TW200507038A - Apparatus for treating substrate and method of treating substrate - Google Patents
Apparatus for treating substrate and method of treating substrateInfo
- Publication number
- TW200507038A TW200507038A TW093120984A TW93120984A TW200507038A TW 200507038 A TW200507038 A TW 200507038A TW 093120984 A TW093120984 A TW 093120984A TW 93120984 A TW93120984 A TW 93120984A TW 200507038 A TW200507038 A TW 200507038A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- treating substrate
- treating liquid
- erected state
- conveying
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/54—Arrangements for reducing warping-twist
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003199087 | 2003-07-18 | ||
JP2004191134A JP4421956B2 (ja) | 2003-07-18 | 2004-06-29 | 基板の処理装置及び処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200507038A true TW200507038A (en) | 2005-02-16 |
TWI347629B TWI347629B (en) | 2011-08-21 |
Family
ID=34379735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093120984A TWI347629B (en) | 2003-07-18 | 2004-07-14 | Apparatus for treating substrates and method of treating substrates |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4421956B2 (zh) |
KR (1) | KR101055247B1 (zh) |
CN (1) | CN100419501C (zh) |
TW (1) | TWI347629B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI402900B (zh) * | 2005-04-20 | 2013-07-21 | Shibaura Mechatronics Corp | 基板之處理裝置及處理方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4557872B2 (ja) * | 2005-11-28 | 2010-10-06 | 株式会社日立ハイテクノロジーズ | 基板処理装置、基板処理方法、及び基板の製造方法 |
TWI319213B (en) * | 2005-11-28 | 2010-01-01 | Hitachi High Tech Corp | A substrate processing device, a substrate processing method and a production method for a substrate |
JP4685618B2 (ja) * | 2005-12-13 | 2011-05-18 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
KR100835745B1 (ko) * | 2006-12-29 | 2008-06-09 | 최찬규 | 하향식 유리 박형화 방법 |
JP2008277556A (ja) * | 2007-04-27 | 2008-11-13 | Shibaura Mechatronics Corp | 基板の処理装置 |
JP4575932B2 (ja) * | 2007-05-29 | 2010-11-04 | 化研テック株式会社 | パレット洗浄装置およびパレット洗浄方法 |
KR100865475B1 (ko) * | 2007-08-30 | 2008-10-27 | 세메스 주식회사 | 노즐 어셈블리, 이를 갖는 처리액 공급 장치 및 이를이용하는 처리액 공급 방법 |
JP5362623B2 (ja) * | 2010-03-03 | 2013-12-11 | 大日本スクリーン製造株式会社 | 基板処理装置 |
DE102010013909A1 (de) * | 2010-04-01 | 2011-10-06 | Lp Vermarktungs Gmbh & Co. Kg | Vorrichtung und Verfahren zum Besprühen einer Oberfläche eines Substrates |
CN102094199A (zh) * | 2010-11-23 | 2011-06-15 | 黄佳佳 | 一种电子软标签的蚀刻设备 |
US8458842B2 (en) * | 2011-05-10 | 2013-06-11 | Nanya Technology Corp. | Post-CMP wafer cleaning apparatus |
KR101342616B1 (ko) * | 2013-04-26 | 2013-12-20 | 창성 주식회사 | 수직형 기판 박리 시스템 |
KR102223764B1 (ko) * | 2013-12-27 | 2021-03-05 | 세메스 주식회사 | 기판처리장치 및 방법 |
CN105158829B (zh) * | 2015-07-30 | 2019-06-04 | 京东方科技集团股份有限公司 | 基板、彩色滤光片模组、形成基板模组的方法和显示装置 |
JP6667241B2 (ja) * | 2015-09-28 | 2020-03-18 | 株式会社Screenホールディングス | 処理液供給装置、基板処理システムおよび処理液供給方法 |
CN106992136B (zh) * | 2017-04-20 | 2020-04-07 | 武汉华星光电技术有限公司 | 湿法蚀刻设备及湿法蚀刻方法 |
KR102433317B1 (ko) * | 2017-10-11 | 2022-08-17 | 삼성디스플레이 주식회사 | 습식 식각 장치 |
CN111006262A (zh) * | 2019-12-31 | 2020-04-14 | 美埃(中国)环境净化有限公司 | 一种水洗型除油烟净化装置及其水洗控制方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10118583A (ja) | 1996-10-24 | 1998-05-12 | Nippon Electric Glass Co Ltd | 板状物の洗浄装置 |
JP3550277B2 (ja) * | 1997-07-24 | 2004-08-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100343044B1 (ko) * | 1997-08-28 | 2002-10-25 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치및처리방법 |
JP3556110B2 (ja) * | 1998-12-22 | 2004-08-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2001343632A (ja) * | 2000-06-02 | 2001-12-14 | Sharp Corp | 液晶表示素子の製造方法 |
JP3622842B2 (ja) * | 2000-12-11 | 2005-02-23 | 住友精密工業株式会社 | 搬送式基板処理装置 |
JPWO2002049087A1 (ja) * | 2000-12-12 | 2004-04-15 | 住友精密工業株式会社 | 揺動シャワー型搬送式基板処理装置 |
JP4180250B2 (ja) * | 2001-05-30 | 2008-11-12 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
2004
- 2004-06-29 JP JP2004191134A patent/JP4421956B2/ja not_active Expired - Fee Related
- 2004-07-14 TW TW093120984A patent/TWI347629B/zh not_active IP Right Cessation
- 2004-07-16 CN CNB2004100640625A patent/CN100419501C/zh not_active Expired - Fee Related
- 2004-07-16 KR KR1020040055566A patent/KR101055247B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI402900B (zh) * | 2005-04-20 | 2013-07-21 | Shibaura Mechatronics Corp | 基板之處理裝置及處理方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI347629B (en) | 2011-08-21 |
KR20050009695A (ko) | 2005-01-25 |
KR101055247B1 (ko) | 2011-08-08 |
JP2005052825A (ja) | 2005-03-03 |
CN1576961A (zh) | 2005-02-09 |
JP4421956B2 (ja) | 2010-02-24 |
CN100419501C (zh) | 2008-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200507038A (en) | Apparatus for treating substrate and method of treating substrate | |
IL206426A0 (en) | Method and device for treating silicon wafers | |
TW200629393A (en) | Substrate treating device | |
KR101408757B1 (ko) | 기판의 처리 장치 | |
TW200724247A (en) | Substrate processing apparatus and substrate processing method | |
KR880001190A (ko) | 집적회로 패케이지 리이드들의 납땜마무리 방법 및 그 장치 | |
KR20090020171A (ko) | 기판 세정용 이류체 분사 노즐 | |
TW200746255A (en) | Substrate processing apparatus | |
TW200501231A (en) | Method and apparatus for etching a substrate | |
JP4909611B2 (ja) | 基板の洗浄処理装置及び洗浄処理方法 | |
TW200631085A (en) | Apparatus for treating substrates | |
TWI431676B (zh) | Substrate processing device and processing method thereof | |
KR20140042782A (ko) | 복련 노즐 및 당해 복련 노즐을 구비하는 기판 처리 장치 | |
KR102018271B1 (ko) | 균일한 에칭 환경 조성을 위한 에칭 장치 | |
TW200709863A (en) | Nozzle for supplying treatment liquid and substrate treating apparatus | |
KR20040110391A (ko) | 기판 처리 장치 | |
WO2012090815A1 (ja) | レジスト除去装置及びレジスト除去方法 | |
KR20170033563A (ko) | 기판 처리 장치 | |
TWI601191B (zh) | 溼式製程設備 | |
CN107879615A (zh) | 折断分离方法及折断分离装置 | |
JP2015223136A (ja) | 水耕パネルの洗浄装置および方法 | |
TWI809115B (zh) | 物品處理程序及執行程序之設備 | |
KR100562724B1 (ko) | 화면표시장치용 글라스의 배면 식각장치 | |
KR20080062350A (ko) | 기판 세정 장비 | |
KR100834194B1 (ko) | 기판 공정용 렘젯 노즐 및 이를 장착한 기판 공정용 기기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |