KR101924857B1 - Thermal conductive particle - Google Patents

Abstract

There is provided a thermally conductive composite material including thermally conductive particles, a matrix material and the thermally conductive particles, a thermally conductive adhesive film including the composite material, and an apparatus including the thermally conductive composite material.

Description

Thermal conductive particles

A thermally conductive composite material including the thermally conductive particles, a thermally conductive adhesive film including the thermally conductive composite material, and an apparatus including the thermally conductive composite material.

BACKGROUND ART [0002] With the recent increase in the number of components incorporated in various electronic devices such as smart phones and LCD devices, heat generation on circuit boards and the like is gradually increasing.

Failure to rapidly discharge the heat generated by the electronic device to the outside of the electronic device may degrade the performance of the components incorporated in the electronic device, thereby shortening the life of the electronic device. For this purpose, a method of installing a heat-radiating fan or the like can be considered, but the size of the heat-radiating fan may hinder the miniaturization of the device.

Therefore, it is urgent to develop a thermally conductive material which can perform an effective heat dissipation function while having various uses and forms.

A thermally conductive particle having excellent thermal conductivity and durability, a thermally conductive composite material containing the thermally conductive particles, a thermally conductive adhesive film including the thermally conductive composite material, and an apparatus including the thermally conductive composite material.

According to one aspect,

Insulating core; And

A shell covering the surface of the insulating core, the shell including a thermally conductive material;

The thermally conductive particles are provided.

According to another aspect, there is provided a thermally conductive composite comprising the thermally conductive particles.

According to another aspect,

And the thermally conductive composite material,

Wherein the matrix material comprised in the thermally conductive composite comprises an adhesive material,

The thermally conductive composite material is a thermally conductive film having a film form,

There is provided a thermally conductive adhesive film further comprising at least one of a base film, a release film and a metal layer.

According to another aspect, an apparatus is provided that includes the thermally conductive composite material.

The thermally conductive particles have excellent thermal conductivity and durability and are excellent in compatibility with various matrix materials, and the composite material including the matrix material and the thermally conductive particles may have various uses and / or shapes. Therefore, the thermally conductive composite material including the thermally conductive particles can be employed in various devices and can effectively perform an excellent heat conduction function for a long period of time.

1 is a view schematically showing one embodiment of the thermally conductive particle.
Figure 2 is a schematic illustration of a cross section of one embodiment of the thermally conductive particle.
Figure 3 schematically shows a cross section of another embodiment of the thermally conductive particle.
4 is a schematic cross-sectional view of one embodiment of the thermally conductive composite material.
5 is a schematic view showing a cross section of one embodiment of the thermally conductive adhesive film.
6 is a view schematically showing a cross section of another embodiment of the thermally conductive adhesive film.
7 is a TEM photograph of the aluminum nitride powder (thermally conductive particle A) used in Comparative Example A. FIG.
8 is a TEM photograph of the thermally conductive particle 1 produced in Example 1. Fig.

Thermal conductivity  particle

The thermally conductive particles 10 according to one embodiment are shown in FIG. 1, and schematic cross-sections of the thermally conductive particles 10 are shown in FIG.

The thermally conductive particles 10 include an insulating core 11 and a shell 15 covering the surface of the insulating core 11 and containing a thermally conductive material.

The thermally conductive particles 10 including the insulating core 11 and the shell 15 are clearly distinguished from particles made of a thermally conductive material only. Without being limited by any particular theory, for example, without an insulating core 11, particles made of only aluminum nitride may have a relatively large standard deviation of particle diameters and may not be uniform in particle form, Can be relatively large. Therefore, it may be difficult to uniformly disperse in the matrix material to be described later, and the contact efficiency of the particles made of only aluminum nitride may be low, and the heat conduction efficiency may be lowered.

The insulating core 11 may improve the durability of the thermally conductive particles 10 and may serve to maintain the shell 15 in shape and to prevent the shell 15 from being damaged.

The insulating core 11 may be a spherical core.

The shell 15 includes a thermally conductive material and functions to impart heat conductivity to the thermally conductive particles 10.

The shell 15 may be a continuous film covering the surface of the insulating core 11.

The outer surface of the shell 15 may be smooth.

According to one embodiment, the shortest distance d ₁ from an arbitrary point P ₁ on the outer surface of the shell 15 to the surface of the insulating core 11 and the shortest distance d ₁ between the shortest distance d ₁ on the outer surface of the shell 15, other jeomin P ₂ from the difference between the minimum distance (d ₂₎ of the surface to the insulating core 11, for 0㎛ 1㎛ to, for example, to 0㎛ 0.1㎛, as another example, to 0.01 0㎛ Mu m, but is not limited thereto. Here, P _{1, which} is an arbitrary point on the outer surface of the shell 15, may be all points on the outer surface of the shell 15. That is, the deviation between the thicknesses measured at any point of the shell 15 may range from 0 탆 to 1 탆, for example from 0 탆 to 0.1 탆, and as another example, from 0 탆 to 0.01 탆 .

According to another embodiment, the shortest distance d ₁ from an arbitrary point P ₁ on the outer surface of the shell 15 to the surface of the insulating core 11 and the shortest distance d ₁ between the shortest distance d ₁ on the outer surface of the shell 15, the shortest distance (d ₂₎ of the other one jeomin from P ₂ to the surface of the dielectric core 11 is, practically, may be equal to each other. Here, P _{1, which} is an arbitrary point on the outer surface of the shell 15, may be all points on the outer surface of the shell 15. That is, the thicknesses measured at arbitrary points of the shell 15 may be equal to each other.

The shell 15 as described above is clearly distinguished from, for example, a shell composed of a plurality of particulate thermally conductive fillers and having a large surface roughness (that is, uneven outer surface) on the outer surface.

As described above, the thermally conductive particles 10 including the shell 15 having a smooth outer surface and a relatively small deviation between the measured thicknesses at arbitrary points are arranged such that the plurality of thermally conductive particles 10 are effectively The heat conduction efficiency between the thermally conductive particles 10 can be improved.

The ratio between the diameter d ₃ of the insulating core 11 and the thickness d ₁ and d ₂ of the shell 15 is in the range of 2: 1 to 20,000: 1, for example, 20: 1 to 4000 : 1. ≪ / RTI > The diameter d ₃ of the insulating core 11 may be selected from the range of 0.1 탆 to 100 탆, for example, in the range of 1 탆 to 40 탆. The thickness (d ₁ , d ₂ ) of the shell 15 may be selected in the range of 0.005 μm to 0.5 μm, for example, in the range of 0.01 μm to 0.05 μm. The thickness of the diameter (d ₃₎ to the diameter (d ₃₎ and the shell (15) of rain, the insulating core (11) between the thickness (d _1, d ₂₎ of the shell (15) of the insulating core 11 ( d _1, d ₂₎ that it is possible to obtain the compatibility and / or dispersibility is good thermally conductive particles 10 with respect to the various types of matrix materials, if belong to the range, while having a good thermal conductivity, and durability at the same time as described above .

There is no space between the surface of the insulating core 11 and the inner surface of the shell 15. [

According to one embodiment, the surface of the insulating core 11 and the inner surface of the shell 15 are in contact with each other.

According to another embodiment, the entire surface of the insulating core 11 is covered with the shell 15, and there is no empty space in the thermally conductive particle 10.

As a result, damage of the shell 15 in the thermally conductive particles 10 can be prevented, and the thermally conductive particles 10 can have excellent durability.

The insulating core 11 may comprise silicon, silicon oxide, an insulating resin, and any combination thereof.

According to one embodiment, the insulating resin is at least one selected from the group consisting of nylon resin, polyethylene resin, polypropylene resin, polybutylene resin, polyester resin, polyurethane resin, styrene butadiene resin, vinyl resin, polycarbonate resin, polysulfone resin, poly Polyvinyl acetate resins, polyvinyl acetate resins, polystyrene resins, styrene divinylbenzene resins, silicone resins, epoxy resins, phenolic resins, polyethylene resins and acrylic resins (for example, poly (Methyl methacrylate) (PMMA)), but the present invention is not limited thereto.

For example, the insulating core 11 may be made of an acrylic resin (for example, poly (methyl methacrylate) (PMMA) or the like), but is not limited thereto. Alternatively, the insulating core 11 may be made of silicon, but is not limited thereto.

The shell 15 comprises a thermally conductive material.

The thermally conductive material is an inorganic material, and the shell 15 may not include an organic material. The organic material means any chemical species including carbon. Therefore, the shell 15 is clearly distinguished from any shell formed by, for example, a plating method. Any shell formed by the plating method essentially contains an organic material derived from various dispersants, acidity regulators and the like, which are inevitably included in the plating composition. As a result, the shell 15 does not include an organic matter which is an impurity that is vulnerable to heat, and thus can have excellent heat conduction efficiency.

According to one embodiment, the shell 15 is made of a thermally conductive material, and the thermally conductive material may be an inorganic material.

For example, the thermally conductive material included in the shell 15 may be selected from the group consisting of a nitride of a Group 13 element, an oxide of a Group 13 element, an oxynitride of an Group 13 element, Combinations thereof.

According to one embodiment, the Group 13 element may be selected from B, Al, Ga and In, but is not limited thereto.

According to another embodiment, the thermally conductive material may be aluminum nitride or boron nitride. The aluminum nitride or boron nitride has excellent thermal conductivity, high electrical insulation, low coefficient of thermal expansion and excellent corrosion resistance, and the shell 15 made of aluminum nitride or boron nitride exhibits improved performance of the thermally conductive particles 10 . ≪ / RTI >

According to another embodiment, the shell 15 may consist of aluminum nitride or boron nitride.

For example, the shell 15 may be a single layer of a thermally conductive material. According to one embodiment, the shell 15 may be a single layer of aluminum nitride or boron nitride.

Meanwhile, according to another embodiment, the shell 15 may have a multi-layer structure. That is, the shell 15 may include two or more separate shells. The two or more distinct shells may comprise different materials.

3 schematically shows a cross-section of one embodiment of thermally conductive particles 20 comprising a two-layered shell.

The thermally conductive particles 20 include an insulating core 21 and a shell 25 covering the surface of the insulating core 21 and including a thermally conductive material. The shell 25 includes a first shell 25-1 covering the surface of the insulating core 21 and a second shell 25-2 covering an outer surface of the first shell 25-1 .

The ratio of the thickness d ₄ of the first shell 25-1 to the thickness d ₅ of the second shell 25-2 is in the range of 10: 1 to 1:10, for example, 3: 7 to 7: 3, but the present invention is not limited thereto.

For a description of the insulating core 21, refer to the description of the insulating core 11 in Fig.

According to one embodiment, the first shell 25-1 and the second shell 25-2 each include a thermally conductive material, and the thermally conductive material included in the first shell 25-1, The thermally conductive materials included in the two shells 25-2 may be different from each other. For example, the first shell 25-1 may include aluminum nitride, and the second shell 25-2 may include boron nitride.

Thermal conductivity  Method of manufacturing particles

The method for manufacturing the thermally conductive particles 10 and 20 may include forming shells 15 and 25 including a thermally conductive material on the surface of the insulating core 11 and 21.

The step of forming the shells 15 and 25 including the thermally conductive material on the surfaces of the insulating cores 11 and 21 may be performed by a sputtering method.

The vacuum chamber for sputtering includes a support on which a container containing the insulating core 11, 21 is placed, a target including a thermally conductive material for forming the shells 15, 25, and an electrode for ejecting atoms from the target .

The shells 15 and 25 of the thermally conductive particles 10 and 20 are formed on the surfaces of the insulating cores 11 and 21 by a sputtering method to have a smooth outer surface and a constant thickness, 21) surface, but may be substantially free of impurities (for example, organic matter) other than the substance (for example, a thermally conductive substance) emitted from the target. The shells 15 and 25 of the thermally conductive particles 10 and 20 formed in this manner are formed of, for example, i) a plurality of particle-type thermally conductive fillers, and the outer surface has a large surface roughness Quot; shell ") formed by a plating method, which essentially includes an organic material derived from various dispersants, acidity regulators and the like that are necessarily contained in a composition for plating, and a " rugged"

According to one embodiment, the sputter cathode power for forming the shells 15, 25 may be between 0.1 and 5 Kw, and an inert gas (e.g., an inert gas) supplied into the vacuum chamber for forming the shells 15, Argon gas) is 10 to 500 scm, and the degree of vacuum of the vacuum chamber for forming the shells 15 and 25 can be adjusted to 0.1 mTorr to 5 mmTorr, but is not limited thereto.

The method of manufacturing the thermally conductive particles 10 and 20 may be such that the insulating cores 11 and 21 are pre-processed before forming the shells 15 and 25 containing a thermally conductive material on the surfaces of the insulating cores 11 and 21, The method comprising the steps of:

The preprocessing step may improve the bonding strength between the surfaces of the insulating cores 11 and 21 and the inner surfaces of the shells 15 and 25 containing the thermally conductive material and / Contaminants, moisture, static electricity, and the like.

The preprocessing step may include at least one of, for example, a plasma treatment on the surfaces of the insulating cores 11 and 21 and an ultrasonic treatment to the insulating cores 11 and 21.

The plasma treatment may be performed, for example, by plasma-treating the surface of the insulating core 11, 21 in an atmosphere containing at least one of argon, oxygen and nitrogen.

By the ultrasonic treatment, friction between the insulating cores 11 and 21 is induced by ultrasonic vibration, and various contaminants and the like on the surfaces of the insulating cores 11 and 21 can be removed.

The method of manufacturing the thermally conductive particles 10 and 20 may further include forming the thermally conductive particles 10 and 20 after forming the shells 15 and 25 including the thermally conductive material on the surfaces of the insulating core 11 and 21, ). ≪ / RTI >

The drying step may be performed by forming the shells 15 and 25 on the surfaces of the insulating cores 11 and 21 by sputtering and then subjecting them to a relative humidity of 25% Lt; 0 > C to 80 < 0 > C for 1 hour to 2 hours. The drying temperature can be adjusted by gradually warming to a specific temperature at room temperature.

Thermal conductivity  Composite and manufacturing method thereof

The thermally conductive particles 10, 20 as described above can be mixed with various matrix materials. Thus, according to another aspect, there is provided a thermally conductive composite material comprising a matrix material and the thermally conductive particles (10, 20). The matrix material included in the thermally conductive composite material and the thermally conductive particles 10 and 20 may be mixed. Refers to a material different from the thermally conductive particles 10 and 20 that can be mixed with the thermally conductive particles 10 and 20. The content of the matrix material is not particularly limited as long as the content of the thermally conductive particles 10 , 20), respectively.

The description of the thermally conductive particles (10, 20) included in the thermally conductive composite material is given above.

The matrix material included in the thermally conductive composite material may be selected from an adhesive material, a polymer resin, a polymerizable monomer, a solvent, an ink, and a paint.

The adhesive material may be selected from materials having any known adhesiveness. For example, the adhesive material may be selected from a polyvinyl alcohol-based compound, a polyurethane-based compound, a polyester-based compound, a polyacrylic-based compound, and a polyepoxy-based compound, but is not limited thereto. For example, epoxy acrylate may be used as the adhesive material, but the present invention is not limited thereto.

The polymer resin may be selected from any known polymer resin such as an insulating resin, a thermoplastic resin, and a thermosetting resin. Alternatively, the polymer resin may be a polymerization product of a polymerizable monomer described below.

The polymerizable monomer may be a monomer having a polymer capable of forming a polymer by various polymerization reactions, for example, a styryl group, an oxide group, a halogen atom, or the like.

The solvent may be selected from any solvent capable of mixing with the thermally conductive particles to provide fluidity to the thermally conductive composite.

The ink and the paint may be selected from commercially available ink compositions for forming a resist, commercially available paints including various dyes and / or pigments.

The thermally conductive composite can have the form of particles, films, parts having any shape, or liquid compositions having any viscosity.

According to one embodiment, if the matrix material comprises an adhesive and the thermally conductive composite material has the form of a film, the thermally conductive composite material may be used as a functional layer of a thermally conductive adhesive film.

According to another embodiment, if the matrix material comprises a polymer resin and the thermally conductive composite material has the shape of a part having any shape, the thermally conductive composite material may be a part that can be employed in a predetermined device , Heat dissipation parts).

According to another embodiment, if the matrix material comprises a polymerizable monomer and the thermally conductive composite has the form of a liquid composition having an arbitrary viscosity, the thermally conductive composite may comprise a composition for forming a part having a predetermined pattern .

According to another embodiment, if the matrix material comprises at least one of a solvent, an ink and a paint, and the thermally conductive composite has the form of a liquid composition having an arbitrary viscosity, the thermally conductive composite must have a heat- Can be used as a composition capable of being provided directly on a substrate (for example, provided directly by spraying).

According to another embodiment, if the matrix material is an adhesive or a solvent and the thermally conductive composite material has a particle shape, the thermally conductive composite material may be provided directly on a substrate requiring heat radiation function (for example, Provided thermally conductive material.

The matrix material may further include at least one material selected from a dispersing agent, a crosslinking agent, a filler, a viscosity modifier, a curing agent, and a polymerization initiator depending on the use and form of the thermally conductive composite material, but is not limited thereto.

For example, the crosslinking agent may include at least one substance selected from boric acid, glutaraldehyde, melamine, peroxy ester compounds and alcoholic compounds, and the dispersant may be a saturated hydrocarbon ester, But are not limited to, ethylcellosolve, methylcellosolve, ethylcellosolve acetate, silica, or any combination thereof.

According to one embodiment, the matrix material comprises an adhesive material, a crosslinking agent, and a dispersant, wherein the adhesive material may include epoxy acrylate, peroxy ester as the crosslinking agent, and silica as a dispersing agent, no.

The method of manufacturing the thermally conductive composite includes mixing the thermally conductive particles and the matrix material. The mixing of the thermally conductive particles and the matrix material may be mechanical mixing, for example, mechanical mixing using a stirrer or an ultrasonic mixer, but is not limited thereto.

According to one embodiment, the method for producing a thermally conductive composite material comprises mixing thermally conductive particles and a dispersion solvent before mixing the thermally conductive particles and the matrix material to provide a thermally conductive particle-containing dispersion liquid As shown in FIG. The dispersion solvent is a solvent which serves to provide a thermally conductive particle-containing dispersion such that the thermally conductive particles can be uniformly mixed with the matrix particles. Examples of the solvent include ethanol, methanol, propane, Can be selected from among the solvents which are easy to use. For example, the thermally conductive particle-containing dispersion may include, but is not limited to, 45 to 55 parts by weight of a dispersing solvent per 100 parts by weight of the thermally conductive particles. The mixing of the thermally conductive particles and the dispersion solvent may be performed by mechanical mixing, for example, mechanical mixing using a stirrer or an ultrasonic mixer, but is not limited thereto.

The step of mixing the thermally conductive particles and the matrix material may be performed by directly mixing the thermally conductive particles and the matrix material or by mixing the matrix material with a thermally conductive particle-containing dispersion as described above .

When the thermally conductive particle-containing dispersion and the matrix material are mixed, 10 to 50 parts by weight of the thermally conductive particle-containing dispersion per 100 parts by weight of the matrix material may be mixed, but the present invention is not limited thereto.

The method of manufacturing the thermally conductive composite may further include removing any solvent after mixing the thermally conductive particles and the matrix material or after mixing the thermally conductive particles and the matrix material. The optional solvent may be, for example, a dispersion medium contained in the thermally conductive particle-containing dispersion liquid. According to one embodiment, the solvent removal step may be performed by heat treatment.

Thermal conductivity  film

Fig. 4 is a view schematically showing a cross section of the thermally conductive film 200, which is an embodiment of the thermally conductive composite material having the film shape.

The thermally conductive film 200 may comprise a matrix material 23 and thermally conductive particles 10. The description of the matrix material 23 and the thermally conductive particles 10 is given above.

For example, the matrix material 23 may comprise an adhesive material. Alternatively, the matrix material 23 may further include at least one of a crosslinking agent and a dispersing agent in addition to the adhesive material. When the matrix material 23 includes an adhesive material and a crosslinking agent, the amount of the adhesive material may be 60 to 70 parts by weight per 100 parts by weight of the matrix material 23, but is not limited thereto.

The thermally conductive particles 10 in the thermally conductive film 200 are connected to each other to form a chain having a predetermined length (for example, a chain connecting both surfaces of the thermally conductive film 200) Can be formed. Optionally, after the thermally conductive film 200 is formed, the thermally conductive film 200 may be further pressed. As a result, the heat generated from one surface of the thermally conductive film 200, as shown in Fig. 4, along the surface of the plurality of thermally conductive particles 10 which are in contact with each other and form a chain of a predetermined length, The heat conductive film 200 can move to the other side of the film 200, and the heat conductive film 200 can have an excellent heat radiation function.

Since the thermally conductive particles 10 include both the insulating core 11 and the shell 15 and there is no void space inside the thermally conductive particles 10, / RTI > and / or damage can be substantially prevented.

Further, as described above, since the outer surface of the shell 15 is smooth as shown in Fig. 4, not only the contact between the thermally conductive particles 10 can be efficiently performed, but also substantially no organic matter is contained , The thermal conduction between the plurality of thermally conductive particles 10 that are in contact with each other as shown in FIG. 4 can be effectively performed.

Therefore, the thermally conductive film 200 including the thermally conductive particles 10 can have excellent durability and heat conduction efficiency at the same time.

Thermal conductivity  Adhesive film and manufacturing method thereof

The thermally conductive film 200 may be used for a thermally conductive adhesive film. Therefore, according to another aspect, there is provided a thermally conductive adhesive film including the thermally conductive film 200. [ In addition to the thermally conductive film 200, the thermally conductive adhesive film may further include at least one of a base film, a release film, and a metal layer.

Figs. 5 and 6 each show one embodiment of the thermally conductive adhesive film. The thermally conductive adhesive film of Fig. 5 has a structure in which a release film 100, a thermally conductive film 200, a base film 300 and a metal layer 400 are stacked in this order, and the thermally conductive adhesive film of Fig. 6 is a release film 100, a thermally conductive film 200, a metal layer 400, and a base film 300 are stacked in this order.

The release film 100 protects the surface of the thermally conductive film 200 and prevents adhesion of various contaminants to the surface of the thermally conductive film 200. The release film 100 may be provided on the surface of the thermally conductive film 200 by a lamination process or the thermally conductive film 200 may be directly formed on the release film 100. The release film 100 may have a thickness of, for example, 10 mu m to 70 mu m. The material of the release film 100 may refer to the material of the base film 300 described later.

For a description of the matrix material 23 and the thermally conductive particles 10 in the thermally conductive film 200, reference is made to what is described herein. The matrix material 23 includes an adhesive, and may further include a crosslinking agent to improve the adhesiveness.

The thickness of the thermally conductive film 200 may be, for example, in a range of thicknesses of 10 占 퐉 to 100 占 퐉, for example, 10 占 퐉 to 60 占 퐉, but is not limited thereto.

The thermally conductive film 200 may be formed by providing a composition comprising the matrix material 23 and the thermally conductive particles 10 on the substrate film 300 or the metal layer 400.

The base film 300 serves as a substrate for forming the thermally conductive film 200 and / or the metal layer 400.

The base film 300 may include a known polymer resin. The base film 300 may include a material having durability, flexibility, chemical resistance, abrasion resistance, and the like to such an extent that no change in shape occurs even in a wide range of temperatures (for example, from minus 250 캜 to image 400 캜). For example, the base film 300 may include a polyester resin, a polyimide resin, a polyacrylate resin, a polyethylene resin, and the like, but is not limited thereto. The thickness of the base film 300 may be, for example, in the range of 30 to 500 占 퐉, but is not limited thereto.

The metal layer 400 may further serve to impart an electromagnetic shielding function and / or a thermally conductive function to the thermally conductive adhesive film. The metal layer 400 may comprise, for example, a thermally conductive metal. According to one embodiment, the metal layer 400 may include at least one metal selected from tin (Sn), copper (Cu), nickel (Ni), and silver (Ag) The metal layer 400 may be formed by a method such as sputtering, plating, or the like. The thickness of the metal layer 400 may be, for example, in the range of 5 to 50 占 퐉, for example, 10 to 35 占 퐉, but is not limited thereto.

The structure of the thermally conductive adhesive film has been described with reference to FIGS. 5 and 6. However, the structure of the thermally conductive adhesive film is not limited thereto. For example, the thermally conductive adhesive film may not include a metal layer. A seed layer for enhancing the bonding force between the base film 300 and the metal layer 400 may further be interposed between the base film 300 and the metal layer 400 of FIGS. The seed layer may include, for example, NiCr and may be formed by sputtering, but is not limited thereto.

The thermally conductive adhesive film can be fixed by pressing one surface of the thermally conductive adhesive film 200 at a specific position on a predetermined substrate after removing the release film 100. At this time, the heat generated in the predetermined substrate passes through the thermally conductive film 200 along the plurality of thermally conductive particles 10 included in the thermally conductive film 200, and is discharged to the outside. As a result, Can be performed.

Thermal conductivity  Appliances with composite materials

The thermally conductive composite material may be included in any device requiring a thermally conductive function or a heat-dissipating function.

For example, the device may be a printed circuit board (e.g., a solder resistor on a printed circuit board), various electronic devices (e.g., a cell phone, a display, a refrigerator, a computer, But is not limited thereto.

There are various methods of providing the thermally conductive composite to the device.

According to one embodiment, the thermally conductive composite material can be directly supplied to the device by a spraying method, a coating method, or the like. At this time, heat treatment, light irradiation, and the like may be optionally performed to induce patterning of the thermally conductive composite material, removal of the solvent contained in the thermally conductive composite material, and / or polymerization of the matrix material.

According to another embodiment, a thermally conductive adhesive film including the release film is prepared in advance, a release film is removed from the thermally conductive adhesive film, and a thermally conductive film having a surface exposed is placed on a predetermined surface of the apparatus By applying pressure, the thermally conductive composite material can be provided to the device.

The present invention will now be described in more detail with reference to the following examples and experimental examples. In addition, terms and words used in the present specification and claims should not be construed as being limited to ordinary or dictionary meanings, and should be construed as meaning and concept consistent with the technical scope of the present invention.

The embodiments, examples and drawings described in the present specification are merely preferred embodiments of the present invention and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents and variations There may be examples.

[Example]

Example  One

Thermal conductivity  Manufacturing of particles

An insulating core (average particle size of 1.28 mu m), which is a spherical core made of silicon, was plasma-treated for 30 minutes under an argon atmosphere, and then a shell having an average thickness of 0.02 mu m made of aluminum nitride was formed on the surface of the insulating core by sputtering To prepare thermally conductive particles 1. At this time, the sputter cathode power was 0.1 to 5 Kw, the argon gas supplied into the vacuum chamber was 10 to 500 scm, and the degree of vacuum of the vacuum chamber was 0.1 to 5 mm Torr.

Thermal conductivity  Manufacture of composites

65 parts by weight of epoxy acrylate, 25 parts by weight of peroxyester and 10 parts by weight of silica were mixed and stirred, and then 20 parts by weight of the thermoconductive particles 1 were added to the resulting product. Then, the mixture was stirred using an ultrasonic mixer, To prepare a conductive composite 1. The stirring was carried out by gradually warming the temperature of the ultrasonic mixer from room temperature to about 85 캜 for 40 minutes and then stirring with an ultrasonic stirrer at 85 캜 for 60 minutes.

Thermal conductivity  Production of adhesive films

The thermally conductive composite material 1 was coated on a 50 탆 thick polyester film as a release film and then dried at 80 캜 to form a heat conductive film 1 having a thickness of 50 탆. Next, a NiCr seed layer (sputtering cathode power = 2 Kw, sputtering rate = 1.5 m / min, 100 sccm argon atmosphere) was formed on the thermally conductive film 1 by sputtering, and then a sputtering method A Cu layer 1 having a thickness of 0.2 탆 was formed (sputter cathode power = 5 Kw, sputtering rate = 1.5 m / min, 100 sccm argon atmosphere) A copper layer 2 is further formed by using the copper plating layer under the conditions of 4 to 5 Amper Per Square Deci-Meter (ASD) Layer (2)) was formed on the thermally conductive film (1) to prepare a thermally conductive adhesive film (1).

Comparative Example  A

Thermal conductivity  Preparation of Particle A

Instead of the thermally conductive particles 1, an aluminum nitride powder having an average particle diameter of 15 mu m was prepared as the thermally conductive particles A.

Thermal conductivity  Manufacture of composites

A thermally conductive composite material A was prepared using the same method as that of the thermally conductive composite material of Example 1, except that the thermally conductive particle A was used instead of the thermally conductive particle 1.

Thermal conductivity  Production of adhesive films

A thermally conductive adhesive film A was produced using the same method as that of the thermally conductive adhesive film of Example 1 except that the thermally conductive composite material A was used in place of the thermally conductive composite material 1.

Evaluation example  One

7 and 8 are TEM photographs of the aluminum nitride powder (thermally conductive particle A) used in Comparative Example A and the thermally conductive particle 1 prepared in Example 1, respectively. The particles of the aluminum nitride powder of Fig. 7 have a nonuniform shape and have a relatively large surface roughness, but the thermally conductive particle 1 of Fig. 8 has a smooth spherical shape as well as a smooth surface.

Evaluation example  2

The vertical thermal conductivity of the thermally conductive adhesive film 1 of Example 1 and the thermally conductive adhesive film A of Comparative Example A were evaluated by ASTM D5470 measurement method and the horizontal thermal conductivity was evaluated by Angstron's method. Respectively.

Vertical thermal conductivity (W / mk) Horizontal thermal conductivity (W / mK) Example 1
Thermally conductive adhesive film 1 2.659 154.687 The thermally conductive adhesive film A of Comparative Example A 2.487 150.237

From Table 1, it can be confirmed that the thermally conductive adhesive film 1 of Example 1 has a higher thermal conductivity than the thermally conductive adhesive film A of Comparative Example A.

10, 20: thermally conductive particles
11, 21: Insulating core
15, 25: Shell
25-1: First shell
25-2: Second shell
200: thermally conductive film
23: Matrix material
100: release film
300: substrate film
400: metal layer

Claims (13)

Insulating core; And a shell covering the surface of the insulating core, the shell including a thermally conductive material,
Wherein the insulating core is a spherical core made of silicon,
Wherein the shell is formed on the surface of the insulating core by sputtering in a vacuum chamber, the shell is made of aluminum nitride and has a thickness of 0.01 탆 to 0.05 탆,
Wherein the shell is a continuous film covering the surface of the insulating core, the outer surface is smooth, and is formed without containing an organic substance.
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