KR101883727B1 - EMI shielding particle, EMI shielding composite including the EMI shielding particle, EMI shielding adhesive film including the EMI shielding composite and apparatus including the EMI shielding composite - Google Patents

Abstract

An EMI shielding composite comprising EMI shielding particles, a matrix material and the EMI shielding particles, an EMI shielding adhesive film comprising the composite, and an EMI shielding composite are provided.

Description

FIELD OF THE INVENTION [0001] The present invention relates to EMI shielding particles, EMI shielding composites including the EMI shielding particles, EMI shielding adhesive films including the EMI shielding composites, and EMI shielding particles. including the EMI shielding composite and apparatus including the EMI shielding composite}

An EMI shielding composite including EMI shielding particles, EMI shielding particles, an EMI shielding adhesive film including the EMI shielding composite, and an EMI shielding composite.

EMI (Electro Magnetic Interference), which can be derived from various electronic devices such as a smart phone, an LCD, and an OLED, may adversely affect the human body.

Various types of EMI shielding films are currently being developed for EMI shielding, but conventional EMI shielding films have problems such as EMI shielding effect being inferior to expectation, so that effective shielding of EMI is achieved, It is urgent to develop a novel concept of EMI shielding material which can be applied to various applications and forms.

An EMI shielding composite including the EMI shielding particles, an EMI shielding adhesive film including the EMI shielding composite, and an EMI shielding composite material having excellent EMI shielding and durability.

According to one aspect,

Insulating core; And

A shell covering the surface of the insulative core and including an EMI shielding material;

EMI shielding particles are provided.

According to another aspect, there is provided an EMI shielding composite comprising the EMI shielding particles.

According to another aspect,

The EMI shielding composite comprising:

Wherein the matrix material included in the EMI shielding composite comprises an adhesive material,

The EMI shielding composite is an EMI shielding film in the form of a film,

There is provided an EMI shielding adhesive film further comprising at least one of a base film, a release film and a metal layer.

According to another aspect, an apparatus is provided, including the EMI shielding composite.

The EMI shielding particles have excellent EMI shielding and durability and are not only lightweight but also excellent in compatibility with various matrix materials. The composite material including the matrix material and the EMI shielding particles may have various uses and / or forms have. Accordingly, the EMI shielding composite material including the EMI shielding particles is used in various devices, and can effectively perform an excellent EMI shielding function for a long period of time.

FIG. 1 schematically shows an embodiment of the EMI shielding particle. FIG.
2 is a schematic illustration of a cross section of one embodiment of the EMI shielding particle.
3 is a schematic illustration of a cross section of another embodiment of the EMI shielding particle.
Figure 4 is a schematic illustration of a cross section of another embodiment of the EMI shielding particle.
5 is a view schematically showing a cross section of an embodiment of the EMI shielding film.
6 is a view schematically showing a cross section of one embodiment of the EMI shielding adhesive film.
7 is a view schematically showing a cross section of another embodiment of the EMI shielding adhesive film.
8 is a TEM photograph of the aluminum powder (EMI shielding particle A) used in Comparative Example A. FIG.
Fig. 9 is a TEM photograph of the EMI shielding particle 1 produced in Example 1. Fig.

EMI shielding particles

The EMI shield particle 10 according to one embodiment is shown in FIG. 1, and a schematic cross-section of the EMI shield particle 10 is shown in FIG.

The EMI shielding particle 10 includes an insulating core 11 and a shell 15 covering the surface of the insulating core 11 and including an EMI shielding material.

EMI shielding particles 10 including the insulating core 11 and the shell 15 are clearly distinguished from particles made of an EMI shielding material only. Without being limited by a particular theory, for example, without the insulating core 11, particles made of only silver (Ag) have a relatively large standard deviation of particle diameters and can not be uniform in particle form, The surface roughness can be relatively large. Therefore, it may be difficult to uniformly disperse in the matrix material to be described later, and the EMI shielding efficiency may be lowered.

The insulating core 11 may improve the durability of the EMI shield particle 10 and may serve to maintain the shell 15 in shape and to prevent damage to the shell 15. [

The insulating core 11 may be a spherical core.

The shell 15 includes an EMI shielding material and functions to impart EMI shielding performance to the EMI shielding particles 10. [

The shell 15 may be a continuous film covering the surface of the insulating core 11.

The outer surface of the shell 15 may be smooth.

According to one embodiment, the shortest distance d ₁ from an arbitrary point P ₁ on the outer surface of the shell 15 to the surface of the insulating core 11 and the shortest distance d ₁ between the shortest distance d ₁ on the outer surface of the shell 15, other jeomin P ₂ from the difference between the minimum distance (d ₂₎ of the surface to the insulating core 11, for 0㎛ 1㎛ to, for example, to 0㎛ 0.1㎛, as another example, to 0.01 0㎛ Mu m, but is not limited thereto. Here, P _{1, which} is an arbitrary point on the outer surface of the shell 15, may be all points on the outer surface of the shell 15. That is, the deviation between the thicknesses measured at any point of the shell 15 may range from 0 탆 to 1 탆, for example from 0 탆 to 0.1 탆, and as another example, from 0 탆 to 0.01 탆 .

According to another embodiment, the shortest distance d ₁ from an arbitrary point P ₁ on the outer surface of the shell 15 to the surface of the insulating core 11 and the shortest distance d ₁ between the shortest distance d ₁ on the outer surface of the shell 15, the shortest distance (d ₂₎ of the other one jeomin from P ₂ to the surface of the dielectric core 11 is, practically, may be equal to each other. Here, P _{1, which} is an arbitrary point on the outer surface of the shell 15, may be all points on the outer surface of the shell 15. That is, the thicknesses measured at arbitrary points of the shell 15 may be equal to each other.

Such a shell 15 is made of, for example, a plurality of particle-shaped EMI shielding fillers, and is clearly distinguished from a shell having a large surface roughness (that is, an uneven outer surface) on the outer surface.

As described above, the EMI shielding particles 10 including the shell 15 having a smooth outer surface and a relatively small deviation between the measured thicknesses at arbitrary points can have excellent light reflection efficiency.

The ratio between the diameter d ₃ of the insulating core 11 and the thickness d ₁ and d ₂ of the shell 15 is in the range of 2: 1 to 20,000: 1, for example, 20: 1 to 4000 : 1. ≪ / RTI > The diameter d ₃ of the insulating core 11 may be selected in the range of 1.0 탆 to 100 탆, for example, in the range of 1 탆 to 40 탆. The thickness (d ₁ , d ₂ ) of the shell 15 may be selected in the range of 0.005 μm to 0.5 μm, for example, in the range of 0.01 μm to 0.05 μm. The thickness of the diameter (d ₃₎ to the diameter (d ₃₎ and the shell (15) of rain, the insulating core (11) between the thickness (d _1, d ₂₎ of the shell (15) of the insulating core 11 ( d ₁ , d ₂ ) falls within the above-mentioned range, it is possible to obtain an EMI shielding particle 10 having excellent compatibility and durability with respect to various matrix materials while having excellent EMI shielding performance and durability have.

There is no space between the surface of the insulating core 11 and the inner surface of the shell 15. [

According to one embodiment, the surface of the insulating core 11 and the inner surface of the shell 15 are in contact with each other.

According to another embodiment, the entire surface of the insulating core 11 is covered with the shell 15, and there is no void space inside the EMI shielding particle 10.

As a result, damage of the shell 15 of the EMI shielding particles 10 can be prevented, and the EMI shielding particle 10 can have excellent durability.

The insulating core 11 may comprise silicon, silicon oxide, an insulating resin, or any combination thereof.

According to one embodiment, the insulating resin is at least one selected from the group consisting of nylon resin, polyethylene resin, polypropylene resin, polybutylene resin, polyester resin, polyurethane resin, styrene butadiene resin, vinyl resin, polycarbonate resin, polysulfone resin, poly Polyvinyl acetate resins, polyvinyl acetate resins, polystyrene resins, styrene divinylbenzene resins, silicone resins, epoxy resins, phenolic resins, polyethylene resins and acrylic resins (for example, poly (Methyl methacrylate) (PMMA)), but the present invention is not limited thereto.

For example, the insulating core 11 may be made of an acrylic resin (for example, poly (methyl methacrylate) (PMMA) or the like), but is not limited thereto.

