TW200508629A - Anisotropic conductive connector and wafer inspection device - Google Patents

Anisotropic conductive connector and wafer inspection device

Info

Publication number
TW200508629A
TW200508629A TW093116029A TW93116029A TW200508629A TW 200508629 A TW200508629 A TW 200508629A TW 093116029 A TW093116029 A TW 093116029A TW 93116029 A TW93116029 A TW 93116029A TW 200508629 A TW200508629 A TW 200508629A
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
inspection device
wafer inspection
conductive connector
connecting conduction
Prior art date
Application number
TW093116029A
Other languages
English (en)
Other versions
TWI248519B (en
Inventor
Hisao Igarashi
Kazuo Inoue
Katsumi Sato
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200508629A publication Critical patent/TW200508629A/zh
Application granted granted Critical
Publication of TWI248519B publication Critical patent/TWI248519B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW093116029A 2003-06-09 2004-06-03 Anisotropic conductive connector and wafer inspection device TWI248519B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003163866 2003-06-09

Publications (2)

Publication Number Publication Date
TW200508629A true TW200508629A (en) 2005-03-01
TWI248519B TWI248519B (en) 2006-02-01

Family

ID=33508767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116029A TWI248519B (en) 2003-06-09 2004-06-03 Anisotropic conductive connector and wafer inspection device

Country Status (6)

Country Link
US (1) US7384279B2 (zh)
EP (1) EP1640729A4 (zh)
KR (1) KR100684221B1 (zh)
CN (1) CN1806178A (zh)
TW (1) TWI248519B (zh)
WO (1) WO2004109302A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571613B (zh) * 2005-09-22 2017-02-21 星社股份有限公司 負和正表面膨脹之電性測量用的膨脹感測器

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
EP1640729A4 (en) 2003-06-09 2010-06-16 Jsr Corp ANISOTROPIC CONDUCTIVE CONNECTOR AND WAFER INSPECTION DEVICE
KR100708880B1 (ko) * 2006-12-12 2007-04-18 주식회사 리뷰텍 이방성 전도루버를 이용한 프로브 헤드 유닛
KR100886712B1 (ko) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
JP5081533B2 (ja) * 2007-08-21 2012-11-28 ポリマテック株式会社 異方導電性コネクタおよび異方導電性コネクタの接続構造
KR200449396Y1 (ko) * 2008-02-25 2010-07-07 주식회사 아이에스시테크놀러지 매개기판을 가진 테스트 소켓
CN101576576B (zh) * 2008-05-08 2012-05-30 南茂科技股份有限公司 探针卡组件以及使用于探针卡组件的中介装置
JP5509486B2 (ja) * 2009-03-05 2014-06-04 ポリマテック・ジャパン株式会社 弾性コネクタ及び弾性コネクタの製造方法並びに導通接続具
JP5404220B2 (ja) * 2009-07-09 2014-01-29 株式会社オーディオテクニカ コンデンサマイクロホン
JP5684584B2 (ja) * 2010-04-28 2015-03-11 株式会社アイエスシーＩｓｃ Ｃｏ．， Ｌｔｄ． 電子部品、電子部材の接続方法および回路接続部材
JP2012078222A (ja) * 2010-10-01 2012-04-19 Fujifilm Corp 回路基板接続構造体および回路基板の接続方法
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
KR101204941B1 (ko) * 2012-04-27 2012-11-27 주식회사 아이에스시 전극지지부를 가지는 테스트용 소켓 및 그 테스트용 소켓의 제조방법
JP5880428B2 (ja) * 2012-12-28 2016-03-09 株式会社オートネットワーク技術研究所 カードエッジコネクタ
WO2014129784A1 (ko) * 2013-02-19 2014-08-28 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓
US9435852B1 (en) * 2015-09-23 2016-09-06 GlobalFoundries, Inc. Integrated circuit (IC) test structure with monitor chain and test wires
WO2018021216A1 (ja) * 2016-07-28 2018-02-01 日本電産リード株式会社 検査治具、基板検査装置、及び検査治具の製造方法
KR20190035735A (ko) * 2016-08-08 2019-04-03 세키스이가가쿠 고교가부시키가이샤 도통 검사 장치용 부재 및 도통 검사 장치
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
CN106864181B (zh) * 2017-04-28 2018-11-27 吉林大学 一种基于导电膜的汽车防爆胎预警装置及其控制方法
US10177058B1 (en) * 2018-01-26 2019-01-08 Powertech Technology Inc. Encapsulating composition, semiconductor package and manufacturing method thereof
CN111987548B (zh) * 2019-05-21 2021-09-21 新韩精密电子有限公司 各向异性导电片
JP7226415B2 (ja) * 2020-03-18 2023-02-21 カシオ計算機株式会社 表示装置及び時計

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JP2737647B2 (ja) * 1994-03-10 1998-04-08 カシオ計算機株式会社 異方導電性接着剤およびそれを用いた導電接続構造
JPH1140224A (ja) 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート
JP2000147036A (ja) 1998-11-10 2000-05-26 Murata Mfg Co Ltd 表面電位計
KR100375117B1 (ko) * 1998-12-30 2003-08-19 제이에스알 가부시끼가이샤 위치 결정부를 구비한 이방 도전성 시트_
JP2000207943A (ja) * 1999-01-11 2000-07-28 Sony Corp 異方性導電膜及び異方性導電膜を用いた電気的接続装置
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
JP4240724B2 (ja) * 2000-01-26 2009-03-18 Ｊｓｒ株式会社 異方導電性シートおよびコネクター
EP1195860B1 (en) * 2000-09-25 2004-12-01 JSR Corporation Anisotropically conductive sheet, production process thereof and applied product thereof
JP3906068B2 (ja) * 2000-12-08 2007-04-18 Ｊｓｒ株式会社 異方導電性シート、コネクターおよびウエハ検査装置
AU2002221060A1 (en) * 2000-12-08 2002-06-18 Jsr Corporation Anisotropic conductive sheet and wafer inspection device
JP2002184821A (ja) * 2000-12-12 2002-06-28 Jsr Corp シート状コネクターおよびその製造方法並びにプローブ装置
DE60238824D1 (de) * 2001-02-09 2011-02-17 Jsr Corp "anisotroper leitfähiger verbinder, herstellungsverfahren dafür und sondenglied"
JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
EP1640729A4 (en) 2003-06-09 2010-06-16 Jsr Corp ANISOTROPIC CONDUCTIVE CONNECTOR AND WAFER INSPECTION DEVICE

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571613B (zh) * 2005-09-22 2017-02-21 星社股份有限公司 負和正表面膨脹之電性測量用的膨脹感測器

Also Published As

Publication number Publication date
KR20060014440A (ko) 2006-02-15
US20060154500A1 (en) 2006-07-13
EP1640729A4 (en) 2010-06-16
CN1806178A (zh) 2006-07-19
WO2004109302A1 (ja) 2004-12-16
KR100684221B1 (ko) 2007-02-22
EP1640729A1 (en) 2006-03-29
US7384279B2 (en) 2008-06-10
TWI248519B (en) 2006-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees