TW200415955A - Flexible frame for mounting a deposition mask - Google Patents

Flexible frame for mounting a deposition mask Download PDF

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Publication number
TW200415955A
TW200415955A TW092131405A TW92131405A TW200415955A TW 200415955 A TW200415955 A TW 200415955A TW 092131405 A TW092131405 A TW 092131405A TW 92131405 A TW92131405 A TW 92131405A TW 200415955 A TW200415955 A TW 200415955A
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TW
Taiwan
Prior art keywords
deposition mask
peelable
deposition
flexible frame
frame
Prior art date
Application number
TW092131405A
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English (en)
Inventor
Thomas K Clark
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200415955A publication Critical patent/TW200415955A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Description

200415955 玖、發明說明： 【發明所屬之技術領域】 本發明關於在製造有機發光二極體⑴LED)製程中，透過 沉積光罩將有機材料沉積至基板的方法。 口 【先前技術】 。雖然淺光罩已經被製造出來以及使用於工業材料沉積製 程上已達相當長的-段應用時間，但對於主動式矩陣有機 發光裝置（OLED)所使用的可剝除沉積光罩f要比先前製 造應用需要較大的準確度。 【發明内容】 、一種製造可剝除沉積光罩的過程將-可剥除沉積光罩, 成在板上，該可沉積光罩係一利用金屬化合物以電力方^ 形成在板上，#著利用_經過製圖的光阻劑以化學法备 =《可剝除 >儿積光罩接著由該板以人工移除。該移除廷 程包括首先提高-角且將電力形成的材料由該板抽離，^ :由該㈣除該可剝除沉積光罩。該製程如同人工製程拖 人員連、，傳遞万式實行。該可剝除沉積光罩係使里易 =變形的薄的延展性材料製成。移除後的可剝除沉積先 :、由過私的抽㉘方向而產生結構性變形與捲曲。 二T制除光罩也受到不_致剥離方向及該可剝除光罩由該 板剥離時角度變化的影響。 忙触了$除A⑯光罩必須現在安裝在—沉積製程中使用的 該可剝除沉積光罩現在以人工利料準裝置(共同讓 人MM75,簡i號美國專利）安裝至該框體。該可剝除沉
O:\89\89249.DOC 200415955 積光罩首先必須人工對準該光罩。接著，該可剝除沉積光 罩利用-對準板儘可能維持成平面。該對準板試圖將結構 已捲曲變形的可剥除沉積光罩儘可能整平，而以人工製程 將膠帶施加至可剥除沉積光罩外緣及沉積框體，藉此㈣ 可剝除沉積光罩連接至框體。當施加個別膠帶時，方向性 應力被引入該可剝除沉積光罩。該方向性應力使安裝的可 剝除沉積光罩產生漣波或波形。該漣波有害於沉積過程。 於材料精確沉積的沉積過程期間，該可剝除沉積光罩必須 與基板儘可能同平面。 在製作有機發光裝置（0LED)中，在一些步驟中有機層須 沉積在整個基板上。主要是希望可剝除沉積光罩能對準及 正確安裝’以便精確沉積1可剥除光罩典型係—由薄的 延展性材料製成。該可剥除沉積光罩典型係由微影製圖而 成及因為其很薄所以其容許有機材料沉積在整個基板的適 當位置。該可剥除沉積光罩必須正確安裝及對準至基板。 孩下文係用以安裝及對準該可剥除沉積光罩的標準技術說 明。該先前技藝典型使用—_及以人工將光罩對準框體 財心。膠帶通常用以固定該可剝除沉積光罩至框體，具 安裝可剥=積光罩的框體相對於該基板而定位空室 中0 —— 、 、本，明目的係提供-種由該板移除可剝除沉積光罩的改 艮万式’而在由該板移除後減少該可剥除沉積光罩中的漣 波。 此目的達成係藉由一種將沉積光罩安裝在可彎曲框體，
O:\89\89249.DOC 200415955 使用材料真空沉積，透過可剥除沉積光罩形成〇led之方 去’琢方法包括下列步驟： (a)提供一具有該剝除沉積光罩形成於其上之板件； ⑻提供具有邊界部份之可.f曲框體，此邊界部份界定一對 應該可剥除沉積光罩上邊界部份之框體開口； ⑷對準及接著固定該可.彎曲框體邊界部份至該可剥除沉 積光罩㈣界部份，及由該板移除該可f曲框體與固定 的可剝除沉積光罩；及 ⑷在-載體中安裝具有該可剝除沉#光罩的可彎曲框 體，孩載體於後續材料真空沉積期間，維持該可剥除沉 積光罩的平面性。 本發明優點係當安裝在框體時可剝除沉積光罩的捲曲已 經減少。 一進一步的優點係在該板移除前利用膠帶將該框體固定 至可剥除沉積光罩’以易於安裝可剥除沉積光罩至框體。 【實施方式】 a 圖1係一具有較佳由鋁製成之邊界部份1〇的可彎曲框體 14的等體積圖，該邊界部份10具有—容許有機材料沉積= 中心直角^^36。位於該直角外形可·f曲框體14 —外侧角 的号一抓絲$ 18。如圖1所述，在可彎曲框體14相反角落的 兩個位置，有定位器孔2〇 ^該定位器孔2〇具有雙重目的。 如圖1所述，該定位器孔20的作用為視覺對準孔，用於手 動將該可彎曲框體14對準位於該可剥出沉積光罩12相反角 落的對準目標24。本發明將該可彎曲礦體14邊界部份1〇對 O:\89\89249.DOC -8- ;固毛至可剥除沉積光罩的邊界部份。這有助於該可彎 曲才匡體14 爲m ^ ^ 固疋可剝除沉積光罩12由該板38移除。圖2對 =可彎曲框體14中的^位器孔2G。—可剝除沉積光罩12以 兒力形成的板38及一可剝除沉積光罩12。 朴說明_可彎曲框體14具有—可剝除沉積光印以黏 耆万事連接及安裝在載體26中的分解圖。一可剝除沉積光 =12具有對準孔22，上面有利用黏著層丨6安裝的可彎曲框 14 3可考曲框體14具有一抓持片18，如此有助於該可 剝除/儿積框體12的移除，其將在圖3中討論。該具有定位 的了 ％曲框體14以其相反角落位置用於對準該可剝 除冗和光罩12。忒可剝除沉積光罩12具有一對準目標％位 於孩可剝除沉積光罩12的相反角落中，而該可剝除沉積光 罩12對應於該可彎曲框體14中的對準孔22。該立體分解圖 也說明-載體26具有位於中心凹處3〇相反角落中的兩插銷 28,其對準可彎曲框體14中之定位孔2()。該中心凹處％建 構成一圖案，以容納一可彎曲框體14，而框體周圍的空隙 不會限制熱膨脹。該載體26的開口34位於邊界凹處3〇的載 體26中。在材料後續真空沉積期間，此安裝配置維持該可 剥除沉積12的平面性。另外，—衛鐵32提供_種插入 具有.黏著層-16可彎曲框體丨4及與載體2 6同平面的可剝除沉 積光罩12的方法，這種方式不會限制熱膨脹所產生的橫向 移動。熱膨脹於該沉積過程期間發生。由此瞭解有機材料 透過可剝除沉積光罩沉積，而形成一具有溫差的有機發光 二極體（OLED) 〇 ^ O:\89\89249.DOC -9- 200415955 圖3說明由該板38移除該㈣ 用位於可彎曲拒减 日口過私，利 与曲框組14上的抓持片18 ,由該板 該可剝除沉積光罩12，炊；一 、 知问及釗除 、 ”、、猎人工提供鬲抓持片18將彎曲 该可，考曲框體〗4，4rr A丄、、， 此由孩板38剝除該可剝除沉積光罩 、、。孩移除過程完成，職可f曲框體14且轉著方式連 接《孩可剥除沉積光罩12現在將安裝在載體30。 【圖式簡單說明】 圖係可弓曲框體在移除其位於板上的等體積圖； 圖係如本發明可剝除沉積光罩之可彎曲框體及載體 的立體分解圖；及 圖說月在忒可剥除沉積光罩由一板移除期間之可彎曲 框體。 【圖式代表符號說明】 10 邊界部份 32 衛鐵 12 可剝除沉積光罩 34 開口 14 可彎曲框體 36 中心直角開口 16 黏著層 38 板 18 抓持片 20 定库器孔 22: 、對 24 對準目標 26 載體 28 插銷 30 中心凹處
O:\89\89249.DOC -10-

