JP3136300B2 - Conductive ceramics, method for producing conductive ceramics film, method for producing conductive ceramics molded product, composition for forming conductive ceramics, and electric heating element - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a conductive ceramics, conductive
Manufacturing method of conductive ceramic film , conductive ceramic molding
The present invention relates to a method for producing a product, a composition for forming a conductive ceramic, and an electric heating element.

[0002]

2. Description of the Related Art Conventionally, an electric heating element having a structure in which carbon powder or carbon fiber is dispersed in plastic or rubber is known. However, these heating elements have a low heating temperature, and the general heating temperature is 100%. It is below ° C. In addition, as an electric heating element,
Metals such as tungsten, molybdenum, and platinum-rhodium alloys are known. These metals can be heated to a high temperature of 500 ° C. or higher by energizing them. However, since they are metals, they are easily deteriorated by the oxidizing action of oxygen in the air during heating at high temperatures, and there is a difficulty in durability. is there. on the other hand,
As the electric heating element, a heating element that generates heat at a medium heat temperature of 100 to 500 ° C. and can be easily and inexpensively manufactured is demanded from the viewpoint of application to home heaters and the like. A heating element meeting such a demand has not yet been developed.

[0003]

SUMMARY OF THE INVENTION The present invention provides a conductive ceramic which efficiently generates heat at a medium temperature of 100 to 500.degree. C. by energization and which can be easily and inexpensively manufactured, and a method for manufacturing the same. It is an object of the present invention to provide a method for producing a conductive ceramic film, a method for producing a conductive ceramic molded product, a composition for forming a conductive ceramic, and an electric heating element.

[0004]

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have completed the present invention.

That is, according to the present invention, a resin containing metal-coated sericite powder and / or inorganic short fibers and frit powder is dispersed at 400 to 1000 ° C.
A structure in which metal-coated sericite powder and / or inorganic short fibers and carbon powder are dispersed in a porous inorganic vitreous body obtained by performing a heat treatment under the above temperature conditions. The content of the metal-coated sericite powder and / or the inorganic short fibers is the inorganic vitreous material.
Powder and / or inorganic body and the metal-coated sericite
An electrically conductive ceramic is provided, which is 45 to 65% by weight based on the total amount of the substance and the short fibers .

According to the present invention, a slurry mixture of metal-coated sericite powder and / or inorganic short fibers, frit powder, and a resin solution or resin dispersion is also provided.
Was applied to the heat insulation of the substrate, dried, 400
Subjected to heat treatment temperature of 1000 ° C., to melt the frit powder, and made resin from forming a conductive ceramic film heat on the substrate by carbonization, the slurry
Of the metal-coated sericite powder and / or the inorganic substance short fiber to the total amount of the metal-coated sericite powder and / or inorganic substance short fiber and the frit powder in the solid mixture. A method for producing a conductive ceramic film, wherein the proportion is 45 to 65% by weight is provided.

Further, according to the present invention, a slurry-like mixture of metal-coated sericite powder and / or inorganic short fibers, frit powder, and a resin solution or resin dispersion is provided. An object is applied on a substrate, dried, and a film formed on the substrate is peeled from the substrate, subjected to a heat treatment at a temperature of 400 to 1000 ° C., and baked to form a conductive ceramic film. The slurry mixture
The ratio of the metal-coated sericite powder and / or the inorganic substance short fiber to the total amount of the metal-coated sericite powder and / or the inorganic substance short fiber and the frit powder is 45%. To 65% by weight, and a method for producing a conductive ceramic film.

Further, according to the present invention, a mixture of metal-coated sericite powder and / or inorganic short fiber, frit powder, and resin is formed into a predetermined shape, and then subjected to 400-400. to melt the frit powder is subjected to heat treatment in the heating temperature of 1000 ° C., and becomes the resin from forming a conductive ceramic molded product was carbonized, 該混
Powder of the metal-coated sericite in a compound and / or
Alternatively, the ratio of the metal-coated sericite powder and / or the inorganic short fiber to the total amount of the inorganic short fiber and the frit powder is 45 to 65% by weight. A method for manufacturing a ceramic molded product is provided. Still further, according to the present invention, there is provided a composition obtained by dispersing a metal-coated sericite and / or an inorganic short fiber and a frit powder in a resin solution or a resin dispersion,
The ratio of the metal-coated sericite powder and / or the inorganic substance short fiber to the total amount of the metal-coated sericite powder and / or the inorganic substance short fiber and the frit powder is 45 to 45. 65% by weight of the composition for forming a conductive ceramic is provided.

Further, according to the present invention, by conducting electricity made of the conductive ceramic, 10
A heating heating element that generates heat of 0 to 500 ° C. is provided.

[0010]

DETAILED DESCRIPTION OF THE INVENTION In the present invention, metal-coated sericite powder or inorganic short fibers is used. These can be manufactured by a conventionally known method. As this method, for example, after activating the surface of sericite powder or short fibers of an inorganic substance using a solution containing noble metal ions, the metal coating is immersed in an electroless metal plating bath to convert the metal coating of the inorganic substance. There is a method of forming on the surface of powder or short fiber (JP-A-59-182961, JP-A-59-208064, etc.). In this method, the sericite powder having a conductive metal film formed on the surface and the inorganic short fibers are:
If necessary, electroplating can be performed, and a thick metal coating can be applied to the surface.

The sericite powder or the short fiber of an inorganic substance can be subjected to electroless plating and exhibits heat resistance at a temperature of about 600 to 1000 ° C. The average particle size of the powder is 10
-100 μm, preferably 30-60 μm. Examples of the inorganic short fibers include silicon carbide whiskers, potassium titanate whiskers, alumina fibers, glass fibers, wollastonite fibers, and the like.
The thickness (diameter) of the short fiber is 5 to 15 μm, preferably 5 to 15 μm.
10 to 10 μm, and its length is 2 to 1000 μm, preferably 40 to 50 μm.

Examples of the metal formed on the sericite powder or the inorganic short fibers include various metals used in electroless plating. Something like this,
For example, in addition to Ni, Co, Cu, W and the like, alloys such as Ni-Co and the like can be mentioned. From the viewpoint of durability, use of nickel is particularly preferable. The thickness of the metal coating on the metal-coated inorganic substance powder or short fiber is 0.1 to 5 μm, preferably 0.3 to 1 μm.

The frit used in the present invention only needs to have a melting temperature higher than the range of use of the conductive ceramic of the present invention, and various conventionally known ones can be used. The typical melting onset temperature of the frit is 2
The temperature is 50 ° C or higher, preferably 300 to 800 ° C, more preferably 350 to 600 ° C. As such a frit, for example, low-temperature molten glass containing lead oxide as a main component,
In addition to lead-based materials such as lead borosilicate and lead silicate, various types of lead-free materials can be mentioned. These can be used alone or in the form of a mixture. The frit is usually used in a powder form, and has an average particle size of 5 to 200 μm, preferably 10 to 150 μm.

An example of producing the conductive ceramic of the present invention is as follows: powder of sericite, which is a metal-coated inorganic substance, and / or short fibers of the inorganic substance (hereinafter, these are also simply referred to as metal-coated inorganic substance). ) And frit powder, and then a resin solution or a resin dispersion is added to the mixture and stirred to obtain a slurry mixture containing the metal-coated inorganic substance, the frit powder, and the resin. This slurry mixture is
Used as a conductive ceramic forming composition. In this slurry mixture, the ratio of the metal-coated inorganic substance is 45 to 65% by weight based on the total amount of the metal-coated inorganic substance and the frit powder. The ratio of the frit powder is 35 to 55% by weight based on the total amount of the metal-coated inorganic substance and the frit powder. The total content of the metal-coated inorganic substance and the frit powder in the slurry mixture is
It is 50 to 80% by weight, preferably 60 to 70% by weight. The ratio of the resin in the slurry mixture is
It is 15 to 35 parts by weight, preferably 20 to 25 parts by weight, based on 100 parts by weight of the total amount of the metal-coated inorganic substance and the frit powder.

As the resin, a conventionally known thermosetting resin can be arbitrarily used. As such a resin,
Phenolic resin, guanamine resin, epoxy resin, urethane resin, melamine resin, urea resin, maleic resin,
Examples thereof include thermosetting resins such as unsaturated polyester resins and xylene resins. These resins are used as a solution or a dispersion. As a solvent that provides these solutions or dispersions, various organic solvents, water, or a mixture thereof is used. The concentration of the resin in the solution or dispersion is 30
-60% by weight, preferably 40-55% by weight. In the present invention, the use of a thermosetting resin is particularly advantageous. The thermosetting resin can be cured by applying the slurry-like mixture on a substrate and drying the resin at a curing temperature of the resin. Such a cured product has excellent shape retention at high temperatures, and its shape is favorably maintained even when the temperature rises to the firing temperature.

Next, the slurry mixture is applied on a heat-resistant insulating substrate in the form of a film, dried, and fired. The firing temperature is a temperature in a range where the frit is melted and the resin is carbonized, and is generally 400 to 1000.
° C, preferably 500-900 ° C. For firing, an inert gas atmosphere such as nitrogen or argon is used. The oxygen concentration in the atmosphere is 5 vol% or less, preferably 0%. Thus, the conductive ceramic film can be formed on the heat-resistant insulating substrate.

Examples of the heat-resistant insulating substrate include various ceramic plates such as a ceramic plate, a clay clay plate, an alumina ceramic plate, a mullite plate, a zirconia plate, and a cordierite plate, as well as ceramic columns, cylinders, containers and the like. Can be. Various methods such as roll coating, spray coating, print coating, and brush coating can be used as a method for applying the slurry mixture on the heat-resistant insulating substrate. The thickness of the conductive ceramic film formed on the substrate obtained as described above is 200 to 500 μm, preferably 300 to 500 μm.
４００400 μm.

In order to produce a conductive ceramic film which is not supported on a substrate according to the present invention, the above slurry-like mixture is applied to a substrate which has been subjected to a non-adhesion treatment such as Teflon coating, dried, and dried on the substrate. After forming a film made of, the film may be peeled off and fired. in this case,
A conductive substrate such as a steel plate can be used as the substrate. The thickness of the conductive ceramic film thus obtained is 500 to 2000 μm, preferably 700 to 12 μm.
00 μm.

In another method for obtaining the conductive ceramic of the present invention, a metal-coated inorganic substance, a frit powder and a resin are mixed at a melting temperature of the resin, and the obtained mixture is thermoformed into a predetermined shape. And firing. In this case, the content of the resin in the mixture is 10 to 30% by weight, preferably 1 to 30% by weight.
5 to 25% by weight. In addition, calendering, extrusion, injection molding, or the like can be used as the thermoforming method. The shape of the molded product can be various shapes such as a film, a sheet, a plate, a rod, and a container.

Further, in the present invention, the molten mixture is cooled and finely pulverized into a powder comprising fine particles containing a metal-coated inorganic substance, a frit powder and a resin. Can also be used. As a method of obtaining a conductive ceramic using such powder, there is a method of thermoforming this powder as a molding material and baking it, or a method of fluidizing this powder and adding the powder in the fluidized state. A method in which a substrate heated to the temperature at which the resin is softened or melted is present and the powder is attached to the surface of the substrate, followed by firing, and the powder is applied to the surface of the substrate by an electrostatic coating method and then fired. Methods and the like can be mentioned.

The conductive ceramic of the present invention obtained as described above has a porous structure having many fine voids (voids) as a whole, and its specific gravity is smaller than that of the frit. . This porous structure is formed by a gas generated by the thermal decomposition of a resin when a molded article composed of a metal-coated inorganic substance, a frit powder, and a resin is fired. The specific gravity of the conductive ceramic of the present invention is 2 to 4, preferably 2.5 to 3.5.
Range. Further, the conductive ceramic of the present invention,
Frit is melted, cooled and formed into a vitreous body, in which metal-coated inorganic substance and carbide powder (carbon powder) generated by thermal decomposition of resin are dispersed, showing conductivity as a whole It is. Carbide powder also exists in the pores. The content of the metal-coated inorganic substance contained in the conductive ceramic is 45 to 65% by weight, and the content of the carbon powder is 0.5 to 5% by weight, preferably 1 to 3% by weight. The total amount of the metal-coated inorganic substance and the carbon powder is 45 to 81% by weight, preferably 48 to 81% by weight based on the whole ceramics.
~ 66% by weight.

The conductive ceramics of the present invention usually comprises 1
It has a volume resistivity of / 10 ³ to 10 ³ Ω · cm, and its resistance can be changed by the addition amount of the metal-coated inorganic substance. Further, the conductive ceramic of the present invention,
Usually, the metal-coated inorganic substance is exposed on the surface, and exhibits surface conductivity.

