TW200408693A - High temperature, high strength, colorable materials for use with electronics processing applications - Google Patents
High temperature, high strength, colorable materials for use with electronics processing applications Download PDFInfo
- Publication number
- TW200408693A TW200408693A TW092124310A TW92124310A TW200408693A TW 200408693 A TW200408693 A TW 200408693A TW 092124310 A TW092124310 A TW 092124310A TW 92124310 A TW92124310 A TW 92124310A TW 200408693 A TW200408693 A TW 200408693A
- Authority
- TW
- Taiwan
- Prior art keywords
- article
- item
- metal oxide
- patent application
- oxide
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 64
- 238000012545 processing Methods 0.000 title claims description 14
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 86
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 86
- 229920000642 polymer Polymers 0.000 claims abstract description 49
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 239000000049 pigment Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 27
- 239000013589 supplement Substances 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 21
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 19
- 229920002530 polyetherether ketone Polymers 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 19
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 16
- 229910001887 tin oxide Inorganic materials 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 12
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 9
- -1 Polypropylene Polymers 0.000 claims description 9
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 8
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 6
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims description 5
- 239000004697 Polyetherimide Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 5
- 229920001601 polyetherimide Polymers 0.000 claims description 5
- 239000004695 Polyether sulfone Substances 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229910033181 TiB2 Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 4
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 4
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 229920006393 polyether sulfone Polymers 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- ZZCNKSMCIZCVDR-UHFFFAOYSA-N barium(2+);dioxido(dioxo)manganese Chemical compound [Ba+2].[O-][Mn]([O-])(=O)=O ZZCNKSMCIZCVDR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011231 conductive filler Substances 0.000 claims description 3
- CRHLEZORXKQUEI-UHFFFAOYSA-N dialuminum;cobalt(2+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Co+2].[Co+2] CRHLEZORXKQUEI-UHFFFAOYSA-N 0.000 claims description 3
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 claims description 3
- 229920013653 perfluoroalkoxyethylene Polymers 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- RGYAVZGBAJFMIZ-UHFFFAOYSA-N 2,3-dimethylhex-2-ene Chemical compound CCCC(C)=C(C)C RGYAVZGBAJFMIZ-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- 229920002292 Nylon 6 Polymers 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 229920006127 amorphous resin Polymers 0.000 claims description 2
- 239000004760 aramid Substances 0.000 claims description 2
- 229920003235 aromatic polyamide Polymers 0.000 claims description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 2
- 229920000554 ionomer Polymers 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920001897 terpolymer Polymers 0.000 claims description 2
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 claims 4
- 239000011805 ball Substances 0.000 claims 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 1
- 150000001642 boronic acid derivatives Chemical class 0.000 claims 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims 1
- 239000000292 calcium oxide Substances 0.000 claims 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 125000006353 oxyethylene group Chemical group 0.000 claims 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 claims 1
- 229920000131 polyvinylidene Polymers 0.000 claims 1
- 239000001117 sulphuric acid Substances 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 15
- 239000000945 filler Substances 0.000 description 29
- 229910001220 stainless steel Inorganic materials 0.000 description 15
- 239000010935 stainless steel Substances 0.000 description 15
- 239000011224 oxide ceramic Substances 0.000 description 13
- 229920000049 Carbon (fiber) Polymers 0.000 description 7
- 239000004917 carbon fiber Substances 0.000 description 7
- 150000001450 anions Chemical class 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004043 dyeing Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- YAFQFNOUYXZVPZ-UHFFFAOYSA-N liproxstatin-1 Chemical compound ClC1=CC=CC(CNC=2C3(CCNCC3)NC3=CC=CC=C3N=2)=C1 YAFQFNOUYXZVPZ-UHFFFAOYSA-N 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920008285 Poly(ether ketone) PEK Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 101100409194 Rattus norvegicus Ppargc1b gene Proteins 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
- B32B1/08—Tubular products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D1/00—Rigid or semi-rigid containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material or by deep-drawing operations performed on sheet material
- B65D1/34—Trays or like shallow containers
- B65D1/36—Trays or like shallow containers with moulded compartments or partitions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Packaging Frangible Articles (AREA)
- Elimination Of Static Electricity (AREA)
- Table Devices Or Equipment (AREA)
- Laminated Bodies (AREA)
- Magnetic Heads (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40774902P | 2002-09-03 | 2002-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200408693A true TW200408693A (en) | 2004-06-01 |
Family
ID=32176438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092124310A TW200408693A (en) | 2002-09-03 | 2003-09-03 | High temperature, high strength, colorable materials for use with electronics processing applications |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040126521A1 (enExample) |
| EP (1) | EP1536943A4 (enExample) |
| JP (1) | JP2006506278A (enExample) |
| KR (1) | KR20050039871A (enExample) |
| CN (1) | CN1694803A (enExample) |
| AU (1) | AU2003296901A1 (enExample) |
| TW (1) | TW200408693A (enExample) |
| WO (1) | WO2004038760A2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070026171A1 (en) * | 2002-09-03 | 2007-02-01 | Extrand Charles W | High temperature, high strength, colorable materials for use with electronics processing applications |
| US20040126522A1 (en) * | 2002-10-09 | 2004-07-01 | Extrand Charles W. | High temperature, high strength, colorable materials for device processing systems |
| US7250612B2 (en) * | 2005-09-28 | 2007-07-31 | General Electric Company | Devices and methods capable of authenticating batteries |
| WO2007149783A1 (en) * | 2006-06-20 | 2007-12-27 | Polyone Corporation | Thermally conductive polymer compounds containing zinc sulfide and thermal carbon black |
| US7476339B2 (en) * | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
| US8853723B2 (en) | 2010-08-18 | 2014-10-07 | E. I. Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
| US8969909B2 (en) | 2010-08-18 | 2015-03-03 | E I Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
| US8758860B1 (en) | 2012-11-07 | 2014-06-24 | Bayer Materialscience Llc | Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior |
| EP2799940B1 (fr) * | 2013-04-30 | 2019-07-17 | The Swatch Group Management Services AG | Conditionnement pour aiguilles de montres |
| CN106496992B (zh) * | 2016-10-26 | 2018-08-14 | 宁国市大荣电器有限公司 | 一种耐温高强度电容器塑壳 |
| KR20200142622A (ko) * | 2019-06-12 | 2020-12-23 | 삼성디스플레이 주식회사 | 기판 이송 장치 및 이를 이용한 기판 이송 방법 |
| CN116554638A (zh) * | 2023-06-13 | 2023-08-08 | 南京肯特复合材料股份有限公司 | 导电掺铟氧化锡与聚醚醚酮的复合材料及其制备方法 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US132136A (en) * | 1872-10-15 | Improvement in coffee cleaners and polishers | ||
| US146218A (en) * | 1874-01-06 | Improvement in billiard-registers | ||
| US132232A (en) * | 1872-10-15 | Improvement in steam road-rollers | ||
| DE3416856A1 (de) * | 1984-05-08 | 1985-11-14 | Basf Ag, 6700 Ludwigshafen | Thermoplastische formmassen |
| US4816556A (en) * | 1985-02-22 | 1989-03-28 | E. I. Du Pont De Nemours And Company | Ordered polyetherketones |
| CA1262000A (en) * | 1985-02-27 | 1989-09-26 | Isaburo Fukawa | Process for preparing crystalline aromatic polyetherketones |
| US4818437A (en) * | 1985-07-19 | 1989-04-04 | Acheson Industries, Inc. | Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability |
| JPH0714744B2 (ja) * | 1988-12-15 | 1995-02-22 | 旭有機材工業株式会社 | 集積回路用トレー |
| JP2816864B2 (ja) * | 1989-07-07 | 1998-10-27 | 大塚化学株式会社 | 搬送用ウエーハバスケット及び収納ケース |
| JP2794850B2 (ja) * | 1989-12-01 | 1998-09-10 | 住友化学工業株式会社 | 芳香族ポリスルフォン樹脂組成物 |
| US5890599A (en) * | 1990-09-25 | 1999-04-06 | R.H. Murphy Company | Tray for integrated circuits |
| US5338334A (en) * | 1992-01-16 | 1994-08-16 | Institute Of Gas Technology | Process for preparing submicron/nanosize ceramic powders from precursors incorporated within a polymeric foam |
| US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
| JPH0752661B2 (ja) * | 1992-12-01 | 1995-06-05 | 山一電機株式会社 | Ｉｃキャリア |
| US5447708A (en) * | 1993-01-21 | 1995-09-05 | Physical Sciences, Inc. | Apparatus for producing nanoscale ceramic powders |
| JP2959928B2 (ja) * | 1993-06-23 | 1999-10-06 | チタン工業株式会社 | 白色導電性樹脂組成物 |
| US5827907A (en) * | 1993-08-30 | 1998-10-27 | Ibm Corporation | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
| US5348151A (en) * | 1993-12-20 | 1994-09-20 | Empak, Inc. | Low profile disk carrier |
| US5538675A (en) * | 1994-04-14 | 1996-07-23 | The Dow Chemical Company | Method for producing silicon nitride/silicon carbide composite |
| CA2166060A1 (en) * | 1994-04-28 | 1995-11-09 | Tetsuo Shimizu | Thermoplastic resin composition |
| JP2688664B2 (ja) * | 1994-09-07 | 1997-12-10 | シノン電気産業株式会社 | 半導体デバイス用トレー |
| EP0776998A4 (en) * | 1995-06-14 | 1998-09-02 | Otsuka Kagaku Kk | TITANATE WHISKER AND METHOD FOR THE PRODUCTION THEREOF |
| JPH09111135A (ja) * | 1995-10-23 | 1997-04-28 | Mitsubishi Materials Corp | 導電性ポリマー組成物 |
| JPH09172059A (ja) * | 1995-12-18 | 1997-06-30 | Nippon Precision Circuits Kk | Ｉｃ用チップトレイ |
| US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
| DE19629675A1 (de) * | 1996-07-23 | 1998-01-29 | Merck Patent Gmbh | Lasermarkierbare Kunststoffe |
| US5921397A (en) * | 1996-12-10 | 1999-07-13 | Empak, Inc. | Disk cassette |
| US5794783A (en) * | 1996-12-31 | 1998-08-18 | Intel Corporation | Die-level burn-in and test flipping tray |
| US5791486A (en) * | 1997-01-07 | 1998-08-11 | Fluoroware, Inc. | Integrated circuit tray with self aligning pocket |
| US6413489B1 (en) * | 1997-04-15 | 2002-07-02 | Massachusetts Institute Of Technology | Synthesis of nanometer-sized particles by reverse micelle mediated techniques |
| US6105749A (en) * | 1997-11-25 | 2000-08-22 | International Business Machines Corporation | Enhanced matrix tray feeder |
| US6248177B1 (en) * | 1998-01-09 | 2001-06-19 | Fluoroware, Inc. | Method of cleaning a wafer carrier |
| US6202883B1 (en) * | 1998-02-06 | 2001-03-20 | Mitsubishi Engineering-Plastics Corp. | Tray for semiconductor integrated circuit devices |
| US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
| US6395149B1 (en) * | 1998-06-30 | 2002-05-28 | 3M Innovative Properties Company | Method of making light colored, electrically conductive coated particles |
| US6329058B1 (en) * | 1998-07-30 | 2001-12-11 | 3M Innovative Properties Company | Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers |
| US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
| SG92640A1 (en) * | 1999-06-07 | 2002-11-19 | E Pak Resources S Pte Ltd | Stud and rider for use on matrix trays |
| US6474477B1 (en) * | 2001-05-02 | 2002-11-05 | Ching T. Chang | Carrier assembly for semiconductor IC (integrated circuit) packages |
-
2003
- 2003-09-03 JP JP2004546717A patent/JP2006506278A/ja not_active Withdrawn
- 2003-09-03 US US10/654,584 patent/US20040126521A1/en not_active Abandoned
- 2003-09-03 WO PCT/US2003/027562 patent/WO2004038760A2/en not_active Ceased
- 2003-09-03 TW TW092124310A patent/TW200408693A/zh unknown
- 2003-09-03 CN CNA038249502A patent/CN1694803A/zh active Pending
- 2003-09-03 EP EP03809512A patent/EP1536943A4/en not_active Withdrawn
- 2003-09-03 AU AU2003296901A patent/AU2003296901A1/en not_active Abandoned
- 2003-09-03 KR KR1020057003705A patent/KR20050039871A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006506278A (ja) | 2006-02-23 |
| AU2003296901A1 (en) | 2004-05-13 |
| KR20050039871A (ko) | 2005-04-29 |
| US20040126521A1 (en) | 2004-07-01 |
| EP1536943A4 (en) | 2005-12-28 |
| WO2004038760A2 (en) | 2004-05-06 |
| AU2003296901A8 (en) | 2004-05-13 |
| CN1694803A (zh) | 2005-11-09 |
| WO2004038760A3 (en) | 2004-12-23 |
| EP1536943A2 (en) | 2005-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20070190276A1 (en) | High temperature, high strength, colorable materials for device processing systems | |
| TW200408693A (en) | High temperature, high strength, colorable materials for use with electronics processing applications | |
| TWI401287B (zh) | 無機氧化物透明分散液及含無機氧化物粒子的樹脂組成物、發光元件封裝用組成物及發光元件、硬塗膜與光學機能膜及光學組件，以及含無機氧化物粒子之樹脂組成物的製造方法 | |
| Amoli et al. | Electrical Conductive Adhesives Enhanced with High‐A spect‐R atio Silver Nanobelts | |
| CA2658027C (en) | Coated molecular sieve | |
| TW201825438A (zh) | 陶瓷複合物裝置及方法 | |
| CN1543399A (zh) | 含碳纳米管的涂层 | |
| TW201332163A (zh) | 經塗佈色彩轉換粒子及與其相關聯之裝置、系統與方法 | |
| WO2018104108A1 (en) | Composites comprising layers of nanoobjects and coating, preferably clear coating | |
| Hu et al. | An antifouling and antiviral superhydrophobic elastomer formed by 3D printing and a peptide-based coating | |
| KR101924857B1 (ko) | 열전도성 입자 | |
| US20250236944A1 (en) | Systems, compositions and methods for metal oxynitride deposition using high-base pressure reactive sputtering | |
| CN116568391A (zh) | 颗粒及包含该颗粒的带透明覆膜基材 | |
| Bao et al. | Conductive coating formulations with low silver content | |
| TWI807541B (zh) | 片材及片材之製造方法 | |
| US9376553B2 (en) | Organic-inorganic composite molded product and optical element | |
| Nair et al. | Preparation and characterization of polystyrene films containing PbS nanoparticles | |
| JP2023074970A (ja) | 官能基と珪素を含む外殻と、その内側に空洞を有する粒子の分散液及びその製造方法 | |
| Xia et al. | Multifunctional Magnetic Liquid Metal Based on Ni@ Ag Core–Shell Microspheres Prepared via Synergistic Effects | |
| KR101883727B1 (ko) | Emi 차폐 입자, 상기 emi 차폐 입자를 포함한 emi 차폐 복합재, 상기 emi 차폐 복합재를 포함한 emi 차폐 접착 필름 및 상기 emi 차폐 복합재를 포함한 기기 | |
| EP2882801A1 (en) | Conductive polymeric materials, preparation and use thereof | |
| KR20210156081A (ko) | 산화그래핀을 포함하는 고분자 필름의 제조방법 | |
| JPH06286782A (ja) | 集積回路用ケース | |
| JP2013028748A (ja) | 有機無機複合材料、成形品および光学素子 |