Claims (1)

  1. ’使用材料真空沉 之方法，包括下列 2. 3. 4. 5. 拾、申請專利範固·· -種將沉積光罩安裝在可彎曲框體 積，透過可_沉積光罩形成oled 步驟： ⑷提供—具有_除沉積光罩形成於其上之板件. (=供具有邊界部份之可彎隸體，此邊界部份界定— 士應该可剑除沉積光罩上邊界部份之框體開口； ⑷料及接著固定該可彎曲框體邊界部份至該可剑除 4光罩的邊界部份，及由該板移除該可彎曲框體與Φ 固定的可剝除沉積光罩；及 /、 ⑷在-載體中安裝具有該可剥除沉積光罩的可彎曲框 體’該載體於後續材料真空沉積期間，維持該可剥除 沉積光罩的平面性。 … 如申請範圍第Μ的方法，進-步包括在該可f曲框體 上提供-抓持片’其有助於使用者移除該可彎曲框體及 經過固定之可剝除沉積光罩。 如申請範圍第1項的方法’其中該可剝除沉積光罩係利鲁 用框體對準基準點形成’及該可彎曲框體包括與該可剥 除沉積:光，上基穩點對影之對準孔，以便有助於對準乂 ’申請範ΐ第i項的方法’其中該材料係有機或無：材 如申請範圍第1項的方法，進一步提供一插入該載體中 可彎曲框體與可剝除沉積光罩的衛鐵。 O:\89\89249.DOC
TW092131405A 2002-12-31 2003-11-10 Flexible frame for mounting a deposition mask TW200415955A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/334,956 US6926840B2 (en) 2002-12-31 2002-12-31 Flexible frame for mounting a deposition mask

Publications (1)

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TW200415955A true TW200415955A (en) 2004-08-16

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Country Status (8)

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US (1) US6926840B2 (zh)
EP (1) EP1579024B1 (zh)
JP (1) JP2006512735A (zh)
KR (1) KR20050085929A (zh)
CN (1) CN1732282A (zh)
DE (1) DE60312385T2 (zh)
TW (1) TW200415955A (zh)
WO (1) WO2004061149A1 (zh)

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EP1579024A1 (en) 2005-09-28
US20040123799A1 (en) 2004-07-01
DE60312385D1 (de) 2007-04-19
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CN1732282A (zh) 2006-02-08
KR20050085929A (ko) 2005-08-29

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