TW200425213A - Device, method of manufacturing the same, electro-optic device, and electronic equipment - Google Patents

Device, method of manufacturing the same, electro-optic device, and electronic equipment Download PDF

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Publication number
TW200425213A
TW200425213A TW093108161A TW93108161A TW200425213A TW 200425213 A TW200425213 A TW 200425213A TW 093108161 A TW093108161 A TW 093108161A TW 93108161 A TW93108161 A TW 93108161A TW 200425213 A TW200425213 A TW 200425213A
Authority
TW
Taiwan
Prior art keywords
substrate
conductive film
wiring
film
liquid
Prior art date
Application number
TW093108161A
Other languages
English (en)
Chinese (zh)
Other versions
TWI293470B (fr
Inventor
Toshimitsu Hirai
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200425213A publication Critical patent/TW200425213A/zh
Application granted granted Critical
Publication of TWI293470B publication Critical patent/TWI293470B/zh

Links

Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04CSTRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/02Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
    • E04C2/10Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products
    • E04C2/24Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products laminated and composed of materials covered by two or more of groups E04C2/12, E04C2/16, E04C2/20
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804Next to metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Liquid Crystal (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
TW093108161A 2003-03-26 2004-03-25 Device, method of manufacturing the same, electro-optic device, and electronic equipment TW200425213A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003085539 2003-03-26
JP2004035081A JP2004311957A (ja) 2003-03-26 2004-02-12 デバイスとその製造方法及び電気光学装置並びに電子機器

Publications (2)

Publication Number Publication Date
TW200425213A true TW200425213A (en) 2004-11-16
TWI293470B TWI293470B (fr) 2008-02-11

Family

ID=33478303

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108161A TW200425213A (en) 2003-03-26 2004-03-25 Device, method of manufacturing the same, electro-optic device, and electronic equipment

Country Status (5)

Country Link
US (1) US7326460B2 (fr)
JP (1) JP2004311957A (fr)
KR (1) KR100636257B1 (fr)
CN (1) CN100569515C (fr)
TW (1) TW200425213A (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4297106B2 (ja) * 2005-02-23 2009-07-15 セイコーエプソン株式会社 膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器
JP2006239629A (ja) * 2005-03-04 2006-09-14 Pioneer Electronic Corp 塗布液被塗布材の製造方法、被塗布材
US7554112B1 (en) * 2005-03-10 2009-06-30 E. I. Du Pont De Nemours And Company Organic electronic device and processes for forming and using the same
JP2006278213A (ja) 2005-03-30 2006-10-12 Seiko Epson Corp 電子デバイス用基板、電子デバイス、電子デバイスの製造方法および電子機器
JP4670596B2 (ja) * 2005-11-04 2011-04-13 セイコーエプソン株式会社 膜パターン形成方法、デバイス、電気光学装置、及び電子機器
JP4331167B2 (ja) * 2006-01-19 2009-09-16 株式会社フューチャービジョン パターン形成方法及びその装置
JP2007225644A (ja) * 2006-02-21 2007-09-06 Epson Imaging Devices Corp 電気光学装置の製造方法、電気光学装置、及び電子機器
JP2008010353A (ja) * 2006-06-30 2008-01-17 Seiko Epson Corp マスクの製造方法、配線パターンの製造方法、及びプラズマディスプレイの製造方法
JP5105792B2 (ja) * 2006-08-03 2012-12-26 キヤノン株式会社 機能性膜の製造方法
JP4508277B2 (ja) * 2007-11-20 2010-07-21 セイコーエプソン株式会社 セラミック多層基板の製造方法
JP4968276B2 (ja) * 2009-02-24 2012-07-04 ソニー株式会社 表示装置およびその製造方法
TWI495121B (zh) * 2010-07-09 2015-08-01 Sakamoto Jun A panel, a panel manufacturing method, a solar cell module, a printing apparatus, and a printing method
DE102013210138A1 (de) * 2013-05-30 2014-12-04 Boehringer Ingelheim Vetmedica Gmbh Verfahren zum Erzeugen einer Vielzahl von Messbereichen auf einem Chip sowie Chip mit Messbereichen
CN104199219B (zh) * 2014-06-10 2018-06-19 康惠(惠州)半导体有限公司 一种va液晶显示屏的制作方法
KR20180088722A (ko) 2015-12-02 2018-08-06 베링거잉겔하임베트메디카게엠베하 칩 상에 다수의 측정 영역들을 제조하는 방법 및 다수의 측정 영역들을 갖는 칩
TWI763772B (zh) * 2017-01-30 2022-05-11 德商麥克專利有限公司 電子裝置之有機元件的形成方法
JP2020110780A (ja) * 2019-01-16 2020-07-27 東レエンジニアリング株式会社 インクジェット塗布方法及びインクジェット塗布装置

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US4049844A (en) * 1974-09-27 1977-09-20 General Electric Company Method for making a circuit board and article made thereby
US4317750A (en) * 1980-08-22 1982-03-02 Ferro Corporation Thick film conductor employing nickel oxide
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US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
US4670351A (en) * 1986-02-12 1987-06-02 General Electric Company Flexible printed circuits, prepared by augmentation replacement process
US4853252A (en) * 1986-12-17 1989-08-01 Siemens Aktiengesellschaft Method and coating material for applying electrically conductive printed patterns to insulating substrates
US5079600A (en) * 1987-03-06 1992-01-07 Schnur Joel M High resolution patterning on solid substrates
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
US4912014A (en) * 1988-10-17 1990-03-27 The Mead Corporation Imaging sheet having an open porous matrix containing a photohardenable composition, and a method for use of such a sheet
US5468597A (en) * 1993-08-25 1995-11-21 Shipley Company, L.L.C. Selective metallization process
JPH0992949A (ja) 1995-09-28 1997-04-04 Matsushita Electric Ind Co Ltd フレキシブル配線板
JPH09199816A (ja) 1996-01-16 1997-07-31 Sumitomo Wiring Syst Ltd フレキシブルプリント基板およびその製造方法
US6709806B2 (en) * 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
JP3646784B2 (ja) * 2000-03-31 2005-05-11 セイコーエプソン株式会社 薄膜パタ−ンの製造方法および微細構造体
JP4788852B2 (ja) 2000-07-25 2011-10-05 住友金属鉱山株式会社 透明導電性基材とその製造方法およびこの製造方法に用いられる透明コート層形成用塗布液と透明導電性基材が適用された表示装置
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Also Published As

Publication number Publication date
KR20040084717A (ko) 2004-10-06
CN100569515C (zh) 2009-12-16
JP2004311957A (ja) 2004-11-04
CN1532053A (zh) 2004-09-29
US20040247797A1 (en) 2004-12-09
TWI293470B (fr) 2008-02-11
US7326460B2 (en) 2008-02-05
KR100636257B1 (ko) 2006-10-19

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