TW200419772A - High frequency equipment - Google Patents

High frequency equipment

Info

Publication number
TW200419772A
TW200419772A TW093101715A TW93101715A TW200419772A TW 200419772 A TW200419772 A TW 200419772A TW 093101715 A TW093101715 A TW 093101715A TW 93101715 A TW93101715 A TW 93101715A TW 200419772 A TW200419772 A TW 200419772A
Authority
TW
Taiwan
Prior art keywords
radio frequency
circuit board
side wall
top plate
high frequency
Prior art date
Application number
TW093101715A
Other languages
English (en)
Other versions
TWI242878B (en
Inventor
Kouki Yamamoto
Noriyuki Yoshikawa
Kazuhiko Ohashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200419772A publication Critical patent/TW200419772A/zh
Application granted granted Critical
Publication of TWI242878B publication Critical patent/TWI242878B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
TW093101715A 2003-01-28 2004-01-27 High frequency equipment TWI242878B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003018266A JP2004235184A (ja) 2003-01-28 2003-01-28 高周波装置

Publications (2)

Publication Number Publication Date
TW200419772A true TW200419772A (en) 2004-10-01
TWI242878B TWI242878B (en) 2005-11-01

Family

ID=32820578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093101715A TWI242878B (en) 2003-01-28 2004-01-27 High frequency equipment

Country Status (4)

Country Link
US (1) US7190982B2 (zh)
JP (1) JP2004235184A (zh)
CN (1) CN1332591C (zh)
TW (1) TWI242878B (zh)

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* Cited by examiner, † Cited by third party
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US20050184680A1 (en) * 2004-02-23 2005-08-25 Thomas J. Mayer Methods and apparatus for constructing a power supply capable drawing power from fluorescent lamps
DE102005004158B4 (de) * 2005-01-28 2006-11-30 Siemens Ag Anordnung für die Schirmung von Sockel-Platinen mit einem Schirmblech
US20060206375A1 (en) * 2005-03-11 2006-09-14 Light Rhythms, Llc System and method for targeted advertising and promotions based on previous event participation
US20060206431A1 (en) * 2005-03-11 2006-09-14 Light Rhythms, Llc System and method allowing the purchase of multimedia content from a portable device previously dispensed in connection with an entertainment event
KR100651358B1 (ko) * 2005-06-22 2006-11-29 삼성전기주식회사 Ｒｆ모듈의 전력단 회로를 내장한 인쇄회로기판
US7646092B2 (en) 2005-12-06 2010-01-12 Yamaha Corporation Semiconductor device and manufacturing method thereof
JP4784289B2 (ja) * 2005-12-06 2011-10-05 ヤマハ株式会社 半導体装置の製造方法
JP3969453B1 (ja) * 2006-05-17 2007-09-05 株式会社村田製作所 ケース付き多層モジュール
JP4020149B1 (ja) * 2006-06-19 2007-12-12 株式会社村田製作所 電子部品モジュール
JP4984912B2 (ja) * 2007-01-24 2012-07-25 ミツミ電機株式会社 高周波用チューナモジュール
JP4978639B2 (ja) * 2009-02-18 2012-07-18 ブラザー工業株式会社 プリント基板及び無線通信端末
JP5118713B2 (ja) * 2010-02-25 2013-01-16 シャープ株式会社 回路モジュールおよびそれを備えた電子機器ならびに回路モジュールの製造方法
CA2704683A1 (en) * 2010-05-28 2010-08-12 Ibm Canada Limited - Ibm Canada Limitee Grounded lid for micro-electronic assemblies
KR20120004777A (ko) * 2010-07-07 2012-01-13 삼성전기주식회사 전자 부품 모듈 및 이의 제조방법
US9521740B2 (en) * 2013-10-22 2016-12-13 Avermedia Technologies, Inc. Electronic device and manufacturing method thereof

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US53070A (en) * 1866-03-06 Improvement in horse hay-forks
US2278094A (en) * 1940-03-07 1942-03-31 Colonial Radio Corp Radio receiving apparatus
US4740794A (en) * 1986-01-03 1988-04-26 Motorola, Inc. Connectorless antenna coupler
JPH0365295A (ja) 1989-08-03 1991-03-20 Kankyo Kogaku Kenkyusho:Kk 排水処理用ろ材
JPH07263892A (ja) 1994-03-18 1995-10-13 Sony Corp ケース付き電子部品
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JP3578366B2 (ja) 1995-10-17 2004-10-20 株式会社ルネサステクノロジ 混成集積回路装置
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JP3698305B2 (ja) 2000-09-07 2005-09-21 シャープ株式会社 高周波モジュールおよびその製造方法
JP2002170894A (ja) 2000-11-30 2002-06-14 Matsushita Electric Ind Co Ltd 積層型電子部品
JP2002185256A (ja) 2000-12-19 2002-06-28 Nippon Dempa Kogyo Co Ltd 表面実装型の水晶発振器
US6825411B2 (en) * 2001-06-15 2004-11-30 Hewlett-Packard Development Company, L.P. Method and apparatus for controlling electromagnetic radiation emissions from electronic device enclosures
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JP2004022711A (ja) 2002-06-14 2004-01-22 Ngk Spark Plug Co Ltd シールドキャップ付電子部品
JP2004031787A (ja) 2002-06-27 2004-01-29 Toyo Commun Equip Co Ltd 表面実装型電子デバイス
JP2004031744A (ja) 2002-06-27 2004-01-29 Kyocera Corp 電子部品装置
US20060052064A1 (en) * 2004-09-08 2006-03-09 A.G. Findings & Mfg. Co., Inc. Carrying case for cell phone or other device with protective end cap and cushioning
US20060046779A1 (en) * 2004-08-31 2006-03-02 Tracy James L Method and apparatus for providing enhanced functionality for a mobile communication device
JP7070234B2 (ja) * 2018-08-20 2022-05-18 三菱ケミカル株式会社 活性エネルギー線硬化性樹脂組成物及びコーティング剤

Also Published As

Publication number Publication date
CN1332591C (zh) 2007-08-15
TWI242878B (en) 2005-11-01
US20040156178A1 (en) 2004-08-12
US7190982B2 (en) 2007-03-13
JP2004235184A (ja) 2004-08-19
CN1558714A (zh) 2004-12-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees