200408693 玖、發明說明： 【發明所屬之技術領域】 本申請案主張2002年9月3曰提出申請之美國臨時專 利申請案序號6 0 / 4 0 7，7 4 9之優先權，將其併入本文為參考 資料。 【先前技術】 讀/寫磁頭係讀取磁性媒體上之資訊及/或將資訊寫 於磁性媒體上之電子組件。讀/寫磁頭係被使用於許多電 子裝置中，且其常被使用於電腦中，以自電腦記憶體讀取 資訊或將資訊寫於其上。 典型上使用複雜的組裝生產線於製造讀/寫磁頭，及將 其安裝至電子組件中。讀/寫磁頭被儲存於特殊的讀/寫 磁頭盤並於其中輸送，以使運送容易及使其可於組裝生產 線進行處理。大多數的讀/寫磁頭盤必需防止任何的靜電 放電（E S D )。盤係經由將讀/寫磁頭置於其上之表面作成為 導電性表面，而防止ESD。導電性表面可使靜電消散，以 致靜電荷無法累積於表面上。 讀/寫磁頭係為暗色且體積小；其外觀類似於黑胡椒 子。因此，如盤為暗色，則很難看到讀/寫磁頭。其之暗 色使其難以確認讀/寫磁頭之存在於盤中，及將其自盤移 出，尤其係當使用於機器視覺（m a c h i n e v i s i ο η )時。 習知讀/寫磁頭盤係由經由將聚合物與不銹鋼混合而 製得之材料所形成。由於不銹鋼經由將聚合物製成為導電 性ESD防護材料以彌補聚合物之電性質，因而有時將其稱 5 312/發明說明書(補件)/92-11 /92124310 200408693 為填料。不錄鋼為導電性’且其在南溫下的表現良好 若無顏料的話，其將產生暗色。然而，不銹鋼很難與 物混合，以獲致均勻分佈的不銹鋼。若無均勻分佈， 料將更易具有使材料之ESD防護性質受損的小絕緣點 外，不銹鋼具有可能會潛在損傷讀/寫磁頭的磁性質 者，利用不銹鋼製成之材料需要高濃度的顏料以將其 色，以致材料的其他性質會受損。 【發明内容】 此等問題可經由製造出避免使用不銹鋼的讀/寫磁 盤而解決。使用金屬氧化物填料替代不銹鋼；因此， 可染色。由於材料為淺色因而其可染色，且其不需要 度的顏料以將其染色。製造盤之材料係利用高溫、高 聚合物及金屬氧化物製成較佳。 本發明之一較佳具體例係一種讀/寫磁頭盤，盤的 一部分包括用於接受讀/寫磁頭的靜電放電防護表面 表面係由至少一高溫、高強度聚合物及至少一金屬氧 之混合物所製成。可測量材料之顏色的亮度，及指定-1/ a H旨數中之L值（見以下的論述），例如，多於約 一些具體例係關於用於接受電子組件之有色物件， 具有複數個封袋之盤，封袋各具有包含至少一高溫、 度聚合物、至少一金屬氧化物、及至少一顏料之混合 靜電放電防護表面。一些具體例係關於一種用於電子 處理之盤組，此盤組具有至少兩小組的盤，其中各盤 複數個各包括靜電放電防護表面之封袋，各小組包括 312/發明說明書(補件)/92-11 /92124310 ，但 聚合 則材 〇此 〇再 染 頭 材料 雨濃 強度 至少 ，此 化物 _ CIE 55 ° 其係 兩強 物的 組件 具有 與其 6 200408693 他小組顏色不同的小組顏色。一些具體例係關於一種用於 接受電子組件之物件，此物件具有用於接觸及支承電子組 件之結構，且此結構包括至少一靜電放電防護表面，此靜 電放電防護表面包含至少一高溫、高強度聚合物及至少一 金屬氧化物之混合物，其中此表面具有多於約5 5或6 5之 L值。 一些具體例係關於一種用於接受電子組件之物件，此物 件包括具有複數個封袋之盤，各封袋包括至少一靜電放電 防護表面，此靜電放電防護表面包含至少一高溫、高強度 聚合物、至少一金屬氧化物、及至少一顏料之混合物，其 中此表面具有多於約5 5或6 5之L值。一些具體例係關於 一種製造用於電子處理之物件之方法，此方法包括··模塑 具有包括靜電放電防護表面之封袋之盤，此靜電放電防護 表面包含高溫、高強度聚合物及導電性填料，其中此表面 包括至少約55或65之L值及在103至1014歐姆每平方之 範圍内之電阻率，其中此表面較約0. 1或0 . 0 1 5英吋每英 吋之平均值平坦。一些具體例係關於一種製造用於電子處 理之物件之方法，此方法包括模塑具有包括靜電放電防護 表面之封袋之盤，此靜電放電防護表面包含高溫、高強度 聚合物及導電性填料，其中此表面包括至少約5 5或6 5之 L值及在103至1014歐姆每平方之範圍内之電阻率，其中 此表面較約0 · 1或0 . 0 1 5英对每英忖之平均值平坦。 【實施方式】 本發明之一較佳具體例係一種ESD防護讀/寫磁頭盤， 7 312/發明說明書(補件)/92-11 /92124310 200408693 其係淺色，係由高溫、高強度聚合物製成，且包含金屬氧 化物填料。金屬氧化物填料包括陶瓷較佳。 材料之顏色的亮度可使用國際照明委員會（Commission Internationale d’Eclairage)L*a*b*色系（CIELab ，參見 1. en CIE 1 9 7 6 (L* a* b*)均勻色彩空間及色差式之 發展（The Development of the CIE 1976 (L*a*b*) Uni form Co 1 our - Space and Colour-Difference Formula)，J_._ Society of Dyers and Colourists ， 92:338-341 (1976) 反G · L· kgoston，色彩理論及其於藝術及設計中之應用 (Color Theory and Its Application in Art and Design)、 Hedelberg，1979)客觀地定量。如圖 1 所示，1976 CIELH* 系統對每種顏色在三座標軸上指定一位置。L係亮度之量 度，且其具有自〇 (黑色）至1 〇 〇 (白色）之值。「L」在此係 關於1 9 7 6 CIE 系統所使用；在他處，可使用1/於指 示在此說明為「L」之相同值。a#軸指示紅色或綠色之量， 及軸指示黃色或藍色之量。因此，「a#」及「h^」兩者 之0之值指示均衡的灰色。由於C I E L a b系統係與裝置無 關，因而其係電腦成像應用的普遍選擇。CIELab值可使用 熟悉技藝人士熟悉的標準化試驗測量，例如，使用反射率 計。舉例來說，反射率計係由P h 〇 t 〇 v ο 11 I n s t r u m e n t s， Inc. (Minneapolis, MN)(Photovolt 577 型）及 Minolta Corporation(Ramsey，NJ)(Minolta CM 2002 型）所製造。 因此，L係任何顏色之亮度之客觀、可定量、及具再現性 之量度。 8 312/發明說明書(補件)/92-11/92 Π4310 200408693 參照圖1，在此記述提供自基本上0至約1 0 0之L值之 一些具體例的材料。舉例來說，可經由將聚合物與碳黑混 合以獲致接近0之L值，而達到非常暗，接近黑色的顏色。 且可加入白色顏料，例如，氧化鈦，以獲致接近1 0 0之接 近白色的顏色。適合使用作為用於電子組件處理之支承物 之淺色靜電放電防護材料的一例子係與約5 4重量％之經摻 雜銻之氧化錫導電性材料混合之聚醚醚酮，其具有 6 4 · 9 (於圖1中見為「6 5」）之使用利用對C I E L a b系統程式 化之輸出之反射率光譜光度計測得之L值。說明於文中之 其他樣品經視覺測定落於如以下所記述之範圍内。 相對於相關技藝領域中之習知之處理方法，記述於此之 一些具體例提供具高L值，同時仍維持適當機械及靜電放 電防護導電性質之材料。此外，一些具體例保有可模塑特 性諸如平坦度。一些此等具體例之一態樣係使用金屬氧化 物或陶瓷於獲致靜電放電防護及染色性質。一些此等具體 例之另一態樣係使用高溫、高強度聚合物。一些此等具體 例之另一態樣係使用等向性流動顆粒。可考慮在自約0至 約1 0 0之連續統内之所有範圍。其他具體例獲致具有至少 約3 3、約4 5、約5 5、約6 6、或約8 0之L值之染色。一些 具體例具有落於自約4 5至約1 0 0，自約5 5至約9 9，及自 約6 6至約9 0之L值内之染色。舉例來說，具多於約5 5 之L值之材料將意謂相關材料較具約5 5之L值之材料在 C I E L a b標度上更接近白色。如文中所說明，調整導電性、 聚合、及導電性材料濃度，直至對預期的應用達到機械、 9 312/發明說明_ 補件)/92-11/92124310 200408693 顏色、或導電性質的期望組合為止。熟悉技藝人士於閱讀 本揭示内容之後可容易地進行此種調整。 高溫、高強度聚合物係對熱及化學物質具高抵抗力之聚 合物較佳。聚合物可抵抗化學溶劑N -曱基吼嘻σ定嗣、丙 酮、己酮、及其他侵蝕性極性溶劑較佳。高溫、高強度聚 合物具有高於約1 5 0 °C之玻璃轉移溫度及/或熔點。此 外，高強度、高溫聚合物具有至少2 G P a之挺度較佳。 高溫、高強度聚合物之例子為聚苯醚、離子交聯聚合物 樹脂、耐綸6樹脂、耐綸6，6樹脂、芳族聚醯胺樹脂、聚 碳酸酯、聚縮醛、聚苯硫（P P S )、三甲基戊烯樹脂、聚醚醚 酮（PEEK)、聚醚酮（PEK)、聚砜（PSF)、四氟乙烯/全氟烷 氧乙烯共聚物（P F A )、聚醚砜（P E S )、高溫非晶形樹脂 (ΗΤΑ)、聚稀丙^(PASF)、聚醚醮亞胺（PEI)、液晶聚合物 (LCP)、聚偏二氟乙烯（PVDF)、乙烯/四氟乙烯共聚物 (ETFE)、四氟乙婦/六氟丙稀共聚物（FEP)、四氟乙烤/六 氟丙烯/全氟烷氧乙烯三元共聚物（EPE)等等。亦可使用包 括說明於此之聚合物的混合物、摻混物、及共聚物。特佳 者為 PEK、PEEK、PES、PEI、PSF、PASF、PFA、FEP、ΗΤΑ、 L C Ρ等等。高溫、高強度聚合物之例子亦列於，例如，美 國專利第 5, 240, 753、 4, 757, 126、 4, 816, 556、 5, 767, 198 號、及專利申請案 ΕΡ 1 178 082 及 PCT/US99/24295 (W0 0 0 / 3 4 3 8 1 )中，將其併入本文為參考資料。 金屬氧化物填料係包括金屬氧化物，且可加至高溫、高 強度聚合物，以產生具有淺色及可使用作為讀/寫磁頭盤 10 312/發明說明書(補件)/92-11/92124310 200408693 之足夠機械性質之E S D防護材料的導電性材料。將金屬氧 化物與陶瓷混合或塗布於陶瓷上較佳，例如，經摻雜金屬 氧化物之陶瓷。此等填料典型上具有淺色，而使其可被利 用於製造淺色材料。由於其具淺色，因而可加入其他染色 劑，以賦予材料特殊的顏色。此外，陶究具对用性，且金 屬氧化物/陶瓷結合材料典型上具有與濕度無關的導電性 質。陶瓷係由金屬與非金屬元素結合之化合物所組成之材 料。陶曼包括金屬氧化物。 適當金屬氧化物之例子包括硼酸鋁、氧化鋅、鹼性硫酸 鎂、氧化鎮、鈦酸鉀、棚酸鎮、二棚化鈦、氧化錫、及硫 酸鈣。此列舉之氧化物係為範例，而非要限制本發明之範 圍。填料之進一步的例子提供於，例如，美國專利第 6, 413,489、 6,329,058、 5, 525,556、 5, 599, 511、 5, 447,708、 6, 413, 489、 5, 338, 334、及 5, 240, 753 號中， 將其併入本文為參考資料。一般而言’可視需要將金屬乳 化物掺雜或塗布另一金屬，以賦予或增進導電性。 一較佳的填料為氧化錫，尤其係經摻雜銻之氧化錫，例 如，由Milliken Chemical Co·以商品名Zelec®提供之產 品族。此等產物係小且大略為球形，且顏色為淺灰藍色至 淺灰綠色。此等顏色可產生具包括白色之範圍寬廣之淺色 的材料。此外，可使用經摻雜銻之氧化錫材料於製造透明 薄膜，且其具有大多數陶瓷之優點，諸如，非腐蝕性、對 酸、鹼、氧化劑、高溫、及許多溶劑之抵抗力。 另一較佳種類的填料為晶鬚，尤其係鈦酸鹽晶鬚，及更 11 312/發明說明書(補件)/92-11 /92124310 200408693 尤其係鈦酸鉀及硼酸鋁晶鬚，其說明於，例如，美國專利 第5，9 4 2，2 0 5及5，2 4 0，7 5 3號中，將其併入本文為參考資 料。術語晶鬚係指具有至多約8 X 1 (Γ5平方英吋之截面積及 平均直徑之約至少1 0倍長度的單晶長絲。晶鬚典型上沒有 瑕疵，因此其較具有類似組成物之多晶更強韌。因此，一 些晶鬚填料可改良複合材料之強度，以及賦予其他性質諸 如改良的剛性、耐磨性、及靜電消散。一較佳種類的晶鬚 係由OtsumaChemicalCo.(日本）以商品名DENTALL提供； 其係經塗布一薄層之氧化錫的陶瓷晶鬚。 填料之尺寸及形狀並無限制，其可為，例如，晶鬚、球 體、顆粒、纖維、或其他形狀。填料之尺寸並無限制，但 小顆粒諸如晶鬚或相當尺寸的球體，或非常小的尺寸為較 佳。可採用製造極小顆粒之技術，例如，使用奈米技術。 可使適當的金屬氧化物填料以各種形態設置。舉例來 說，可將惰性核心顆粒塗布金屬氧化物。因此，金屬氧化 物塗層被惰性顆粒延展，而產生較廉價的產物。或者，可 使用中空核心替代惰性顆粒。或者，可經由省去核心，而 使顆粒的尺寸較小。或者可將陶瓷摻雜金屬氧化物。經摻 雜之材料可為導電性，同時仍保有陶瓷的機械及染色性質。 應將金屬氧化物導體提供於材料中，以致形成導體的三 維互連網狀結構。網狀結構提供作為排除靜電荷的電路。 金屬氧化物導體之濃度係與材料之ESD性質相關。相當低 濃度的金屬氧化物導體產生高表面電阻率。電阻率隨金屬 氧化物導體濃度之增加而緩慢下降，直至當金屬氧化物導 12 312/發明說明書(補件V92-11 /92124310 200408693 體開始彼此接觸，及金屬氧化物導體濃度之進一步增加導 致電阻率快速下降時達到「浸透臨限值（p e r c ο 1 a t i ο η threshold)」為止。最終達到由於金屬氧化物導體已形成 最佳數目的網狀結構，因而金屬氧化物導體濃度之進一步 增加無法產生電阻率之實質下降的陶瓷濃度。典型上，添 加具較金屬氧化物導體低之導電性之材料將產生增加的表 面電阻率。因此，加入顏料會影響表面電阻率，但可經由 調整顏料及導電性填料之量而製得具有期望電阻率之組成 物。 具有供讀/寫磁頭盤用之淺色材料有許多優點。一優點 為可看到讀/寫磁頭。另一優點為盤可染色。因此，可使 顏色最佳化，以使磁頭更容易可見。或者，可製造具不同 顏色之不同類型的讀/寫磁頭盤，以致使用者可容易辨識 不同模式及應用的盤。或者，可將各種類型或尺寸的磁頭 儲存於不同顏色的盤中，以致磁頭的運送及使用有效率。 一些具體例進一步加入顏料，以不僅獲致期望的L值， 並且亦獲致特殊的顏色，例如，紅色、綠色、藍色、黃色、 或其之組合。顏料係以適合獲致期望顏色的濃度添加。