The EMI shielding composite 10, including the EMI shielding particles 10, can be made of a lightweight (e.g., non-conductive) material, Lt; / RTI >

The shell 15 includes an EMI shielding material.

The EMI shielding material may include an inorganic material (e.g., an EMI shielding metal), and the shell 15 may not include organic matter. The organic material means any chemical species including carbon. Therefore, the shell 15 is clearly distinguished from any shell formed by, for example, a plating method. Any shell formed by the plating method essentially contains an organic material derived from various dispersants, acidity regulators and the like, which are inevitably included in the plating composition. As a result, the shell 15 does not include an organic matter, which is an impurity having a poor EMI shielding function, and can have an excellent EMI shielding efficiency.

According to one embodiment, the shell 15 is made of an EMI shielding material, and the EMI shielding material may be an inorganic (e.g., EMI shielding metal).

For example, the EMI shielding material that may be included in the shell 15 may include at least one of copper (Cu), iron (Fe), nickel (Ni), aluminum (Al), tin (Sn) But is not limited to, at least one metal selected from Au, Ag, Cr, or any combination thereof (for example, an alloy including two or more metals).

As another example, the EMI shielding material that may be included in the shell 15 may include, but is not limited to, at least one metal selected from silver (Ag) and copper (Cu).

For example, the shell 15 may be a single layer of EMI shielding material. According to one embodiment, the shell 15 may be a single layer of silver (Ag).

Meanwhile, according to another embodiment, the shell 15 may have a multi-layer structure. That is, the shell 15 may include two or more separate shells. The two or more distinct shells may comprise different materials.

3 schematically illustrates a cross-section of one embodiment of an EMI shielding particle 20 including a two-layered shell.

The EMI shielding particles 20 include an insulating core 21 and a shell 25 covering the surface of the insulating core 21 and including an EMI shielding material. The shell 25 includes a first shell 25-1 covering the surface of the insulating core 21 and a second shell 25-2 covering an outer surface of the first shell 25-1 .

The ratio of the thickness d ₄ of the first shell 25-1 to the thickness d ₅ of the second shell 25-2 is in the range of 10: 1 to 1:10, for example, 3: 7 to 7: 3, but the present invention is not limited thereto.

For a description of the insulating core 21, refer to the description of the insulating core 11 in Fig.

According to one embodiment, the first shell 25-1 and the second shell 25-2 each include an EMI shielding material, and the EMI shielding material included in the first shell 25-1 and the shielding material The EMI shielding materials included in the two shells 25-2 may be different from each other. For example, the first shell 25-1 may include copper (Cu) and the second shell 25-2 may include silver (Ag).

The EMI shielding particle may further include a protective layer covering the shell outer surface. The protective layer serves to prevent corrosion of the shell including the EMI shielding material. The protective layer may include an antioxidant material. For example, the antioxidant material may include an alloy of two or more metals including a low-reactivity metal or a low-reactivity metal. According to one embodiment, the antioxidant may be an alloy of nickel (Ni) and chromium (Cr), but is not limited thereto.

4 is a schematic illustration of a cross-section of one embodiment of EMI shielding particles 30 including a protective layer 37. FIG.

The EMI shielding particle 30 includes an insulating core 31, a shell 35 covering the surface of the insulating core 31 and including an EMI shielding material, and a protective layer 37 covering the outer surface of the shell 35 ).

The insulating core 31 and the shell 35 are described with reference to the description of the insulating core 11, 21 and the shell 15, 25, respectively.

According to one embodiment, the shell 35 comprises copper (Cu) and the protective layer 37 may comprise an alloy of nickel and chromium (the weight ratio of nickel to chromium is 8: 2) But is not limited thereto.

The range of 10, for example, 3: the thickness of the shell (35) (d ₆₎ and a ratio of 10 with a thickness (d ₇₎ of the protective layer 37: 1 to 1: 7 to 7: 3 range , But is not limited thereto.

Method for manufacturing EMI shielding particles

The method of manufacturing the EMI shielding particles 10, 20, and 30 may include forming a shell 15, 25, 35 including an EMI shielding material on the surfaces of the insulating core 11, 21, 31 .

The step of forming the shells 15, 25, and 35 including the EMI shielding material on the surfaces of the insulating cores 11, 21, and 31 may be performed by a sputtering method.

Wherein the vacuum chamber for sputtering comprises a target including an EMI shielding material for forming a shell on which a container containing the insulating core 11, 21, 31 is placed, shells 15, 25, 35, And an electrode to be exposed.

The shells 15, 25 and 35 of the EMI shielding particles 10, 20 and 30 are formed on the surfaces of the insulating cores 11, 21 and 31 by sputtering to have a smooth outer surface and a constant thickness (Not shown) formed on the surface of the insulating core 11, 21, 31 but also may be formed to be substantially free of impurities (for example, organic matter) other than the material (for example, EMI shielding material) . The shells 15, 25 and 35 of the EMI shielding particles 10, 20 and 30 formed in this way are, for example: i) composed of a plurality of particulate EMI shielding fillers, Shell ") formed by a plating method, which essentially includes an organic material derived from a dispersant, an acidity regulator and the like, which is inevitably contained in a composition for plating, and ii) a " shell " .

According to one embodiment, the sputter cathode power for forming the shells 15, 25 and 35 may be between 0.1 and 5 Kw, and the inert gas supplied into the vacuum chamber for forming the shells 15, 25 and 35 The degree of vacuum of the vacuum chamber for forming the shells 15, 25, and 35 may be adjusted to 0.1 mTorr to 5 mmTorr, but is not limited thereto.

The method of manufacturing the EMI shielding particles may further include forming an insulating core on the surfaces of the insulating cores before the step of forming the shells including the EMI shielding material on the surfaces of the insulating cores, 11, 21, 31).

The preprocessing step may improve the bonding strength between the surface of the insulating core 11, 21, 31 and the inner surface of the shell 15, 25, 35 including the EMI shielding material, and / And may be performed to remove various contaminants, moisture, static electricity, and the like existing on the surface.

The preprocessing step may include at least one of plasma treatment for the surface of the insulating core 11, 21, 31 and ultrasonic treatment for the insulating core 11, 21, 31, for example.

The plasma treatment may be performed, for example, by plasma-treating the surface of the insulating core 11, 21, 31 in an atmosphere containing at least one of argon, oxygen and nitrogen.

By the ultrasonic treatment, friction between the insulating cores 11, 21, and 31 is induced by ultrasonic vibration, and various contaminants and the like on the surfaces of the insulating cores 11, 21, and 31 can be removed.

The method of fabricating the EMI shielding particles 10 may include forming the shells 15, 25 and 35 including the EMI shielding material on the surfaces of the insulating cores 11, 21 and 31, And drying the shielding particles (10, 20, 30).

The drying step may be carried out by forming the shells 15, 25 and 35 on the surfaces of the insulating cores 11, 21 and 31 by sputtering and then forming the shells 15, 25 and 35 by 25% or less (for example, 5% to 25% Humidity < / RTI > and temperature conditions of 50 DEG C to 80 DEG C for 1 hour to 2 hours. The drying temperature can be adjusted by gradually warming to a specific temperature at room temperature.

The manufacturing method of the first shell 25-1, the second shell 25-2 and the protective layer 37 of the EMI shielding particles 20 and 30 shown in FIGS. , Respectively.

EMI shielding composite and manufacturing method thereof

The EMI shield particles 10, 20, 30 as described above can be mixed with various matrix materials. Thus, according to another aspect, there is provided an EMI shielding composite comprising a matrix material and the EMI shielding particles (10, 20, 30). The matrix material and the EMI shielding particles (10, 20, 30) included in the EMI shielding composite may be mixed. Refers to a material different from the EMI shielding particles 10,20 and 30 which can be mixed with the EMI shielding particles 10,20 and 30, May be larger or smaller than the content of the shielding particles (10, 20, 30).

The description of the EMI shielding particles 10, 20, and 30 included in the EMI shielding composite is described above.

The matrix material included in the EMI shielding composite may be selected from an adhesive material, a polymer resin, a polymerizable monomer, a solvent, an ink, and a paint.

The adhesive material may be selected from materials having any known adhesiveness. For example, the adhesive material may be selected from a polyvinyl alcohol-based compound, a polyurethane-based compound, a polyester-based compound, a polyacrylic-based compound, and a polyepoxy-based compound, but is not limited thereto. For example, epoxy acrylate may be used as the adhesive material, but the present invention is not limited thereto.

