AU2003296901A1 - High temperature, high strength, colorable materials for use with electronics processing applications - Google Patents

High temperature, high strength, colorable materials for use with electronics processing applications

Info

Publication number
AU2003296901A1
AU2003296901A1 AU2003296901A AU2003296901A AU2003296901A1 AU 2003296901 A1 AU2003296901 A1 AU 2003296901A1 AU 2003296901 A AU2003296901 A AU 2003296901A AU 2003296901 A AU2003296901 A AU 2003296901A AU 2003296901 A1 AU2003296901 A1 AU 2003296901A1
Authority
AU
Australia
Prior art keywords
processing applications
high temperature
electronics processing
high strength
colorable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003296901A
Other versions
AU2003296901A8 (en
Inventor
Charles W. Extrad
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of AU2003296901A1 publication Critical patent/AU2003296901A1/en
Publication of AU2003296901A8 publication Critical patent/AU2003296901A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a general shape other than plane
    • B32B1/08—Tubular products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/34—Trays or like shallow containers
    • B65D1/36—Trays or like shallow containers with moulded compartments or partitions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
AU2003296901A 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications Abandoned AU2003296901A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40774902P 2002-09-03 2002-09-03
US60/407,749 2002-09-03
PCT/US2003/027562 WO2004038760A2 (en) 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications

Publications (2)

Publication Number Publication Date
AU2003296901A1 true AU2003296901A1 (en) 2004-05-13
AU2003296901A8 AU2003296901A8 (en) 2004-05-13

Family

ID=32176438

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003296901A Abandoned AU2003296901A1 (en) 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications

Country Status (8)

Country Link
US (1) US20040126521A1 (en)
EP (1) EP1536943A4 (en)
JP (1) JP2006506278A (en)
KR (1) KR20050039871A (en)
CN (1) CN1694803A (en)
AU (1) AU2003296901A1 (en)
TW (1) TW200408693A (en)
WO (1) WO2004038760A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070026171A1 (en) * 2002-09-03 2007-02-01 Extrand Charles W High temperature, high strength, colorable materials for use with electronics processing applications
WO2004033103A2 (en) * 2002-10-09 2004-04-22 Entegris, Inc. High temperature, high strength, colorable materials for device processing systems
US7250612B2 (en) * 2005-09-28 2007-07-31 General Electric Company Devices and methods capable of authenticating batteries
WO2008063709A2 (en) * 2006-06-20 2008-05-29 Polyone Corporation Thermally conductive polymer compounds containing zinc sulfide
US7476339B2 (en) * 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
US8969909B2 (en) 2010-08-18 2015-03-03 E I Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
US8758860B1 (en) 2012-11-07 2014-06-24 Bayer Materialscience Llc Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior
EP2799940B1 (en) * 2013-04-30 2019-07-17 The Swatch Group Management Services AG Packaging for hands of watches
CN106496992B (en) * 2016-10-26 2018-08-14 宁国市大荣电器有限公司 A kind of heat-resistant, high strength degree capacitor plastic housing
KR20200142622A (en) * 2019-06-12 2020-12-23 삼성디스플레이 주식회사 Substrate transferring apparatus and substrate transferring method using the same
CN116554638A (en) * 2023-06-13 2023-08-08 南京肯特复合材料股份有限公司 Conductive indium-doped tin oxide and polyether-ether-ketone composite material and preparation method thereof

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US132232A (en) * 1872-10-15 Improvement in steam road-rollers
US146218A (en) * 1874-01-06 Improvement in billiard-registers
US132136A (en) * 1872-10-15 Improvement in coffee cleaners and polishers
DE3416856A1 (en) * 1984-05-08 1985-11-14 Basf Ag, 6700 Ludwigshafen THERMOPLASTIC MOLDS
US4816556A (en) * 1985-02-22 1989-03-28 E. I. Du Pont De Nemours And Company Ordered polyetherketones
CA1262000A (en) * 1985-02-27 1989-09-26 Isaburo Fukawa Process for preparing crystalline aromatic polyetherketones
US4818437A (en) * 1985-07-19 1989-04-04 Acheson Industries, Inc. Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability
JPH0714744B2 (en) * 1988-12-15 1995-02-22 旭有機材工業株式会社 Tray for integrated circuits
JP2816864B2 (en) * 1989-07-07 1998-10-27 大塚化学株式会社 Transfer wafer basket and storage case
JP2794850B2 (en) * 1989-12-01 1998-09-10 住友化学工業株式会社 Aromatic polysulfone resin composition
US5890599A (en) * 1990-09-25 1999-04-06 R.H. Murphy Company Tray for integrated circuits
US5338334A (en) * 1992-01-16 1994-08-16 Institute Of Gas Technology Process for preparing submicron/nanosize ceramic powders from precursors incorporated within a polymeric foam
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
JPH0752661B2 (en) * 1992-12-01 1995-06-05 山一電機株式会社 IC carrier
US5447708A (en) * 1993-01-21 1995-09-05 Physical Sciences, Inc. Apparatus for producing nanoscale ceramic powders
JP2959928B2 (en) * 1993-06-23 1999-10-06 チタン工業株式会社 White conductive resin composition
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
US5348151A (en) * 1993-12-20 1994-09-20 Empak, Inc. Low profile disk carrier
US5538675A (en) * 1994-04-14 1996-07-23 The Dow Chemical Company Method for producing silicon nitride/silicon carbide composite
US5767198A (en) * 1994-04-28 1998-06-16 Daikin Industries, Ltd. Thermoplastic resin composition
JP2688664B2 (en) * 1994-09-07 1997-12-10 シノン電気産業株式会社 Tray for semiconductor device
EP0776998A4 (en) * 1995-06-14 1998-09-02 Otsuka Kagaku Kk Titanate whisker and process for the production thereof
JPH09111135A (en) * 1995-10-23 1997-04-28 Mitsubishi Materials Corp Conductive polymer composition
JPH09172059A (en) * 1995-12-18 1997-06-30 Nippon Precision Circuits Kk Chip tray for ic
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
DE19629675A1 (en) * 1996-07-23 1998-01-29 Merck Patent Gmbh Laser-markable plastics
US5921397A (en) * 1996-12-10 1999-07-13 Empak, Inc. Disk cassette
US5794783A (en) * 1996-12-31 1998-08-18 Intel Corporation Die-level burn-in and test flipping tray
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket
US6413489B1 (en) * 1997-04-15 2002-07-02 Massachusetts Institute Of Technology Synthesis of nanometer-sized particles by reverse micelle mediated techniques
US6105749A (en) * 1997-11-25 2000-08-22 International Business Machines Corporation Enhanced matrix tray feeder
US6248177B1 (en) * 1998-01-09 2001-06-19 Fluoroware, Inc. Method of cleaning a wafer carrier
US6202883B1 (en) * 1998-02-06 2001-03-20 Mitsubishi Engineering-Plastics Corp. Tray for semiconductor integrated circuit devices
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US6395149B1 (en) * 1998-06-30 2002-05-28 3M Innovative Properties Company Method of making light colored, electrically conductive coated particles
US6329058B1 (en) * 1998-07-30 2001-12-11 3M Innovative Properties Company Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
SG92640A1 (en) * 1999-06-07 2002-11-19 E Pak Resources S Pte Ltd Stud and rider for use on matrix trays
US6474477B1 (en) * 2001-05-02 2002-11-05 Ching T. Chang Carrier assembly for semiconductor IC (integrated circuit) packages

Also Published As

Publication number Publication date
CN1694803A (en) 2005-11-09
TW200408693A (en) 2004-06-01
US20040126521A1 (en) 2004-07-01
EP1536943A4 (en) 2005-12-28
JP2006506278A (en) 2006-02-23
WO2004038760A3 (en) 2004-12-23
KR20050039871A (en) 2005-04-29
EP1536943A2 (en) 2005-06-08
WO2004038760A2 (en) 2004-05-06
AU2003296901A8 (en) 2004-05-13

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase