TW200504898A - Semiconductor device and radiation ray detecting device using the same - Google Patents
Semiconductor device and radiation ray detecting device using the sameInfo
- Publication number
- TW200504898A TW200504898A TW093105034A TW93105034A TW200504898A TW 200504898 A TW200504898 A TW 200504898A TW 093105034 A TW093105034 A TW 093105034A TW 93105034 A TW93105034 A TW 93105034A TW 200504898 A TW200504898 A TW 200504898A
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- ray detecting
- radiation ray
- semiconductor element
- wiring substrate
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 230000005855 radiation Effects 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 238000003491 array Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
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- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Medical Informatics (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Animal Behavior & Ethology (AREA)
- Surgery (AREA)
- Heart & Thoracic Surgery (AREA)
- Biomedical Technology (AREA)
- Radiology & Medical Imaging (AREA)
- Pathology (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003051493A JP3935091B2 (ja) | 2003-02-27 | 2003-02-27 | 半導体装置、及びそれを用いた放射線検出器 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200504898A true TW200504898A (en) | 2005-02-01 |
Family
ID=32923367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093105034A TW200504898A (en) | 2003-02-27 | 2004-02-27 | Semiconductor device and radiation ray detecting device using the same |
Country Status (9)
Country | Link |
---|---|
US (1) | US7663113B2 (zh) |
EP (1) | EP1598863B1 (zh) |
JP (1) | JP3935091B2 (zh) |
KR (1) | KR20060022636A (zh) |
CN (1) | CN100407389C (zh) |
DE (1) | DE602004028707D1 (zh) |
IL (1) | IL170458A (zh) |
TW (1) | TW200504898A (zh) |
WO (1) | WO2004077549A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9508763B2 (en) | 2011-09-28 | 2016-11-29 | Hamamatsu Photonics K.K. | Radiation detector |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4421209B2 (ja) * | 2003-04-11 | 2010-02-24 | 浜松ホトニクス株式会社 | 放射線検出器 |
KR20060131327A (ko) | 2005-06-16 | 2006-12-20 | 엘지전자 주식회사 | 발광 다이오드의 제조 방법 |
TWI311438B (en) * | 2006-08-28 | 2009-06-21 | Advanced Semiconductor Eng | Image sensor module |
JP2008258258A (ja) * | 2007-04-02 | 2008-10-23 | Sanyo Electric Co Ltd | 半導体装置 |
US8071953B2 (en) * | 2008-04-29 | 2011-12-06 | Redlen Technologies, Inc. | ACF attachment for radiation detector |
GB0821158D0 (en) | 2008-11-20 | 2008-12-24 | Durham Scient Crystals Ltd | Semiconductor device connection |
US8575558B2 (en) * | 2010-11-30 | 2013-11-05 | General Electric Company | Detector array with a through-via interposer |
US9917118B2 (en) * | 2011-09-09 | 2018-03-13 | Zecotek Imaging Systems Pte. Ltd. | Photodetector array and method of manufacture |
TWI482240B (zh) * | 2011-12-19 | 2015-04-21 | Nat Univ Tsing Hua | 半導體之貫孔內連接線的製造方法 |
EP2772939B1 (en) | 2013-03-01 | 2016-10-19 | Ams Ag | Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation |
JP6565238B2 (ja) * | 2015-03-17 | 2019-08-28 | セイコーエプソン株式会社 | 液体噴射ヘッド |
JP6747487B2 (ja) * | 2018-10-26 | 2020-08-26 | 大日本印刷株式会社 | 放射線検出装置 |
ES2757984B2 (es) | 2018-10-31 | 2021-02-16 | Univ Valencia Politecnica | Dispositivo para la deteccion de rayos gamma con tabiques activos |
CN112888161B (zh) * | 2020-12-31 | 2023-01-17 | 中国建筑材料科学研究总院有限公司 | 陶瓷单模块、阵列式过孔陶瓷基板及其制造方法和应用 |
Family Cites Families (22)
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US5043582A (en) * | 1985-12-11 | 1991-08-27 | General Imagining Corporation | X-ray imaging system and solid state detector therefor |
SG49842A1 (en) | 1988-11-09 | 1998-06-15 | Nitto Denko Corp | Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor |
JP2555720B2 (ja) | 1988-12-19 | 1996-11-20 | 富士通株式会社 | 半田バンプ部品の実装方法 |
JPH0758013B2 (ja) | 1989-07-19 | 1995-06-21 | 日立造船株式会社 | 煙突解体装置 |
JPH0351477U (zh) * | 1989-09-26 | 1991-05-20 | ||
JPH03203341A (ja) | 1989-12-29 | 1991-09-05 | Hoya Corp | 微小電極を有する基板およびその製造方法 |
US5245191A (en) * | 1992-04-14 | 1993-09-14 | The Board Of Regents Of The University Of Arizona | Semiconductor sensor for gamma-ray tomographic imaging system |
JPH1020042A (ja) * | 1996-06-28 | 1998-01-23 | Shimadzu Corp | X線ct用固体検出器 |
JPH1056040A (ja) * | 1996-08-08 | 1998-02-24 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3272993B2 (ja) | 1997-09-12 | 2002-04-08 | 日本特殊陶業株式会社 | 中継基板、その製造方法、及びその接続方法 |
JPH11121648A (ja) * | 1997-10-20 | 1999-04-30 | Fuji Xerox Co Ltd | 電子部品実装体およびこれを構成する基板 |
JP3236812B2 (ja) * | 1998-02-19 | 2001-12-10 | 京セラ株式会社 | 多層配線基板 |
US6703617B1 (en) * | 1999-04-26 | 2004-03-09 | Simage Oy | Device for imaging radiation |
JP2001053111A (ja) | 1999-08-10 | 2001-02-23 | Matsushita Electric Works Ltd | フリップチップ実装構造 |
JP2001330677A (ja) | 2000-05-24 | 2001-11-30 | Canon Inc | 放射線検出装置 |
GB2364791B (en) | 2000-07-14 | 2004-12-29 | Evan Arkas | Optical channel plates |
JP2002148342A (ja) * | 2000-11-07 | 2002-05-22 | Canon Inc | 放射線撮像装置 |
JP2003017676A (ja) * | 2001-04-27 | 2003-01-17 | Canon Inc | 放射線撮像装置およびそれを用いた放射線撮像システム |
JP4237966B2 (ja) | 2002-03-08 | 2009-03-11 | 浜松ホトニクス株式会社 | 検出器 |
DE10244177A1 (de) * | 2002-09-23 | 2004-04-08 | Siemens Ag | Bilddetektor für Röntgeneinrichtungen mit rückseitig kontaktierten, organischen Bild-Sensoren |
JP4364514B2 (ja) | 2003-01-08 | 2009-11-18 | 浜松ホトニクス株式会社 | 配線基板、及びそれを用いた放射線検出器 |
JP4365108B2 (ja) | 2003-01-08 | 2009-11-18 | 浜松ホトニクス株式会社 | 配線基板、及びそれを用いた放射線検出器 |
-
2003
- 2003-02-27 JP JP2003051493A patent/JP3935091B2/ja not_active Expired - Fee Related
-
2004
- 2004-02-26 KR KR1020057012528A patent/KR20060022636A/ko not_active Application Discontinuation
- 2004-02-26 US US10/546,698 patent/US7663113B2/en not_active Expired - Fee Related
- 2004-02-26 CN CN2004800038573A patent/CN100407389C/zh not_active Expired - Fee Related
- 2004-02-26 DE DE602004028707T patent/DE602004028707D1/de not_active Expired - Lifetime
- 2004-02-26 EP EP04714921A patent/EP1598863B1/en not_active Expired - Fee Related
- 2004-02-26 WO PCT/JP2004/002291 patent/WO2004077549A1/ja active Application Filing
- 2004-02-27 TW TW093105034A patent/TW200504898A/zh unknown
-
2005
- 2005-08-23 IL IL170458A patent/IL170458A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9508763B2 (en) | 2011-09-28 | 2016-11-29 | Hamamatsu Photonics K.K. | Radiation detector |
Also Published As
Publication number | Publication date |
---|---|
EP1598863B1 (en) | 2010-08-18 |
JP3935091B2 (ja) | 2007-06-20 |
EP1598863A1 (en) | 2005-11-23 |
US7663113B2 (en) | 2010-02-16 |
US20070075408A1 (en) | 2007-04-05 |
DE602004028707D1 (de) | 2010-09-30 |
EP1598863A4 (en) | 2006-12-13 |
CN100407389C (zh) | 2008-07-30 |
JP2004265959A (ja) | 2004-09-24 |
IL170458A (en) | 2011-02-28 |
CN1748300A (zh) | 2006-03-15 |
KR20060022636A (ko) | 2006-03-10 |
WO2004077549A1 (ja) | 2004-09-10 |
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