CN101415294A - Carbon alloy base novel electronic circuit board and preparation technique thereof - Google Patents
Carbon alloy base novel electronic circuit board and preparation technique thereof Download PDFInfo
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- CN101415294A CN101415294A CNA2007101340890A CN200710134089A CN101415294A CN 101415294 A CN101415294 A CN 101415294A CN A2007101340890 A CNA2007101340890 A CN A2007101340890A CN 200710134089 A CN200710134089 A CN 200710134089A CN 101415294 A CN101415294 A CN 101415294A
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Abstract
The invention relates to a novel carbon-alloy-based electronic circuit board and a manufacturing process thereof. The electronic circuit board consists of a carbon alloy layer, an insulating coating and a metal circuit layer. The carbon alloy layer comprises at least one carbon alloy plate. The carbon content of the carbon alloy plate is not lower than 60%; thus, the carbon alloy plate has excellent properties such as high thermal conduction and light weight. The insulating coating is preferably made from heat-conducting ceramic dope or the insulating coating is made from temperature-resistant heavy polymer resin insulating dope. The metal circuit layer is made from a current-conducting membrane, the thickness of which is not smaller than 10 microns. The manufacturing process of the invention comprises that a carbon alloy block is firstly prepared and cut into carbon alloy plates; the surface of each carbon alloy plate is sprayed, brushed or dipped with a layer of insulating dope; and the carbon alloy plate is glued or plated with a layer of current-conducting membrane after drying, so as to obtain the electronic circuit board. The novel carbon-alloy-based electronic circuit board of the invention has high thermal coefficient (which is not lower than 150W/m.k), thereby reducing weight, cost and operation temperature of the product and prolonging the service life and operation stability of the electronic devices so as to satisfy development requirements of the electronic industry.
Description
Technical field
The present invention relates to a kind of novel electronic circuit substrate, particularly a kind of is the novel electronic circuit board and the manufacture craft thereof of basic unit with the carbon alloy for what produce the design of high heat electronic building brick.
Technical background
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more littler, and power density is increasing, solve the problem of heat radiation referred a new height, this is a great challenge to the electronics industry design.
Do littler and littler in the face of electronic product, the assembly on the electronic circuit board is increasingly sophisticated; Also produce how unnecessary more heat.Along with developing rapidly of electronic technology,, make the thermal control of electronic devices and components and equipment and thermoanalysis technology obtain general attention and development for the thermal reliability that improves components and parts and equipment and to the adaptive capacity of various severe environmental conditions.
Since semiconductor device in 1948 comes out, the continuous development of the miniaturization of electronic devices and components, microminaturization and integrated technology, the components and parts number that each integrated circuit is comprised has surpassed 250000, because the continuous development of very lagre scale integrated circuit (VLSIC) (VLSIC), special integrated circuit (ASIC), very high speed integrated circuit microelectric techniques such as (VHSIC), the assembling of microelectronic component and equipment can produce extreme relatively temperature.
Studies show that the density of heat flow rate of chip-scale is up to 100W/cm
2It only hangs down two orders of magnitude than the density of heat flow rate on sun surface, the temperature on sun surface can reach 6000 ℃, and the junction temperature of semiconductor integrated circuit chip should be lower than 100 ℃, high density of heat flow rate like this, if do not take rational thermal control technology, will have a strong impact on the thermal reliability of electronic devices and components and equipment.These heats all are the arch-criminals who causes life of product to shorten even can't use.
The purpose of electronic equipment thermal control is and system-levelly to provide good thermal environment for chip-scale, component level, guarantees them under the thermal environment of regulation, can be normal by predetermined scheme, work reliably.Thermal control system must be finished the function of defined, and guarantee the function of its operate as normal with minimum maintenance in the operating period of regulation.
The thermal failure that prevents electronic devices and components is the main purpose of thermal control.Thermal failure is meant that electronic devices and components directly cause losing fully a kind of failure mode of its electric function owing to hot factor.Serious inefficacy, the course of work and the form that depend on local temperature field, electronic devices and components to a certain extent, therefore, just need correctly determine to occur the temperature of thermal failure, and this temperature should become the important criterion of thermal control system, when definite thermal control scheme, the maximum permissible temperature of electronic devices and components and maximum power dissipation should be as main design parameters.
Traditional electronic circuit board is difficult to provide its heat radiation for the hot assembly of height.(conductive coefficient is approximately 0.5～12W/mk) to the Metal Substrate electronic circuit board, electrical insulation properties and machining property and more and more be used widely owing to have good thermal conductivity.The Metal Substrate electronic circuit board mainly is made up of for three layers conductive metal film (as gold, silver, copper, aluminium, platinum etc.), heat conductive insulating layer and metal substrate, conductive metal film is a pcb layer, metal substrate adopts the Heat Conduction Material (conductive coefficients of aluminium: 270W/mk such as aluminium or copper more, the conductive coefficient 380W/mk of copper), the heat conductive insulating layer adopts import ceramic-base material more.
But the metal electron circuit board also has some unsurmountable shortcomings:
(1) metal substrate copper, aluminium hold at high price.For the electronic circuit board processing manufacturing industry, technology has not been core competence of enterprises, and cost becomes the bottleneck of each enterprise of restriction.
(2) metal substrate copper, aluminium weight.The weight of metal is excessive to cause that easily circuit board breaks.Especially when the area of dissipation of radiating subassembly during significantly greater than the area of electronic device, as pure copper weighs 8.96g/cm
3, the heavy 2.70g/cm of fine aluminium
3, in many application, thermal component need be arranged on the circuit board (or class this assembly), to distribute the heat from each assembly on the plate.If use the heat dissipation metal parts, the weight of metal can increase the chance that plate breaks on the plate, and also increases the weight of assembly self, and this is for portable electron device and comply with present electronics miniaturization and light-weighted trend, is even more important.
(3) insulating barrier is generally polymeric material, the ceramics polymer material thermal conductivity 2.2W/mk of import, can anti-reflow temperature 7～8 times non-foaming, homemade ceramics polymer material thermal conductivity 1.5W/mk, can anti-reflow temperature 1～2 time non-foaming because high molecular aging phenomenon and can not guarantee the problem of circuit board and product.
How to increase at present conductive coefficient, intensity and the stability of electronic circuit board, reduce weight and cost, become a problem that urgency is to be solved to satisfy the needs of different heat management systems.
Summary of the invention
The present invention seeks to overcome the shortcoming of existing electronic circuit board, providing a kind of is the novel electronic circuit board and the manufacture craft thereof of Heat Conduction Material basic unit with the carbon alloy.
For achieving the above object, the present invention is achieved by the following technical programs:
The formation that the present invention provides electronic circuit board comprises carbon alloy layer, insulating coating and metallic circuit layer, and wherein insulating coating is positioned on the carbon alloy layer, and the metallic circuit layer is positioned on the insulating coating.The conductive coefficient of this electronic circuit board is not less than 150W/mk.
In technique scheme, described carbon alloy layer comprises one deck carbon alloy plate at least, and carbon alloy adopts pitch, aluminium, zinc, silicon metal powder to mix and burns cast-type, and because of having high heat conduction and premium properties such as in light weight is used, phosphorus content is not less than 60%.
In technique scheme, described insulating coating needs the coating coatings to play insulating effect and produces short circuit to avoid electronic building brick because carbon alloy has high conductivity; Insulating coating is evenly distributed on the carbon alloy plate, makes carbon alloy plate simultaneously have electrical insulating property and good thermal conductivity with insulating coating;
Described insulating coating can be used high molecular polymer or the employing thermal conductive ceramic insulated with material material of heatproof more than 250 degrees centigrade.Described high molecular polymer insulating material can be selected epoxy resin or silicones or resorcinol resin or furfural acetone resin etc.Described thermal conductive ceramic insulating material can adopt boron nitride, aluminium nitride and aluminium oxide etc., wherein boron nitride coating because of self excellent heat conductivity, electrical insulation capability, high temperature resistant property and chemical stability (boron nitride coating is 500 degrees centigrade of heatproofs for a long time by preferred, conductive coefficient is higher than 2.2W/mk), the content of its boron nitride should be not less than 90%;
In technique scheme, described metallic circuit layer requires to have very big current capacity, thereby should use thicker conductive metal film, and as gold, silver, copper, aluminium, platinum etc., thickness is not less than 10 μ m;
In technique scheme, described metallic circuit layer is distributed in the surface of insulating coating in modes such as gummed or plating according to the physical circuit design.
The present invention gives the manufacture craft of carbon alloy base novel electronic circuit board,
This manufacture craft comprises that two go on foot greatly: the preparation of carbon alloy plate and the making step of circuit board, and concrete steps and condition following (wherein percentage is by weight):
The first step: the preparation of carbon alloy plate
(1) with 40～70% particle diameters all less than 5 μ m asphalt powders, 30～40% particle diameters are all less than 5 μ m aluminium powders, 10～20% particle diameters are all less than 5 μ m metallic silicon powers, 10～20% particle diameters all mix less than 5 μ m zinc powders, put into crystal vessel;
(2) crystal vessel is put into the vacuum graphitizing furnace, under vacuum environment, more than 800 ℃, heat more than 12 hours through high temperature;
(3) moulding: behind the cooling forming, the carbon alloy piece is taken out from crystal vessel;
(4) cutting: the carbon alloy plate that the carbon alloy piece is cut or is cut into required size;
Second step: the making of circuit board
(5) apply insulating barrier:
Use spraying method, promptly using pressure is that the spray gun of 0.35～0.42MPa evenly is sprayed on superfine coatings on the surface of graphite cake;
(6) drying: with the carbon alloy plate on surface in the vacuum drying chamber of proper temperature, dry 30～60 minutes;
(7) coating is handled: after the coating drying with dry muslin handle, equating and polishing, the thickness of controlling coating is below 0.2mm;
(8) arrange circuit diagram: use gluing method; to be glued at above the carbon alloy plate that has applied coatings according to the conductive metal film of circuit design shape; spray or brush coatings once more; thickness is not more than 0.2mm, the protection sheet of conductive metal film surface etch part or diaphragm is torn to get final product then.
Above-mentioned manufacturing process steps (5) also can use coating method coatings to be uniformly coated on the surface of carbon alloy plate; Perhaps use impregnation method at normal temperatures and pressures or place coatings to carry out impregnation process in the vacuum impregnation equipment with the carbon alloy plate.
Above-mentioned manufacturing process steps (8), also can use electro-plating method conductive metal film to be distributed in the surface of insulating coating, promptly go up the conducting medium identical, on carbon alloy plate insulating coating, electroplate one deck conductive metal film by galvanoplastic with printed circuit according to the coating of circuit design shape.
Beneficial effect of the present invention is:
1. selecting pitch for use is that raw material is made the carbon alloy material, make it have in light weight, low-cost characteristics, and the adding of aluminium powder, zinc powder makes material have very high conductive coefficient; Thereby with the electronic circuit board light weight that carbon alloy is made into, intensity is big and possess high thermal conductivity coefficient, and in the life-span that intensity is big, high thermal conductivity coefficient is prolonged electronic building brick, lightweight then can alleviate product weight;
2. insulating barrier avoids electronic building brick to produce short circuit;
3. insulating barrier can bear because of the welding electronic building brick produces high heat, avoids changing production process and causes puzzlement.
Description of drawings
Fig. 1 is the vertical face schematic diagram of carbon alloy base electronic circuit board.
Among the figure, the 1st, metallic circuit layer, the 2nd, insulating coating, the 3rd, carbon alloy layer.
Embodiment
Further introduce novel carbon alloy base novel electronic circuit board of the present invention and preparation method thereof below in conjunction with accompanying drawing.
Embodiment one
With 50% less than 5 μ m asphalt powders, 25% less than 5 μ m aluminium powders, and 15% less than 5 μ m metallic silicon powers, and 10% mixes less than 5 μ m zinc powders, puts into crystal vessel; Transfer to the vacuum graphitizing furnace and after heating under 1000 ℃ of high temperature is more than 12 hours, take out, behind the cooling forming, the carbon alloy piece is cut or is cut into the carbon alloy plate of required size in vacuum environment; Re-use No. 7 spray guns of Bink type and spray boron nitride coating on the surface; in vacuum drying chamber after the drying; carry out surface treatment with muslin; control insulating coating (2) is about 0.1mm; on carbon alloy layer (3) surface that the surface is had the conductive copper film (1) of diaphragm to be glued to have applied boron nitride coating (2); spray the boron nitride coating of 0.1mm once more, throw off the diaphragm of conductive copper film surface then.
This kind electronic circuit board conductive coefficient 280W/mk.
Embodiment two:
With 50% less than 5 μ m asphalt powders, 25% less than 5 μ m aluminium powders, and 15% less than 5 μ m metallic silicon powers, and 10% mixes less than 5 μ m zinc powders, puts into crystal vessel; Transfer to the vacuum graphitizing furnace and after heating under 1000 ℃ of high temperature is more than 12 hours, take out, behind the cooling forming, the carbon alloy piece is cut or is cut into the carbon alloy plate of required size in vacuum environment; Re-use spray gun at carbon alloy plate (3) surface spraying boron nitride coating (2), in vacuum drying chamber after the drying, carry out surface treatment with muslin, the control coating is about 0.1mm, go up the conducting medium identical according to the coating of circuit design shape, on the carbon alloy boron nitride, electroplate layer of copper (1) by galvanoplastic with printed circuit.
This kind electronic circuit board conductive coefficient 350W/mk.
Embodiment three:
With 50% less than 5 μ m asphalt powders, 20% less than 5 μ m aluminium powders, and 15% less than 5 μ m metallic silicon powers, and 15% mixes less than 5 μ m zinc powders, puts into crystal vessel; Transfer to the vacuum graphitizing furnace and after heating under 1000 ℃ of high temperature is more than 12 hours, take out, behind the cooling forming, the carbon alloy piece is cut or is cut into the carbon alloy plate of required size in vacuum environment; Re-using paintbrush evenly brushes boron nitride coating on a surface of carbon alloy plate; in vacuum drying chamber after the drying; carry out surface treatment with muslin; the control coating layer thickness is 0.2mm; on carbon alloy (3) surface that the surface is had the conductive aluminum film (1) of diaphragm to be glued to have applied boron nitride (2); spray the boron nitride coating of 0.2mm once more, throw off the diaphragm of conductive aluminum film surface then.
This kind electronic circuit board conductive coefficient 200W/mk.
Embodiment four:
With 50% less than 5 μ m asphalt powders, 20% less than 5 μ m aluminium powders, and 15% less than 5 μ m metallic silicon powers, and 15% mixes less than 5 μ m zinc powders, puts into crystal vessel; Transfer to the vacuum graphitizing furnace vacuum environment is taken out cooling after heating under 1000 ℃ of high temperature is more than 12 hours after, the carbon alloy piece is cut or is cut into the carbon alloy plate of required size; Use paintbrush that aluminium nitride coating (2) is evenly brushed on a surface of carbon alloy plate (3), in vacuum drying chamber after the drying, carry out surface treatment with muslin, the control coating layer thickness is 0.2mm, go up the conducting medium identical according to the coating of circuit design shape, on the carbon alloy aluminium nitride, electroplate layer of aluminum (1) by galvanoplastic with printed circuit.
This kind electronic circuit board conductive coefficient 180W/mk.
Claims (8)
1, a kind of carbon alloy base novel electronic circuit board is characterized in that: this electronic circuit board formation comprises carbon alloy layer, insulating coating and metallic circuit layer, and insulating coating is positioned on the carbon alloy layer, and the metallic circuit layer is positioned on the insulating coating.
2, carbon alloy base novel electronic circuit board according to claim 1 is characterized in that: described carbon alloy layer comprises one deck carbon alloy plate at least, and this carbon alloy plate phosphorus content is not less than 60%.
3, carbon alloy base novel electronic circuit board according to claim 1 is characterized in that: described insulating coating adopts thermal conductive ceramic coatings or the macromolecule copolymer resin coatings of heatproof more than 250 degrees centigrade; The thermal conductive ceramic coatings can adopt coating such as boron nitride, aluminium nitride, aluminium oxide, boron nitride the best wherein, and content should be not less than 90%; High molecular polymer coatings optional epoxy resin or silicones or resorcinol resin or the furfural acetone resin etc. of heatproof more than 250 degrees centigrade.
4, carbon alloy base novel electronic circuit board according to claim 1 is characterized in that: the conductive metal film of described metallic circuit layer is high-conductive metals such as gold, silver, copper, aluminium, platinum, and this conductive metal film thickness is not less than 10 μ m.
5, carbon alloy base novel electronic circuit board according to claim 1 is characterized in that: the conductive coefficient of this electronic circuit board is not less than 150W/mk.
6, a kind of manufacture craft of carbon alloy base novel electronic circuit board is characterized in that:
Described manufacture craft comprises carbon alloy preparation and circuit board making step two parts:
The first step: the step and the condition of carbon alloy preparation,
(1) with 40～70% less than 5 μ m asphalt powders, 30～40% less than 5 μ m aluminium powders, and 10～20% less than 5 μ m metallic silicon powers, and 10～20% mix less than 5 μ m zinc powders, put into crystal vessel;
(2) crystal vessel is put into the vacuum graphitizing furnace, under vacuum environment through high temperature more than 800 ℃ more than 12 hours;
(3) moulding: behind the cooling forming, the carbon alloy piece is taken out from crystal vessel;
(4) cutting: the carbon alloy plate that the carbon alloy piece is cut or is cut into required size;
Second step: the making step of electronic circuit board and condition,
(5) apply coatings:
Use spraying method, promptly using pressure is that the spray gun of 0.35～0.42MPa evenly is sprayed on superfine coatings on the surface of graphite cake;
(6) drying: with the carbon alloy plate on surface in the vacuum drying chamber of proper temperature, dry 30～60 minutes;
(7) coating is handled: after the coating drying with dry muslin handle, equating and polishing, the thickness of controlling coating is below 0.2mm;
(8) arrange circuit diagram: use gluing method; to be glued at above the carbon alloy plate that has applied coatings according to the conductive metal film of circuit design shape; spray or brush coatings once more; thickness is not more than 0.2mm, the protection sheet of conductive metal film surface etch part or diaphragm is torn to get final product then.
7, according to the manufacture craft of the described carbon alloy base novel electronic circuit board of claim 6, it is characterized in that: in this manufacturing process steps (7), use coating method coatings to be uniformly coated on the surface of carbon alloy plate; Perhaps use impregnation method at normal temperatures and pressures or place coatings to carry out impregnation process in the vacuum impregnation equipment with the carbon alloy plate.
8, according to the manufacture craft of the described carbon alloy base novel electronic circuit board of claim 6, it is characterized in that: in this manufacturing process steps (10), use electro-plating method conductive metal film to be distributed in the surface of insulating coating, promptly go up the conducting medium identical, on carbon alloy plate insulating coating, electroplate one deck conductive metal film by galvanoplastic with printed circuit according to the coating of circuit design shape.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101340890A CN101415294A (en) | 2007-10-19 | 2007-10-19 | Carbon alloy base novel electronic circuit board and preparation technique thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101340890A CN101415294A (en) | 2007-10-19 | 2007-10-19 | Carbon alloy base novel electronic circuit board and preparation technique thereof |
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| CN101415294A true CN101415294A (en) | 2009-04-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107034468A (en) * | 2017-05-23 | 2017-08-11 | 上海子创镀膜技术有限公司 | A kind of coating structure of new type solar energy absorption film |
| CN107787499A (en) * | 2015-05-13 | 2018-03-09 | 纳格拉影像股份有限公司 | To prevent physics change and/or the IC chip protection of electricity change |
-
2007
- 2007-10-19 CN CNA2007101340890A patent/CN101415294A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107787499A (en) * | 2015-05-13 | 2018-03-09 | 纳格拉影像股份有限公司 | To prevent physics change and/or the IC chip protection of electricity change |
| CN107787499B (en) * | 2015-05-13 | 2020-11-03 | 纳格拉影像股份有限公司 | Integrated circuit chip protection against physical and/or electrical modification |
| CN107034468A (en) * | 2017-05-23 | 2017-08-11 | 上海子创镀膜技术有限公司 | A kind of coating structure of new type solar energy absorption film |
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Open date: 20090422 |