劑性，同時具可撓性的樹脂薄膜較佳。藉由 支持薄膜具可撓性，可利用滾筒塗布機、刀片塗布機、狹 縫塗布機等，塗布本發明的導電性糊組成物，導電性樹脂 層以滾筒狀捲回的狀態保存且可提供使用。作爲形成支持 薄膜的樹脂，可選擇例如聚乙烯對苯二甲酯、聚酯、聚乙 烯、聚丙烯、聚苯乙烯、聚亞醯胺、聚乙烯醇、聚氯乙 烯、聚氟乙烯等含氟樹脂、尼龍、纖維素等。作爲支持薄 膜的厚度，可例如爲20〜1 00 μιη。 此外，於上述支持薄膜的表面，施行脫型處理較佳。 因此，朝基板的轉錄步驟，易進行支持薄膜的剝離操作。 構成本發明的形成電極用轉錄薄膜之導電性樹脂層， -16- (13) 1272638 藉由塗布本發明的導電性糊組成物、乾燥塗膜、除去溶劑 的一部分或全部而可形成。 作爲塗布導電性糊組成物的方法，膜厚的均句性佳之 膜厚大小（例如1 μηι以上）的塗膜，可有效率形成較 佳，具體而言，可選擇藉由滾筒塗布機之塗布方法，藉由 刀片塗布機之塗布方法，藉由狹縫塗布機之塗布方法，藉 由帷幕塗布機之塗布方法，藉由網印塗布機之塗布方法， 藉由凸板印刷塗布機之塗布方法較佳。 塗膜的乾燥條件，以50〜150。(3溫度0.5〜30分鐘，乾 燥後的溶劑的殘留比例（導電性樹脂層中的含有率）通常 以2質量％以下。 如上述形成之導電性樹脂層的膜厚，通常在 1〜ΙΟΟμιη’介於3〜50μπι較佳，介於5〜40μιη更佳。 而且，於本發明的形成電極用轉錄薄膜，亦可設置保 護膜與轉錄層的表面接觸。保護膜，可使用與支持薄膜相 同之材料。而且，通常在保護膜的表面進行脫型處理，保 護膜的剝離強度，必須比支持薄膜的剝離強度小。 本發明的形成電極用轉錄薄膜，於支持薄膜上形成光 阻層外，導電性樹脂層，亦可疊層形成。藉由轉錄該疊層 於基板上，可獲得導電性樹脂層上形成光阻層的疊層膜。 而且，本發明的形成電極用轉錄薄膜 (A- 1 )藉由塗布本發明的導電性糊組成物所獲得之 導電性樹脂層，以及（Α-2 )含有至少含著色顏料的無機 -17- (14) 1272638 粉末以及接合樹脂之著色樹脂層疊層而得較佳。於著色樹 脂層，作爲無機粉末，更含有上述之導電性粉末以及玻璃 原料混合物較佳。 使用該疊層膜時，由導電性樹脂層與著色樹脂層構成 的聲層電極，可一塊形成，而且，與基板的密合性、導電 性優、外反射光少，可適用於P D P用匯流電極之電極形 成。 更進一步，本發明的形成電極用轉錄薄膜，於支持薄 膜上形成光阻層上，該導電性樹脂層與著色樹脂層，順序 疊層形成亦可。藉由轉錄該疊層膜於基板上，於著色樹脂 層上形成導電性樹脂層，更進一步，於其上形成光阻層， 可得疊層膜。 該著色樹脂層與光阻層，與該導電性樹脂層相同，塗 布含後述的著色顏料之糊組成物以及光阻組成物，乾燥塗 膜、除去溶劑的一部分或全部而可形成。 如此形成之著色樹脂層的膜厚，通常爲1〜20 μιη， 3〜15 μιη較佳，5〜10 μηι更佳。 而且，光阻層的膜厚，通常爲1〜20 μηι，3〜15 μπι較 佳，5〜10 μιη更佳。 含著色顏料之糊組成物 爲了形成著色樹脂層所使用的含著色顏料之糊組成 物，含有至少含著色顏料的無機粉末以及接合樹脂。 含著色顏料之糊組成物中所含的著色顏料，因爲防止 所得之電極的外反射而添加之物質，例如，可選擇Co、 •18- (15) 1272638The conductive paste composition of the present invention comprises at least: (A) a conductive powder (B) a glass raw material mixture and (C) a bonding resin, and the specific surface area of the (A) conductive powder must be 1. 5 to 5.0 m 2 / g. (A) Conductive powder The conductive powder contained in the conductive paste composition of the present invention has a specific surface area of 1.5 to 5.0 m2/g, preferably between 1.5 and 4.0 m2/g, and is between 2 and 〇. Better between ~3.5 m2/g. -8- (5) 1272638 When the specific surface area of the conductive powder is less than 1 · 5 m 2 /g, the conductivity of the electrode pattern obtained by using the conductive paste composition is insufficient. On the other hand, when the specific surface area of the conductive powder exceeds 5. 〇m2/g, powder agglomeration tends to occur in the conductive paste composition, and it is difficult to obtain a stable dispersion state. Further, the electrode pattern obtained by using the conductive paste composition is liable to be damaged to the adhesion of the substrate. Further, the term "specific surface area" as used herein means the average enthalpy obtained by the BET method of the conductive powder in the conductive paste composition. The conductive powder in the conductive paste composition of the present invention may be a metal or an alloy of Ag, Au, Al, Cu, or Ag-Pd alloy, or may be used alone or in combination of two or more. Among these conductive powders, even when baked in the air, the conductivity is not lowered by oxidation, and it is particularly preferable to use Ag which is inexpensive. The shape of the conductive powder is not particularly limited as long as it is a granular shape, a spherical shape, a sheet shape, or the like, and a conductive powder of two or more types may be used alone or in combination. Further, the conductive powder preferably has an average particle diameter of 〇1 to 5 μm, and a conductive powder having a different particle diameter can be used. (Β) Glass raw material mixture The glass raw material mixture contained in the conductive paste composition of the present invention is suitably used as a glass raw material mixture having a low melting point. Usually, a glass raw material mixture having a softening point of 6 5 〇 ° C or less is used, and a glass raw material mixture of 400 to 600 Å is preferably used. When the softening point of the glass raw material mixture is less than 4 〇〇C, the pattern of the glass raw material (6) 1272638, mixed #牧/Starting to melt, may be burned before the decomposition of the bonding resin described later in the firing step. Residual organic residue. Moreover, the softening point of the glass raw material mixture exceeds 60 (in the case of TC, the raw material mixture is not sufficiently melted in the firing step, and the pattern after firing may be insufficient in adhesion. As a composition of the glass raw material mixture, It may be selected, for example, from (1) oxidative oxidation, oxidation shed, cerium oxide series (Pb0-B203-SiO2 system), (2) lead oxide 'boron oxide, cerium oxide, aluminum oxide series (P b 0 - B 2 0 3 - S i 0 2 -Al2〇3 series), (3) zinc oxide, boron oxide, antimony oxide series (211〇-B2〇3-Sl〇2 series), (4) zinc oxide, boron oxide, antimony oxide, Alumina series (ZnO-B2〇3-Si〇2-Al2〇3 series), (5) lead oxide, oxidized fresh, boron oxide, lanthanum oxide series (Pb0-Zn0-B203-Si02 series), (6) oxidation Wrong, zinc oxide, boron oxide, antimony oxide, alumina series (PbO-Zn〇-B2〇3-Si〇2_Al2〇3 series), (7) antimony oxide, oxidation shed, oxidized sand series (Bi2〇3_B2〇3 -Si〇2 series), (8) yttrium oxide, oxidation shed, yttria, alumina series (Bi2〇3-B203-SiO2-Al203 system), (9) yttrium oxide, zinc oxide, boron oxide, oxidation矽 series (Bl203-ZnO-B2〇3-Si〇2 series), (10) cerium oxide, zinc oxide, boron oxide, cerium oxide, aluminum oxide series (Bi2〇3_Zn〇-B2〇3_Si〇2-ai2o3 series) Etc. In the glass raw material mixture, due to environmental problems, the use of the error-free glass contained in the above (3), (4), (7), (8), (9) and (1) The raw material mixture is preferably a lead-free composition containing cerium oxide as described in (7), (8), (9), and (10) from the viewpoint of the long-term stability of the conductive paste composition. The glass raw material mixture is particularly preferably. -10- (7) 1272638 Further, the shape of the above glass raw material mixture is not particularly limited, and the average particle diameter is preferably from 0.1 to ΙΟμηη, preferably from 5 to 5 μηη. When the diameter is less than 0 · 1 μηι, the specific surface area of the glass raw material mixture becomes large, and aggregation of particles tends to occur in the conductive paste composition. It is difficult to obtain a stable dispersion state, and a long-term conductive paste composition is added to increase the viscosity. The situation of change, etc. The other side In the case where the average particle diameter of the glass raw material mixture is 1 〇μπι or more, it is difficult to obtain a high-definition electrode pattern. The above glass raw material mixture may be composed of a mixture of glass raw materials having a single or different, different softening point, phase A combination of two or more kinds of glass raw material mixtures having different shapes and different average particle diameters. The content of the glass raw material mixture in the conductive paste composition is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass based on 100 parts by mass of the conductive powder. When the glass raw material mixture is less than 1 part by mass, the adhesion of the obtained electrode to the substrate may be insufficient. Further, when it exceeds 30 mass parts, the obtained electrode may have low conductivity, and the conductive paste composition has low storage stability and may change over time. (C) Joining resin As the bonding resin contained in the conductive paste composition of the present invention, various resins can be used, and a resin containing 30% by weight to 10% by weight of the alkali-soluble resin is preferably used. Here, "alkali-soluble" means that it can be dissolved by an alkaline etching solution, and has a solubility property to the extent that the etching treatment is completed. Specific examples of such an alkali-soluble resin may, for example, be selected from the group consisting of methyl-11-(8) 1272638-based acrylate-based resin, hydroxystyrene resin, Novalar phenolic resin, polyester resin and the like. In such an alkali-soluble resin, a copolymer of the following monomer (I) and monomer (III), a copolymer of monomer (I), monomer (II) and monomer (III) may be selected as a preferred example. A carboxyl group-containing methacrylate resin. Monomer (I): carboxyl group-containing monomeric acrylic acid, methacrylic acid, maleic acid, trans-butenedioic acid, 2-butenoic acid, methylene succinic acid, methyl butylene Acid, methyl fumaric acid, cinnamic acid, succinic acid mono-2-methylpropenyloxyethyl ester, ω-carboxy polycaprolactone monomethacrylate, and the like. Monomer (II): a hydroxyl group-containing monomer such as 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate or 3-hydroxypropyl methacrylate containing 0 oxime; oxime-hydroxyl group A phenolic hydroxyl group-containing monomer such as styrene, m-hydroxystyrene or p-hydroxystyrene. Monomer (111): other possible copolymerization of monomeric methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, n-dodecyl methacrylate, benzyl methacrylate, methyl a methacrylate other than the monomer (1) such as glycidyl acrylate or dicyclopentanyl methacrylate; an aromatic vinyl monomer such as styrene or α-methyl styrene; butadiene, a conjugated diene such as isoprene-m-diene; a side of a polymeric chain of polystyrene, polymethyl methacrylate, polyethyl methacrylate, polymethyl methacrylate, etc. A macromonomer of a polymerizable unsaturated group such as a methacryloyl group: a copolymer of the above monomer (I) and a monomer (ΠΙ), and a monomer (I), The copolymer of the monomer (Π) and the monomer (111) can be alkali-soluble because of the copolymerization of the monomer (I). The copolymer of the monomer (I), the monomer (II) and the monomer (ΙΠ), the (A) conductive powder, the dispersion stability of the (Β) glass raw material mixture, and the solubility of the alkali developing solution described later. In terms of opinion, it is especially good. The content ratio of the copolymerization component of the monomer (I) in the copolymer is preferably from 5 to 60% by mass, particularly preferably from 10 to 40% by mass, and the content of the copolymerization component of the monomer (u), 1~ 50% by mass is preferred, and 5 to 30% by mass is particularly preferred. The molecular weight of the alkali-soluble resin constituting the conductive paste composition is a weight average molecular weight in terms of GPC polystyrene (hereinafter referred to as "Mw"), preferably 5,000 to 5,000,000, and 1 〇, 〇〇〇 〜3 00,000. good. In the conductive paste composition of the present invention, the ratio of the use of the (C) bonding resin is preferably from 5 to 50 parts by mass based on 100 parts by mass of the conductive powder (A). When the content of the bonding resin is less than 5% by mass, the conductive paste composition tends to cause agglomeration of the powder, and it is difficult to obtain a stable dispersion state, and the flexibility of the film for forming an electrode formed by applying the conductive paste composition is obtained. Transcriptionality is significantly reduced. In addition, when the content of the bonding resin exceeds 50 parts by mass, the shrinkage of the pattern tends to increase in the baking treatment step in the electrode forming step, and deformation of the pattern may occur. (D) Solvent -13- (10) 1272638 The conductive paste composition of the present invention usually contains a solvent. As the solvent, the affinity between the (A) conductive powder and the (B) glass raw material mixture and the solubility of the (C) bonding resin are good, and the conductive paste composition can have an appropriate viscosity, and can be easily dried by drying. Evaporation removal is preferred. Specific examples of such a solvent include, for example, ketones such as 3-pentanone, 2-hexanone, 4-heptanone, and cyclohexanone; n-pentanol, 4-methyl-2-pentanol, and cyclohexanol. Alcohols such as diacetone alcohol; ether alcohols such as 2-methoxyethanol, 2-ethoxyethanol, butoxyethanol, propylene glycol monomethyl ether, and propylene glycol monoethyl ether; n-butyl acetate, amyl acetate, etc. a saturated aliphatic monocarboxylic acid alkyl ester; a lactate such as ethyl lactate or n-butyl lactate; methyl ethoxyethyl acetate, ethyl ethoxyethyl acetate, methoxypropyl acetate, An ether ester such as 3-ethoxypropionate or the like. These may be used alone or in combination of two or more. The content ratio of the solvent in the conductive paste composition can be appropriately selected within a range in which good film formability (fluidity or plasticity) can be obtained, and usually, it is possible to use 100 parts by mass of the (A) conductive powder. 1 to 10,000 mass parts, preferably 10 to 1, and the mass part is better. In addition to the above components, the conductive paste composition contains other inorganic powders, plasticizers, development accelerators, bonding aids, storage stability, antifoaming agents, oxidation inhibitors, ultraviolet absorbers, dispersants, and crosslinkers. Various additives such as a photopolymerization initiator, a photoacid generator, a thermal polymerization initiator, and a thermal acid generator may contain optional components. In particular, the conductive paste composition is preferably a plasticizer in order to maintain good flexibility and transcription of the transcription film for forming an electrode of the present invention. As the plasticizer for the conductive paste composition, various compounds-14-(11) 1272638 can be used, for example, dibutyl adipate, diisobutyl adipate, di-2-ethyl adipate. Hexyl ester, di-2-ethylhexyl sebacate, dibutyl sebacate, dibutyldiethylene sebacate, hydroxypropyl dodecanoate, hydroxypropyl oleate, phthalic acid a compound such as 2-ethylhexyl ester, a dimethacrylate of an alkylene glycol such as ethylene glycol or propylene glycol; a dimethacrylate of a polyalkylene glycol such as polyethylene glycol or polypropylene glycol; a polymethacrylate of a trivalent or higher polyvalent alcohol such as a triol, H4-butanetriol, a trimethylol alkane, a tetramethylol alkane, an isopentaerythritol or a diisopentaerythrin; And a methacrylic ester compound containing at least one methacryl oxime group in a molecule such as a polymethacrylate of a polyalkylene glycol addition product of a trivalent or higher polyvalent alcohol; Preferably. The content of the plasticizer in the conductive paste composition is preferably from 0.5 to 30 parts by mass based on 100 parts by mass of the (A) conductive powder, and more preferably from 1 to 20 parts by mass. In addition, the