JPH11243274A - Formation of solder bump and mask for solder bump formation - Google Patents

Formation of solder bump and mask for solder bump formation

Info

Publication number
JPH11243274A
JPH11243274A JP10059045A JP5904598A JPH11243274A JP H11243274 A JPH11243274 A JP H11243274A JP 10059045 A JP10059045 A JP 10059045A JP 5904598 A JP5904598 A JP 5904598A JP H11243274 A JPH11243274 A JP H11243274A
Authority
JP
Japan
Prior art keywords
mask
work
solder
balls
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10059045A
Other languages
Japanese (ja)
Inventor
Ryohei Kirita
良平 桐田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Tokyo Electronic Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Tokyo Electronic Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd, Tokyo Electronic Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP10059045A priority Critical patent/JPH11243274A/en
Publication of JPH11243274A publication Critical patent/JPH11243274A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H01L2224/11472—Profile of the lift-off mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H01L2224/11474—Multilayer masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To place easily solder balls on electrodes on a work and to make it possible to easily strip a mask from the work, by a method wherein the work with holes inserted with the solder balls is heated to fuse the solder balls and after that, the solder on the balls is made to solidify and the mask on the work is separated from the work. SOLUTION: A release paper 2 is stripped off from a mask main body 1, holes 4 are made to possition on electrodes 6 on a work 5 and a mask is pasted to the work 5 with an adhesive material 2. While minute vibrations are given to the work 5, the work 5 is alternately slanted on both sides thereof to insert solder balls 7 in all the holes 4 provided in the mask. The balls 7 are inserted in all the holes 4 provided in the mask to apply a flux on the mask and the work 5 is heated to fuse the balls 7. The balls are fused and, after the balls are fused to the electrodes 6, the work is cooled to make the solder on the balls 7 solidify and solder bumps 8 are formed. Lastly, after the bumps 8 are formed on the electrodes 6 on the work 5, the mask is stripped off from the work 5. As a result, the bumps 8 are formed at low cost.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は電子部品の基板やパ
ッケージ、チップ素子等にはんだボールではんだバンプ
を形成する方法およびそれに使用するマスクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming solder bumps on an electronic component substrate, package, chip device, or the like with solder balls, and a mask used for the method.

【０００２】[0002]

【従来の技術】一般にＢＧＡ（Ball Grid Arry）、ＣＳ
Ｐ（Chip Size Package）、ＴＡＢ（Tape Automated Bo
nding）、ＭＣＭ（Multi Chip Module）等の多機能部品
をプリント基板へ実装する際は、はんだバンプで行って
いる。つまり多機能部品では予め電極にはんだバンプを
形成しておき、プリント基板への実装時、該はんだバン
プをプリント基板の電極にあてがってからリフロー炉の
ような加熱装置で加熱してはんだバンプを溶融させる。
すると多機能部品に形成されたはんだバンプが多機能部
品の電極とプリント基板の電極とをはんだ付けして導通
させるようになる。2. Description of the Related Art Generally, BGA (Ball Grid Arry), CS
P (Chip Size Package), TAB (Tape Automated Bo)
nding) and mounting of multifunctional components such as MCM (Multi Chip Module) on a printed circuit board by solder bumps. In other words, in the case of multifunctional components, solder bumps are formed on the electrodes in advance, and when mounting on a printed board, the solder bumps are applied to the electrodes on the printed board, and then heated by a heating device such as a reflow furnace to melt the solder bumps. Let it.
Then, the solder bumps formed on the multi-function component solder the electrodes of the multi-function component and the electrodes of the printed circuit board to conduct.

【０００３】また前記多機能部品やＱＦＰ、ＳＯＩＣ等
チップ素子を搭載した電子部品では、チップ素子の電極
とチップ素子を搭載するワークの電極間を極細の金線で
接続するというワイヤーボンディングを行っていた。現
在のワイヤーボンディング技術は接続作業が非常に高速
であり、一箇所の接続に０．１秒という短時間で行える
ものである。しかしながら、ワイヤーボンディングは如
何に高速作業が行えるといえども電極一箇所毎に接続を
行うため、電極が多数設置された電子部品では全ての電
極を接続するのに相当の時間がかかっていた。また金線
は貴金属であるため材料自体が高価であるばかりでな
く、数十μｍの極細線に加工しなければならないため、
その加工に多大な手間がかって、やはり高価となるもの
であった。さらにワイヤーボンディングは、電極がワー
クの中央部に多数設置されたものに対しては、金線が同
士が接触してしまうため接続が不可能であった。[0003] In addition, in the above-mentioned electronic parts on which chip elements such as multifunctional parts and QFPs and SOICs are mounted, wire bonding is performed in which the electrodes of the chip elements and the electrodes of the work on which the chip elements are mounted are connected by ultrafine gold wires. Was. With the current wire bonding technology, the connection operation is extremely fast, and connection at one location can be performed in a short time of 0.1 second. However, no matter how high-speed the wire bonding can be, since connection is made for each electrode, it takes a considerable time to connect all the electrodes in an electronic component having a large number of electrodes. In addition, the gold wire is a noble metal, so the material itself is not only expensive, but also it must be processed into an ultra-fine wire of several tens of μm.
The processing required a great deal of time and was expensive. Further, in the wire bonding, connection was not possible with a large number of electrodes placed at the center of the work because the gold wires would contact each other.

【０００４】そこで近時では、チップ素子とパッケージ
との導通を金線を使わずに互いの電極同士を直接接続す
るというＤＣＡ（Direct Chip Attachment）方式も採り
入れられるようになってきている。このＤＣＡ方式と
は、チップ素子の電極に予めはんだバンプを形成してお
き、チップ素子をパッケージに実装するときに、パッケ
ージの電極にはんだバンプをあてがって、はんだバンプ
を溶融させることにより両者間で導通をとるようにす
る。ＤＣＡ方式は、金線を使わないため安価に製造で
き、しかも一度の作業で全ての電極の接続ができるため
生産性にも優れている。従って、最近では多機能部品の
実装やＤＣＡ方式での電極の接続に、はんだバンプでの
接続が多く採用されるようになってきた。このはんだバ
ンプによる接続は、電極がワークの中央部に多数設置さ
れていても、ワークと搭載物の電極を向かい合わせにし
て、この間をはんだバンプで接続するため、ワイヤーボ
ンディングのように接続物同士が接触することは決して
起こらない。In recent years, therefore, a DCA (Direct Chip Attachment) system has been adopted in which the electrodes of a chip element and a package are directly connected to each other without using a gold wire. In this DCA method, solder bumps are formed in advance on the chip element electrodes, and when the chip element is mounted on a package, the solder bumps are applied to the package electrodes and the solder bumps are melted to form a solder bump. Conduct continuity. The DCA method is excellent in productivity because it can be manufactured at a low cost because it does not use a gold wire, and all electrodes can be connected in a single operation. Therefore, recently, solder bumps are often used for mounting multifunctional components and connecting electrodes in the DCA method. Even if a large number of electrodes are installed in the center of the work, the connection by solder bumps is made by connecting the work and the electrodes of the mounted object to each other and connecting them with solder bumps. Contact never happens.

【０００５】従来のはんだボールによるはんだバンプの
形成方法としては、転写式、マスク式、キャリアテープ
式がある。Conventional methods for forming solder bumps using solder balls include a transfer type, a mask type, and a carrier tape type.

【０００６】転写式とは、ワークの電極と一致したとこ
ろにはんだボールよりも小さい穴が穿設された吸着ヘッ
ドを用いるものである（参照：特開昭６１−２４２７５
９号、同６４−７３６２５号、特開平４−６５１３０
号、同５−１０９８３号、同６−１６３５５０号、同７
−１６９７６９号、同７−２０４００号、同７−２０４
０１号、同７−２１２０２３号、同７−３０２７９６
号）。転写式では、先ず真空装置に接続された吸着ヘッ
ドの穴を吸引状態にして、該穴にはんだボールを吸着さ
せる。そして吸着ヘッドをワーク上に移動させ、粘着性
のフラックスが塗布されたワークの電極にはんだボール
を近接させてから吸着ヘッドの吸引状態を解いてはんだ
ボールをワークの電極に落下させる。その後、電極には
んだボールが搭載されたワークをリフロー炉で加熱して
はんだボールを溶融させることによりはんだバンプを形
成する。[0006] The transfer type uses a suction head in which a hole smaller than a solder ball is formed at a position coinciding with an electrode of a work (refer to JP-A-61-24275).
No. 9, No. 64-73625, JP-A-4-65130
Nos. 5-10983, 6-163550 and 7
No. 169969, No. 7-20400, No. 7-204
No. 01, No. 7-212023, No. 7-302796
issue). In the transfer type, first, a hole of a suction head connected to a vacuum device is set in a suction state, and a solder ball is sucked into the hole. Then, the suction head is moved onto the work, the solder ball is brought close to the electrode of the work to which the adhesive flux is applied, and then the suction state of the suction head is released to drop the solder ball onto the work electrode. Thereafter, the work in which the solder balls are mounted on the electrodes is heated in a reflow furnace to melt the solder balls, thereby forming solder bumps.

【０００７】マスク式とは、ワークの電極と一致したと
ことに穴が穿設された金属製マスク、または樹脂製マス
クを用いるものである（参照：特開平７−２０２４０３
号、同７−２１２０２１号、同８−３００６１３号、同
８−３３０７１６号、同９−１６２５３３号）。マスク
式では、ワークの電極に粘着性フラックスを塗布してお
き、マスクの穴とワークの電極を一致させた状態でマス
クをワークに載置する。その後、はんだボールをマスク
の穴に落とし込んでから、マスクをワーク上から外し、
ワークをリフロー炉で加熱することによりワークの電極
にはんだバンプを形成するものである。[0007] The mask type uses a metal mask or a resin mask in which a hole is formed in accordance with an electrode of a work or a resin mask (refer to Japanese Patent Application Laid-Open No. 7-202403).
Nos. 7-212021, 8-36013, 8-330716, and 9-162533). In the mask type, an adhesive flux is applied to an electrode of a work, and the mask is placed on the work in a state where the holes of the mask are aligned with the electrodes of the work. After that, drop the solder ball into the hole of the mask, remove the mask from the work,
A solder bump is formed on an electrode of the work by heating the work in a reflow furnace.

【０００８】キャリアテープ式とは、前述吸着式とマス
ク式を併用したはんだバンプの形成方法である（参照：
特開昭２−２９５１８６号）。このキャリアテープ式
は、表面の一部分にマスク、裏面全域に紫外線剥離性接
着剤が塗布され、そこにカバーフィルムが接着された長
尺のキャリアテープを用いるものである。キャリアテー
プはワークの電極と一致したところにはんだボールを挿
入できる穴が穿設されており、該キャリアテープの表面
にはんだボールよりも小さな穴が穿設されたマスクを設
置してあって、キャリアテープの裏面には紫外線で粘着
性を失う接着剤が塗布されている。このキャリアテープ
式は、キャリアテープをはんだールが収容された真空装
置内に置いて、表面のマスクの小さな穴から吸引するこ
とによりキャリアテープの裏面から穴の中にはんだボー
ルを吸引装着する。そして裏面のカバーフィルムを剥が
し、回路基板の電極とはんだボールを位置合わせしてか
らキャリアテープを紫外線剥離性接着剤で回路基板に貼
り付け、吸引を解除する。その後、マスクの穴からフラ
ックスを塗布し、キャリアテープの下側からホットプレ
ートで加熱してはんだバンプを形成する。はんだバンプ
が形成されたならば、キャリアテープの上側から紫外線
を照射して接着剤の接着力を弱めることによりキャリア
テープを回路基板から剥がす。[0008] The carrier tape method is a method of forming solder bumps using both the suction method and the mask method (see:
JP-A-2-295186). The carrier tape type uses a long carrier tape in which a mask is applied to a part of the front surface and an ultraviolet-peelable adhesive is applied to the entire back surface, and a cover film is adhered thereto. The carrier tape is provided with holes through which solder balls can be inserted at positions corresponding to the electrodes of the work, and a mask having holes smaller than the solder balls is provided on the surface of the carrier tape. An adhesive that loses its tackiness with ultraviolet light is applied to the back surface of the tape. In the carrier tape type, the carrier tape is placed in a vacuum device containing solder wool, and is sucked from a small hole in a mask on the front surface to suction-mount a solder ball into the hole from the back surface of the carrier tape. Then, the cover film on the back surface is peeled off, the electrodes of the circuit board are aligned with the solder balls, and then the carrier tape is attached to the circuit board with an ultraviolet-peelable adhesive to release suction. After that, a flux is applied from a hole of the mask, and heated by a hot plate from below the carrier tape to form a solder bump. After the solder bumps are formed, the carrier tape is peeled from the circuit board by irradiating ultraviolet rays from above the carrier tape to weaken the adhesive force of the adhesive.

【０００９】[0009]

【発明が解決しようとする課題】ところで転写式は、は
んだボールを確実にワークの電極に載置することが困難
であるという信頼性の面と、転写装置が非常に高価であ
るという経済性の面とにおいて問題のあるものであっ
た。即ち転写式は、吸着ヘッドにはんだボールを吸着さ
せた後、吸着ヘッドを移動させて吸着ヘッドのはんだボ
ールをワークの電極と完全に一致させなければならない
が、吸着ヘッドの移動を機械的に行うため、その精度を
出すのが非常に難しいものであった。特に近時のように
ワークや電極が非常に小さくなり、しかも隣り合った電
極の間隔が非常に近接したものでは、ほんの少しの誤差
でもはんだボールを正確に載置できなくなる。また転写
式に用いる吸着ヘッドは金属製や樹脂製のブロックに微
少で深い穴を正確に穿設しなければならないため、穴加
工に多大な手間がかかり高価となるものであった。In the transfer method, the reliability is that it is difficult to reliably mount the solder balls on the electrodes of the work, and the economy is that the transfer device is very expensive. There was a problem in terms of aspect. That is, in the transfer type, after the solder ball is sucked by the suction head, the suction head must be moved to make the solder ball of the suction head completely coincide with the electrode of the work, but the movement of the suction head is performed mechanically. Therefore, it was very difficult to obtain the accuracy. In particular, when a work or an electrode becomes very small as in recent days, and a space between adjacent electrodes is very close, a solder ball cannot be accurately placed even with a slight error. In addition, the suction head used in the transfer method requires a minute and deep hole to be accurately formed in a block made of metal or resin.

【００１０】さらに転写式では、はんだボールを吸着ヘ
ッドの穴に吸引して吸着させる際に、はんだボールを気
体で吹き上げたり、振動で大きく移動させたりするた
め、はんだボールに静電気が帯電し、はんだボールが静
電気で穴以外のところに付着することが往々にしてあっ
た。その結果、はんだボールがワークの不要箇所に載置
され、その箇所ではんだボールが溶融してしまい、それ
が近接した電極間で融合してブリッジを作るという問題
もあった。Further, in the transfer method, when the solder ball is sucked into the hole of the suction head and sucked, the solder ball is blown up by gas or moved largely by vibration, so that the solder ball is charged with static electricity, Balls often adhered to places other than holes due to static electricity. As a result, there is also a problem that the solder ball is placed at an unnecessary portion of the work, and the solder ball is melted at that portion, and the solder ball fuses between adjacent electrodes to form a bridge.

【００１１】マスク式は、高価な装置を必要としないた
め、経済的には転写式よりも優れているが、従来のマス
ク式は信頼性に問題があるものであった。つまり従来の
マスク式は、電極と一致したところにはんだボールを挿
入できる穴が穿設された金属製マスクや樹脂製マスク
を、フラックスが塗布されたワークの電極と合わせて載
置し、その後はんだボールをマスクの穴に挿入してフラ
ックスで粘着させてからマスクを除去するものであっ
た。そのためマスクを除去した後に、少しの振動や衝撃
が加わると、はんだボールが電極からずれてしまうが、
そのまま加熱装置で溶融されると所定の位置以外のとこ
ろではんだボールが溶融する。このようにはんだボール
が所定の位置以外のところで溶融すると、不要な導通が
おきて電子部品が不良となってしまう。The mask type is economically superior to the transfer type because it does not require an expensive apparatus, but the conventional mask type has a problem in reliability. In other words, in the conventional mask type, a metal mask or resin mask that has a hole through which a solder ball can be inserted at a position corresponding to the electrode is placed along with the flux-coated work electrode, and then the solder The ball was inserted into the hole of the mask and adhered with a flux, and then the mask was removed. Therefore, if a little vibration or shock is applied after removing the mask, the solder ball will be displaced from the electrode,
When the solder ball is melted as it is, the solder ball melts at a position other than the predetermined position. When the solder ball melts at a position other than the predetermined position, unnecessary conduction occurs and the electronic component becomes defective.

【００１２】キャリアテープ式は、キャリアテープを紫
外線剥離性の接着剤でワークに固定したまま加熱するた
め、振動や衝撃が加わってもはんだボールがずれるよう
なことはない。しかしながら、キャリアテープの穴には
んだボールを挿入する際に、キャリアテープの上側から
吸引しなければならないため、吸引用の高価な真空装置
が必要となる。またキャリアテープをワークに接着した
接着剤を剥がすのに高価な紫外線照射装置も必要であっ
た。In the carrier tape method, since the carrier tape is heated while being fixed to the work with an ultraviolet-peelable adhesive, the solder balls do not shift even when vibration or impact is applied. However, when inserting the solder balls into the holes of the carrier tape, the suction must be performed from above the carrier tape, so that an expensive vacuum device for suction is required. Also, an expensive ultraviolet irradiation device was required to peel off the adhesive bonding the carrier tape to the work.

【００１３】またキャリアテープ式におけるキャリアの
穴は円柱状、即ち穴の壁面が垂直となっているため、は
んだバンプ形成後、はんだバンプが穴内で穴の壁面に接
触した状態となっていると、キャリアテープをワークか
ら剥がし取るときに、はんだバンプが穴の壁面に引っ掛
かって、キャリアテープを剥がしにくくするとともに、
はんだバンプが剥がれることもあった。しかもキャリア
テープ式は、キャリアテープ上に貼付したマスクに、該
マスクと同一箇所にキャリアテープの穴よりも小径の穴
を穿設しなければならず、この穿設作業が工程数を増や
して生産価格を高価なものにしていた。Further, since the hole of the carrier in the carrier tape type is cylindrical, ie, the wall surface of the hole is vertical, if the solder bump is in contact with the wall surface of the hole in the hole after the formation of the solder bump, When peeling the carrier tape from the work, the solder bumps are caught on the wall of the hole, making it difficult to peel the carrier tape,
In some cases, the solder bumps came off. In addition, in the carrier tape type, a hole smaller in diameter than the hole of the carrier tape must be formed in the same place as the mask on the mask affixed on the carrier tape. The price was expensive.

【００１４】本発明は、はんだボールを確実にワークの
電極に載置できるばかりでなく、高価な装置を用いなく
てもはんだボールを容易にワークの電極に載置でき、し
かもマスクの剥がし取りも容易に行えるという、はんだ
バンプ形成方法およびはんだバンプ形成用マスクを提供
することにある。According to the present invention, not only can the solder ball be reliably mounted on the electrode of the work, but also the solder ball can be easily mounted on the electrode of the work without using an expensive device, and the mask can be peeled off. An object of the present invention is to provide a solder bump forming method and a solder bump forming mask which can be easily performed.

【００１５】[0015]

【課題を解決するための手段】本発明者は、マスクを耐
熱性の粘着剤でワークに粘着させてからマスクの穴には
んだボールを挿入させれば高価な真空装置が必要となら
ず、しかもそのまま加熱を行えばワークに振動や衝撃が
加わってもはんだボールは絶対に他所にずれるようなこ
とがなくなり、またマスクの穴の上部の径を下部の径よ
りも小さくすれば、穴の中に挿入されたはんだボールは
穴から抜け出にくくなること等に着目して本発明を完成
させた。The inventor of the present invention eliminates the need for an expensive vacuum apparatus if a mask is adhered to a work with a heat-resistant adhesive and then a solder ball is inserted into a hole in the mask. If heating is performed as it is, even if vibration or impact is applied to the work, the solder ball will never shift to another place, and if the diameter of the upper part of the hole of the mask is smaller than the diameter of the lower part, the solder ball will The present invention was completed by paying attention to the fact that the inserted solder balls are difficult to come out of the holes.

【００１６】本発明は、耐熱性を有するマスクにワーク
の電極と同一箇所に穴を穿設する工程：穴が穿設された
マスクをマスクの穴とワークの電極とを一致させてワー
クに耐熱性粘着剤で貼り付ける工程：ワークに貼り付け
たマスクの全ての穴にマスクの上部からはんだボールを
挿入する工程：穴にはんだボールが挿入されたワークを
加熱してはんだボールを溶融させ、しかる後はんだを凝
固させる工程：ワークに貼り付けたマスクを剥離する工
程：から成ることを特徴とするはんだバンプの形成方法
である。According to the present invention, a step of perforating a hole in a heat-resistant mask at the same position as an electrode of a work is performed. Step of attaching with a non-stick adhesive: Inserting solder balls from above the mask into all holes of the mask attached to the work Step: Heating the work with the solder balls inserted into the holes to melt the solder balls A method of forming a solder bump, comprising: a step of solidifying the post-solder: a step of removing the mask attached to the work.

【００１７】またもう一つの本発明は、マスクの本体は
耐熱性を有する材料から成り、ワークの電極と同一箇所
にはんだボールを挿入できる円錐台形の穴が穿設されて
いて、しかも裏面に耐熱性の粘着剤が塗布されていると
ともに、粘着剤の塗布面には剥離紙が貼付されているこ
とを特徴とするはんだバンプ形成用マスクである。According to another aspect of the present invention, a mask body is made of a heat-resistant material, and a truncated cone-shaped hole through which a solder ball can be inserted is formed at the same position as a work electrode, and a heat-resistant back surface is provided. A solder bump forming mask, characterized in that a pressure-sensitive adhesive is applied, and a release paper is attached to a surface on which the pressure-sensitive adhesive is applied.

【００１８】[0018]

【発明の実施の形態】本発明ではんだボールではんだバ
ンプを形成するワークとは、例えばＢＧＡ、ＣＳＰ、Ｔ
ＡＢ、ＭＣＭ等の基板やパッケージ或いはＤＣＡ方式で
直接基板やパッケージに搭載するチップ素子等である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The work for forming a solder bump with a solder ball in the present invention includes, for example, BGA, CSP, T
It is a chip or the like mounted on a substrate or package such as AB or MCM or directly on the substrate or package by DCA method.

【００１９】本発明のはんだバンプの形成方法は、ワー
クの電極とマスクの穴とを一致させてワークにマスクを
貼り付け、その後でマスクの穴にはんだボールを挿入す
るものである。マスクの穴へはんだボールを挿入するに
は、マスクの上に大量のはんだボールを置き、ワークを
バイブレーターで微振動させたり、ワークを一定角度往
復傾斜させたり、或いは軟らかい刷毛でマスクの上を掃
いたりする方法が採用できる。In the method of forming a solder bump according to the present invention, a mask is attached to a work in such a manner that electrodes of the work are aligned with holes of the mask, and then solder balls are inserted into the holes of the mask. To insert solder balls into the holes in the mask, place a large amount of solder balls on the mask and finely vibrate the work with a vibrator, tilt the work back and forth at a certain angle, or sweep the top of the mask with a soft brush. You can adopt a method to go.

【００２０】本発明のはんだバンプの形成方法でフラッ
クスを使う場合、予めワークの電極にフラックスを塗布
しておく場合と、マスクの穴にはんだボールを挿入した
後で穴の中にフラックスを塗布する場合がある。マスク
のワーク貼り付け前に予めフラックスをワークの電極に
塗布する方法としては、スクリーンを用いた印刷法、デ
ィスペンサーを用いた吐出法、多数のピンを用いたピン
転写法等がある。またマスクのワーク貼り付け後にフラ
ックスを塗布する方法としては、スプレーを用いたスプ
レー塗布法、刷毛を用いた刷毛塗り法等がある。When a flux is used in the method of forming a solder bump according to the present invention, a flux is applied to an electrode of a work in advance, or a flux is applied to a hole after a solder ball is inserted into a hole of a mask. There are cases. As a method of applying a flux to the electrodes of the work in advance before attaching the work to the mask, there are a printing method using a screen, a discharge method using a dispenser, a pin transfer method using a large number of pins, and the like. Further, as a method of applying the flux after the mask is attached to the work, there are a spray coating method using a spray, a brush coating method using a brush, and the like.

【００２１】本発明のはんだバンプ形成用マスクは、は
んだ付け温度で変質しない程度の耐熱性を有するもので
あれば如何なる材料でも使用可能であるが、はんだバン
プ形成後ワークから剥がし取りやすくするため、可撓性
や曲げ性のある材料がよい。本発明に使用して好適なマ
スクの材料としてはポリイミド、ポリテトラフルオロエ
チレンのような可撓性を有する高分子樹脂、紙、或いは
可撓性はないが容易に曲げて剥がしやすい紙・フェノー
ル、ガラス・エポキシ、等である。The mask for forming a solder bump of the present invention can be made of any material as long as it has a heat resistance that does not deteriorate at the soldering temperature. A flexible or bendable material is preferred. Suitable mask materials for use in the present invention include polyimide, flexible polymeric resins such as polytetrafluoroethylene, paper, or paper or phenol, which is not flexible but is easily bent and peeled off. Glass, epoxy, etc.

【００２２】本発明のはんだバンプ形成用マスクに穿設
する穴は円錐台形、即ち上部が狭く、下部が広い形状で
あるが、上部の狭い部分ははんだボールが容易に通過す
る大きさとなっていなければならない。つまり穴が円錐
台形であると、一度穴に入ったはんだボールは、はんだ
ボールの挿入作業中に多少の振動や衝撃、刷毛での強い
掃きならし等があっても狭い上部から抜け出にくくな
り、またはんだバンプ形成後、はんだバンプが穴の壁面
に接触した状態となっても、穴の壁面に引っ掛かること
なく簡単に剥がし取ることができるからである。The hole formed in the mask for forming a solder bump of the present invention has a truncated conical shape, that is, a shape having a narrow upper portion and a wider lower portion, but the narrow portion at the upper portion must be large enough to allow a solder ball to easily pass. Must. In other words, if the hole is frusto-conical, the solder ball once in the hole will not easily fall out of the narrow upper part even if there is some vibration or shock during the solder ball insertion work, strong sweeping with a brush, etc. Further, even after the solder bump is formed, even if the solder bump comes into contact with the wall surface of the hole, it can be easily peeled off without being caught on the wall surface of the hole.

【００２３】マスクの穴の穿設方法としては、ドリル、
パンチング、レーザー光線、等如何なる装置を用いるこ
とができる。As a method of forming a hole in the mask, a drill,
Any device such as punching and laser beam can be used.

【００２４】[0024]

【実施例】以下図面に基づいて本発明を説明する。図１
は本発明のはんだバンプ形成用マスクの拡大断面図、図
２は本発明のはんだバンプの形成方法を説明するもので
ある。BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG.
FIG. 2 is an enlarged cross-sectional view of the solder bump forming mask of the present invention, and FIG. 2 illustrates a solder bump forming method of the present invention.

【００２５】先ず始めに本発明のはんだバンプ形成用マ
スクについて説明する。First, the solder bump forming mask of the present invention will be described.

【００２６】本発明のはんだバンプ形成用マスクは、本
体１がはんだ付け温度で変質しない耐熱材料から成って
いる。本体１の裏面には耐熱性の粘着剤２が塗布され、
該粘着剤塗布面には剥離紙３が貼り付けられている。The mask for forming a solder bump of the present invention is made of a heat-resistant material whose main body 1 does not deteriorate at the soldering temperature. A heat-resistant adhesive 2 is applied to the back of the main body 1,
A release paper 3 is adhered to the pressure-sensitive adhesive applied surface.

【００２７】また本体１にはワークの電極と一致したと
ころに、粘着剤２、剥離紙３を貫通して円錐台形の穴４
・・・が穿設されている。穴４の上部は、ワークの電極
に載置するはんだボールの直径よりも僅かに大きくなっ
ており、はんだボールが容易に穴の中に挿入できるよう
になっている。In the main body 1, a hole 4 having a truncated cone shape penetrating the adhesive 2 and the release paper 3 at a position coinciding with the electrode of the work.
... are drilled. The upper part of the hole 4 is slightly larger than the diameter of the solder ball placed on the electrode of the work, so that the solder ball can be easily inserted into the hole.

【００２８】次に本発明のはんだバンプの形成方法につ
いて説明する。Next, a method of forming a solder bump according to the present invention will be described.

【００２９】本体１の裏面に耐熱性の粘着剤２が塗布
され、該粘着剤の塗布面に剥離紙３が貼り付けられた耐
熱性のあるマスクを準備する。本体１、粘着剤２、剥離
紙３が一体となったマスクには後述ワーク５の電極６と
一致したところに円錐台形の穴４を穿設する。A heat-resistant mask is prepared in which a heat-resistant adhesive 2 is applied to the back surface of the main body 1 and a release paper 3 is adhered to the adhesive-coated surface. A truncated conical hole 4 is formed in a mask in which the main body 1, the adhesive 2, and the release paper 3 are integrated, at a position corresponding to an electrode 6 of a work 5 described later.

【００３０】マスクの本体１から剥離紙２を剥がし取
り、穴４をワーク５の電極６に位置させてマスクを粘着
剤２でワーク５に貼り付ける。The release paper 2 is peeled off from the main body 1 of the mask, the holes 4 are positioned on the electrodes 6 of the work 5, and the mask is attached to the work 5 with the adhesive 2.

【００３１】次いでマスクの上に多量のはんだボール
７を載置し、ワーク５に微少な振動を与えながらワーク
５を両側に互い違いに傾斜させて、マスクの全ての穴４
にはんだボール７を挿入する。穴へのはんだボール挿入
後、液状フラックスをスプレー装置でマスクの全面に吹
き付け、穴の中にフラックスを染み込ませる。Next, a large amount of solder balls 7 are placed on the mask, and the work 5 is alternately inclined on both sides while applying a slight vibration to the work 5 so that all the holes 4 of the mask are formed.
Insert the solder ball 7 into the hole. After the solder balls are inserted into the holes, the liquid flux is sprayed on the entire surface of the mask with a spray device, so that the flux penetrates into the holes.

【００３２】マスクの全ての穴４にはんだボール７を
挿入してフラックスを塗布したならば、ワーク５を図示
しないリフロー炉で加熱して、はんだボールを溶融させ
る。はんだボールが溶融して電極６に融着した後、ワー
クを冷却して溶融したはんだを凝固させ、はんだバンプ
８を形成する。After the solder balls 7 are inserted into all the holes 4 of the mask and the flux is applied, the work 5 is heated in a reflow furnace (not shown) to melt the solder balls. After the solder balls are melted and fused to the electrodes 6, the work is cooled to solidify the molten solder to form solder bumps 8.

【００３３】ワーク５の電極６にはんだバンプ８が形
成された後、ワーク５からマスクを剥がし取る。After the solder bumps 8 are formed on the electrodes 6 of the work 5, the mask is peeled off from the work 5.

【００３４】ここで本発明を用いたフリップチップパッ
ケージへのはんだバンプの形成について説明する。Here, formation of a solder bump on a flip chip package using the present invention will be described.

【００３５】５個並んだ所謂５個取りのフリップチップ
パッケージはエポキシ製であり、基板表面には直径０．
１mmの円形の電極が計１８８０個設置されている。はん
だバンプ形成用のマスクは、厚さが０．１２５mmのポリ
イミド製であり、裏面には耐熱性の粘着剤が０．０４５
mmの厚さで塗布され、該塗布面には剥離紙が貼り付けら
れている。マスクにはフリップチップパッケージの電極
と一致したところに円錐台形の穴が穿設されている。円
錐台形の穴の上部は直径が０．１５mm、穴の下部の直径
は０．２mmとなっている。先ずマスクの剥離紙を剥がし
てからマスクの穴とワークの電極とを一致させてマスク
をワークに粘着させる。該穴の中に直径が０．１４mmの
はんだボール（６３Ｓｎ−Ｐｂ）を挿入し、リフロー炉
中２３０℃で加熱してはんだボールを溶融させる。はん
だが凝固後、マスクを剥がしたところ全ての電極には、
はんだバンプが形成されていた。The so-called five-piece flip-chip package in which five pieces are arranged is made of epoxy, and has a diameter of 0.3 mm on the substrate surface.
A total of 1880 circular electrodes of 1 mm are installed. The mask for forming the solder bump is made of polyimide having a thickness of 0.125 mm, and a heat-resistant adhesive of 0.045 mm is formed on the back surface.
It is applied with a thickness of mm, and a release paper is attached to the application surface. A truncated conical hole is formed in the mask at a position corresponding to the electrode of the flip chip package. The diameter of the upper part of the truncated conical hole is 0.15 mm, and the diameter of the lower part of the hole is 0.2 mm. First, the release paper of the mask is peeled off, and the mask is adhered to the work by aligning the holes of the mask with the electrodes of the work. A solder ball (63Sn-Pb) having a diameter of 0.14 mm is inserted into the hole and heated at 230 ° C. in a reflow furnace to melt the solder ball. After the solder solidified, the mask was peeled off and all the electrodes
Solder bumps were formed.

【００３６】[0036]

【発明の効果】以上説明したように、本発明によれば微
少で多数の電極を有するワークへのはんだバンプの形成
が真空装置、搭載装置、紫外線照射装置のような高価な
設備を必要とせず安価に行える。また本発明のマスクは
一度穴の中に入ったはんだボールが抜け出にくくなるた
め、はんだボールをワークの電極に確実に載置できるば
かりでなく、さらにははんだバンプが形成されない未は
んだやはんだボールが重複して載置される過剰はんだが
皆無となるという経済性、信頼性において従来にない優
れた効果を奏するものである。As described above, according to the present invention, it is possible to form solder bumps on a work having minute and many electrodes without using expensive equipment such as a vacuum apparatus, a mounting apparatus, and an ultraviolet irradiation apparatus. Inexpensive. Further, the mask of the present invention makes it difficult for the solder ball once in the hole to come out, so that not only the solder ball can be securely mounted on the electrode of the work, but also unsolder or solder ball where no solder bump is formed is formed. This has an unprecedented superior effect in terms of economy and reliability that there is no redundant solder that is placed in duplicate.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明のはんだバンプ形成用マスクの拡大断面
図FIG. 1 is an enlarged sectional view of a mask for forming a solder bump of the present invention.

【図２】本発明のはんだバンプの形成方法を説明する図FIG. 2 is a diagram illustrating a method for forming a solder bump according to the present invention.

【符号の説明】[Explanation of symbols]

１ マスク本体 ２ 粘着剤 ３ 剥離紙 ４ 円錐台形の穴 DESCRIPTION OF SYMBOLS 1 Mask body 2 Adhesive 3 Release paper 4 Truncated conical hole

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 耐熱性を有するマスクにワークの電極と
同一箇所に穴を穿設する工程：穴が穿設されたマスクを
マスクの穴とワークの電極とを一致させてワークに耐熱
性粘着剤で貼り付ける工程：ワークに貼り付けたマスク
の全ての穴にマスクの上部からはんだボールを挿入する
工程：穴にはんだボールが挿入されたワークを加熱して
はんだボールを溶融させ、しかる後はんだを凝固させる
工程：ワークに貼り付けたマスクを剥離する工程：から
成ることを特徴とするはんだバンプの形成方法。1. A step of perforating a hole in a heat-resistant mask at the same position as an electrode of a work: heat-adhering the mask with the perforated hole to the work by matching the hole of the mask with the electrode of the work. Pasting process with the agent: Inserting solder balls from the top of the mask into all the holes of the mask pasted on the work: Heating the work with the solder balls inserted into the holes, melting the solder balls, and then soldering Solidifying: a step of removing the mask attached to the work :. 【請求項２】 マスクの本体は耐熱性を有する材料から
成り、ワークの電極と同一箇所にはんだボールを挿入で
きる円錐台形の穴が穿設されていて、しかも裏面に耐熱
性の粘着剤が塗布されているとともに、粘着剤の塗布面
には剥離紙が貼付されていることを特徴とするはんだバ
ンプ形成用マスク。2. The main body of the mask is made of a heat-resistant material, and has a truncated conical hole through which a solder ball can be inserted at the same position as the electrode of the work, and a heat-resistant adhesive is applied to the back surface. A mask for forming a solder bump, wherein a release paper is attached to a surface of the pressure-sensitive adhesive applied. 【請求項３】 前記マスクの本体は、ポリイミド、ポリ
テトラフルオロエチレン等の可撓性を有する樹脂である
ことを特徴とする請求項２記載のはんだバンプ形成用マ
スク。3. The solder bump forming mask according to claim 2, wherein the main body of the mask is made of a flexible resin such as polyimide or polytetrafluoroethylene. 【請求項４】 前記マスクの本体は、紙であることを特
徴とする請求項２記載のはんだバンプ形成用マスク。4. The mask according to claim 2, wherein the main body of the mask is paper. 【請求項５】 前記マスクの本体は、紙・フェノール、
ガラス・エポキシ等の曲げやすい材料であることを特徴
とする請求項２記載のはんだバンプ形成用マスク。5. The main body of the mask is paper / phenol,
3. The mask for forming a solder bump according to claim 2, wherein the mask is made of a flexible material such as glass or epoxy.
JP10059045A 1998-02-25 1998-02-25 Formation of solder bump and mask for solder bump formation Pending JPH11243274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10059045A JPH11243274A (en) 1998-02-25 1998-02-25 Formation of solder bump and mask for solder bump formation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10059045A JPH11243274A (en) 1998-02-25 1998-02-25 Formation of solder bump and mask for solder bump formation

Publications (1)

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JPH11243274A true JPH11243274A (en) 1999-09-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP10059045A Pending JPH11243274A (en) 1998-02-25 1998-02-25 Formation of solder bump and mask for solder bump formation

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JP (1) JPH11243274A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6595404B2 (en) 2000-01-13 2003-07-22 Hitachi, Ltd. Method of producing electronic part with bumps and method of producing electronic part
WO2004061149A1 (en) * 2002-12-31 2004-07-22 Eastman Kodak Company Flexible frame for mounting a deposition mask
WO2004082346A1 (en) 2003-03-10 2004-09-23 Hitachi Metals, Ltd. Method and device for mounting conductive ball
KR100955279B1 (en) * 2008-06-10 2010-04-30 주식회사 서보 Metal mask
JP2014090129A (en) * 2012-10-31 2014-05-15 Toppan Printing Co Ltd Method of mounting solder joint material on a mounting substrate and mounting substrate mounted with solder joint material

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6595404B2 (en) 2000-01-13 2003-07-22 Hitachi, Ltd. Method of producing electronic part with bumps and method of producing electronic part
SG99331A1 (en) * 2000-01-13 2003-10-27 Hitachi Ltd Method of producing electronic part with bumps and method of producing elctronic part
US6695200B2 (en) 2000-01-13 2004-02-24 Hitachi, Ltd. Method of producing electronic part with bumps and method of producing electronic part
WO2004061149A1 (en) * 2002-12-31 2004-07-22 Eastman Kodak Company Flexible frame for mounting a deposition mask
US6926840B2 (en) 2002-12-31 2005-08-09 Eastman Kodak Company Flexible frame for mounting a deposition mask
WO2004082346A1 (en) 2003-03-10 2004-09-23 Hitachi Metals, Ltd. Method and device for mounting conductive ball
EP1603374A1 (en) * 2003-03-10 2005-12-07 Hitachi Metals, Ltd. Method and device for mounting conductive ball
US7431792B2 (en) 2003-03-10 2008-10-07 Hitachi Metals, Ltd. Method and apparatus for placing conductive balls
EP1603374A4 (en) * 2003-03-10 2009-05-06 Hitachi Metals Ltd Method and device for mounting conductive ball
KR100955279B1 (en) * 2008-06-10 2010-04-30 주식회사 서보 Metal mask
JP2014090129A (en) * 2012-10-31 2014-05-15 Toppan Printing Co Ltd Method of mounting solder joint material on a mounting substrate and mounting substrate mounted with solder joint material

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