可 經由加入熟悉技藝人士已知之顏料，及將其與如文中所說 明之導電性材料及聚合物混合，以獲致期望的顏色、導電 性、及機械特性，而完成期望的染色。顏料之例子包括二 氧化鈦、氧化鐵、氧化鉻綠、鐵藍、鉻綠、磺酸矽酸鋁、 鋁酸鈷、錳酸鋇、鉻酸鉛、硫化鎘及硒化鎘。如須要黑色， 則可使用碳黑，或者碳黑係以不會產生過暗或黑色的濃度 13 312/發明說明書(補件)/92-11 /92124310 200408693 使用。可利用顏料達成的顏色跨越可見光之光譜，包括白 色。 填料係以足以使讀/寫磁頭盤具有在約1 0 3至約1 0 14歐 姆每平方之範圍（使表面具有E S D防護性質之範圍）内之表 面電阻率的量存在較佳；表面電阻率係在約1 04至低於約 1 0 7歐姆每平方之間之範圍内更佳。此外，填料係均勻分 佈於整個材料，以避免會使其之ESD防護性質受損的小絕 緣點較佳。此外，填料係以避免於材料中產生黑色的濃度 存在較佳，及避免於材料中產生暗色更佳。製造ESD防護 材料所需之碳黑之濃度使材料變暗，及基本上變黑。習知 微晶片盤係利用碳黑製造。 一般使用由聚合物及碳填料製成之材料於製造用於固 定微晶片之微晶片盤。然而，先前技藝之微晶片盤由於微 晶片盤因存在碳填料而顏色非常暗，因而並不適合使用作 為讀/寫磁頭盤。在微晶片盤中，由於讀/寫磁頭小且暗， 且微晶片盤為暗色，因而讀/寫磁頭將難以被看到。結果， 很難將此種先前技藝的盤與讀/寫磁頭結合使用。此外， 可接受的晶片盤表面電阻率通常係在至少約1 0 7至1 0 8每 平方之範圍内。相對地，可接受的讀/寫磁頭盤表面電阻 率通常係在約1 0 4至低於約1 0 7歐姆每平方之範圍内。由 於必需將導電性材料加至聚合物以產生ESD防護材料，因 而具例如，1 0 8歐姆每平方之電阻率之材料較具例如，1 0 4 歐姆每平方之電阻率之材料具有更多填料。由於與將填料 量提高至高量值相關的不確定性，因而無法設想將製造供 14 312/發明說明書(補件)/92-11 /92124310 200408693 電腦晶片盤用之E S D防護材料之方法轉移至讀/寫磁頭 盤。此外5利用於電腦晶片處理之材料’例如晶圓載體’ 必需具有非常低量的可萃取金屬離子，但此並非讀/寫磁 頭盤材料的主要顧慮。因此，無法將用於製造微晶片盤之 技術及方法應用於製造讀/寫磁頭盤。 因此，製造讀/寫磁頭盤之科學家發展出不同於製造電 腦晶片盤的技術。替代使用碳填料，讀/寫磁頭盤習慣上 係利用金屬填料諸如不銹鋼製造。不銹鋼為導電性，其在 高溫下的表現良好，且不會於材料中產生暗色。由於材料 不為暗色，因而可容易看見讀/寫磁頭。 本發明人意料之外地發現可將高溫、高強度聚合物與多 於約40重量％之陶瓷混合，以獲致不損失期望處理性質諸 如可模塑性及流動性且不損失期望機械性質諸如壓縮及拉 伸強度及適當剛性之ESD防護材料的驚人結果。由於雖然 可將聚合物與適量的非聚合材料混合，而不損失聚合物於 終產物中之期望性質，但加入大量的非聚合材料，即多於 約4 0重量％，將可預期會產生具有不類似於聚合物之性質 的終產物，因而此結果相當驚人。經摻雜金屬氧化物或經 其處理之陶瓷對於產生ESD防護材料為較佳。然而，典型 上需要大量的此種陶瓷，以於材料中獲致期望的導電性。 陶瓷之較佳濃度範圍係在約4 0 %及約7 5 %之間，更佳的濃度 範圍係在約4 5 %及約7 0 %之間，及又更佳之範圍係在約5 0 % 及約60%之間。 此外，將多於約4 0重量％之金屬氧化物及/或陶瓷加至 15 312/發明說明_ 補件)/92-11 /92124310 200408693 高強度、高溫聚合物可驚人地產生具有平坦表面之材料， 及更驚人地，其較利用不銹鋼所獲致之表面平坦。然而， 事實上，使用金屬氧化物與高強度、高溫聚合物產生較利 用不銹鋼製得之盤更平坦的讀/寫磁頭盤。有時可用術語 平滑以指示其不會翹曲，同本申請案之優先權文件之情 況，但為清楚起見，在此採用術語平坦係指示其不會翹曲。 翹曲係有時在模塑或其他處理步驟中不期望地引入至表面 中之曲率。因此，不應將術語平坦與糙度之量度混淆。平 坦度係讀/寫磁頭盤的一期望特徵。意料外之平坦度的一 可能理由係使用於平坦表面中之金屬氧化物具有等向性的 流動形狀。等向性的流動形狀係可抵抗由於由流動流體所 產生之力而成為於任何特殊方向中取向的形狀；換言之， 顆粒之流動特性在所有方向中大致相同。因此，球形顆粒 由於當將顆粒混合於流動流體中時，其不會於任何特殊方 向中取向，因而其具有等向性的流動形狀。相對地，桿狀 顆粒由於有將其之最長軸排列在平行於流動方向之方向中 的傾向，因而其不具有等向性的流動形狀。 此處之許多具體例係就讀/寫磁頭盤作說明，由於其係 為較佳具體例。然而，亦應明暸此等說明更大致適用於在 電子處理中使用之所有類型的盤。盤被使用於，例如，微 晶片、電腦組件、及聲頻組件製程，亦參見美國專利第 6, 079, 565號及2002年9月11曰提出申請之美國專利序 號1 0 / 2 4 1，8 1 5，將其併入本文為參考資料。電子處理包括 涉及組裝電子工業用之組件的製程。由於必需將組件以方 16 312/發明說明書(補件)/92-11 /92124310 200408693 便且可保護組件防止污染及 存，因而盤有用於此種製程 接觸，因而將其支承之靜電 封袋，例如，如同圖2及3 封袋可為，例如，刻紋，被 溝槽，或限制組件在盤上時 盤，而不會使組件自盤移出 (圖4 )，且堆疊較佳亦可堆 易。 表面可包括經由自材料模 知曉模塑成表面之材料，則 假設表面類似於材料的整體 上部可能具有不同於材料整 面具有可以每英吋之英吋數 知的平坦度測量或L值比色 的平均。因此，此種測量可 的測量，例如原子力顯微術 參照圖2 - 4，其描繪具有 袋180具有底表面120，其 上之側面1 0 2。盤1 0 0之頂 在封袋1 8 0之間之分隔。頂 盤側面1 2 2連續且與其垂直 唇1 1 2係垂直於下方盤側面 以堆疊形態1 0 1設置，而不 靜電放電之方式移動及/或儲 。盤包括接受電子組件並與其 放電防護表面。盤具有複數個 。組件容納於盤的封袋中，此 壁、柱、或突起包圍之空間， 之移動性，以致可成功地移動 之其他結構。盤係可堆疊較佳 疊於例如托板上，以使處理容 塑表面而得之材料。因此，如 知曉表面中之材料。因此，可 組成物，儘管當明暸表面之最 體的組成物。此外，可測定表 測量的平均平坦度。可使用習 測量，其提供表面之顯著部分 與提供表面之極小部分之平均 ，以作區別。 複數個封袋1 8 0之盤1 0 0。封 形成將物體容納於底表面1 2 0 端表面132為連續，且其界定 端表面1 3 2之外緣1 1 6與上方 。盤側面1 2 2係垂直於唇1 1 2。 1 1 4。參照圖4，可將盤1 0 0 使底部盤表面1 2 6衝擊於電組 17 312/發明說明書(補件)/92-11 /92124310 200408693 件（例如，由2 0 8所描繪）上。唇1 1 2作為底部盤表面1 2 6 之觸止。 實施例1 經由自如表1所指示之金屬氧化物陶瓷與PEEK之混合 物模塑，而製備得原型讀/寫磁頭盤。模塑方法基本上係 與經載入不銹鋼之PEEK所使用之方法相同，雖然將模塑溫 度稍微向下調整。此等實驗之結果顯示Z e 1 e c ® E C P 1 4 1 Ο T 係利用於製造淺色讀/寫磁頭盤之較佳的金屬氧化物陶 瓷。此外，高温、高強度聚合物可載入多於4 0百分比之填 料，而不會使讀/寫磁頭盤所需之機械性質受損。再者， 驚人地發現用於固定讀/寫磁頭之表面平坦，其具有超過 利用不錄鋼填料所得之平坦度的平坦度。 表1 :金屬氧化物顆粒與高溫、高強度聚合物之混合物。 金屬氧化物填料 載入量 (wt.%) 顏色 表面電阻率（歐 姆/平方） Zelec® ECP 1410T 40 淺灰色 1013 Zelec® ECP 1410T 60 淺灰色 105 Zelec® ECP 141 OM 40 暗灰色 105 Zelec® ECP 1410M 60 未作用 一一 Zelec® ECP 1410XC 40 未作用 — Zelec® ECP 1410XC 60 未作用 -- 18 312/發明說明書(補件)/92-11 /92124310 200408693 實施例2 經由自如表2所指示之PEEK與金屬氧化物陶瓷之混合 物模塑，而製備得原型讀/寫磁頭盤。模塑方法基本上係 與經載入不銹鋼之PEEK所使用之方法相同，雖然將模塑溫 度稍微向下調整。此等實驗之結果顯示可使用金屬氧化物 陶瓷於製造ESD防護的淺色讀/寫磁頭盤。此外，高溫、 高強度聚合物可載入多於4 0百分比之填料，而不會使讀/ 寫磁頭盤所需之機械性質受損。 表2 :金屬氧化物顆粒與高溫、高強度聚合物之混合物的 ESD性質。 載入量（％) 表面電阻率（歐姆/平方） 靜電消散（秒） 40 1013 100 47 1013 120 52 107 0. 03 54 105 0. 03 60 105 0. 03 60 105 0.03 實施例3 如表3所指示，將與金屬氧化物陶瓷混合.之PEEK之各 種組成物之性質與碳纖維組成物（1 8重量％ )及使用作為控 制之P E E K之純混合物作比較。將Z e 1 e c ® E C P 1 4 1 0 T ( 5 2 % ) 使用作為金屬氧化物陶瓷。模塑方法基本上係與經載入不 銹鋼之PEEK所使用之方法相同，雖然對於大多數的組成物 將模塑溫度稍微向下調整。原型磁頭盤之收縮率係自 0 . 0 0 8至0 . 0 1 3英叶/英忖，其係可接受的量。此外，原 型顯著地平坦。第一原型磁頭盤模型具有平均平坦度 0 . 0 0 4 +/ - 0 · 0 0 1英吋/英吋，最大值〇 . 〇 〇 7英吋/英吋 19 312/發明說明書(補件)/92-11 /92124310 200408693 之用於接受讀/寫磁頭之表面；第二原型磁頭盤模型具有 平均平坦度0 . 0 1 3 +/ - Q. 0 1 0英吋/英吋，最大值0 . 〇 1 7 英吋/英吋之用於接受讀/寫磁頭之表面。 此等實驗之結果顯示可使用金屬氧化物於製造具多於 40重量百分比之金屬氧化物填料之淺色ESD防護讀/寫磁 頭盤，而不會使磁頭盤所需之機械性質受損。此外，此等 實驗顯示使用高溫、高強度聚合物與金屬氧化物，諸如金 屬氧化物陶瓷結合，可製得意料之外的平坦表面。 表3 :金屬氧化物與PEEK之各種化合物之性質。 純 碳纖維 (18°/〇) 金屬氧化物陶 瓷（52%) 比重 1. 3 1.4 2. 1 熔融溫度（°c ) 349 344 344 模數（Gpa) 3. 9 11 6. 5 破裂應力（MPa) 80 110 90 破裂應變（％) 50 1. 8 1. 8 實施例4 如表4中之指示，將P E E K與金屬氧化物陶瓷混合之各 種組成物之樹脂純度性質與碳纖維組成物（1 8重量％)及使 用作為控制之P E E K之純混合物作比較。將Z e 1 e c ® E C P 1 4 1 0 T ( 5 2重量％ )使用作為金屬氧化物陶瓷。經由將樣品 及1 0個提那克斯（T e n a X )管在1 0 0 °C下維持3 0分鐘，及使 用自動熱脫附單元-氣體層析儀/質量光譜儀分析釋放氣 體，而測量出氣。經由將材料之板置於稀硝酸中在8 5 °C下 1小時，及利用I C P / M S感應偶合電漿/質量光譜儀分析萃 取金屬，而分析金屬。經由使材料暴露至稀薄水在8 5 °C下 20 312/發明說明書(補件)/92-11 /92124310 200408693 1小時，隨後再利用離子層析儀分析水，而分析陰離子。 表5顯示回收的金屬。表6顯示回收的陰離子。 此等實驗之結果顯示金屬氧化物陶瓷較使用碳纖維形 成之相當材料具有顯著更多的可萃取金屬。然而，萃取金 屬之量適用於讀/寫磁頭盤。 表4 :含有金屬氧化物之各種高溫、高強度化合物之樹脂 純度。 純 PEEK 碳纖維 (18%) 金屬氧化物 陶瓷（5 2 % ) 出氣（V g/g) 0.60 0.62 0.50 金屬（ng/g ) 6 6 5 8 1057 2 2 7 8 陰離子（ng/g) 464 1104 41 9 表5 :表4之組成物之金屬層級。 存在金屬 純 Al、Ca、Co、Fe、K、Na、Ni、 Pb 、 Sn 、 Ti 碳纖維（1 8 % ) B、 Ca、 Co、 Fe、 K、 Mg、 Na、 Ni、Zn 金屬氧化物陶瓷 (52%) Al、B、Ba、Ca、Co、Cr、Cu、 Fe、K、Mg、Mn、Na、Ni、Pb、 Sb 、 Sn 、 Ti 、 Zn 表6:表4之各種PEEK化合物之陰離子 陰離子 (ng/g ) 純 碳纖維（1 8 % ) 金屬氧化物（5 2 °/〇) 氟根 41 0 34 56 氯根 BDL 400 280 硝酸根 BDL 130 14 硫酸根 10 對70 60 磷酸根 44 BDL 900 BDL指示低於彳貞測極限 氺氺氺 說明於文中之具體例係提供作為本發明之實例，而非要 限制本發明之範圍及精神。將記述於本申請案中之所有專 21200408693 发明 Description of the invention: [Technical field to which the invention belongs] This application claims the priority of the US provisional patent application serial number 6 0/4 0 7, 7 4 9 filed on September 3, 2002, and incorporates it into This article is for reference. [Prior art] A read / write head is an electronic component that reads information on a magnetic medium and / or writes information on a magnetic medium. Read / write heads are used in many electronic devices, and they are often used in computers to read or write information from computer memory. Complex assembly lines are typically used to make read / write heads and to mount them into electronic components. Read / write heads are stored in special read / write head disks and transported in them to make transport easy and make them ready for processing in assembly lines. Most read / write head disks must prevent any electrostatic discharge (ESD). The disk prevents ESD by making the surface on which the read / write head is placed a conductive surface. Conductive surfaces dissipate static electricity so that static charges cannot accumulate on the surface. The read / write head is dark and small; its appearance is similar to black peppercorns. Therefore, if the disk is dark, it is difficult to see the read / write head. Its dark color makes it difficult to confirm the presence of the read / write head in the disk, and to remove it from the disk, especially when used in machine vision (m a c h i n e v i s i ο η). A conventional read / write head disk is formed of a material obtained by mixing a polymer with stainless steel. Because stainless steel is made of a polymer as a conductive ESD protection material to compensate for the electrical properties of the polymer, it is sometimes called 5 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693 as a filler. Non-recorded steel is conductive 'and it performs well at South temperature. Without pigment, it will produce a dark color. However, it is difficult to mix stainless steel with the material to obtain a uniformly distributed stainless steel. If there is no uniform distribution, the material will be more likely to have small insulation points that impair the ESD protection properties of the material. Stainless steel has the potential to damage the magnetic properties of the read / write head. Materials made of stainless steel require high concentrations of pigments. Color it so that other properties of the material are impaired. SUMMARY OF THE INVENTION These problems can be solved by manufacturing a read / write disk that avoids the use of stainless steel. Metal oxide fillers are used instead of stainless steel; therefore, dyeable. Since the material is light-colored, it can be dyed, and it does not require a degree of pigment to dye it. The material for manufacturing the disc is preferably made of high temperature, high polymer and metal oxide. A preferred embodiment of the present invention is a read / write head disk. A part of the disk includes an electrostatic discharge protective surface for receiving the read / write head. The surface is made of a mixture of at least one high temperature, high strength polymer and at least one metal oxygen. Made of. Measurable material's color brightness and L value in the specified -1 / a H number (see discussion below), for example, more than about some specific examples are about colored objects used to receive electronic components, with multiple Each of the sealing bags has a mixed electrostatic discharge protective surface including at least one high-temperature polymer, at least one metal oxide, and at least one pigment. Some specific examples relate to a disk set for electronic processing. The disk set has at least two groups of disks, each of which includes a plurality of sealing bags each including an electrostatic discharge protective surface, and each group includes 312 / Invention Specification (Supplement) / 92-11 / 92124310, but the polymer material is 〇〇〇 The dyeing material is at least rain-strength, this compound _ CIE 55 ° Its two strong components have a group color that is different from the color of other groups of 200408693. Some specific examples are related to an object for receiving an electronic component. The object has a structure for contacting and supporting the electronic component, and the structure includes at least one electrostatic discharge protection surface. The electrostatic discharge protection surface includes at least one high temperature and high strength. A mixture of a polymer and at least one metal oxide, wherein the surface has an L value of more than about 55 or 65. Some specific examples relate to an object for receiving electronic components. The object includes a tray with a plurality of sealed bags, each sealed bag includes at least one electrostatic discharge protective surface, the electrostatic discharge protective surface includes at least a high temperature, high strength polymer A mixture of at least one metal oxide and at least one pigment, wherein the surface has an L value of more than about 55 or 65. Some specific examples are related to a method of manufacturing an article for electronic processing, which method includes molding a disc having a sealed bag including an electrostatic discharge protective surface including a high temperature, high strength polymer, and electrical conductivity. Filler, where the surface includes an L value of at least about 55 or 65 and a resistivity in the range of 103 to 1014 ohms per square, wherein the surface is more than an average of about 0.1 or 0.5 1 inch per inch The value is flat. Some specific examples relate to a method of manufacturing an article for electronic processing, the method comprising molding a tray having a sealed bag including an electrostatic discharge protective surface including a high temperature, high strength polymer and a conductive filler, The surface includes an L value of at least about 5 5 or 6 5 and a resistivity in the range of 103 to 1014 ohms per square, where the surface is more than about 0 · 1 or 0. 0 15 average per inch The value is flat. [Embodiment] A preferred specific example of the present invention is an ESD-protected read / write head disk, 7 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693, which is a light color and is polymerized by high temperature and high strength. And made of metal oxides. The metal oxide filler preferably includes ceramics. The brightness of the color of the material can use the Commission Internationale d'Eclairage L * a * b * color system (CIELab, see 1. en CIE 1 9 7 6 (L * a * b *) uniform color space and color difference The Development of the CIE 1976 (L * a * b *) Uni form Co 1 our-Space and Colour-Difference Formula), J _._ Society of Dyers and Colourists, 92: 338-341 (1976) G. L. kgoston, Color Theory and Its Application in Art and Design (Hedelberg, 1979) objectively quantified. As shown in Figure 1, the 1976 CIELH * system assigns a position for each color on a three-coordinate axis. L is a measure of brightness and has a value from 0 (black) to 100 (white). "L" is used here with respect to the 1 9 7 6 CIE system; elsewhere, you can use the same value as indicated by the "1 /" in this description. The a # axis indicates the amount of red or green, and the axis indicates the amount of yellow or blue. Therefore, a value of 0 for both "a #" and "h ^" indicates a balanced gray. Because the C I E L a b system is device-independent, it is a popular choice for computer imaging applications. The CIELab value can be measured using standardized tests familiar to those skilled in the art, for example, using a reflectometer. For example, the reflectance meter is manufactured by Ph 0 〇 t 〇 v ο 11 I n s t r u m en t s, Inc. (Minneapolis, MN) (Photovolt 577 type) and Minolta Corporation (Ramsey, NJ) (Minolta CM 2002 type). Therefore, L is an objective, quantifiable, and reproducible measure of the brightness of any color. 8 312 / Description of the Invention (Supplement) / 92-11 / 92 Π4310 200408693 With reference to FIG. 1, there are described materials which provide specific examples of L values from substantially 0 to about 100. For example, a very dark, near black color can be achieved by mixing a polymer with carbon black to achieve an L value close to 0. A white pigment, such as titanium oxide, may be added to obtain a color close to white, which is close to 100. An example of a light-colored electrostatic discharge protection material suitable for use as a support for the processing of electronic components is a polyetheretherketone mixed with about 54% by weight of antimony-doped tin oxide conductive material, which has 6 4 · 9 (see "6 5" in Figure 1) Use the L value measured using a reflectance spectrophotometer with the output programmed to the CIEL ab system. Other samples described in the text were visually determined to fall within the ranges described below. Compared to the conventional processing methods in the related arts, the specific examples described here provide materials with high L values while still maintaining proper mechanical and electrostatic discharge protection conductive properties. In addition, some specific examples retain moldability such as flatness. One of these specific examples is the use of metal oxides or ceramics to achieve electrostatic discharge protection and dyeing properties. Another aspect of some of these specific examples is the use of high temperature, high strength polymers. Another aspect of some of these specific examples is the use of isotropic flowing particles. All ranges within the continuum from about 0 to about 100 can be considered. Other specific examples result in dyeing having an L value of at least about 3, about 4, 5, about 5, 5, about 66, or about 80. Some specific examples have stains that fall within L values from about 45 to about 100, from about 55 to about 99, and from about 66 to about 90. For example, a material with an L value of more than about 5 5 will mean that the relevant material is closer to white on the C I E L a b scale than a material with an L value of about 5 5. As explained in the text, adjust the conductivity, polymerization, and concentration of the conductive material until the desired application reaches mechanical, 9 312 / Explanation _ Supplement) / 92-11 / 92124310 200408693 color, or the desired combination of conductive properties . Those skilled in the art can easily make such adjustments after reading this disclosure. High-temperature, high-strength polymers are preferred as they are highly resistant to heat and chemicals. Polymers are resistant to the chemical solvents N-fluorenyl, acetone, hexanone, and other aggressive polar solvents. High temperature, high strength polymers have glass transition temperatures and / or melting points above about 150 ° C. In addition, high strength, high temperature polymers have a stiffness of at least 2 G Pa. Examples of high temperature, high strength polymers are polyphenylene ether, ionomer resin, nylon 6 resin, nylon 6,6 resin, aromatic polyamide resin, polycarbonate, polyacetal, polyphenylene sulfide (PPS), trimethylpentene resin, polyetheretherketone (PEEK), polyetherketone (PEK), polysulfone (PSF), tetrafluoroethylene / perfluoroalkoxyethylene copolymer (PFA), polyethersulfone (PES), high-temperature amorphous resin (ΗΤΑ), polypropylene (PASF), polyetherimide (PEI), liquid crystal polymer (LCP), polyvinylidene fluoride (PVDF), ethylene / tetrafluoroethylene Copolymer (ETFE), tetrafluoroethane / hexafluoropropylene copolymer (FEP), tetrafluoroethane / hexafluoropropylene / perfluoroalkoxyethylene terpolymer (EPE), etc. Mixtures, blends, and copolymers including the polymers described herein may also be used. Particularly preferred are PEK, PEEK, PES, PEI, PSF, PASF, PFA, FEP, ΗΤΑ, LC, etc. Examples of high temperature, high strength polymers are also listed, for example, U.S. Patent Nos. 5,240, 753, 4, 757, 126, 4, 816, 556, 5, 767, 198, and patent application EP 1 178 082 And PCT / US99 / 24295 (W0 0 0/3 4 3 8 1), which is incorporated herein by reference. Metal oxide fillers include metal oxides and can be added to high-temperature, high-strength polymers to produce light-colored and usable as read / write head disks 10 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693 Conductive material with sufficient mechanical properties as ESD protection material. It is preferred to mix or coat metal oxides with ceramics, for example, ceramics doped with metal oxides. These fillers are typically light-colored, making them useful for making light-colored materials. Due to its light color, other dyes can be added to give the material a special color. In addition, ceramics are versatile, and metal oxide / ceramic bonding materials typically have conductivity properties that are independent of humidity. Ceramics are materials composed of a combination of metal and non-metal elements. Tauman includes metal oxides. Examples of suitable metal oxides include aluminum borate, zinc oxide, basic magnesium sulfate, oxidized ballast, potassium titanate, shed acid ballast, titanium oxide, tin oxide, and calcium sulfate. The listed oxides are examples and are not intended to limit the scope of the invention. Further examples of fillers are provided in, for example, U.S. Patent Nos. 6,413,489, 6,329,058, 5, 525,556, 5, 599, 511, 5, 447,708, 6, 413, 489, 5, 338, 334, and 5, 240, No. 753, which is incorporated herein by reference. Generally speaking, ' as needed, a metal emulsion is doped or coated with another metal to impart or enhance conductivity. A preferred filler is tin oxide, especially antimony-doped tin oxide, such as the product family provided by Milliken Chemical Co. under the trade name Zelec®. These products are small and roughly spherical, and are light gray-blue to light gray-green in color. These colors can produce materials with a wide range of light colors including white. In addition, antimony-doped tin oxide materials can be used to make transparent films, and it has the advantages of most ceramics, such as non-corrosive, resistance to acids, alkalis, oxidants, high temperatures, and many solvents. Another preferred type of filler is whiskers, especially titanate whiskers, and more 11 312 / Invention Specification (Supplements) / 92-11 / 92124310 200408693, especially potassium titanate and aluminum borate whiskers. For example, in U.S. Patent Nos. 5,9 4 2,205 and 5,2 40,7 53, which are incorporated herein by reference. The term whisker refers to a single crystal filament having a cross-sectional area of at most about 8 X 1 (Γ5 square inches) and a length of at least about 10 times the average diameter. The whisker is typically free of defects and is therefore more of a similar composition. Polycrystals are stronger. Therefore, some whisker fillers can improve the strength of composites and impart other properties such as improved rigidity, abrasion resistance, and static dissipation. A better type of whisker is provided by Otsuma Chemical Co. (Japan) Provided under the trade name DENTALL; it is a ceramic whisker coated with a thin layer of tin oxide. The size and shape of the filler are not limited, and may be, for example, whiskers, spheres, particles, fibers, or other shapes. Fillers The size is not limited, but small particles such as whiskers or spheres of equivalent size, or very small sizes are preferred. Techniques for making very small particles can be used, for example, using nanotechnology. Appropriate metal oxide fillers can be made Set in various forms. For example, the inert core particles can be coated with metal oxides. Therefore, the metal oxide coating is stretched by the inert particles, resulting in a cheaper product Alternatively, a hollow core can be used in place of the inert particles. Alternatively, the size of the particles can be made smaller by eliminating the core. Or the ceramic can be doped with a metal oxide. The doped material can be conductive while still retaining the ceramic The mechanical and dyeing properties of the metal oxide conductor should be provided in the material so as to form a three-dimensional interconnected network structure of the conductor. The network structure is provided as a circuit to exclude electrostatic charges. The concentration of the metal oxide conductor is related to the ESD property of the material The relatively low concentration of the metal oxide conductor produces a high surface resistivity. The resistivity decreases slowly as the concentration of the metal oxide conductor increases, until the metal oxide conductivity 12 312 / Invention Specification (Supplement V92-11 / 92124310 200408693) Begin contact with each other, and the further increase in the concentration of metal oxide conductors leads to a rapid decrease in resistivity until the "perc ο 1 ati ο η threshold" is reached. Finally, the optimal number of metal oxide conductors has been reached. Network structure, so further increase in metal oxide conductor concentration cannot generate electricity The ceramic concentration decreases substantially. Typically, adding a material with lower conductivity than metal oxide conductors will result in increased surface resistivity. Therefore, the addition of pigment will affect the surface resistivity, but the pigment and conductivity can be adjusted by The amount of filler is used to make a composition with the desired resistivity. Light-colored materials for read / write head disks have many advantages. One advantage is that the read / write head can be seen. Another advantage is that the disk can be dyed. , Can optimize the color to make the magnetic head easier to see. Or, different types of read / write head disks with different colors can be made, so that users can easily identify the disks with different modes and applications. The types or sizes of magnetic heads are stored in disks of different colors, so that the magnetic heads are efficiently transported and used. Some specific examples further add pigments to achieve not only the desired L value, but also special colors, such as red, green, blue, yellow, or a combination thereof. The pigment is added at a concentration suitable to obtain a desired color. The desired dyeing can be accomplished by adding pigments known to those skilled in the art and mixing them with conductive materials and polymers as described herein to achieve the desired color, conductivity, and mechanical properties. Examples of the pigment include titanium dioxide, iron oxide, chrome oxide green, iron blue, chrome green, aluminum sulfonate silicate, cobalt aluminate, barium manganate, lead chromate, cadmium sulfide, and cadmium selenide. If black is required, carbon black can be used, or carbon black can be used in a concentration that does not produce excessive darkness or black 13 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693. The colors that can be achieved with pigments span the visible spectrum, including white. The filler is preferably present in an amount sufficient to allow the read / write head disk to have a surface resistivity in a range of about 103 to about 10 14 ohms per square (a range that makes the surface have ESD protective properties); the surface resistivity It is more preferably in a range between about 104 and less than about 107 ohms per square. In addition, the filler is evenly distributed throughout the material to avoid small insulation points that would damage its ESD protection properties. In addition, the filler is better to avoid the presence of a black concentration in the material, and it is better to avoid the dark color in the material. The concentration of carbon black required to make the ESD protection material darkens the material and substantially blackens it. Conventional microchip disks are manufactured using carbon black. Materials made of polymers and carbon fillers are generally used in the manufacture of microchip disks used to hold microchips. However, the microchip disk of the prior art is not suitable as a read / write head disk because the microchip disk is very dark due to the presence of carbon filler. In a microchip disk, since the read / write head is small and dark, and the microchip disk is dark, the read / write head will be difficult to see. As a result, it is difficult to use such a prior art disk in combination with a read / write head. In addition, acceptable wafer disc surface resistivities typically range from at least about 107 to 108 per square. In contrast, acceptable surface resistivity of read / write head disks typically ranges from about 104 to less than about 107 ohms per square. Since it is necessary to add a conductive material to the polymer to produce an ESD protection material, a material having a resistivity of 108 ohms per square has more fillers than a material having a resistivity of 10 4 ohms per square, for example. . Due to the uncertainty associated with increasing the amount of filler to a high value, it is not possible to envisage transferring the method of manufacturing ESD protective materials for 14 312 / Invention Specification (Supplements) / 92-11 / 92124310 200408693 for computer wafer discs to reading / Write head disk. In addition, materials 'such as wafer carriers' used in computer wafer processing must have very low levels of extractable metal ions, but this is not a major concern for read / write head disk materials. Therefore, the technique and method for manufacturing a microchip disk cannot be applied to manufacturing a read / write head disk. As a result, scientists who make read / write head disks have developed technologies that are different from those used to make computer wafer disks. Instead of using a carbon filler, the read / write head disk is conventionally manufactured using a metal filler such as stainless steel. Stainless steel is electrically conductive, it performs well at high temperatures, and does not produce a dark color in the material. Since the material is not dark, the read / write head can be easily seen. The inventors have unexpectedly discovered that high temperature, high strength polymers can be mixed with more than about 40% by weight of ceramics to obtain desired processing properties such as moldability and flowability without loss of desired mechanical properties such as compression and Amazing results of tensile strength and moderately rigid ESD protective materials. Since although a polymer can be mixed with a suitable amount of non-polymeric material without losing the desired properties of the polymer in the final product, adding a large amount of non-polymeric material, i.e., more than about 40% by weight, would be expected to produce The end product is not similar to the properties of the polymer, so this result is quite amazing. Doped metal oxides or ceramics treated by them are preferred for producing ESD protection materials. However, a large number of such ceramics are typically required to achieve the desired conductivity in the material. The preferred concentration range for ceramics is between about 40% and about 75%, the more preferred concentration range is between about 45% and about 70%, and the more preferred range is about 50%. And about 60%. In addition, more than about 40% by weight of metal oxides and / or ceramics are added to 15 312 / Explanation _ Supplement) / 92-11 / 92124310 200408693 High-strength, high-temperature polymers can surprisingly produce Material, and more surprisingly, it is flatter than the surface obtained with stainless steel. However, in fact, the use of metal oxides and high-strength, high-temperature polymers produces flatter read / write head disks than disks made from stainless steel. Sometimes the term smooth can be used to indicate that it will not warp, as in the case of the priority document of this application, but for clarity, the term flat is used here to indicate that it will not warp. Warpage is the curvature that is sometimes undesirably introduced into the surface during molding or other processing steps. Therefore, the terms flatness and measure of roughness should not be confused. Flatness is a desired feature of read / write head disks. One possible reason for the unexpected flatness is that the metal oxide used in the flat surface has an isotropic flow shape. Isotropic flow shapes are resistant to shapes that are oriented in any particular direction due to the forces generated by the flowing fluid; in other words, the flow characteristics of the particles are approximately the same in all directions. Therefore, spherical particles have an isotropic flow shape because they are not oriented in any particular direction when they are mixed in a flowing fluid. In contrast, rod-shaped particles tend to align their longest axis in a direction parallel to the direction of flow, so they do not have an isotropic flow shape. Many specific examples here are described with reference to a read / write head disk, as they are preferred specific examples. However, it should also be understood that these instructions apply more broadly to all types of discs used in electronic processing. Disks are used, for example, in the manufacturing of microchips, computer components, and audio components. See also U.S. Patent No. 6,079,565 and U.S. Patent No. 10/2 4 1,8 filed on September 11, 2002. 1 5, which is incorporated herein by reference. Electronic processing involves processes that involve assembling components for the electronics industry. Since the component must be sealed in accordance with 16 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693 and can protect the component from contamination and storage, there is an electrostatic sealing bag used for this process contact, so it is supported. For example, as in FIGS. 2 and 3, the sealing bag can be, for example, engraved, grooved, or restrict the component to the disk when the component is on the disk without removing the component from the disk (Figure 4). easy. The surface may include materials that are molded into the surface by knowing from the material mold, assuming that the entire upper part of the surface similar to the material may have a flatness measurement or L value colorimetry that is different from the entire surface and can be known in inches per inch Average. Therefore, such a measurement is possible, such as atomic force microscopy with reference to Figs. 2-4, which depicts a bag 180 having a bottom surface 120, and a side surface 102 thereon. The top of the tray 100 is divided between the sealing bags 180. The side of the top plate 1 2 2 is continuous and perpendicular to it. The lip 1 1 2 is perpendicular to the side of the bottom plate. It is set in a stacked form 1 0 1 and is not moved and / or stored in a static discharge manner. The disc includes a protective surface that receives and discharges electronic components. The disc has a plurality of. The module is housed in a sealed bag of the disc, and the space surrounded by this wall, column, or protrusion is so mobile that it can be successfully moved to other structures. The trays can be stacked preferably on a pallet, for example, to handle materials obtained from a plastic surface. Therefore, if you know the material in the surface. Therefore, it is possible to compose the composition, although it is necessary to know the most specific composition of the surface. In addition, the average flatness measured by the meter can be determined. A measurement can be used, which provides an average of a significant portion of the surface and an average of a very small portion of the surface. A plurality of sealed bags of 1 0 0 to 1 0 0. The seal forms the object on the bottom surface 1 2 0 and the end surface 132 is continuous and defines the end surface 1 3 2 and the outer edge 1 1 6 and above. The side of the plate 1 2 2 is perpendicular to the lip 1 1 2. 1 1 4. Referring to FIG. 4, the disk 1 0 0 can be caused to impact the bottom disk surface 1 2 6 on the electric unit 17 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693 pieces (for example, depicted by 2008). The lip 1 1 2 serves as the contact stop of the bottom disk surface 1 2 6. Example 1 A prototype read / write head disk was prepared by molding from a mixture of a metal oxide ceramic and PEEK as indicated in Table 1. The molding method is basically the same as that used for PEEK loaded with stainless steel, although the molding temperature is adjusted slightly downward. The results of these experiments show that Z e 1 e c ® E C P 1 4 1 〇 T is a better metal oxide ceramic used in the manufacture of light-colored read / write head disks. In addition, high-temperature, high-strength polymers can be loaded with more than 40 percent of the filler without compromising the mechanical properties required for read / write head disks. Furthermore, it has been surprisingly found that the surface for fixing the read / write head is flat and has a flatness that exceeds that obtained by using a non-recording steel filler. Table 1: Mixtures of metal oxide particles and high temperature, high strength polymers. Metal oxide filler loading (wt.%) Color surface resistivity (ohms / square) Zelec® ECP 1410T 40 light gray 1013 Zelec® ECP 1410T 60 light gray 105 Zelec® ECP 141 OM 40 dark gray 105 Zelec® ECP 1410M 60 No action-Zelec® ECP 1410XC 40 No action-Zelec® ECP 1410XC 60 No action-18 312 / Description of the Invention (Supplement) / 92-11 / 92124310 200408693 Example 2 PEEK and A mixture of metal oxide ceramics is molded to prepare a prototype read / write head disk. The molding method is basically the same as that used for PEEK loaded with stainless steel, although the molding temperature is adjusted slightly downward. The results of these experiments show that metal oxide ceramics can be used to make light-colored read / write head disks with ESD protection. In addition, high-temperature, high-strength polymers can be loaded with more than 40 percent filler without compromising the mechanical properties required for read / write head disks. Table 2: ESD properties of mixtures of metal oxide particles and high temperature, high strength polymers. Load (%) Surface resistivity (ohm / square) Static dissipation (seconds) 40 1013 100 47 1013 120 52 107 0. 03 54 105 0. 03 60 105 0. 03 60 105 0.03 Example 3 As shown in Table 3 Indicate that the properties of various components of PEEK mixed with metal oxide ceramics are compared with the carbon fiber composition (18% by weight) and the use of a pure mixture of PEEK as a control. Z e 1 e c ® E C P 1 4 1 0 T (52%) was used as the metal oxide ceramic. The molding method is basically the same as that used for PEEK loaded stainless steel, although the molding temperature is adjusted slightly downward for most compositions. The shrinkage rate of the prototype magnetic head disk is from 0.08 to 0.013 inch / inch, which is an acceptable amount. In addition, the prototype is significantly flat. The first prototype magnetic head disk model has an average flatness of 0.04 + /-0 · 0 0 1 inch / inch with a maximum value of 0.07 inch / inch 19 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693 The surface used to receive read / write heads; the second prototype head disk model has an average flatness of 0. 0 1 3 + /-Q. 0 1 0 inch / inch, maximum 0 〇17 inch / inch surface for receiving read / write heads. The results of these experiments show that metal oxides can be used to fabricate light-colored ESD-protected read / write head disks with more than 40 weight percent metal oxide filler without compromising the mechanical properties required for the head disk. In addition, these experiments have shown that the use of high temperature, high strength polymers in combination with metal oxides, such as metal oxide ceramics, can produce unexpected flat surfaces. Table 3: Properties of various compounds of metal oxides and PEEK. Pure carbon fiber (18 ° / 〇) Metal oxide ceramic (52%) Specific gravity 1. 3 1.4 2. 1 Melting temperature (° c) 349 344 344 Modulus (Gpa) 3. 9 11 6. 5 Rupture stress (MPa) 80 110 90 Rupture Strain (%) 50 1. 8 1. 8 Example 4 As indicated in Table 4, the resin purity properties and carbon fiber composition (18% by weight) of various compositions in which PEEK and metal oxide ceramics were mixed ) And using a pure mixture of PEEK as a control. Z e 1 e c ® E C P 1 4 1 0 T (52% by weight) was used as the metal oxide ceramic. The measurement was performed by maintaining the sample and 10 Tena X tubes at 100 ° C for 30 minutes, and analyzing the released gas using an automatic thermal desorption unit-gas chromatograph / mass spectrometer. Out of breath. The metal was analyzed by placing the plate of the material in dilute nitric acid at 85 ° C for 1 hour, and analyzing the extracted metal using an IC P / MS induction coupling plasma / mass spectrometer. Anion was analyzed by exposing the material to thin water at 85 ° C for 20 312 / Invention Specification (Supplement) / 92-11 / 92124310 200408693 for 1 hour, followed by analysis of the water using an ion chromatograph. Table 5 shows the recovered metals. Table 6 shows the anions recovered. The results of these experiments show that metal oxide ceramics have significantly more extractable metals than comparable materials formed using carbon fibers. However, the amount of metal extracted is suitable for read / write head disks. Table 4: Purity of various high temperature, high strength compounds containing metal oxides. Pure PEEK carbon fiber (18%) metal oxide ceramic (52%) outgassing (V g / g) 0.60 0.62 0.50 metal (ng / g) 6 6 5 8 1057 2 2 7 8 anion (ng / g) 464 1104 41 9 Table 5: Metal levels of the composition of Table 4. Presence of metallic pure Al, Ca, Co, Fe, K, Na, Ni, Pb, Sn, Ti carbon fibers (18%) B, Ca, Co, Fe, K, Mg, Na, Ni, Zn metal oxide ceramics ( 52%) Al, B, Ba, Ca, Co, Cr, Cu, Fe, K, Mg, Mn, Na, Ni, Pb, Sb, Sn, Ti, Zn Table 6: Anions and anions of various PEEK compounds in Table 4 (ng / g) pure carbon fiber (18%) metal oxide (5 2 ° / 〇) fluoride 41 0 34 56 chloride BDL 400 280 nitrate BDL 130 14 sulfate 10 to 70 60 phosphate 44 BDL 900 BDL The indication is lower than the "testing limit". The specific examples described in the text are provided as examples of the present invention and are not intended to limit the scope and spirit of the present invention. All patents that will be described in this application 21
312/發明說明書(補件)/92-11/9212汜10 200408693 利及公告併入本文為參考資料。 本發明之一具體例係一種讀/寫磁頭盤，盤的至少一 分包括用於接受讀/寫磁頭的靜電放電防護表面，此表 係由至少一高溫、高強度聚合物及至少一金屬氧化物之 合物所製成。本發明之另一具體例係一種利用選自包括 苯硫、聚醚醯亞胺、聚芳基酮、聚醚酮、聚醚醚酮、聚 酮酮、及聚醚砜之高溫、高強度聚合物製成之盤。本發 之另一具體例係一種盤，其中至少一金屬氧化物係選自 括硼酸鋁、氧化鋅、鹼性硫酸鎂、氧化鎂、石墨、鈦酸卸 硼酸鎂、二硼化鈦、氧化錫、硫酸鈣、及經摻雜銻之氧 錫。本發明之另一具體例係一種盤，其中金屬氧化物係 顆粒設置，且此顆粒係以至少4 0重量百分比之濃度，或 5 0及7 0百分比之間之濃度存在於混合物中。顆粒亦可 一步包括陶兗。此外，金屬氧化物可以晶鬚設置。此外 晶鬚可選自包括由鈦酸鉀及硼酸鋁製成之晶鬚。本發明 另一具體例係一種包括以顆粒設置之金屬氧化物之填料 其中此顆粒具有等向性的流動形狀。 【圖式簡單說明】 圖1描繪一些具體例之1 9 7 6 CIE l/a*b'空間及L值之 標系統； 圖2描繪用於接受電子組件之多封袋盤； 圖3描繪如由圖2中之線條3 - 3所指示之視圖之圖2 橫剖面；及 圖4描繪複數個呈堆疊形態之圖2之盤。 312/發明說明書(補件)/92-11 /92124310 部 面 混 聚 明 包 化 以 在 進 之 座 之 22 200408693 (元件符號說 100 101 1 02 112 114 116 120 122 126 132 180 208 盤 堆疊形態 側面 唇 下方盤側面 外緣 底表面 上方盤側面 底部盤表面 頂端表面 封袋 電組件312 / Invention Specification (Supplement) / 92-11 / 9212 汜 10 200408693 The benefit and announcement are incorporated herein by reference. A specific example of the present invention is a read / write head disk. At least one part of the disk includes an electrostatic discharge protection surface for receiving the read / write head. The watch is oxidized by at least one high temperature, high strength polymer and at least one metal. Made of the compound of things. Another specific example of the present invention is a high-temperature, high-intensity polymerization using a material selected from the group consisting of phenylsulfide, polyetherimide, polyarylketone, polyetherketone, polyetheretherketone, polyketoneketone, and polyethersulfone. Made of objects. Another specific example of the present invention is a disk, wherein at least one metal oxide is selected from the group consisting of aluminum borate, zinc oxide, basic magnesium sulfate, magnesium oxide, graphite, magnesium titanate, titanium diboride, and tin oxide. , Calcium sulfate, and tin oxide doped with antimony. Another embodiment of the present invention is a disc in which metal oxide particles are provided, and the particles are present in the mixture at a concentration of at least 40 weight percent, or a concentration between 50 and 70 percent. The granules can also include pottery in one step. In addition, the metal oxide may be provided with a whisker. In addition, the whiskers may be selected from the group consisting of whiskers made of potassium titanate and aluminum borate. Another embodiment of the present invention is a filler including a metal oxide provided in particles in which the particles have an isotropic flow shape. [Schematic description] Figure 1 depicts some specific examples of the 1 9 7 6 CIE 1 / a * b 'space and L value standard system; Figure 2 depicts multiple pouches for receiving electronic components; Figure 3 depicts such as A cross section of FIG. 2 with a view indicated by lines 3-3 in FIG. 2; and FIG. 4 depicts a plurality of discs of FIG. 2 in a stacked configuration. 312 / Invention Manual (Supplements) / 92-11 / 92124310 The surface is mixed and packed to make it into the seat 22 200408693 (the component symbol says 100 101 1 02 112 114 116 120 122 126 132 180 208 tray side Below the lip, the outer edge of the side of the disk, the bottom surface, the top of the disk, the bottom of the disk, the top surface, and the top surface of the bag.
312/發明說明書(補件)/92-11 /92124310 23312 / Invention Specification (Supplement) / 92-11 / 92124310 23