TW200415955A - Flexible frame for mounting a deposition mask - Google Patents

Flexible frame for mounting a deposition mask Download PDF

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Publication number
TW200415955A
TW200415955A TW092131405A TW92131405A TW200415955A TW 200415955 A TW200415955 A TW 200415955A TW 092131405 A TW092131405 A TW 092131405A TW 92131405 A TW92131405 A TW 92131405A TW 200415955 A TW200415955 A TW 200415955A
Authority
TW
Taiwan
Prior art keywords
deposition mask
peelable
deposition
flexible frame
frame
Prior art date
Application number
TW092131405A
Other languages
Chinese (zh)
Inventor
Thomas K Clark
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200415955A publication Critical patent/TW200415955A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A method of mounting a deposition mask onto a flexible frame for use in vacuum deposition of material through a pealable deposition mask in forming an OLED, including the steps of providing a plate with the pealable deposition mask formed thereon; providing the flexible frame having border portions, such border portions defining a frame opening which corresponds to border portions on the pealable deposition mask; aligning and then securing the border portions of the flexible frame to the border portions of the pealable deposition mask and removing the flexible frame and secured pealable deposition mask from the plate; and mounting the flexible frame with the pealable deposition mask in a carrier which maintains planarity of the pealable deposition mask during subsequent vacuum deposition of material.

Description

200415955 玖、發明說明： 【發明所屬之技術領域】 本發明關於在製造有機發光二極體⑴LED)製程中，透過 沉積光罩將有機材料沉積至基板的方法。 口 【先前技術】 。雖然淺光罩已經被製造出來以及使用於工業材料沉積製 程上已達相當長的-段應用時間，但對於主動式矩陣有機 發光裝置（OLED)所使用的可剝除沉積光罩f要比先前製 造應用需要較大的準確度。 【發明内容】 、一種製造可剝除沉積光罩的過程將-可剥除沉積光罩, 成在板上，該可沉積光罩係一利用金屬化合物以電力方^ 形成在板上，#著利用_經過製圖的光阻劑以化學法备 =《可剝除 >儿積光罩接著由該板以人工移除。該移除廷 程包括首先提高-角且將電力形成的材料由該板抽離，^ :由該㈣除該可剝除沉積光罩。該製程如同人工製程拖 人員連、，傳遞万式實行。該可剝除沉積光罩係使里易 =變形的薄的延展性材料製成。移除後的可剝除沉積先 :、由過私的抽㉘方向而產生結構性變形與捲曲。 二T制除光罩也受到不_致剥離方向及該可剝除光罩由該 板剥離時角度變化的影響。 忙触了$除A⑯光罩必須現在安裝在—沉積製程中使用的 該可剝除沉積光罩現在以人工利料準裝置(共同讓 人MM75,簡i號美國專利）安裝至該框體。該可剝除沉200415955 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for depositing an organic material onto a substrate through a deposition mask in a process for manufacturing an organic light emitting diode (LED). Mouth [prior art]. Although shallow masks have been manufactured and used in industrial material deposition processes for a long period of time, the peelable deposition mask f for active matrix organic light-emitting devices (OLEDs) is longer than before Manufacturing applications require greater accuracy. [Summary of the Invention] A process of manufacturing a peelable deposition mask will be a peelable deposition mask formed on a board, which is formed by using a metal compound to form electricity on the board, # 着Chemically prepared using a patterned photoresist = "Peelable" The product mask is then manually removed from the board. The removing process includes first raising the angle and removing the material formed by the electric power from the plate, and removing the peelable deposition mask by the ripping. This process is similar to the manual process of dragging people together, and it is carried out in various ways. The peelable deposition mask is made of a thin, ductile material that deforms easily. After removing the strippable deposits, structural deformation and curling are caused by the direction of the excessively private pumping. The two-T mask is also affected by the non-peeling direction and the change in angle of the peelable mask when it is peeled from the plate. If you are busy, you must install the reticle. The strippable reticle used in the deposition process is now installed to the frame with artificial material (commonly assigned MM75, Jan. US patent). The peelable sink

O:\89\89249.DOC 200415955 積光罩首先必須人工對準該光罩。接著，該可剝除沉積光 罩利用-對準板儘可能維持成平面。該對準板試圖將結構 已捲曲變形的可剥除沉積光罩儘可能整平，而以人工製程 將膠帶施加至可剥除沉積光罩外緣及沉積框體，藉此㈣ 可剝除沉積光罩連接至框體。當施加個別膠帶時，方向性 應力被引入該可剝除沉積光罩。該方向性應力使安裝的可 剝除沉積光罩產生漣波或波形。該漣波有害於沉積過程。 於材料精確沉積的沉積過程期間，該可剝除沉積光罩必須 與基板儘可能同平面。 在製作有機發光裝置（0LED)中，在一些步驟中有機層須 沉積在整個基板上。主要是希望可剝除沉積光罩能對準及 正確安裝’以便精確沉積1可剥除光罩典型係—由薄的 延展性材料製成。該可剥除沉積光罩典型係由微影製圖而 成及因為其很薄所以其容許有機材料沉積在整個基板的適 當位置。該可剥除沉積光罩必須正確安裝及對準至基板。 孩下文係用以安裝及對準該可剥除沉積光罩的標準技術說 明。該先前技藝典型使用—_及以人工將光罩對準框體 財心。膠帶通常用以固定該可剝除沉積光罩至框體，具 安裝可剥=積光罩的框體相對於該基板而定位空室 中0 —— 、 、本，明目的係提供-種由該板移除可剝除沉積光罩的改 艮万式’而在由該板移除後減少該可剥除沉積光罩中的漣 波。 此目的達成係藉由一種將沉積光罩安裝在可彎曲框體，O: \ 89 \ 89249.DOC 200415955 The mask must first be manually aligned with the mask. Then, the peelable deposition mask utilization-alignment plate is kept as flat as possible. The alignment plate tries to flatten the peelable deposition mask whose structure is curled and deformed as much as possible, and manually applies adhesive tape to the outer edge of the peelable deposition mask and the deposition frame, thereby removing the deposition. The photomask is connected to the frame. When individual tapes are applied, directional stress is introduced into the peelable deposition mask. This directional stress creates ripples or waveforms on the mounted peelable deposition mask. This ripple is detrimental to the deposition process. During the deposition process for accurate material deposition, the strippable deposition mask must be as coplanar as possible with the substrate. In fabricating an organic light emitting device (OLED), an organic layer must be deposited on the entire substrate in some steps. The main hope is that the strippable reticle can be aligned and installed properly 'for accurate deposition. A strippable reticle is typically made of a thin, ductile material. The strippable deposition mask is typically formed by lithographic mapping and because it is thin, it allows organic materials to be deposited in place throughout the substrate. The peelable deposition mask must be properly mounted and aligned to the substrate. The following is a description of standard techniques used to install and align the removable deposition mask. This previous technique typically uses—and manually aligns the photomask with the frame. Adhesive tape is usually used to fix the peelable deposition photomask to the frame. The frame with the peelable = photomask installed is positioned relative to the substrate in the empty chamber. Modification of the plate removal peelable deposition mask 'while reducing ripples in the peelable deposition mask after removal by the plate. This is achieved by installing a deposition mask in a flexible frame,

O:\89\89249.DOC 200415955 使用材料真空沉積，透過可剥除沉積光罩形成〇led之方 去’琢方法包括下列步驟： (a)提供一具有該剝除沉積光罩形成於其上之板件； ⑻提供具有邊界部份之可.f曲框體，此邊界部份界定一對 應該可剥除沉積光罩上邊界部份之框體開口； ⑷對準及接著固定該可.彎曲框體邊界部份至該可剥除沉 積光罩㈣界部份，及由該板移除該可f曲框體與固定 的可剝除沉積光罩；及 ⑷在-載體中安裝具有該可剝除沉#光罩的可彎曲框 體，孩載體於後續材料真空沉積期間，維持該可剥除沉 積光罩的平面性。 本發明優點係當安裝在框體時可剝除沉積光罩的捲曲已 經減少。 一進一步的優點係在該板移除前利用膠帶將該框體固定 至可剥除沉積光罩’以易於安裝可剥除沉積光罩至框體。 【實施方式】 a 圖1係一具有較佳由鋁製成之邊界部份1〇的可彎曲框體 14的等體積圖，該邊界部份10具有—容許有機材料沉積= 中心直角^^36。位於該直角外形可·f曲框體14 —外侧角 的号一抓絲$ 18。如圖1所述，在可彎曲框體14相反角落的 兩個位置，有定位器孔2〇 ^該定位器孔2〇具有雙重目的。 如圖1所述，該定位器孔20的作用為視覺對準孔，用於手 動將該可彎曲框體14對準位於該可剥出沉積光罩12相反角 落的對準目標24。本發明將該可彎曲礦體14邊界部份1〇對 O:\89\89249.DOC -8- ;固毛至可剥除沉積光罩的邊界部份。這有助於該可彎 曲才匡體14 爲m ^ ^ 固疋可剝除沉積光罩12由該板38移除。圖2對 =可彎曲框體14中的^位器孔2G。—可剝除沉積光罩12以 兒力形成的板38及一可剝除沉積光罩12。 朴說明_可彎曲框體14具有—可剝除沉積光印以黏 耆万事連接及安裝在載體26中的分解圖。一可剝除沉積光 =12具有對準孔22，上面有利用黏著層丨6安裝的可彎曲框 14 3可考曲框體14具有一抓持片18，如此有助於該可 剝除/儿積框體12的移除，其將在圖3中討論。該具有定位 的了 ％曲框體14以其相反角落位置用於對準該可剝 除冗和光罩12。忒可剝除沉積光罩12具有一對準目標％位 於孩可剝除沉積光罩12的相反角落中，而該可剝除沉積光 罩12對應於該可彎曲框體14中的對準孔22。該立體分解圖 也說明-載體26具有位於中心凹處3〇相反角落中的兩插銷 28,其對準可彎曲框體14中之定位孔2()。該中心凹處％建 構成一圖案，以容納一可彎曲框體14，而框體周圍的空隙 不會限制熱膨脹。該載體26的開口34位於邊界凹處3〇的載 體26中。在材料後續真空沉積期間，此安裝配置維持該可 剥除沉積12的平面性。另外，—衛鐵32提供_種插入 具有.黏著層-16可彎曲框體丨4及與載體2 6同平面的可剝除沉 積光罩12的方法，這種方式不會限制熱膨脹所產生的橫向 移動。熱膨脹於該沉積過程期間發生。由此瞭解有機材料 透過可剝除沉積光罩沉積，而形成一具有溫差的有機發光 二極體（OLED) 〇 ^ O:\89\89249.DOC -9- 200415955 圖3說明由該板38移除該㈣ 用位於可彎曲拒减 日口過私，利 与曲框組14上的抓持片18 ,由該板 該可剝除沉積光罩12，炊；一 、 知问及釗除 、 ”、、猎人工提供鬲抓持片18將彎曲 该可，考曲框體〗4，4rr A丄、、， 此由孩板38剝除該可剝除沉積光罩 、、。孩移除過程完成，職可f曲框體14且轉著方式連 接《孩可剥除沉積光罩12現在將安裝在載體30。 【圖式簡單說明】 圖係可弓曲框體在移除其位於板上的等體積圖； 圖係如本發明可剝除沉積光罩之可彎曲框體及載體 的立體分解圖；及 圖說月在忒可剥除沉積光罩由一板移除期間之可彎曲 框體。 【圖式代表符號說明】 10 邊界部份 32 衛鐵 12 可剝除沉積光罩 34 開口 14 可彎曲框體 36 中心直角開口 16 黏著層 38 板 18 抓持片 20 定库器孔 22: 、對 24 對準目標 26 載體 28 插銷 30 中心凹處O: \ 89 \ 89249.DOC 200415955 A method for forming an OLED by a peelable deposition mask using a material vacuum deposition method includes the following steps: (a) providing a mask having the stripped deposition mask formed thereon The plate; ⑻Provide a frame with a border part. F curved frame, this border part defines a pair of frame openings that should be peelable from the upper part of the deposition mask; ⑷align and then fix the can. Bending the frame boundary portion to the peelable deposition mask boundary portion, and removing the f-curve frame and the fixed peelable deposition mask from the board; and The flexible frame of the peelable sink #mask can maintain the flatness of the peelable deposition mask during subsequent vacuum deposition of the material. The advantage of the present invention is that the curl of the peelable deposition mask when mounted on the frame has been reduced. A further advantage is that the frame is fixed to the peelable deposition mask ' with tape before the board is removed to facilitate installation of the peelable deposition mask to the frame. [Embodiment] a Figure 1 is an isometric view of a flexible frame 14 having a boundary portion 10 preferably made of aluminum. The boundary portion 10 has-allow organic material deposition = center right angle ^^ 36 . Located at this right-angled shape can · f-curve frame body 14-the outer corner of the number one wire $ 18. As shown in FIG. 1, at two positions on opposite corners of the flexible frame 14, there are locator holes 20, which have a dual purpose. As shown in FIG. 1, the positioner hole 20 functions as a visual alignment hole for manually aligning the flexible frame 14 to an alignment target 24 located at an opposite corner of the peelable deposition mask 12. According to the present invention, the boundary portion of the bendable ore body 14 is 10 pairs