AU2002221060A1 - Anisotropic conductive sheet and wafer inspection device - Google Patents

Anisotropic conductive sheet and wafer inspection device

Info

Publication number
AU2002221060A1
AU2002221060A1 AU2002221060A AU2106002A AU2002221060A1 AU 2002221060 A1 AU2002221060 A1 AU 2002221060A1 AU 2002221060 A AU2002221060 A AU 2002221060A AU 2106002 A AU2106002 A AU 2106002A AU 2002221060 A1 AU2002221060 A1 AU 2002221060A1
Authority
AU
Australia
Prior art keywords
inspection device
anisotropic conductive
conductive sheet
wafer inspection
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002221060A
Inventor
Hisao Igarashi
Kazuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of AU2002221060A1 publication Critical patent/AU2002221060A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
AU2002221060A 2000-12-08 2001-12-05 Anisotropic conductive sheet and wafer inspection device Abandoned AU2002221060A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000374561 2000-12-08
JP2000-374561 2000-12-08
PCT/JP2001/010641 WO2002047149A1 (en) 2000-12-08 2001-12-05 Anisotropic conductive sheet and wafer inspection device

Publications (1)

Publication Number Publication Date
AU2002221060A1 true AU2002221060A1 (en) 2002-06-18

Family

ID=18843731

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002221060A Abandoned AU2002221060A1 (en) 2000-12-08 2001-12-05 Anisotropic conductive sheet and wafer inspection device

Country Status (5)

Country Link
US (1) US6870385B2 (en)
KR (1) KR20030078870A (en)
AU (1) AU2002221060A1 (en)
TW (1) TWI282426B (en)
WO (1) WO2002047149A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002065588A1 (en) * 2001-02-09 2002-08-22 Jsr Corporation Anisotropic conductive connector, its manufacture method and probe member
JP3573120B2 (en) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 Anisotropic conductive connector, method of manufacturing the same, and application product thereof
AU2003254853A1 (en) 2002-08-09 2004-02-25 Jsr Corporation Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method
KR100715751B1 (en) * 2002-08-09 2007-05-08 제이에스알 가부시끼가이샤 Anisotropic conductivity connector, probe member, wafer inspecting device, and wafer inspecting method
WO2004015761A1 (en) * 2002-08-09 2004-02-19 Jsr Corporation Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method
KR100741228B1 (en) * 2003-02-18 2007-07-19 제이에스알 가부시끼가이샤 Anisotropic conductive connector and probe member and wafer inspecting device and wafer inspecting method
CN1765032A (en) * 2003-03-26 2006-04-26 Jsr株式会社 Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
CN1806178A (en) * 2003-06-09 2006-07-19 Jsr株式会社 Anisotropic conductive connector and wafer inspection device
CN101882720B (en) * 2003-06-12 2011-11-30 Jsr株式会社 Anisotropc conductive connector device and production method therefor and circuit device inspection device
US7687906B2 (en) * 2006-03-31 2010-03-30 Brother Kogyo Kabushiki Kaisha Connecting structure, method for forming bump, and method for producing device-mounting substrate
JP4518041B2 (en) * 2006-05-19 2010-08-04 エルピーダメモリ株式会社 Probe card
KR100886712B1 (en) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 Semiconductor package and method of manufacturing the same
WO2014034102A1 (en) * 2012-09-03 2014-03-06 シャープ株式会社 Display device and method for producing same
CN104701206A (en) * 2015-03-02 2015-06-10 上海华岭集成电路技术股份有限公司 Three-dimensional packaging chip silicon through hole testing device
JP2018073577A (en) * 2016-10-27 2018-05-10 株式会社エンプラス Anisotropic conductive sheet and method of producing the same
US10707551B1 (en) 2019-02-25 2020-07-07 Nanning Fugui Precision Industrial Co., Ltd. Wireless router and wireless device
JP7226415B2 (en) * 2020-03-18 2023-02-21 カシオ計算機株式会社 display device and clock

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2908747B2 (en) * 1996-01-10 1999-06-21 三菱電機株式会社 IC socket
JPH09223860A (en) 1996-02-16 1997-08-26 Japan Synthetic Rubber Co Ltd Circuit board device for inspection
US6103359A (en) * 1996-05-22 2000-08-15 Jsr Corporation Process and apparatus for manufacturing an anisotropic conductor sheet and a magnetic mold piece for the same
JPH1140224A (en) * 1997-07-11 1999-02-12 Jsr Corp Anisotropic conductive sheet
US6172878B1 (en) * 1997-12-27 2001-01-09 Canon Kabushiki Kaisha Multi-element module and production process thereof
JP3557887B2 (en) * 1998-01-14 2004-08-25 日立ハイテク電子エンジニアリング株式会社 Contact device for IC device
JP3737899B2 (en) * 1999-01-29 2006-01-25 日東電工株式会社 Semiconductor element inspection method and anisotropic conductive film therefor
JP4379949B2 (en) * 1999-05-13 2009-12-09 Ｊｓｒ株式会社 Anisotropic conductive sheet, method for manufacturing the same, electrical inspection apparatus for circuit device, and electrical inspection method
JP2000331538A (en) * 1999-05-17 2000-11-30 Nitto Denko Corp Anisotropic conductive film and manufacture thereof
JP3714030B2 (en) * 1999-05-26 2005-11-09 松下電器産業株式会社 Elevating storage device
JP4085518B2 (en) 1999-05-27 2008-05-14 Ｊｓｒ株式会社 Mold and manufacturing method thereof, mold for mold manufacturing and method for manufacturing anisotropic conductive sheet
TW561266B (en) 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
JP2001343433A (en) * 2000-03-28 2001-12-14 Toshiba Corp Semiconductor testing apparatus
ATE284083T1 (en) * 2000-09-25 2004-12-15 Jsr Corp ANISOTROPIC CONDUCTIVE CONNECTION SHEET, METHOD OF PRODUCTION THEREOF AND PRODUCT THEREOF
JP4522604B2 (en) * 2001-03-19 2010-08-11 日東電工株式会社 Anisotropic conductive film

Also Published As

Publication number Publication date
TWI282426B (en) 2007-06-11
WO2002047149A1 (en) 2002-06-13
KR20030078870A (en) 2003-10-08
US20040028893A1 (en) 2004-02-12
US6870385B2 (en) 2005-03-22

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