conductive paste composition of the present invention may contain a photosensitive material. In this case, a photosensitive component is formed by adding a radiation-sensitive component constituting an alkali-developing type radiation resist composition to be described later. When the photosensitive paste composition is provided with photosensitivity, the electrode pattern can be formed without using the photoresist composition. In the conductive paste composition, the (A) bonding resin and any of the above-mentioned optional organic components are dissolved as a vehicle, and then the (A) conductive powder, the (B) glass raw material mixture, and any of the above-mentioned inorganic powders as needed. The mixing is carried out by kneading using a kneading machine such as a roller kneader, a mixer, an emulsifier mixer, a ball mill, a glass bead mill, etc., and can be adjusted by -15-(12)!272638. The conductive paste composition prepared as described above has a paste composition suitable for fluidity of coating, and has a viscosity of usually 100 to 10,000,000 cp, preferably 5 to 10,000 cp. <Formation of a transcription film for an electrode> The transcription film for forming an electrode of the present invention must contain a conductive resin layer obtained by applying the conductive paste composition of the present invention. The transcription film for forming an electrode of the present invention is usually composed of a support film and a transcription layer containing at least a conductive resin layer obtained by applying the conductive paste composition of the present invention, and is an electrode for a dry film method. The composite material forming the step. The support film for forming the transcription film for an electrode of the present invention has heat resistance and solvent resistance, and a flexible resin film is preferable. The conductive paste composition of the present invention can be applied by a roll coater, a blade coater, a slit coater or the like by a roll coater, a blade coater, a slit coater or the like, and the conductive resin layer can be stored in a roll-like state and can be provided. use. As the resin forming the support film, for example, fluorine, such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyamidamine, polyvinyl alcohol, polyvinyl chloride, polyvinyl fluoride, etc., may be selected. Resin, nylon, cellulose, etc. The thickness of the supporting film can be, for example, 20 to 100 μm. Further, it is preferable to perform a release treatment on the surface of the above-mentioned support film. Therefore, the transcription step of the substrate facilitates the peeling operation of the support film. The conductive resin layer constituting the transcription film for an electrode of the present invention can be formed by applying the conductive paste composition of the present invention, drying the coating film, and removing a part or all of the solvent. As a method of applying the conductive paste composition, a coating film having a uniform film thickness (for example, 1 μm or more) having a uniform film thickness can be preferably formed efficiently, and specifically, coating by a roll coater can be selected. The method is a coating method by a blade coater, a coating method by a slit coater, a coating method by a curtain coater, a coating method by a screen coater, and a coating method by a convex plate printing coater. Preferably. The drying conditions of the coating film are 50 to 150. (3) The temperature is 0.5 to 30 minutes, and the residual ratio of the solvent after drying (content ratio in the conductive resin layer) is usually 2% by mass or less. The film thickness of the conductive resin layer formed as described above is usually 1 to ΙΟΟμιη' Preferably, it is preferably between 3 and 50 μm, and more preferably between 5 and 40 μm. Further, in the transcription film for forming an electrode of the present invention, a protective film may be provided in contact with the surface of the transcription layer. The protective film may be the same as the support film. Further, the release treatment is usually performed on the surface of the protective film, and the peel strength of the protective film must be smaller than the peel strength of the support film. The transcription film for forming an electrode of the present invention forms a photoresist layer on the support film and is electrically conductive. The resin layer may be formed by lamination. By laminating the laminate on the substrate, a laminated film in which a photoresist layer is formed on the conductive resin layer can be obtained. Further, the transcription film for forming an electrode of the present invention (A-1) a conductive resin layer obtained by coating the conductive paste composition of the present invention, and (Α-2) an inorganic-17-(14) 1272638 powder containing at least a coloring pigment, and a bonding resin The colored resin layer is preferably used as the inorganic powder, and the conductive powder and the glass raw material mixture are preferably contained as the inorganic powder. When the laminated film is used, the conductive resin layer and the colored resin layer are used. The acoustic layer electrode can be formed in one piece, and has excellent adhesion to the substrate, excellent conductivity, and less external reflected light, and can be applied to the electrode of the bus electrode for PDP. Further, the transcription film for forming an electrode of the present invention is The conductive resin layer and the colored resin layer may be laminated in this order on the photoresist layer formed on the support film, and the conductive film layer may be formed on the colored resin layer by transcribed the laminated film on the substrate. Further, a photoresist film is formed thereon to obtain a laminated film. The colored resin layer and the photoresist layer are coated with a paste composition containing a coloring pigment to be described later and a photoresist composition, and dried, similarly to the conductive resin layer. The coating film may be formed by removing a part or all of the solvent. The film thickness of the colored resin layer thus formed is usually 1 to 20 μm, preferably 3 to 15 μm, and 5 to 10 μm. Further, the film thickness of the photoresist layer is usually 1 to 20 μm, preferably 3 to 15 μm, more preferably 5 to 10 μm. The coloring pigment-containing paste composition is used to form a colored resin layer. The paste composition contains an inorganic powder containing at least a coloring pigment and a binder resin. The coloring pigment contained in the paste composition containing the coloring pigment is added by a material which prevents external reflection of the obtained electrode, for example, Co, •18- (15) 1272638
Cr、Cu、Fe、Μη、Ni、Ti、Zn等的金屬以及其氧化物、 複合氧化物、碳化物、氮化物、硫化物、矽化物、硼化 物、碳黑、石墨等的無機粉末，可使用單獨或混合2種以 上。其中作爲較佳之著色顏料，可選自 Co、Cr、Cu、 Fe、Μη、Ni、Ti組成的群之金屬粉末、金屬氧化物以及 複合氧化物粉末（例如，可選擇Ni粉末、C〇304粉末、 FesCU粉末、Cu-Cr複合氧化物粉末、Cu-Fe-Mn複合氧化 物粉末、Cu-Cr-Mn複合氧化物粉末、Co-Fe-Mn複合氧化 物粉末等）。藉由使用該等著色顏料，可得例如黑色、灰 色等的含著色顏料糊組成物。 上述著色顏料的平均粒徑，1 μηι以下較佳，〇.〇1〜〇.5 μπι更佳。使用著色顏料的平均粒徑超過1 μπι之含無機粉 末的樹脂組成物的情況，難以獲得足夠防止外光反射效果 的電極。著色顏料的平均粒徑不足0 · 0 1 μπι的情況，因著 色顏料的比表面積變大，含著色顏料之糊組成物中易發生 粉末的凝集，難以獲得安定分散狀態。 於上述含著色顏料之糊組成物，作爲無機粉末，含著： 色顏料較佳，更進一步，含有導電性粉末以及玻璃原料混 合物更佳。導電性粉末與著色顏料的含有比例，導電性粉 末：著色顏料的値，以75 : 2 5〜25 : 7 5的比例較佳。上述 含有比例，藉由使用含導電性粉末與著色顏料的含著色顏 料之糊組成物，可具有足夠外光反射防止效果，而且具有 形成作爲電極機能的導電性之PDP用匯流電極。而且， 玻璃原料混合物的含有比例，相對用於含著色顏料之糊組 -19- (16) 1272638 成物的全部無機粉末，50質量％以下，以1〜3 Ο 佳。 含著色顏料之糊組成物中，作爲導電性粉末 Ag、Au、Al、Cu、Ag-Pd合金等的金屬以及合 用單獨或2種以上混合。於該等導電性粉末中， 氣中燒成的情況下亦不因氧化而產生導電性降低 較廉價的Ag特別好。 上述導電性粉末的形狀，可爲粒狀、球狀、 特別限定，可使用單獨或2種以上的形狀的導電 合。而且，上述導電性粉末的平均粒徑，0.1。 佳，可使用混合相異粒徑的導電性粉末。 而且，含著色顏料之糊組成物中，較佳的玻 合物，可使用與本發明的導電性糊組成物相同的 混合物。 上述含著色顏料之糊組成物所含之接合樹脂 與本發明的導電性糊組成物相同的接合樹脂。 而且，上述含著色顏料之糊組成物，與本發 性糊組成物相同，可含有溶劑以及上述以外的無 可塑劑、顯像促進劑、接合助劑、保存安定性、 氧化防止劑、紫外線吸收劑、分散劑、交鏈劑、 始劑、光酸產生劑、熱聚合起始劑、熱酸產生劑 加劑，可含有任意成分。 含著色顏料之糊組成物，可與本發明的導電 物相同方式調製。 質量％較 ，可選擇 金，可使 即使於大 ，以使用 片狀等不 性粉末混 5 μηι 較 璃原料混 玻璃原料 ，可選擇 明的導電 機粉末、 消泡劑、 光聚合起 等各種添 性糊組成 -20- (17) 1272638 如上述所調製之含著色顏料之糊組成物，具有適於塗 布的流動性之糊組成物，其黏度’通常爲1 〇 0〜1 0 0，0 0 0 。9，500〜10,000。戶較佳。 光阻組成物 爲了形成光阻層所使用之光阻組成物，可使用例如， 鹼顯像型感放射線性光阻組成物，有機溶劑顯像型感放射 線性光阻組成物，水性顯像型感放射線性光阻組成物等， 較佳可使用鹼顯像型感放射線性光阻組成物。本發明所謂 之「放射線」，係指包含可見光、紫外線、遠紫外線、電 子線、X線等。 鹼顯像型感放射線性光阻組成物，含有鹼可溶性樹脂 與感放射線成分爲必要成分。構成鹼顯像型感放射線性光 阻組成物之鹼可溶性樹脂，可選擇例如構成含無機粉末的 樹脂組成物的鹼可溶性樹脂。 構成鹼顯像型感放射線性光阻組成物之感放射線成 分，例如（a )反應性單體與光聚合起始劑的組合，（b ) 三聚氰胺樹脂與由放射線照射形成酸之光酸產生劑的組合 較佳，上述（a )的組合中，特別以甲基丙烯酸酯化合物 與光聚合起始劑的組合更佳。 構成感放射線成分之甲基丙烯酸酯化合物的具體例， 可選擇：乙二醇、丙二醇等的烷二醇的甲基丙烯酸二酯 類；聚乙二醇、聚丙二醇等聚烷二醇的甲基丙烯酸二酯 類；兩末端爲羥基的聚丁二烯、兩末端爲羥基的聚異戊二 •21 - (18) 1272638 烯、兩末端爲羥基的聚己內酯等的兩末端羥基化聚合體的 甲基丙烯酸二酯類；丙三醇、1，2,4-丁三醇、三羥甲基烷 類、四羥甲基烷類、異戊四醇、二異戊四醇等的三價以上 的多價醇的聚甲基丙烯酸酯類；三價以上的多價醇的聚烷 二醇附加物的聚甲基丙烯酸酯類；1，4·環己二醇、1，4-苯 二醇類等的環狀聚醇的聚甲基丙烯酸酯類；聚酯甲基丙烯 酸酯、環氧甲基丙烯酸酯、胺基甲酸乙酯樹脂甲基丙烯酸 酯、醇酸樹脂甲基丙烯酸酯、矽樹脂甲基丙烯酸酯、螺環 樹脂甲基丙烯酸酯等的寡聚甲基丙烯酸酯類等，可使用該 等單獨或二種以上組合。 而且，構成感放射線成分之光聚合起始劑的具體例， 苯甲基、二苯乙醇酮、二苯丙酮、樟腦醌、2-羥基-2-甲 基-1-苯基-2·丙酮、1-羥基環己基苯基酮、2,2-二甲基-2-苯基苯乙酮、2-甲基-[4’-(甲硫基）]-2-嗎啉-1-丙酮、2-苯 甲基-2-二甲基胺基-1-(4-嗎啉苯基）-1-丁酮等的羰基化合 物；過氧化二苯甲醯、過氧化二第三丁烷、第三丁基過氧 化氫、氫過氧異丙苯、對過氧化甲烷等的有機過氧化物； l，3-bis (三氯甲基）-5-(2’-氯苯基）-1，3,5-三畊、2-[2-(2-呋 喃）乙炔基]-4,6-bis(2-氯苯基）-1，3,5-三畊等的三鹵甲烷 類；2,2’-bis(2-氯苯基）4,5,4’，5’-四苯基-1，2’-二咪唑等的 咪唑的二聚物，可使用該等單獨或二種以上混合。 該鹼顯像型感放射線性光阻組成物之感放射線成分的 含有比例，以鹼可溶性樹脂爲1〇〇質量部，通常爲1〜3 〇〇 質量部，以1 〇〜200質量部較佳。 -22- 1272638 (19) 而且，鹼顯像型感放射線性光阻組成物中，爲了賦予 良好的膜形成性，含有適當的有機溶劑較佳。如此之有機 溶劑，可選擇構成含無機粉末的樹脂組成物中列舉之溶 劑。 於光阻組成物，除上述成分外，含有顯像促進劑、接 合助劑、保存安定性、消泡劑、氧化防止劑、紫外線吸收 劑、均勻劑等各種添加劑亦可。 光阻組成物，藉由均勻溶解上述鹼可溶性樹脂、感放 射線性成分以及依據需要之上述任意成分，可調製而成。 如上述所調製的光阻組成物，具有適於塗布的流動性 之糊組成物，其黏度，通常爲10〜10,000 cp，10 0〜1，000 CP較佳。 〈電極的形成方法〉 本發明的PDP用電極的形成方法，使用本發明的形 成電極用轉錄薄膜較佳，包含：〔1〕導電性樹脂層的轉 錄步驟；〔2〕光阻膜的形成步驟；〔3〕光阻膜的曝光步 驟；〔4〕光阻膜的顯像步驟；〔5〕導電性樹脂層的蝕刻 步驟；〔6〕圖形的燒成步驟。而且，〔〗〕導電性樹脂層 的轉錄步驟，使用導電性樹脂層與著色樹脂層的疊層膜較 佳。 〔1〕導電性樹脂層的轉錄步驟 導電性樹脂層，使用本發明的形成電極用轉錄薄膜， -23- 1272638 (20) 轉錄構成該轉錄薄膜的導電性樹脂層於基板上而形成。此 時’支持薄膜上有導電性樹脂層，於該導電性樹脂層上使 用有著色樹脂層的轉錄薄膜，轉錄導電性樹脂層與著色樹 脂層的疊層膜較佳。 轉錄步驟的一例表示如下所述。根據需要使用之形成 電極用轉錄薄膜的保護膜剝離後，於基板上，如與導電性 樹脂層（疊層膜的情況則是著色樹脂層）表面接觸般重疊 轉錄薄膜，藉由加熱滾筒熱壓接該轉錄薄膜，將支持薄膜 從導電性樹脂層剝離除去。如此，轉錄導電性樹脂層至基 板上，成爲密合狀態。而且，於疊層膜的情況，著色樹脂 層形成於基板上，於其上，形成導電性樹脂層，成爲密合 狀態。 於此，轉錄的條件，例如，加熱滾筒的表面溫度在 2 0〜140 °C，於加熱滾筒上滾筒的壓力爲1〜5 kg/cm2，加熱 滾筒的移動速度爲0.1〜10.0 m/分。而且，亦可預熱基 板，預熱的溫度可例如爲40〜1〇〇。(：。 〔2〕光阻膜的形成步驟 該步驟，係形成光阻膜於導電性樹脂層的表面。 光阻膜，可藉由網版印刷法、滾輪塗布法、旋轉塗布 法、流延塗布法等塗布上述之光阻組成物後，乾燥塗膜而 可形成。 而且’於支持薄膜上所形成光阻膜，藉由轉錄至導電 性樹脂層的表面亦可，如前述般，使用具光阻層與導電性 -24 - 1272638 (21) 樹脂層的疊層膜之轉錄薄膜，或者具光阻層、導電性樹脂 層與著色樹脂層的疊層膜之轉錄薄膜，一起進行轉錄亦 可。根據如此之形成方法’步驟可簡化外，同時可預期所 形成之電極的膜厚均勻性。 〔3〕光阻膜的曝光步驟 該步驟，係於光阻膜的表面，隔著曝光用光罩，以紫 外線等的放射線選擇性的曝光，形成光阻圖形的潛像。 於此’作爲放射線照射裝置，使用前述微影術所使用 的紫外線照射裝置，製造半導體以及液晶顯示裝置時所使 用之曝光裝置等，並無特別限制。 〔4〕光阻膜的顯像步驟 該步驟，藉由對已曝光之光阻膜進行顯像處理，將光 阻圖形（潛像）顯現。 於光阻膜的顯像步驟中，使用之顯影液，根據光阻膜 (光阻組成物）的種類，可適當選擇。具體而言，鹼顯像 型感放射線性光阻組成物，可使用鹼顯影液於光阻膜。 作爲鹼顯影液的有效成分，可選擇例如：氫氧化鋰、 氫氧化鈉、氫氧化鉀、磷酸氫鈉、磷酸氫二銨、磷酸氫二 鉀、磷酸氫二鈉、磷酸二氫銨、磷酸二氫鉀、磷酸二氫 鈉、矽酸鋰、矽酸鈉、矽酸鉀、碳酸鋰、碳酸鈉、碳酸 鉀、硼酸鋰、硼酸鈉、硼酸鉀、氨等的無機鹼性化合物； 氫氧化四甲基銨、氫氧化三甲基羥乙基銨、甲基胺、二甲 -25- (22) 1272638 基胺、三甲基胺、乙基胺、二乙基胺、三乙基胺、異丙基 胺、二異丙基胺、乙醇胺等的有機鹼性化合物。 於光阻膜的顯像步驟，使用之鹼顯影液，前述鹼性化 合物的1種或2種以上溶解於水中，可調製而成。於此鹼 顯影液中的鹼性化合物的濃度，通常爲0.001〜10重量％， 0.0 1〜5重量％較佳。而且，由驗顯影液進行顯像處理後， 通常施行水洗處理。 於此，顯像處理的條件，根據光阻膜，可選擇適當之 顯影液的種類·組成·濃度、顯像時間、顯像溫度、顯像 方法（例如浸泡法、搖動法、沖淋法、噴灑法、混拌 法）、顯像裝置等。 藉由該顯像步驟，形成由光阻殘留部與光阻除去部構 成的光阻圖形（對應曝光用光罩的圖形）。 該光阻圖形，於下一步驟（蝕刻步驟）中，作爲蝕刻 遮罩作用，光阻殘留部的構成材料，必須比導電性樹脂層 與著色樹脂層的構成材料，對蝕刻液之溶解度小。 〔5〕導電性樹脂層的蝕刻步驟 .該步驟，導電性樹脂層（以及著色樹脂層）進行蝕刻 處理，形成對應光阻圖形之導電性樹脂層（以及著色樹脂 層）的圖形。 亦即導電性樹脂層中，光阻圖形之光阻除去部所對應 的部分，溶解於蝕刻液，選擇性的除去。因此，若持續進 行蝕刻處理，導電性樹脂層（以及著色樹脂層）上光阻除 -26- (23) 1272638 去部所對應的部分，露出基板表面。 導電性樹脂層的蝕刻步驟所使用之蝕刻液，鹼性溶液 較佳。因此，導電性樹脂層（以及著色樹脂層）所含之鹼 可溶性樹脂可輕易溶解而除去。 而且，導電性樹脂層（以及著色樹脂層）所含之無機 粉末，因鹼可溶性樹脂均勻分散，藉由鹼性溶液溶解具結 合劑的鹼可溶性樹脂並洗淨之，亦可同時除去無機粉末。 於此，作爲蝕刻液使用之鹼性溶液，與顯影液相同組 成的溶液更佳。 蝕刻液，藉由顯像步驟中使用之顯影液相同溶液，可 連續進行顯像步驟與蝕刻步驟，可簡化步驟。 而且，由鹼性溶液進行蝕刻處理後，通常施行水洗處 理。而且，必要時蝕刻處理後，亦可包含於導電性樹脂層 (以及著色樹脂層）圖形側面以及基板露出部上殘存不要 部分擦拭取出的步驟。 於此，可選擇適當之蝕刻液的種類·組成.濃度、處 理時間、處理溫度、處理方法（例如浸泡法、搖動法、沖 淋法、噴灑法、混拌法）、處理裝置等。 而且，蝕刻處理後，光阻殘留部的一部分或全部，即 使殘留，該光阻殘留部在下一燒成步驟中除去。 〔6〕圖形的燒成步驟 該步驟，對導電性樹脂層（以及著色樹脂層）的圖 形，進行燒成處理，形成電極。因此，樹脂層殘留部中的 -27- (24) 1272638 有機物質燒失，於基板表面上，可獲得形成圖形（疊層膜 時爲疊層圖形）之電極。 於此，燒成處理的溫度，必須到達使樹脂層殘留部中 的有機物質燒失的溫度，通常大氣中，400〜600 °C。而 且’燒成時間通常爲10〜90分鐘之間。 {實施例} 以下，說明本發明的實施例，本發明不因此限定。而 且’以下「質量部」以「部」表示。 而且，Mw爲東受公司（TOSOH)製凝膠滲透色譜分 析儀（GPC)(商品名HLC- 8 02A )測定之聚苯乙烯換算 的重量平均分子量。 〈實施例1 > (1 )導電性糊組成物的調製 (A)以比表面積1.8m2/g的Ag粉100部，作爲導電 性粉末；（B )平均粒徑3 μ m的B i 2 Ο 3 - B 2 Ο 3 - S i Ο 2系的玻 璃原料混合物（不定形，軟化點520 °C ) 10部，作爲玻璃 原料混合物；（C )甲基丙烯酸2 -乙基己酯/甲基丙烯酸 3-羥基丙酯/甲基丙烯酸/ 丁二酸單2-甲基丙烯氧基乙醋 > 60/20/20/20 (質量 ％ )共聚合體（Mw = 5 0,000 ) 20 部’作爲接合樹脂；油酸1部、壬二酸二2 _乙基己酯1 〇 部，作爲其他任意成分；以及丙二醇單甲醚i 〇〇部，作爲 溶劑；以玻璃珠磨機捏合後，用不鏽鋼網（50〇網目，25 -28- (25) 1272638 μιη直徑）過濾後，導電性糊組成物調製而成。 (2 )鹼顯像型感放射線性光阻組成物的調製 以甲基丙烯酸苯甲酯/甲基丙烯酸二75/2 5 (質邏 共聚合體（Mw = 3 0,000 ) 60部，作爲鹼可溶性樹脂 二丙烯酸三丙烯乙二酯40部，作爲多官能基單體（ 射線性成分）·，以 2-苯甲基-2-二甲基胺基嗎 基）-1 - 丁酮 5部，作爲光聚合起始劑（感放射線 分）；以乙酸甲氧基丙酯10 0部，作爲溶劑；捏合後 由匣式濾器（2 μιη直徑）過濾，鹼顯像型感放射線 阻組成物（以下稱爲「光阻組成物」）調製而成。 (3 )轉錄薄膜的製作 藉由以下（i )與（ii )的操作，順序疊層光阻 及導電性樹脂層，成爲之疊層膜，形成於支持薄膜上 作成本發明的形成電極用轉錄薄膜。 (i )以（2 )調製成光阻組成物，利用刀片塗布 塗布於膜厚3 8 μ m的P E T膜所成的支持薄膜上’以 °C、3分鐘乾燥塗膜’除去溶劑’於支持薄膜上，形 度8 μιη的光阻膜。 (ii )以（1 )調製成之導電性糊組成物，利用 塗布機，塗布於（i )所製成的光阻膜上’以1 〇 〇 °c、 鐘乾燥塗膜，除去溶劑，形成厚度25 的導電性樹 於光阻膜上，具有光阻膜與導電性樹脂層之疊層膜’ :%) ;以 感放 琳苯 性成 ，藉 性光 膜以 ，製 機， 100 成厚 刀片 5分 脂層 形成 -29 - (26) 1272638 於支持薄膜上，製作成形成電極用轉錄薄膜。 (4 )疊層膜的轉錄步驟 於玻璃基板表面，如同與由（3 )製成之形成電極用 轉錄薄膜的導電性樹脂層表面接觸，重疊轉錄薄膜，以加 熱滾筒，熱壓接該轉錄薄膜。於此，作爲壓接條件，以加 熱滾筒的表面溫度loot、滾筒壓力2.5 kg/cm、加熱滾 筒的移動速度〇·5 m/分。因此，轉錄薄膜轉錄至玻璃基板 表面，成爲密合狀態。 (5 )光阻膜的曝光步驟·顯像步驟 上述（4 )中於玻璃基板形成之疊層膜中的光阻膜， 從支持薄膜上隔著曝光光罩（100 μπι寬的條狀圖形以及 四邊5 cm的圖形），藉由超高壓水銀燈，以400mJ/cm2 照射i線（波長3 6 5nm的紫外光）。剝離光阻膜上的支持 薄膜，然後，對曝光後之光阻膜，以0.5質量％的碳酸鈉 水溶液（3 (TC )作爲顯影液，藉由沖淋法3 0秒，進行光 阻膜的顯像處理。 因此，除去未受紫外光照射的未硬化的光阻，形成光 阻圖形。 (6 )導電性樹脂層的蝕刻步驟 連續上述步驟，以 0.5質量％的碳酸鈉水溶液（3 0 °C )作爲鈾刻液，藉由沖淋法6 0秒，進行導電性樹脂層 -30- (27) 1272638 的鈾刻處理。 然後，用超純水進行水洗處理，以及乾燥處理。因 此，形成導電性樹脂層殘留部與導電性樹脂層除去部構成 的圖形。 (7 )圖形的燒成步驟 形成導電性樹脂層圖形之玻璃基板，於燒成爐內大氣 壓下，以5 90 °C 30分鐘進行燒成處理。因此，於玻璃基板 表面上，形成膜厚8 μηι的電極圖形。 (8 )電極圖形的導電性評價 所得之電極圖形（四邊5 cm的圖形）的阻抗率，以 四點探針測定，2 · 9 μΩ · c m，表示具有不到 3.0 μΩ · c m 的優良導電性。 (9 )電極圖形的密合性評價 所得之電極圖形（1 00 μηι寬的條狀圖形）上，貼上 依據JIS Ζ 1 522的規定賽璐仿（cellophane)黏著膠，依 照JIS K5 4 00膠帶法，進行密合性評價。其結果，無法剝 離電極圖形，表示具有良好的密合性。 〈實施例2〜4〉 實施例1中作爲導電性粉末（A )，使用如表1中的 比表面積的A g粒子，此外具有與實施例1相同之導電性 -31 - (28) 1272638 糊組成物的調製、形成電極用轉錄薄膜的製作、形成電極 圖形以及進行電極圖形的評價。 電極圖形的評價結果，表示於表1中。 〈實施例5〉 進行實施例2中（1 )導電性糊組成物的調製，（2 ) 鹼顯像型感放射線性光阻組成物的調製’更進一步，以 (1 ’）進行以下的含著色顏料糊組成物的調製。 (1’）含著色顏料糊組成物的調製 以平均粒徑1 μιη的Ag粉60部，作爲導電性粉末； 以平均粒徑0.6 μηι的Cu-Fe-Mn複合氧化物粉末40部， 作爲著色顏料；平均粒徑3 μπι的Bi203-B2〇3-Si〇2系的 玻璃原料混合物（不定形，軟化點520 °C ) 1 0部，作爲玻 璃原料混合物；（C)甲基丙烯酸2 -乙基己酯/甲基丙烯 酸3-羥基丙酯/甲基丙烯酸/ 丁二酸單2-甲基丙烯氧基 乙酯= 60/20/20/20 (質量 ％ )共聚合體（Mw = 50,000) 20部，作爲接合樹脂；油酸1部、壬二酸二2-乙基己酯 W部，作爲其他任意成分；以及丙二醇單甲醚1〇〇部， 作爲溶劑；以玻璃珠磨機捏合後，用不鏽鋼網（5 00網 目’ 2 5 μχη直徑）過濾後，含著色顏料糊組成物調製而 成。 實施例2中（3 )轉錄薄膜的製作，與實施例2相同 的製成轉錄薄膜之後， (Ui )實施例2中（ii )製成之轉錄薄膜的導電性樹 -32- (29) 1272638 脂層上，利用刀片塗布機，塗布（1，）調製成的含著色顏 料糊組成物，以1 〇 〇 °C、5分鐘乾燥塗膜’除去溶劑’形 成厚度5 μηι的導電性樹脂層於光阻膜上’具有光阻膜、 導電性樹脂層與含著色顏料的樹脂層之疊層膜’形成於支 持薄膜上，製作成本發明的形成電極用轉錄薄膜’與實施 例2相同，形成電極圖形以及進行電極圖形的評價。電極 圖形的評價結果，表示於表1中。 〈比較例1〜3〉 實施例1中作爲導電性粉末（A ) ’使用如表1中的 比表面積的A g粒子，此外具有與實施例1相同之導電性 糊組成物的調製、形成電極用轉錄薄膜的製作、形成電極 圖形以及進行電極圖形的評價。 電極圖形的評價結果，表示於表1中。 〈比較例4〉 實施例5中作爲導電性粉末（A )，使用如表1中的 比表面積的Ag粒子，此外具有與實施例5相同之導電性 糊組成物的調製、形成電極用轉錄薄膜的製作、卩彡$ β g 圖形以及進行電極圖形的評價。 電極圖形的評價結果，表示於表1中。 發明的效果 根據本發明的導電性糊組成物以及形成電極g _ _彔_ •33- (30) 1272638 膜，可形成不僅具有優良的導電性’而且具有良好的密合 性之電極圖形。本發明的導電性糊組成物以及开< 成電極用 轉錄薄膜，可適合使用於電發顯示器（PDP)的電極形 成。 【圖示簡單說明】 圖1表示說明用的/般p 13 p的剖面圖 主要元件對照表 1 :玻璃基板 2 :玻璃基板 3 :隔牆 4 :透明電極 5 :匯流電極 6 :位址電極 7 :螢光體 8 :介電層 9 :介電層 1 〇 :保護膜 -34-Metals such as Cr, Cu, Fe, Μη, Ni, Ti, Zn, and inorganic powders such as oxides, composite oxides, carbides, nitrides, sulfides, tellurides, borides, carbon black, graphite, etc. Use alone or in combination of two or more. Among them, as a preferred color pigment, it may be selected from the group consisting of metal powders of Co, Cr, Cu, Fe, Mn, Ni, Ti, metal oxides, and composite oxide powders (for example, Ni powder, C 〇 304 powder may be selected) FesCU powder, Cu-Cr composite oxide powder, Cu-Fe-Mn composite oxide powder, Cu-Cr-Mn composite oxide powder, Co-Fe-Mn composite oxide powder, etc.). By using these colored pigments, a pigment-containing pigment paste composition such as black or gray can be obtained. The average particle diameter of the above colored pigment is preferably 1 μηι or less, more preferably 〇.〇1 to 〇.5 μπι. When a resin composition containing an inorganic powder having an average particle diameter of more than 1 μm is used, it is difficult to obtain an electrode having a sufficient effect of preventing external light reflection. When the average particle diameter of the coloring pigment is less than 0 · 0 1 μm, the specific surface area of the coloring pigment is increased, and the powder composition containing the coloring pigment tends to aggregate, and it is difficult to obtain a stable dispersion state. The paste composition containing the coloring pigment as the inorganic powder preferably contains a color pigment, and further preferably contains a conductive powder and a glass raw material mixture. The ratio of the conductive powder to the coloring pigment, and the conductive powder: the color of the coloring pigment, is preferably 75:25 to 25:75. The above-mentioned content ratio is obtained by using a paste composition containing a coloring pigment containing a conductive powder and a coloring pigment, and has a sufficient external light reflection preventing effect, and has a conductive PDP bus electrode for forming an electrode function. Further, the content ratio of the glass raw material mixture is preferably 50% by mass or less, preferably 1 to 3 parts, based on the total inorganic powder of the paste group -19-(16) 1272638 containing a coloring pigment. The paste composition containing the coloring pigment is mixed as a conductive powder of Ag, Au, Al, Cu, Ag-Pd alloy or the like alone or in combination of two or more kinds. In the case of the conductive powder, in the case of firing in the gas, the conductivity is not lowered by oxidation, and it is particularly preferable to use Ag which is inexpensive. The shape of the conductive powder may be a granular shape or a spherical shape, and is particularly limited, and a single or two or more types of conductive materials may be used. Further, the average particle diameter of the above conductive powder was 0.1. Preferably, a conductive powder of a mixed phase particle size can be used. Further, as the preferred composition of the paste composition containing the coloring pigment, the same mixture as the conductive paste composition of the present invention can be used. The bonding resin contained in the paste composition containing the coloring pigment is the same as the bonding resin of the conductive paste composition of the present invention. Further, the paste composition containing the coloring pigment may contain a solvent, a non-plasticizer other than the above, a development accelerator, a bonding aid, a storage stability, an oxidation inhibitor, and an ultraviolet absorption, similarly to the present composition. The agent, the dispersing agent, the crosslinking agent, the starting agent, the photoacid generator, the thermal polymerization initiator, and the thermal acid generator additive may contain optional components. The paste composition containing the coloring pigment can be prepared in the same manner as the conductor of the present invention. When the mass is more than %, gold can be selected, and even if it is large, a glass material such as a sheet-like non-powder is mixed with 5 μηι of a glass material, and a variety of additives such as a conductive powder, an antifoaming agent, and a photopolymerization can be selected. Paste composition -20- (17) 1272638 A paste composition containing a coloring pigment prepared as described above, having a fluidity paste composition suitable for coating, having a viscosity of usually 1 〇0 to 1 0 0,0 0 0. 9,500~10,000. Household is better. Photoresist composition For the formation of the photoresist composition used for the photoresist layer, for example, an alkali-developing type radiation sensitive linear resist composition, an organic solvent development type radiation sensitive linear resist composition, and an aqueous development type can be used. For the radiation-sensitive linear resist composition or the like, an alkali-developing type radiation-sensitive photoresist composition can be preferably used. The term "radiation" as used in the present invention means visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray, or the like. The alkali-developing radiation sensitive linear resist composition contains an alkali-soluble resin and a radiation-sensitive component as essential components. The alkali-soluble resin constituting the alkali-developing radiation sensitive resist composition may, for example, be an alkali-soluble resin constituting a resin composition containing an inorganic powder. A radiation sensitive component constituting the alkali-developing radiation sensitive photoresist composition, for example, (a) a combination of a reactive monomer and a photopolymerization initiator, and (b) a melamine resin and a photoacid generator which forms an acid by radiation irradiation The combination of the above (a) is particularly preferably a combination of a methacrylate compound and a photopolymerization initiator. Specific examples of the methacrylate compound constituting the radiation component include a methacrylic acid diester of an alkylene glycol such as ethylene glycol or propylene glycol, or a methyl group of a polyalkylene glycol such as polyethylene glycol or polypropylene glycol. Two terminal hydroxylated polymers of polyacrylates; polybutadienes having hydroxyl groups at both ends, polyisoprene 21-(18) 1272638ene having hydroxyl groups at both ends, and polycaprolactone having hydroxyl groups at both ends Diesters of methacrylic acid; trivalents of glycerol, 1,2,4-butanetriol, trimethylolane, tetramethylolane, isovalerol, diisopentaerythritol, etc. Polymethacrylates of the above polyvalent alcohols; polymethacrylates of polyalkylene glycol additions of trivalent or higher polyvalent alcohols; 1,4·cyclohexanediol, 1,4-benzene Polymethacrylates of cyclic polyalcohols such as alcohols; polyester methacrylate, epoxy methacrylate, urethane resin methacrylate, alkyd methacrylate, hydrazine Oligomeric methacrylates such as resin methacrylate or spiro resin methacrylate, etc., can be used Separately or in combination of two or more. Further, specific examples of the photopolymerization initiator constituting the radiation component are benzyl, benzophenone, diphenylacetone, camphorquinone, 2-hydroxy-2-methyl-1-phenyl-2·acetone, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethyl-2-phenylacetophenone, 2-methyl-[4'-(methylthio)]-2-morpholine-1-propanone, a carbonyl compound such as 2-benzyl-2-dimethylamino-1-(4-morpholinyl)-1-butanone; dibenzoguanidine peroxide, dibutane peroxide, and Tributyl hydroperoxide, cumene hydroperoxide, organic peroxides such as methane peroxide; l,3-bis (trichloromethyl)-5-(2'-chlorophenyl)-1, Trihalomethanes such as 3,5-three tillage, 2-[2-(2-furan)ethynyl]-4,6-bis(2-chlorophenyl)-1,3,5-three tillage; a dimer of imidazole such as 2'-bis(2-chlorophenyl)4,5,4',5'-tetraphenyl-1,2'-diimidazole, which may be used alone or in combination mixing. The content ratio of the radiation-sensitive component of the alkali-developing radiation sensitive photoresist composition is 1 part by mass of the alkali-soluble resin, usually 1 to 3 parts by mass, and more preferably 1 to 2 parts by mass. . -22- 1272638 (19) Further, in the alkali-developing radiation sensitive photoresist composition, it is preferred to contain a suitable organic solvent in order to impart good film formability. As such an organic solvent, a solvent exemplified as a resin composition constituting the inorganic powder can be selected. The photoresist composition may contain various additives such as a development accelerator, a bonding aid, a storage stability, an antifoaming agent, an oxidation preventive agent, an ultraviolet absorber, and a homogenizer in addition to the above components. The photoresist composition can be prepared by uniformly dissolving the alkali-soluble resin, the radiation-sensitive component, and the optional components described above. The photoresist composition prepared as described above has a paste composition suitable for coating fluidity, and its viscosity is usually 10 to 10,000 cp, preferably 10 to 1,000 CP. <Method for Forming Electrode> The method for forming an electrode for PDP of the present invention preferably uses the transcription film for forming an electrode of the present invention, and comprises: [1] a transcription step of a conductive resin layer; and [2] a step of forming a photoresist film [3] exposure step of the photoresist film; [4] development step of the photoresist film; [5] etching step of the conductive resin layer; [6] baking step of the pattern. Further, the transcription step of the conductive resin layer is preferably carried out using a laminated film of a conductive resin layer and a colored resin layer. [1] Transcription step of the conductive resin layer The conductive resin layer is formed by transcribed the conductive resin layer constituting the transcription film on the substrate using the transcription film for forming an electrode of the present invention, -23-1272638 (20). In this case, the conductive film is provided on the support film, and a transcription film having a colored resin layer is used for the conductive resin layer, and a laminated film of the conductive resin layer and the colored resin layer is preferably used. An example of the transcription step is as follows. After the protective film for forming the transcription film for an electrode to be used is peeled off, the transcription film is superposed on the substrate so as to be in contact with the surface of the conductive resin layer (the colored resin layer in the case of a laminated film), and is heated by a heating roller. The transcription film was attached, and the support film was peeled off from the conductive resin layer. In this manner, the conductive resin layer is transferred to the substrate to be in a sealed state. Further, in the case of a laminated film, a colored resin layer is formed on a substrate, and a conductive resin layer is formed thereon to be in an adhered state. Here, the conditions of the transcription, for example, the surface temperature of the heating roller is 20 to 140 ° C, the pressure of the roller on the heating roller is 1 to 5 kg/cm 2 , and the moving speed of the heating roller is 0.1 to 10.0 m / min. Moreover, the substrate may be preheated, and the preheating temperature may be, for example, 40 to 1 Torr. (: [2] Step of forming a photoresist film This step is to form a photoresist film on the surface of the conductive resin layer. The photoresist film can be formed by screen printing, roller coating, spin coating, casting After coating the above-mentioned photoresist composition by a coating method or the like, the coating film can be dried and formed. Further, the photoresist film formed on the support film can be transcribed to the surface of the conductive resin layer, and the device can be used as described above. The transcription film of the laminated film of the photoresist layer and the conductive -24 - 1272638 (21) resin layer, or the transcription film of the laminated film having the photoresist layer, the conductive resin layer and the colored resin layer, may be transcribed together. According to such a formation method, the steps can be simplified, and the uniformity of the film thickness of the formed electrode can be expected. [3] Exposure step of the photoresist film This step is applied to the surface of the photoresist film via the exposure light. The cover is selectively exposed to radiation such as ultraviolet rays to form a latent image of the resist pattern. Here, as a radiation irradiation device, a semiconductor and a liquid crystal display device are manufactured using the ultraviolet irradiation device used in the above-described lithography. The exposure apparatus used at the time is not particularly limited. [4] Development step of the photoresist film In this step, the photoresist pattern (latent image) is visualized by performing development processing on the exposed photoresist film. In the development step of the photoresist film, the developer to be used may be appropriately selected depending on the type of the photoresist film (photoresist composition). Specifically, the alkali-developing radiation-sensitive photoresist composition can be used. The alkali developer is used as a resist film. As an active component of the alkali developer, for example, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate or disodium hydrogen phosphate can be selected. , inorganic ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate, lithium niobate, sodium citrate, potassium citrate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate, ammonia, etc. Basic compound; tetramethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, methylamine, dimethyl-25-(22) 1272638-amine, trimethylamine, ethylamine, diethylamine Organic alkalization of triethylamine, isopropylamine, diisopropylamine, ethanolamine, etc. The alkali developing solution used in the developing step of the photoresist film may be prepared by dissolving one or more of the above-mentioned basic compounds in water, and the concentration of the basic compound in the alkali developing solution is It is usually 0.001 to 10% by weight, preferably 0.01 to 5% by weight. Further, after the development process is carried out by the developer, the water washing treatment is usually performed. Here, the conditions of the development treatment can be selected according to the photoresist film. Suitable developer type, composition, concentration, development time, development temperature, development method (for example, immersion method, shaking method, shower method, spraying method, mixing method), developing device, etc. In the developing step, a photoresist pattern (corresponding to the pattern of the exposure mask) composed of the photoresist residual portion and the photoresist removing portion is formed. The photoresist pattern is used as an etching mask in the next step (etching step). The constituent material of the photoresist residual portion must be smaller than the constituent material of the conductive resin layer and the colored resin layer, and the solubility in the etching liquid is small. [5] Etching step of the conductive resin layer. In this step, the conductive resin layer (and the colored resin layer) is etched to form a pattern of the conductive resin layer (and the colored resin layer) corresponding to the resist pattern. In the conductive resin layer, the portion corresponding to the photoresist removal portion of the photoresist pattern is dissolved in the etching liquid and selectively removed. Therefore, if the etching treatment is continued, the conductive resin layer (and the colored resin layer) is light-blocked by the portion corresponding to the portion -26-(23) 1272638, and the surface of the substrate is exposed. The etching solution used in the etching step of the conductive resin layer is preferably an alkaline solution. Therefore, the alkali-soluble resin contained in the conductive resin layer (and the colored resin layer) can be easily dissolved and removed. Further, the inorganic powder contained in the conductive resin layer (and the colored resin layer) is uniformly dispersed by the alkali-soluble resin, and the alkali-soluble resin having a binder is dissolved in an alkaline solution and washed, and the inorganic powder can be simultaneously removed. Here, as the alkaline solution used as the etching solution, a solution having the same composition as the developer is more preferable. The etching solution can continuously carry out the developing step and the etching step by the same solution of the developing solution used in the developing step, and the step can be simplified. Further, after the etching treatment with an alkaline solution, a water washing treatment is usually carried out. Further, after the etching treatment, if necessary, it may be included in the pattern side surface of the conductive resin layer (and the coloring resin layer) and the exposed portion of the substrate, and the step of wiping out is not required. Here, the type, composition, concentration, treatment time, treatment temperature, treatment method (e.g., soaking method, shaking method, shower method, spraying method, mixing method), processing device, and the like of an appropriate etching liquid can be selected. Further, after the etching treatment, part or all of the remaining portion of the photoresist remains, and the remaining portion of the photoresist is removed in the next baking step. [6] Burning step of pattern In this step, the pattern of the conductive resin layer (and the colored resin layer) is subjected to a baking treatment to form an electrode. Therefore, the organic material of -27-(24) 1272638 in the residual portion of the resin layer is burned out, and an electrode (in the form of a laminated pattern when the laminated film is formed) can be obtained on the surface of the substrate. Here, the temperature of the baking treatment must reach a temperature at which the organic substance in the remaining portion of the resin layer is lost to heat, and is usually 400 to 600 ° C in the atmosphere. Moreover, the firing time is usually between 10 and 90 minutes. {Examples} Hereinafter, examples of the invention will be described, but the invention is not limited thereto. And the following "quality department" is indicated by "part". Further, Mw is a polystyrene-equivalent weight average molecular weight measured by a gel permeation chromatograph (GPC) (trade name: HLC-8 02A) manufactured by Tosoh Corporation. <Example 1> (1) Preparation of conductive paste composition (A) 100 parts of Ag powder having a specific surface area of 1.8 m 2 /g as a conductive powder; (B) B i 2 having an average particle diameter of 3 μm Ο 3 - B 2 Ο 3 - S i Ο 2 series of glass raw material mixture (unshaped, softening point 520 °C) 10 parts, as a glass raw material mixture; (C) 2-ethylhexyl methacrylate / methyl 3-hydroxypropyl acrylate/methacrylic acid/succinic acid mono-2-methylpropenyloxyacetate> 60/20/20/20 (% by mass) copolymer (Mw = 5 0,000) 20 parts as a joint Resin; oleic acid 1 part, di-2-ethylhexyl sebacate 1 〇 part, as other optional ingredients; and propylene glycol monomethyl ether i 〇〇 part, as solvent; after kneading with glass bead mill, stainless steel mesh (50 〇 mesh, 25 -28- (25) 1272638 μιη diameter) After filtration, the conductive paste composition was prepared. (2) Alkali-developing type radiation sensitive linear resist composition is prepared by using benzyl methacrylate/methacrylic acid two 75/2 5 (mass-coded copolymer (Mw = 3 0,000) 60 parts as an alkali-soluble resin 40 parts of tripropylene propylene diacrylate, as a polyfunctional monomer (radio component), and 5 parts of 2-benzyl-2-dimethylamino cyano)-1-butanone a polymerization initiator (sensing radiation); using 10 parts of methoxypropyl acetate as a solvent; after kneading, it is filtered by a sputum filter (2 μm diameter), and an alkali-developing radiation-sensitive composition (hereinafter referred to as "Photoresist composition" is prepared. (3) Preparation of Transcription Film The photoresist layer and the conductive resin layer are laminated in this order by the following operations (i) and (ii), and the laminated film is formed on the support film to form an electrode for transcription. film. (i) The photoresist composition was prepared by (2), and coated on a support film formed by coating a PET film having a thickness of 38 μm by a blade to dry the coating film at ° C for 3 minutes to remove the solvent. On the film, a photoresist film of 8 μm is formed. (ii) a conductive paste composition prepared by (1), which is applied onto the photoresist film (i) by a coater to dry the coating film at 1 ° C, and remove the solvent to form a solvent. The conductive layer of thickness 25 is on the photoresist film, and has a laminated film of the photoresist film and the conductive resin layer ':%); the lining of the lining is formed by the sensible film, and the machine is made into a thickness of 100 Å. The blade 5 is divided into a lipid layer to form -29 - (26) 1272638 on a support film to form a transcription film for forming an electrode. (4) The transcription step of the laminated film is on the surface of the glass substrate as in contact with the surface of the conductive resin layer formed of the transcription film for forming an electrode made of (3), and the transcription film is superposed to heat the roller to thermocompress the transcription film. . Here, as the pressure bonding conditions, the surface temperature loot of the heating roller, the drum pressure of 2.5 kg/cm, and the moving speed of the heating roller were 5·5 m/min. Therefore, the transcription film is transcribed to the surface of the glass substrate to be in a sealed state. (5) Exposure step and development step of the photoresist film The photoresist film in the laminate film formed on the glass substrate in the above (4) is sandwiched between the support film by an exposure mask (a strip pattern of 100 μm width and Four-sided 5 cm pattern), i-line (ultraviolet light with a wavelength of 365 nm) was irradiated at 400 mJ/cm2 by an ultra-high pressure mercury lamp. The support film on the photoresist film was peeled off, and then the photoresist film after exposure was subjected to a 0.5% by mass aqueous sodium carbonate solution (3 (TC) as a developing solution by a shower method for 30 seconds to perform a photoresist film. Therefore, the uncured photoresist which is not irradiated with ultraviolet light is removed to form a photoresist pattern. (6) The etching step of the conductive resin layer is continued in the above steps, with 0.5% by mass aqueous sodium carbonate solution (30 °) C) The uranium engraving solution is subjected to a uranium engraving treatment of the conductive resin layer -30-(27) 1272638 by a showering method for 60 seconds. Then, it is subjected to a water washing treatment with ultrapure water, and a drying treatment. A pattern formed by the conductive resin layer remaining portion and the conductive resin layer removing portion. (7) The pattern firing step forms a glass substrate of a conductive resin layer pattern, and is subjected to 5 90 ° C for 30 minutes under atmospheric pressure in a firing furnace. The firing treatment was performed. Therefore, an electrode pattern having a film thickness of 8 μm was formed on the surface of the glass substrate. (8) The impedance ratio of the electrode pattern (four-sided 5 cm pattern) obtained by evaluating the conductivity of the electrode pattern was investigated at four points. Needle measurement, 2 · 9 μ Ω · cm means excellent conductivity of less than 3.0 μΩ · cm. (9) Electrode pattern obtained by evaluation of adhesion of electrode pattern (bar pattern of 1 00 μηι width), affixed according to JIS Ζ 1 522 The adhesion of the cellophane adhesive was evaluated in accordance with the JIS K5 4 00 tape method. As a result, the electrode pattern could not be peeled off, indicating that the adhesiveness was good. <Examples 2 to 4> Examples In the first embodiment, as the conductive powder (A), A g particles having a specific surface area as shown in Table 1 were used, and the same conductivity as in Example 1 was prepared. -31 - (28) 1272638 Modification of the paste composition, formation of electrode transcription The film was produced, the electrode pattern was formed, and the electrode pattern was evaluated. The evaluation results of the electrode pattern are shown in Table 1. <Example 5> In Example 2, (1) modulation of the conductive paste composition was carried out, (2) Further, the preparation of the alkali-developing type radiation-sensitive resist composition is further carried out, and the following pigment-containing pigment paste composition is prepared by (1'). (1') Preparation of a pigment-containing pigment paste composition by average particle diameter 1 μηη Ag 60 parts, as conductive powder; 40 parts of Cu-Fe-Mn composite oxide powder having an average particle diameter of 0.6 μηι, as a coloring pigment; Bi203-B2〇3-Si〇2-based glass material having an average particle diameter of 3 μm Mixture (unshaped, softening point 520 °C) 10 parts, as a glass raw material mixture; (C) 2-ethylhexyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid / succinic acid single 2-methylpropenyloxyethyl ester = 60/20/20/20 (% by mass) 20 parts of copolymer (Mw = 50,000) as a bonding resin; oleic acid 1 part, di-2-ethylhexyl sebacate Part W, as other optional ingredients; and propylene glycol monomethyl ether 1 ,, as a solvent; after kneading in a glass bead mill, after filtering with a stainless steel mesh (500 mesh '25 μM diameter), containing a coloring pigment paste The object is modulated. In the second embodiment, (3) transcription film was produced, and after the same transcriptional film as in Example 2, (Ui) the conductive tree of the transcription film prepared in Example 2 (ii) - 32-(29) 1272638 On the lipid layer, a pigmented pigment paste composition prepared by coating (1) was applied by a blade coater, and the coating film 'removing solvent' was dried at 1 ° C for 5 minutes to form a conductive resin layer having a thickness of 5 μm. On the photoresist film, a laminated film having a photoresist film, a conductive resin layer, and a resin layer containing a coloring pigment is formed on a support film, and a transcription film for forming an electrode of the invention is produced in the same manner as in the second embodiment to form an electrode. Graphics and evaluation of electrode patterns. The evaluation results of the electrode pattern are shown in Table 1. <Comparative Examples 1 to 3> In Example 1, as the conductive powder (A)', A g particles having a specific surface area as shown in Table 1 were used, and the conductive paste composition similar to that of Example 1 was prepared to form an electrode. The preparation of the transcription film, the formation of the electrode pattern, and the evaluation of the electrode pattern were carried out. The evaluation results of the electrode patterns are shown in Table 1. <Comparative Example 4> In Example 5, as the conductive powder (A), Ag particles having a specific surface area as shown in Table 1 were used, and a conductive paste composition similar to that of Example 5 was prepared to form a transcription film for an electrode. The production, 卩彡 $ β g graphics and evaluation of the electrode pattern. The evaluation results of the electrode patterns are shown in Table 1. EFFECTS OF THE INVENTION According to the conductive paste composition of the present invention and the film for forming the electrode g____ 33-(30) 1272638, it is possible to form an electrode pattern having not only excellent conductivity but also good adhesion. The conductive paste composition of the present invention and the opening/forming film for the electrode can be suitably used for electrode formation of an electric hair-emitting display (PDP). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the general components of the conventional p 13 p. Table 1: Glass substrate 2: Glass substrate 3: Partition wall 4: Transparent electrode 5: Bus electrode 6: Address electrode 7 : Phosphor 8 : Dielectric layer 9 : Dielectric layer 1 〇: Protective film - 34-