The polymer resin may be selected from any known polymer resin such as an insulating resin, a thermoplastic resin, and a thermosetting resin. Alternatively, the polymer resin may be a polymerization product of a polymerizable monomer described below.

The polymerizable monomer may be a monomer having a polymer capable of forming a polymer by various polymerization reactions, for example, a styryl group, an oxide group, a halogen atom, or the like.

The solvent may be selected from any solvent capable of mixing with the EMI shielding particles to provide fluidity to the EMI shielding composite.

The ink and the paint may be selected from commercially available ink compositions for forming a resist, commercially available paints including various dyes and / or pigments.

The EMI shielding composite may have the form of particles, films, parts having any shape, or liquid composition having any viscosity.

According to one embodiment, if the matrix material comprises an adhesive and the EMI shielding composite has the form of a film, the EMI shielding composite may be used as a functional layer of an EMI shielding adhesive film.

According to another embodiment, if the matrix material comprises a polymer resin and the EMI shielding composite has the form of a part having any shape, the EMI shielding composite may be a part , EMI shielding film).

According to another embodiment, if the matrix material comprises a polymerizable monomer and the EMI shielding composite has the form of a liquid composition having any viscosity, the EMI shielding composite may comprise a composition for forming a part having a predetermined pattern .

According to another embodiment, if the matrix material comprises at least one of solvent, ink and paint, and the EMI shielding composite has the form of a liquid composition having any viscosity, the EMI shielding composite may have an EMI shielding function May be used as a composition which can be directly supplied to various substrates (for example, provided directly by spraying).

According to another embodiment, if the matrix material is an adhesive or a solvent and the EMI shielding composite has the form of particles, the EMI shielding composite may be provided directly to a substrate requiring EMI shielding (e.g., Directly provided). ≪ / RTI >

The matrix material may further include at least one material selected from a dispersing agent, a crosslinking agent, a filler, a viscosity modifier, a curing agent, and a polymerization initiator depending on the use and form of the EMI shielding composite material.

For example, the crosslinking agent may include at least one substance selected from boric acid, glutaraldehyde, melamine, peroxy ester compounds and alcoholic compounds, and the dispersant may be a saturated hydrocarbon ester, But are not limited to, ethylcellosolve, methylcellosolve, ethylcellosolve acetate, silica, or any combination thereof.

According to one embodiment, the matrix material comprises an adhesive material, a crosslinking agent, and a dispersant, wherein the adhesive material may include epoxy acrylate, peroxy ester as the crosslinking agent, and silica as a dispersing agent, no.

The method of fabricating the EMI shielding composite includes mixing the EMI shielding particles and the matrix material. The step of mixing the EMI shielding particles and the matrix material may be mechanical mixing, for example, mechanical mixing using a stirrer or an ultrasonic mixer, but is not limited thereto.

According to one embodiment, the method of fabricating the EMI shielding composite comprises mixing the EMI shielding particles with a dispersing solvent prior to mixing the EMI shielding particles and the matrix material to provide an EMI shielding particle-containing dispersion As shown in FIG. The dispersion solvent is a solvent that serves to provide an EMI shield particle-containing dispersion such that the EMI shield particles can be uniformly mixed with the matrix particles. For example, ethanol, methanol, propane, Can be selected from among the solvents which are easy to use. For example, the EMI shield particle-containing dispersion may include, but is not limited to, 45 to 55 parts by weight of a dispersing solvent per 100 parts by weight of EMI shielding particles. The mixing of the EMI shield particles and the dispersion solvent may be performed by mechanical mixing, for example, mechanical mixing using a stirrer or an ultrasonic mixer, but is not limited thereto.

The mixing of the EMI shielding particles and the matrix material may be performed by directly mixing the EMI shielding particles and the matrix material or by mixing the matrix material with an EMI shielding particle containing dispersion as described above .

When the EMI shielding particle-containing dispersion and the matrix material are mixed, 10 to 50 parts by weight of the EMI shielding particle-containing dispersion per 100 parts by weight of the matrix material may be mixed, but the present invention is not limited thereto.

The method for fabricating an EMI shielding composite may further include removing any solvent after mixing the EMI shielding particles and the matrix material or after mixing the EMI shielding particles and the matrix material. The optional solvent may be, for example, a dispersion solvent contained in the EMI shield particle-containing dispersion. According to one embodiment, the solvent removal step may be performed by heat treatment.

EMI shielding film

5 is a schematic view showing a cross section of an EMI shielding film 200, which is an embodiment of an EMI shielding composite having the above film form.

The EMI shielding film 200 may include a matrix material 23 and EMI shielding particles 10. The description of the matrix material 23 and the EMI shielding particle 10 are each described above.

For example, the matrix material 23 may comprise an adhesive material. Alternatively, the matrix material 23 may further include at least one of a crosslinking agent and a dispersing agent in addition to the adhesive material. When the matrix material 23 includes an adhesive material and a crosslinking agent, the amount of the adhesive material may be 60 to 70 parts by weight per 100 parts by weight of the matrix material 23, but is not limited thereto.

Since the EMI shielding particle 10 includes both the insulating core 11 and the shell 15 and there is no void space inside the EMI shielding particle 10, / RTI > and / or damage can be substantially prevented.

Further, since the shell 15 substantially contains no organic matter, it can have excellent EMI shielding performance and durability at the same time.

EMI shielding adhesive film and manufacturing method thereof

The EMI shielding film 200 may be used in an EMI shielding adhesive film. Therefore, according to another aspect, an EMI shielding adhesive film including the EMI shielding film 200 is provided. In addition to the EMI shielding film 200, the EMI shielding adhesive film may further include at least one of a base film, a release film, and a metal layer.

6 and 7 show, respectively, one embodiment of the EMI shielding adhesive film. The EMI shielding adhesive film of FIG. 6 has a structure in which a release film 100, an EMI shielding film 200, a base film 300 and a metal layer 400 are stacked in this order, and the EMI shielding adhesive film of FIG. 100, an EMI shielding film 200, a metal layer 400, and a base film 300 are stacked in this order.

The release film 100 protects the surface of the EMI shielding film 200 and prevents various contaminants from adhering to the surface of the EMI shielding film 200. The release film 100 may be provided on the surface of the EMI shielding film 200 by a lamination process or the EMI shielding film 200 may be directly formed on the release film 100. The release film 100 may have a thickness of, for example, 10 mu m to 70 mu m. The material of the release film 100 may refer to the material of the base film 300 described later.

For a description of the matrix material 23 and the EMI shielding particles 10 in the EMI shielding film 200, reference is made to what is described herein. The matrix material 23 includes an adhesive, and may further include a crosslinking agent to improve the adhesiveness.

The thickness of the EMI shielding film 200 may be, for example, 10 占 퐉 to 100 占 퐉, for example, 10 占 퐉 to 60 占 퐉, but is not limited thereto.

The EMI shielding film 200 may be formed by providing a composition including the matrix material 23 and the EMI shielding particles 10, 20 and 30 on the base film 300 or the metal layer 400.

The base film 300 serves as a substrate for forming the EMI shielding film 200 and / or the metal layer 400.

The base film 300 may include a known polymer resin. The base film 300 may include a material having durability, flexibility, chemical resistance, abrasion resistance, and the like to such an extent that no change in shape occurs even in a wide range of temperatures (for example, from minus 250 캜 to image 400 캜). For example, the base film 300 may include a polyester resin, a polyimide resin, a polyacrylate resin, a polyethylene resin, and the like, but is not limited thereto. The thickness of the base film 300 may be, for example, in the range of 30 to 500 占 퐉, but is not limited thereto.

The metal layer 400 may further provide an electromagnetic shielding function and / or an EMI shielding function to the EMI shielding adhesive film. The metal layer 400 may comprise, for example, an EMI shielding metal. According to one embodiment, the metal layer 400 may include at least one metal selected from tin (Sn), copper (Cu), nickel (Ni), and silver (Ag) The metal layer 400 may be formed by a method such as sputtering, plating, or the like. The thickness of the metal layer 400 may be, for example, in the range of 5 to 50 占 퐉, for example, 10 to 35 占 퐉, but is not limited thereto.

