AU2001248851A1 - Semiconductor device inspection system - Google Patents
Semiconductor device inspection systemInfo
- Publication number
- AU2001248851A1 AU2001248851A1 AU2001248851A AU4885101A AU2001248851A1 AU 2001248851 A1 AU2001248851 A1 AU 2001248851A1 AU 2001248851 A AU2001248851 A AU 2001248851A AU 4885101 A AU4885101 A AU 4885101A AU 2001248851 A1 AU2001248851 A1 AU 2001248851A1
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- inspection system
- device inspection
- semiconductor
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/888—Marking defects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-124875 | 2000-04-25 | ||
| JP2000124875 | 2000-04-25 | ||
| PCT/JP2001/003525 WO2001082364A1 (en) | 2000-04-25 | 2001-04-24 | Semiconductor device inspection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001248851A1 true AU2001248851A1 (en) | 2001-11-07 |
Family
ID=18634934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001248851A Abandoned AU2001248851A1 (en) | 2000-04-25 | 2001-04-24 | Semiconductor device inspection system |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6969620B2 (en) |
| EP (1) | EP1290726A4 (en) |
| JP (1) | JP2003535460A (en) |
| KR (1) | KR100779922B1 (en) |
| CN (1) | CN1211851C (en) |
| AU (1) | AU2001248851A1 (en) |
| TW (1) | TW586170B (en) |
| WO (1) | WO2001082364A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9037280B2 (en) * | 2005-06-06 | 2015-05-19 | Kla-Tencor Technologies Corp. | Computer-implemented methods for performing one or more defect-related functions |
| CN100403508C (en) * | 2005-06-29 | 2008-07-16 | 联华电子股份有限公司 | Defect detection component and detecting and producing method thereof |
| JP5581835B2 (en) * | 2010-06-15 | 2014-09-03 | セイコーエプソン株式会社 | Semiconductor device inspection method and semiconductor device inspection system |
| CN103886113A (en) * | 2014-04-04 | 2014-06-25 | 东莞铭丰集团有限公司 | Method and device for collecting and processing data of wafers in wafer boxes |
| CN104949996A (en) * | 2015-06-29 | 2015-09-30 | 广东溢达纺织有限公司 | Non-stop method and system for automatically identifying defects of textile fabrics |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0480939A (en) | 1990-07-24 | 1992-03-13 | Hitachi Ltd | Manufacture of semiconductor integrated circuit device |
| US5219765A (en) | 1990-09-12 | 1993-06-15 | Hitachi, Ltd. | Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process |
| JPH07176575A (en) * | 1993-12-21 | 1995-07-14 | Fujitsu Ltd | Method and apparatus for testing semiconductor device |
| JPH07302819A (en) | 1994-04-28 | 1995-11-14 | Kokusai Electric Co Ltd | Inspection method for semiconductor element |
| JP2755195B2 (en) | 1994-12-08 | 1998-05-20 | 日本電気株式会社 | Semiconductor device manufacturing method and device |
| JPH10173021A (en) * | 1996-12-12 | 1998-06-26 | Mitsubishi Electric Corp | Method and apparatus for analyzing manufacturing line |
| KR100216066B1 (en) * | 1997-05-20 | 1999-08-16 | 윤종용 | Control system and control method for ic test process |
| US6408219B2 (en) | 1998-05-11 | 2002-06-18 | Applied Materials, Inc. | FAB yield enhancement system |
| JPH11330184A (en) | 1998-05-13 | 1999-11-30 | Mitsubishi Electric Corp | Wafer testing method |
| WO2000014790A1 (en) | 1998-09-03 | 2000-03-16 | Hitachi, Ltd. | Inspection system and method for producing electronic device by using the same |
-
2001
- 2001-04-24 CN CNB018084877A patent/CN1211851C/en not_active Expired - Lifetime
- 2001-04-24 JP JP2001579355A patent/JP2003535460A/en active Pending
- 2001-04-24 EP EP01922058A patent/EP1290726A4/en not_active Ceased
- 2001-04-24 TW TW090109786A patent/TW586170B/en not_active IP Right Cessation
- 2001-04-24 US US10/258,444 patent/US6969620B2/en not_active Expired - Fee Related
- 2001-04-24 AU AU2001248851A patent/AU2001248851A1/en not_active Abandoned
- 2001-04-24 WO PCT/JP2001/003525 patent/WO2001082364A1/en active Application Filing
- 2001-04-24 KR KR1020027014268A patent/KR100779922B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20030155280A1 (en) | 2003-08-21 |
| WO2001082364A1 (en) | 2001-11-01 |
| CN1434981A (en) | 2003-08-06 |
| KR100779922B1 (en) | 2007-11-28 |
| KR20020088001A (en) | 2002-11-23 |
| TW586170B (en) | 2004-05-01 |
| EP1290726A4 (en) | 2005-04-13 |
| CN1211851C (en) | 2005-07-20 |
| EP1290726A1 (en) | 2003-03-12 |
| US6969620B2 (en) | 2005-11-29 |
| JP2003535460A (en) | 2003-11-25 |
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