of O: \ 89 \ 89249.DOC -8-; the hair is fixed to the boundary portion of the peelable deposition mask. This helps the bendable body 14 to be m ^ ^, and the removable peelable deposition mask 12 is removed from the plate 38. FIG. 2 shows the positioner hole 2G in the flexible frame 14. -A plate 38 formed by the peelable deposition mask 12 and a peelable deposition mask 12. Description of the Park_The flexible frame 14 has an exploded view which can peel off the deposited light to adhere to everything and install it in the carrier 26. A peelable deposition light = 12 has an alignment hole 22 with a flexible frame 14 mounted on it using an adhesive layer. 3 The testable frame 14 has a gripping piece 18, which helps the peelable / The removal of the child product frame 12 will be discussed in FIG. 3. The positioned curved frame 14 is used to align the removable redundant mask 12 with its opposite corner position.忒 The peelable deposition mask 12 has an alignment target% located in the opposite corner of the peelable deposition mask 12, and the peelable deposition mask 12 corresponds to the alignment hole in the flexible frame 14 twenty two. The three-dimensional exploded view also illustrates that the carrier 26 has two pins 28 in opposite corners of the central recess 30, which are aligned with the positioning holes 2 () in the flexible frame 14. The central recess is constructed as a pattern to accommodate a flexible frame body 14, and the space around the frame body does not restrict thermal expansion. The opening 34 of the carrier 26 is located in the carrier 26 at the boundary recess 30. This mounting configuration maintains the planarity of the strippable deposit 12 during subsequent vacuum deposition of the material. In addition, —Wei Tie 32 provides _ a method of inserting an adhesive layer, a -16 flexible frame, and a peelable deposition mask 12 in the same plane as the carrier 26. This method does not limit the thermal expansion. Move laterally. Thermal expansion occurs during this deposition process. It is understood that organic materials are deposited through a strippable deposition mask to form an organic light emitting diode (OLED) with a temperature difference. ○ O: \ 89 \ 89249.DOC -9- 200415955 Figure 3 illustrates the movement of the plate 38 In addition to this, the holding piece 18 located on the bendable refraining day pass, and the curved frame group 14 is used to remove the deposition mask 12 from the board, and cook; one, knowing and removing, " The hunting hand-supplied 鬲 grabbing piece 18 will bend the frame, and test the frame 〖4,4rr A 、, 」, which is peeled off by the child plate 38. The removal removal mask is completed. The flexible frame 14 is connected in a rotating manner, and the "Peelable Deposition Deposition Mask 12 will now be installed on the carrier 30. [Brief description of the figure] The figure shows the structure of the flexible frame when it is removed from the board. Equal volume diagram; The diagram is a three-dimensional exploded view of the flexible frame and the carrier of the peelable deposition mask of the present invention; and the flexible frame of the peelable deposition mask removed from a plate in the present invention. [Illustration of representative symbols of the figure] 10 Boundary part 32 Guard iron 12 Peelable deposition mask 34 Opening 14 Flexible frame 36 Right angle in the center 16 adhesive layer 38 port plate 18 gripping sheet 20 given library holes 22: of the support pin 24 at the target 26 30 28 central cavity

O:\89\89249.DOC -10-O: \ 89 \ 89249.DOC -10-

Claims (1)

’使用材料真空沉 之方法，包括下列 2. 3. 4. 5. 拾、申請專利範固·· -種將沉積光罩安裝在可彎曲框體 積，透過可_沉積光罩形成oled 步驟： ⑷提供—具有_除沉積光罩形成於其上之板件. (=供具有邊界部份之可彎隸體，此邊界部份界定— 士應该可剑除沉積光罩上邊界部份之框體開口； ⑷料及接著固定該可彎曲框體邊界部份至該可剑除 4光罩的邊界部份，及由該板移除該可彎曲框體與Φ 固定的可剝除沉積光罩；及 /、 ⑷在-載體中安裝具有該可剥除沉積光罩的可彎曲框 體’該載體於後續材料真空沉積期間，維持該可剥除 沉積光罩的平面性。 … 如申請範圍第Μ的方法，進-步包括在該可f曲框體 上提供-抓持片’其有助於使用者移除該可彎曲框體及 經過固定之可剝除沉積光罩。 如申請範圍第1項的方法’其中該可剝除沉積光罩係利鲁 用框體對準基準點形成’及該可彎曲框體包括與該可剥 除沉積:光，上基穩點對影之對準孔，以便有助於對準乂 ’申請範ΐ第i項的方法’其中該材料係有機或無：材 如申請範圍第1項的方法，進一步提供一插入該載體中 可彎曲框體與可剝除沉積光罩的衛鐵。 O:\89\89249.DOC'The method of using material vacuum sinking includes the following 2. 3. 4. 5. Picking up and applying for a patent Fangu ...-A deposition mask is installed in the volume of the flexible frame, and an oled step is formed through the deposition mask: ⑷ Provided—with _ except for the plate on which the deposition mask is formed. (= For a bendable body with a boundary portion, this boundary portion is defined-the scholar should be able to remove the frame on the upper boundary portion of the deposition mask Body opening; ⑷ material and then fixing the flexible frame boundary part to the boundary part of the mask 4 mask, and remove the flexible frame and the Φ fixed peelable deposition mask from the board; And /, 安装 Install a flexible frame with the peelable deposition photomask in a carrier 'the carrier maintains the flatness of the peelable deposition photomask during subsequent vacuum deposition of materials ...… as in scope M of the scope of application The method further includes providing a grasping sheet on the flexible curved frame body, which helps a user to remove the flexible frame body and a fixed peelable deposition photomask. For example, the first scope of application Item method 'wherein the peelable deposition mask Quasi-reference point formation 'and the flexible frame includes alignment holes aligned with the strippable deposit: light, upper base stability point to shadow, to help align the' Method of Applying for Paragraph i 'in which The material is organic or non-material: The method is as described in item 1 of the scope of application, and further provides a guard iron that can be inserted into the carrier with a flexible frame and a peelable deposition mask. O: \ 89 \ 89249.DOC
TW092131405A 2002-12-31 2003-11-10 Flexible frame for mounting a deposition mask TW200415955A (en)

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EP1579024B1 (en) 2007-03-07
WO2004061149A1 (en) 2004-07-22
DE60312385T2 (en) 2007-11-29
EP1579024A1 (en) 2005-09-28
US20040123799A1 (en) 2004-07-01
DE60312385D1 (en) 2007-04-19
US6926840B2 (en) 2005-08-09
CN1732282A (en) 2006-02-08
KR20050085929A (en) 2005-08-29

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