The structure of the EMI shielding adhesive film has been described with reference to FIGS. 6 and 7. However, the structure of the EMI shielding adhesive film is not limited thereto. For example, the EMI shielding adhesive film may not include a metal layer. A seed layer for enhancing the bonding force between the base film 300 and the metal layer 400 may further be interposed between the base film 300 and the metal layer 400 of FIGS. The seed layer may include, for example, NiCr (an alloy of Ni and Cr), and may be formed by sputtering, but is not limited thereto.

After the release film 100 is removed, the exposed surface of the EMI shielding adhesive film 200 may be disposed at a specific position of a predetermined substrate and then pressed and fixed. At this time, the heat generated from the predetermined substrate passes through the EMI shielding film 200 along the plurality of EMI shielding particles 10 included in the EMI shielding film 200 and is discharged to the outside, Can be performed.

Devices with EMI shielding composite

The EMI shielding composite may be included in any device requiring an EMI shielding function.

For example, the device may be a printed circuit board (e.g., a solder resistor on a printed circuit board), various electronic devices (e.g., a cell phone, a display, a refrigerator, a computer, But is not limited thereto.

There are a variety of ways to provide the EMI shielding composite to the device.

According to one embodiment, the EMI shielding composite can be provided directly to the device by spraying, coating, or the like. At this time, heat treatment, light irradiation, and the like may be optionally performed to induce patterning of the EMI shielding composite, solvent removal included in the EMI shielding composite, and / or polymerization of the matrix material.

According to another embodiment, after the EMI shielding adhesive film containing the release film is prepared in advance, the release film is removed from the EMI shielding adhesive film, and the exposed EMI shielding film is placed on a predetermined surface of the apparatus By applying pressure, the EMI shielding composite can be provided to the device.

The present invention will now be described in more detail with reference to the following examples and experimental examples. In addition, terms and words used in the present specification and claims should not be construed as being limited to ordinary or dictionary meanings, and should be construed as meaning and concept consistent with the technical scope of the present invention.

The embodiments, examples and drawings described in the present specification are merely preferred embodiments of the present invention and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents and variations There may be examples.

[Example]

Example  One

Fabrication of EMI shielding particles

(Average particle size 4.0 탆), which is a spherical core made of PMMA resin, was subjected to plasma treatment for 30 minutes under an argon atmosphere, and then sputtering was applied to the surface of the insulating core, By forming the shell, EMI shielding particles 1 were produced. At this time, the sputter cathode power was 0.1 to 5 Kw, the argon gas supplied into the vacuum chamber was 10 to 500 scm, and the degree of vacuum of the vacuum chamber was 0.1 to 5 mm Torr.

Manufacture of EMI shielding composites

65 parts by weight of epoxy acrylate, 25 parts by weight of peroxyester and 10 parts by weight of silica were mixed and stirred. 20 parts by weight of the EMI shielding particles 1 were added to the resultant, and then stirred using an ultrasonic mixer to obtain EMI Shielding composite 1 was prepared. The stirring was carried out by gradually warming the temperature of the ultrasonic mixer from room temperature to about 85 캜 for 40 minutes and then stirring with an ultrasonic stirrer at 85 캜 for 60 minutes.

Manufacture of EMI shielding adhesive film

The EMI shielding composite 1 was coated on a 50 탆 thick polyester film as a release film and then dried at 80 캜 to form an EMI shielding film 1 having a thickness of 50 탆. Next, a NiCr seed layer (sputtering cathode power = 2 Kw, sputtering rate = 1.5 m / min, argon atmosphere of 100 sccm) was formed on the EMI shielding film 1 by sputtering, and then a sputtering method A Cu layer 1 having a thickness of 0.2 탆 was formed (sputter cathode power = 5 Kw, sputtering rate = 1.5 m / min, 100 sccm argon atmosphere) A copper layer 2 is further formed by using the copper plating layer under the conditions of 4 to 5 Amper Per Square Deci-Meter (ASD) Layer 2) was formed on the EMI shielding film 1, an EMI shielding adhesive film 1 was produced.

Example  2

Fabrication of EMI shielding particles

(Average particle size 4.0 占 퐉) which is a spherical core made of PMMA resin was subjected to plasma treatment for 30 minutes under an argon atmosphere and then sputtering was applied to the surface of the insulating core so that the surface of the insulating core was made of copper After forming the shell, a protective layer having an average thickness of 0.02 탆 was formed on the surface of the shell by sputtering using an alloy of nickel (Ni) and chromium (Cr: nickel: chromium in a weight ratio of 8: 2) Thereby preparing EMI shielding particles 2. At this time, the sputter cathode power was 0.1 to 5 Kw, the argon gas supplied into the vacuum chamber was 10 to 500 scm, and the degree of vacuum of the vacuum chamber was 0.1 to 5 mm Torr.

Manufacture of EMI shielding composites

The EMI shielding composite 2 was manufactured using the same method as that of the EMI shielding composite material of Example 1 except that the above-mentioned EMI shielding particle 2 was used in place of the EMI shielding particle 1.

Manufacture of EMI shielding adhesive film

The EMI shielding adhesive film 2 was prepared in the same manner as in the method of producing the EMI shielding adhesive film 1 of Example 1, except that the EMI shielding composite 2 was used instead of the EMI shielding composite 1.

Comparative Example  A

Preparation of EMI shielding particle A

Instead of the EMI shielding particles 1, silver (Ag) powders having an average particle diameter of 15 占 퐉 were prepared as the EMI shielding particles A.

Manufacture of EMI shielding composites

The EMI shielding composite A was manufactured using the same method as that of the EMI shielding composite material of Example 1, except that the above-mentioned EMI shielding particle A was used instead of the EMI shielding particle 1.

Manufacture of EMI shielding adhesive film

An EMI shielding adhesive film A was prepared using the same method as that of the EMI shielding adhesive film of Example 1, except that the EMI shielding composite A was used instead of the EMI shielding composite 1.

Evaluation example  One

TEM photographs of the silver (Ag) powder (EMI shielding particle A) used in Comparative Example A and the EMI shielding particle 1 prepared in Example 1 are shown in FIGS. 8 and 9, respectively. It can be confirmed that the particles of the silver (Ag) powder of FIG. 8 have a nonuniform shape and the surface roughness is relatively large, but the EMI shielding particle 1 of FIG. 9 has a smooth spherical shape as well as a smooth surface .

Evaluation example  2

The EMI shielding ratios of the EMI shielding adhesive film 1 of Example 1, the EMI shielding adhesive film 2 of Example 2 and the EMI shielding adhesive film A of Comparative Example A were evaluated by the ASTM D4935 method and the results are shown in Table 1 .

EMI shielding rate (dB) Example 1
EMI Shielding Adhesive Film 1 55.2dB Example 2
EMI Shielding Adhesive Film 2 54.3dB The EMI shielding adhesive film A of Comparative Example A 49.8dB

From Table 1, it can be seen that the EMI shielding adhesive film 1 of Example 1 and the EMI shielding adhesive film 2 of Example 2 have an EMI shielding ratio superior to that of the EMI shielding adhesive film A of Comparative Example A.

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10, 20, 30: EMI shielding particles
11, 21, 31: insulating core
15, 25, 35: Shell
25-1: First shell
25-2: Second shell
37: Protective layer
200: EMI shielding film
23: Matrix material
100: release film
300: substrate film
400: metal layer

Claims (13)

Insulating core; A shell including a continuous film covering the surface of the insulating core, an inner surface contacting the surface of the insulating core, an outer surface being smooth, and including an EMI shielding material; And a protective layer covering the outer surface of the shell and including an antioxidant material,
Wherein the insulating core is a spherical core,
Wherein the protective layer is an alloy of nickel and chromium,
The ratio of the diameter of the insulating core to the thickness of the shell is selected from the range of 2: 1 to 20,000: 1, the diameter of the insulating core is selected from the range of 1.0 to 100 탆, the thickness of the shell is 0.005 Mu] m to 0.5 [mu] m,
Wherein the shell is formed by a sputtering method and does not contain an organic matter. delete delete delete The method according to claim 1,
Wherein the insulating core comprises silicon, silicon oxide, an insulating resin, or any combination thereof. delete The method according to claim 1,
Wherein the EMI shielding material is selected from the group consisting of Cu, Fe, Ni, Al, Sn, Zn, Au, Ag, Cr, EMI shielding particles, including any combination thereof. delete delete delete delete delete delete

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