The conductive ceramic of the present invention can be used as an electric heating element by attaching an electrode thereto. As a method for attaching an electrode to the conductive ceramic of the present invention, various conventionally known methods can be employed. As such a method, a method of applying a silver paste on a ceramic surface to form a silver sintered film as an electrode,
Method of embedding metal wire inside ceramics, method of soldering metal wire on ceramic surface using ultrasonic soldering equipment and special solder, method of embedding metal wire or wire mesh in molded product in advance and firing And the like. Further, the conductive ceramics of the present invention is finely pulverized,
It can be a conductive ceramic powder. Such a conductive ceramic powder can be mixed into a plastic in order to give the plastic an antistatic property and an electromagnetic shielding property.

[0024]

The conductive ceramics of the present invention can be manufactured inexpensively in an electric furnace for pottery and ceramics without requiring a large-scale apparatus by a plasma spraying method or a gas spraying method. It has a function and effect. (1) Since the metal-coated inorganic substance is dispersed in an inorganic glassy matrix, the electric stability at high temperatures is higher than that of an electric heating element obtained by dispersing a conductive substance in a plastic matrix. . Therefore, the range of application to a high-temperature conductive circuit board, a high-frequency induction heating film, a sheet heating element, and the like can be expanded. (2) Since the resin is used as a binder for molding, the molded article has excellent shape retention and maintains its adhesiveness until the frit is melted. (3) The fired ceramic is a porous body having microvoids, which has an effect of relaxing internal stress generated at the time of heat generation, and has a high effect of adhesion to a substrate. (4) Since it has conductivity, it can be used as an electromagnetic wave shield or an antistatic tile.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to embodiments. In addition,% shown below is% by weight.

Example 1 Surface treatment of sericite (average particle size 38 μm) with γ-aminopropyltriethoxysilane (adhesion amount 0.5 g)
/ Sericite 100 g), then palladium ion solution (PdCl ₂ 1.0 g / l, concentrated HCl 2 ml / l)
To perform an activation treatment, and then electroless nickel plating was performed using an acid bath having the following specifications to obtain an electroless plating powder having a metallization ratio of 38%. In order to perform electroless plating, an aqueous solution in which a small amount of DL malic acid and succinic acid are dissolved is heated to 70 ° C., and the above-mentioned powder is charged into a plating tank automatically adjusted for pH and stirred. A solution having the following specifications was pumped up, and nickel was plated on the powder surface at PH 6.5 while dripping. (Acid bath specification) Nickel sulfate 20 g / l Sodium hypophosphite 15 g / l DL malic acid 30 g / l Succinic acid 20 g / l The amount of nickel coated on the powder is the amount of the powder charged into the bath and dropped. Controlled by solution volume. As a result of analysis, the content of phosphorus in the nickel coating was about 5%, and a powder having excellent conductivity was obtained.

The obtained nickel-plated powder was made of borosilicate flux of borosilicate flux which is a frit agent for ceramics.
-7 (manufactured by Nissou Sangyo Co., Ltd .: melting temperature 500 ° C.), low melting glass lead oxide type frit agent CT-410 (manufactured by Iwaki Glass Co., Ltd .: softening point 337 ° C.), low viscosity phenol resin PX-1600 (Honen Corporation) and cerazole (Mita Shoten Co., Ltd.), a squeegee oil for porcelain pigment, were each mixed with the composition shown in Table 1 on an alumina ceramic plate (thickness: 670 μm) using an applicator. Applied. After a part of the solvent such as methanol was volatilized, a curing reaction of the phenol resin was performed in a dryer at 130 ° C. Further, using an electric furnace, under nitrogen atmosphere at 300 ° C. for 1 hour, 400 ° C.
For 1 hour and further at 550 ° C. for 30 minutes, and then gradually cooled to room temperature. At the time of firing, the substrate was held vertically in the electric furnace, but no detachment or partial peeling of the coating was observed. An epoxy-based silver paste was applied to the obtained conductive ceramic film as an electrode, and further baked as necessary to form a baked silver film on both surfaces of the conductive ceramic film in a belt shape. The thickness of the conductive ceramic film (50 × 50 mm) after firing on the alumina ceramic plate is 4
30 μm, and its volume resistivity is 3.6 × 10
⁻² Ω · cm. As a result of gradually applying a voltage through the electrodes at both ends, the surface temperature near the center at 8.6 V was 35
0 ° C. was reached. After maintaining this state for 5 hours, there was no abnormality in the heat generation state, and the resistance change after cooling was within + 3%.

Example 2 In Example 1, the composition of the mixture was the composition shown in Table 1, and a cordierite sintered plate (thickness: 7.6 m) was used as a substrate.
The experiment was performed in the same manner except that m) was used. The thickness of the conductive ceramic film (80 × 50 mm) is 330 μm
And its volume resistivity was 2.4 Ω · cm. With a load of 100 V, the temperature near the center reached 350 ° C. A test was performed for 5 cycles, in which the process was left at 100 V for 1 hour and then left at 0 V for 1 hour, and a test of 5 cycles was performed. In this case, no change in appearance was observed. Although the change in resistance was + 4% after the first cycle, the change afterwards was small and +5 after 5 cycles.
%Met.

Example 3 An experiment was carried out in the same manner as in Example 1 except that the composition of the mixture was as shown in Table 1 and a ceramic plate (thickness: 5.7 mm) was used as a substrate. A conductive ceramic film (60 × 50 m) formed on a ceramic plate fired at 1280 ° C.
m) had a thickness of 420 μm and a volume resistivity of 7.4 × 10 ⁻² Ω · cm. At 22 V, the surface temperature near the center was about 200 ° C. In order to see the damage of the heat-producing film when the surface was immediately cooled, a 90-mm-diameter branched glass Erlenmeyer flask (300 mm) was used.
ml) of tap water (27 ° C.), and the water was constantly replaced. During this time, the coating was not damaged, and the resistance change after 5 hours was + 1.5%.

Example 4 In Example 1, the composition of the mixture was the composition shown in Table 1, and a Pyrex glass cylinder (outer diameter: 56 m) was used as a substrate.
m, an inner diameter of 48 mm). Along the outer periphery of the Pyrex glass cylinder, a ring-shaped conductive ceramic film (width 20 mm, circumference 176)
mm) was formed, but its thickness was 540 μm. After firing, small cracks were observed, but the coating did not fall off. The resistance in the ring diameter direction is 1
It was 05Ω. It was taken out by leaving it in an electric oven controlled at 150 ° C. for 7 days, and the resistance was measured.
Had increased to Ω. However, no significant change in the appearance of the coating was observed. When two electrodes made of an epoxy-based silver paste were formed so as to face each other in the ring diameter direction, and electricity was supplied, a slight temperature distribution was observed, but heat was generated smoothly.

[0031]

[Table 1]

Example 5 A short glass fiber (length: 300 μm, diameter: 13 μm) obtained by cutting a monofilament for FRP was applied to the surface of Example 1.
Nickel plating was performed in accordance with the plating pretreatment and the plating method described above, to obtain conductive fibers having a metallization ratio of 40%. A slurry having the following composition was prepared using the fibers, applied on an alumina ceramic plate, and fired in the same manner as in Example 1 to obtain a conductive ceramic film (60 × 50 mm). The film thickness was 490 μm. First, glass fibers were put into the resin slurry liquid and loosened, and then other powders were charged and stirred, whereby uniform dispersion could be achieved without producing pills. Nickel-plated sericite powder 22.5 g Nickel-plated glass short fiber 3.0 g Borosilicate frit (M-7) 17.5 g Lead oxide frit (CT-410) 8.0 g Phenolic resin (CX-1600) 29.0 g Squeegee oil (cerazole) 1.0 g The conductive ceramic coating was observed with an optical microscope, and it was confirmed that the fibers were uniformly dispersed. By mixing the conductive fibers, excellent conductivity of 1.2 × 10 ⁻² Ω · cm was obtained, and it was possible to raise the surface temperature by 250 ° C. at a low voltage of 6 V.

Example6  The slurry of Example 1 shown in Table 1 was placed on a Teflon-coated steel sheet.
After curing for 1 hour at 130 ° C,
After holding at 00 ° C. for 60 minutes, the cured film (50 × 30
mm) was peeled off. The thickness of this cured film is 1.25 mm
Met. Further, this film was placed in an electric furnace under a nitrogen atmosphere for 3 hours.
Baking treatment at 00, 400, 500, 550 ° C for 1 hour each
After cooling at each temperature treatment, take out and change resistance
Was measured. The measurement was made with a crocodile clip
At the top, we measured the change in resistance. as a result
Are shown in Table 2 below. However, the value at 130 ° C was the value before peeling.
It is a value measured by contacting the surface with a clip. Normal
In measuring the resistance value, silver paste is applied to both ends.
If you didn't do that, the resistance would be higher than normal
It has become. From 400 ° C for carbon scattering and low temperature
A sudden drop in resistance due to the start of frit dissolution is observed.
Can be After firing was completed, silver paste was applied and measured
As a result, it was 0.39Ω, and the volume resistivity was 3.4 ×.
10^-2A conductive ceramic film of Ω · cm was obtained. Ma
Also, hold the fired film horizontally and keep the voltage unchanged.
Table 3 shows the results of measuring the surface temperature rise. plus
Stable emission at high temperatures that cannot be obtained with tic-based composite conductors
There is a fever.

