JPS6185703A - Conductor material composition - Google Patents
Conductor material compositionInfo
- Publication number
- JPS6185703A JPS6185703A JP20679984A JP20679984A JPS6185703A JP S6185703 A JPS6185703 A JP S6185703A JP 20679984 A JP20679984 A JP 20679984A JP 20679984 A JP20679984 A JP 20679984A JP S6185703 A JPS6185703 A JP S6185703A
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- material composition
- substrate
- composition
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の属する技術分封〕
本発明はプリント基板等の基板上に焼結により固層され
る導電体材料組成物に係シ、特に導電性物質としての貴
金属の使用量を低減しうるとともに高性能な電気特性を
呈しうる導電体材料組成物に関する。[Detailed Description of the Invention] [Technical Encapsulation to Which the Invention Pertains] The present invention relates to a conductive material composition that is solidified by sintering on a substrate such as a printed circuit board, and particularly relates to the amount of noble metal used as a conductive substance. The present invention relates to a conductive material composition that can reduce the amount of electricity and exhibit high-performance electrical properties.
導電体材料組成物は通常、導電性ペーストとも称せられ
、これをプリント基板等の基板上に所望の模様に塗布し
、あるいは所望の配線に印刷し、乾燥の後、焼結固着す
ることにより、プリント基板等の導電体として広く用い
られている。The conductive material composition is usually also called a conductive paste, and it can be applied to a substrate such as a printed circuit board in a desired pattern, or printed on a desired wiring, dried, and then sintered and fixed. Widely used as a conductor for printed circuit boards, etc.
この糧の用途を有する導電性ペーストとして、従来、金
粉ないしは銀粉などのむくな導電性物質、基板への固着
剤としての低融点ガラス粉体、テレピン油などの溶剤、
その他を含有したものが知られているが、ここで用いら
れる導電性物質はむくな金ないしは銀の微粉体（金粉な
いしは銀粉）であるので、その使用量の増加を余儀なく
され、このため高価となる。Conventionally, conductive pastes used for this purpose include solid conductive substances such as gold powder or silver powder, low melting point glass powder as a fixing agent to the substrate, solvents such as turpentine oil, etc.
Products containing other substances are known, but since the conductive material used here is solid gold or silver fine powder (gold powder or silver powder), the amount used has to be increased, which makes them expensive. Become.
本発明の目的は導電性物質としての貴金属の使用量が低
減されるとともに高性能な電気特性を呈しうる、前述の
公知技術に存する欠点を改良した導電体材料組成物を提
供することにある。An object of the present invention is to provide a conductive material composition that can reduce the amount of precious metal used as a conductive substance and exhibit high-performance electrical properties, which improves the drawbacks of the above-mentioned known techniques.
前述の目的を達成するため、本発明によれば、基板上に
焼結により固着される導電体材料組成物において、貴金
属めっきの施されたカーボンまたはセラミックス微粉体
からなる導電性物質と、焼結の後この導電性物質を前記
基板上に均質に固着せしめる固着剤とを主成分として含
むことを特徴とする。In order to achieve the above-mentioned object, according to the present invention, in a conductive material composition fixed on a substrate by sintering, a conductive substance made of carbon or ceramic fine powder plated with a noble metal, and It is characterized in that it contains as a main component a fixing agent that then uniformly fixes the conductive substance onto the substrate.
以下、本発明を具体的に説明する。 The present invention will be specifically explained below.
本発明にかかる導電性物質は金（Ａｕ）、＊（Ａｇ）、
パラジウム（Ｐｄ ） 、白金（Ｐｔ）等の貴金属めっ
きの施された黒鉛、カーボンブラック等のカーボン微粉
体、またはセラミックス微粉体であって、平均粒径２ミ
クロン以下、好ましくは１ミクロン以下である。なお、
前記微粉体への貴金属のめつきは公知の懸濁電解法、あ
るいは銀鏡反応等を利用して施されるが、その他のいか
なる方法により施されでもかまわないｏしたがって、こ
こではめつき方法についての説明は省略する０
また、本発明に用いられる固着剤は後述の焼結の後、前
述導電性物質を後述の基板上に均質に固着せしめ得る物
質であって、例えば融点３００乃至６００℃の低融点ガ
ラス粉体（平均粒径２ミクロン前後）が用いられ、具体
的にはホウケイ酸鉛ガラス粉体（融点的５００℃、平均
粒径２ミクロン）が挙げれる。The conductive substance according to the present invention is gold (Au), *(Ag),
Graphite plated with a noble metal such as palladium (Pd) or platinum (Pt), carbon fine powder such as carbon black, or ceramic fine powder, and has an average particle size of 2 microns or less, preferably 1 micron or less. In addition,
The fine powder is plated with precious metals using the known suspension electrolysis method or silver mirror reaction, but any other method may be used.Therefore, here we will discuss the plating method. Further, the fixing agent used in the present invention is a material that can homogeneously fix the conductive material on the substrate described later after sintering described later, and is a material with a low melting point of 300 to 600°C, for example. A melting point glass powder (average particle diameter of about 2 microns) is used, and a specific example is lead borosilicate glass powder (melting point of 500° C., average particle diameter of 2 microns).