[0034]

[Table 2]

[0035]

[Table 3]

────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI H05B 3/14 C04B 35/00 J (72) Inventor Shinji Suzuki 37-1 Hongo Akaya, Toei-cho, Kitashitara-gun, Aichi Pres. Judge Toshiro Keiko Kakizawa Judge Satoru Satoru Miura (56) References JP-A-61-203505 (JP, A) JP-A-61-85703 (JP, A) JP-A-4-192208 (JP, A) JP 2-288203 (JP, A) JP-A-63-32805 (JP, A) JP-A-4-19905 (JP, A) JP-A-6-1223057 (JP, A) JP-B-3-77648 (JP, A) B2) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01B 1/00 H01B 5/16

Claims (8)

(57) [Claims] 1. A heat treatment is carried out at a temperature of 400 to 1000 ° C. in a state in which sericite powder and / or inorganic short fibers coated with metal in a resin and frit powder are dispersed. Having a structure in which powder of metal-coated sericite and / or short fibers of an inorganic substance and carbon powder are dispersed in a porous inorganic vitreous body. A conductive ceramic, wherein the content of the site powder and / or the inorganic short fibers is 45 to 65% by weight. 2. The conductive ceramic according to claim 1, which is formed in a film shape. 3. The conductive ceramic according to claim 1, which is formed in a film shape on a heat-resistant insulating substrate. 4. A powder of metal-coated sericite and / or
Alternatively , a slurry-like mixture of inorganic short fibers, frit powder, a resin solution or a resin dispersion is applied to a heat-resistant insulating substrate, dried, and subjected to a heat treatment at a temperature of 400 to 1000 ° C. Melting the frit powder and carbonizing the resin to form a conductive ceramic film on the heat-resistant substrate , wherein the metal-coated sericite powder and / or inorganic substance in the slurry-like mixture Wherein the proportion of the metal-coated sericite powder and / or inorganic short fibers to the total amount of the short fibers and the frit powder is 45 to 65% by weight. Production method. 5. A powder of metal-coated sericite and / or
Alternatively, a slurry-like mixture of inorganic short fibers, frit powder, a resin solution or a resin dispersion is applied on a substrate, dried, and a film formed on the substrate is peeled from the substrate.
A heat treatment under a temperature condition of 00 to 1000 ° C., and baking to form a conductive ceramic film. The metal-coated sericite powder and / or inorganic substance in the slurry-like mixture is formed . The production of a conductive ceramic film, wherein the ratio of the metal-coated sericite powder and / or the inorganic short fiber to the total amount of the short fiber and the frit powder is 45 to 65% by weight. Method. 6. A powder of metal-coated sericite and / or
Or a mixture of inorganic short fibers, frit powder and resin
And after forming into a predetermined shape, to melt the frit powder is subjected to heat treatment in the heating temperature of 400 to 1000 ° C.,
And forming a conductive ceramic molded product by carbonizing a resin, wherein the metal is coated with respect to the total amount of the metal-coated sericite powder and / or inorganic short fibers and frit powder in the mixture. The proportion of coated sericite powder and / or inorganic short fibers is between 45 and 65;
% By weight. 7. A composition comprising metal-coated sericite and / or inorganic short fibers and frit powder dispersed in a resin solution or a resin dispersion, wherein the metal-coated sericite powder is dispersed. The ratio of the metal-coated sericite powder and / or the inorganic short fiber to the total amount of the body and / or the inorganic short fiber and the frit powder is 45 to 65% by weight. For forming conductive ceramics. 8. The conductive ceramics according to claim 1, wherein the conductive ceramics are made to conduct electricity.
A heating heating element that generates heat of up to 500 ° C.