本発明組成物は前述の導電性物質と固着剤を主成分とし
、これらを任意の混合比率で混合し、好ましくは導電性
物質１００重量部に対して固着剤３゛乃至刃重量部、さ
らに好ましくは５乃至加重置部の混合比率で混合し、さ
らにこの混合物に他の成分１例えばエチルセルローズ、
飽和脂肪酸変性アルキッド樹脂等の賦型剤、テレピン油
等の溶剤、エチレングリコールモノエチルエーテル等の
稀釈剤等を任意の適当量添加混合することにより得られ
る０
このようにして得られた本発明にかかる組成物はアルミ
ナセラミック板等の基板上に任意の模様に塗布ないしは
印刷され、例えばプリント基板を得る場合には配線模様
に印刷され、次いで大気中に適当な時間放置して乾燥の
後、約６００℃の温度まで徐々に昇温し、この温度に適
当な時間保つことにより焼結される。焼結後、導電性物
質は前記固着剤により基板上に均質に固着されて電気伝
導性の良好な導電体を形成する。また、本発明にかかる
導電性物質はカーボンまたはセラミックス微粉体に貴金
属がめつきされたもの（平均めつき°膜厚０．３ミクロ
ン程度）であるので、従来のむくな貴金属微粉体と比較
して貴金属の使用量が著しく低減される。The composition of the present invention has the above-mentioned conductive substance and adhesive as main components, and these are mixed in an arbitrary mixing ratio, preferably 3 to 3 parts by weight of the adhesive to 100 parts by weight of the conductive substance, and more preferably. are mixed at a mixing ratio of 5 to 100% by weight, and further added to this mixture are other ingredients such as ethyl cellulose,
The present invention obtained in this way can be obtained by adding and mixing any suitable amount of excipient such as saturated fatty acid-modified alkyd resin, solvent such as turpentine oil, diluent such as ethylene glycol monoethyl ether, etc. Such a composition is coated or printed in an arbitrary pattern on a substrate such as an alumina ceramic plate, for example, in the case of obtaining a printed circuit board, it is printed in a wiring pattern, and then left in the atmosphere for an appropriate period of time to dry, and then dried. Sintering is carried out by gradually increasing the temperature to 600° C. and keeping it at this temperature for an appropriate period of time. After sintering, the conductive material is uniformly fixed onto the substrate by the adhesive to form a conductor with good electrical conductivity. In addition, since the conductive material according to the present invention is made of carbon or ceramic fine powder plated with noble metal (average plating x film thickness of about 0.3 microns), it is more effective than conventional solid noble metal fine powder. The amount of precious metals used is significantly reduced.
以下、本発明を実施例により説明する。The present invention will be explained below using examples.
実施例
次の組成の導電性ペースト（本発明Ｋかかる導電体材料
組成物〕を調製した。Example A conductive paste (conductive material composition according to the present invention) having the following composition was prepared.
銀めっきの施された黒鉛微粉体・・・・・・・・・・・
・５０（重量％）（平均粒径１ミクロン、平均めつき膜
厚０．３ ミクロン）エチルセルローズ ・・・・・・
・・・・・・・・・・・・・・・・・・ 、ｉ、３８（
３１量％）飽和脂肪酸変性アルキッド樹脂・・・・・・
１５．６２（＃ ）テレピン油 ・・・・・・・・・
・・・・・・・・・・・・−・・・・・・・・・・・・
・・ ８．７５（＃ ）エチレングリコールモノエチル
エーテル・・・１５．００（ｔｔ ）このペーストを
アルミナセラミック板上に配線模様に印刷し、−昼夜大
気中に放置の後、７分間で６００℃まで昇温し、この温
度で１０分間保持し、その後加分間で常温まで戻して焼
きつけ、膜厚１６．３ ミクロンの配線図の印刷された
プリント基板を得た。この配線に単二乾電池を用いて通
電したところ、通常の銅線と同様に豆電球が点灯し、配
線は導電体であることがわかった。さらにこの導電体（
配線）の抵抗値を測定したところ３回の平均値でｏ、ｏ
ｏｓΩ／ｍであシ、良好な電導性を有することがわかっ
た。また、黒鉛微粉体の銀めっき層は平均膜厚０．３ミ
クロンであるので、銀の使用量がむくな銀粉と比較して
４０乃至５０％節約することができた。Silver-plated graphite fine powder...
・50 (weight%) (average particle size 1 micron, average plating thickness 0.3 micron) Ethyl cellulose...
・・・・・・・・・・・・・・・・・・ ,i,38(
31% by weight) Saturated fatty acid modified alkyd resin...
15.62 (#) Turpentine oil ・・・・・・・・・
・・・・・・・・・・・・－・・・・・・・・・・・・
...8.75 (#) Ethylene glycol monoethyl ether...15.00 (tt) This paste was printed in a wiring pattern on an alumina ceramic board, and after being left in the air day and night, it was heated to 600°C for 7 minutes. The temperature was raised to 100.degree. C., held at this temperature for 10 minutes, and then returned to room temperature during a heating period and baked to obtain a printed circuit board with a wiring diagram printed on it and having a film thickness of 16.3 microns. When this wire was energized using an AA battery, a miniature light bulb lit up just like a normal copper wire, indicating that the wire was a conductor. Furthermore, this conductor (
When I measured the resistance value of the wire (wiring), the average value of 3 times was o, o
It was found that it had good conductivity at osΩ/m. Furthermore, since the silver plating layer of fine graphite powder has an average thickness of 0.3 microns, the amount of silver used can be reduced by 40 to 50% compared to plain silver powder.
以上のとおり、本発明組成物は導電性物質としてカーボ
ンまたはセラミックス微粉体に貴金属めっきが施された
ものを用いるから、従来のむくな貴金属からなる導屈性
物實と比較して貴金属の使用量を４０乃至５０Ｘ節約す
ることができ、経済上啄めて有効であり、しかも導電性
も非常に良好であり、プリント基板の製造等、広い用途
を有するものである。As described above, since the composition of the present invention uses carbon or ceramic fine powder plated with a precious metal as a conductive substance, the amount of precious metal used is higher than that of conventional conductive materials made of solid noble metals. It is economically effective as it can save 40 to 50 times of energy consumption, and has very good conductivity, so it has a wide range of uses, such as in the production of printed circuit boards.
Claims (3)
において、貴金属めつきの施されたカーボンまたはセラ
ミックス微粉体からなる導電性物質と、焼結の後この導
電性物質を前記基板上に均質に固着せしめる固着剤とを
主成分として含むことを特徴とする導電体材料組成物。(1) In a conductive material composition that is fixed on a substrate by sintering, a conductive material made of carbon or ceramic fine powder plated with a noble metal is added to the substrate after sintering. A conductive material composition characterized by containing as a main component a fixing agent for uniformly fixing.
前記貴金属は金（Ａｕ）、銀（Ａｇ）、パラジウム（Ｐ
ｄ）、または白金（Ｐｔ）である組成物。(2) In the composition according to claim 1,
The noble metals include gold (Au), silver (Ag), and palladium (P).
d), or platinum (Pt).
前記固着剤は低融点ガラス粉体である組成物。(3) In the composition according to claim 1,
A composition in which the fixing agent is a low melting point glass powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20679984A JPS6185703A (en) | 1984-10-02 | 1984-10-02 | Conductor material composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20679984A JPS6185703A (en) | 1984-10-02 | 1984-10-02 | Conductor material composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185703A true JPS6185703A (en) | 1986-05-01 |
Family
ID=16529285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20679984A Pending JPS6185703A (en) | 1984-10-02 | 1984-10-02 | Conductor material composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185703A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0896621A (en) * | 1994-09-28 | 1996-04-12 | Agency Of Ind Science & Technol | Conductive ceramics |
| JP2007244551A (en) * | 2006-03-15 | 2007-09-27 | Transcutaneous Technologies Inc | Iontophoresis apparatus |
| JP2008095855A (en) * | 2006-10-12 | 2008-04-24 | Pioneer Electronic Corp | Fixing structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58163102A (en) * | 1982-03-20 | 1983-09-27 | ティーディーケイ株式会社 | Conductive paste |
-
1984
- 1984-10-02 JP JP20679984A patent/JPS6185703A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58163102A (en) * | 1982-03-20 | 1983-09-27 | ティーディーケイ株式会社 | Conductive paste |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0896621A (en) * | 1994-09-28 | 1996-04-12 | Agency Of Ind Science & Technol | Conductive ceramics |
| JP2007244551A (en) * | 2006-03-15 | 2007-09-27 | Transcutaneous Technologies Inc | Iontophoresis apparatus |
| JP2008095855A (en) * | 2006-10-12 | 2008-04-24 | Pioneer Electronic Corp | Fixing structure |
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