JPS5871507A - Conductive paste - Google Patents

Conductive paste

Info

Publication number
JPS5871507A
JPS5871507A JP16958481A JP16958481A JPS5871507A JP S5871507 A JPS5871507 A JP S5871507A JP 16958481 A JP16958481 A JP 16958481A JP 16958481 A JP16958481 A JP 16958481A JP S5871507 A JPS5871507 A JP S5871507A
Authority
JP
Japan
Prior art keywords
parts
weight
powder
film
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16958481A
Other languages
Japanese (ja)
Other versions
JPH0143965B2 (en
Inventor
角田 志郎
徹 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP16958481A priority Critical patent/JPS5871507A/en
Publication of JPS5871507A publication Critical patent/JPS5871507A/en
Publication of JPH0143965B2 publication Critical patent/JPH0143965B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はメッキ処理、つ(可能な低温焼成用厚膜導電ペ
ーストに関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thick film conductive paste for plating and low temperature firing.

厚膜技術を用いて導体、抵抗体、誘電体を基板上に回路
として形成する場合、最後の工程で導体による外部電極
の形成を行なうことがある。この場合焼成温邸が1.1
−いと行に抵抗体ておいてその特性値が著るしく変化す
る。このため、この外部電極となる導体の焼成を500
〜t!;O0C程度の温度で行なうのか一般的である。
When forming conductors, resistors, and dielectrics as circuits on a substrate using thick film technology, external electrodes may be formed using the conductors in the final step. In this case, firing Ontei is 1.1
- When the resistor is placed in the opposite direction, its characteristic value changes significantly. For this reason, the conductor that will become the external electrode is fired for 500
~t! ; It is generally carried out at a temperature of about O0C.

所が従来のこのような低温焼成用の4市ペースl−には
次のような欠点があった。即ち、従来一般の導電ペース
トはAg、Pa、Pt、Au 等の貴金属粉末(合金を
含む)、ガラス粉末、酸化ビスマス及び有機質ビヒクル
で構成されており、このような構成の導電ペーストは7
so −qso oC焼成用に適し、焼成膜と基板との
接着強度が強く、半田付けも可能である。シ、かしなが
らこのような導電ペーストを基板上にSOO〜tso 
Oc程度の温度で焼付けても充分な接着強度が得られな
い。その原因はこのような低温度では酸化ビスマスは軟
化せず、導電皮膜と基板との接着に何ら寄与しないから
である。このためSOO〜500Cで焼成するための導
電ペーストは酸化ビスマスを添加せず、その代りにガラ
ス粉末を増量して接着強度の改善を図っている。
However, the conventional four-city pace l- for low-temperature firing had the following drawbacks. That is, conventional conductive pastes are composed of noble metal powders (including alloys) such as Ag, Pa, Pt, and Au, glass powder, bismuth oxide, and an organic vehicle.
so-qso Suitable for OC firing, has strong adhesive strength between the fired film and the substrate, and can be soldered. While doing so, apply such a conductive paste on the board.
Even if it is baked at a temperature of approximately 200°C, sufficient adhesive strength cannot be obtained. This is because bismuth oxide does not soften at such low temperatures and does not contribute to the adhesion between the conductive film and the substrate. For this reason, conductive pastes for firing at SOO~500C do not contain bismuth oxide, but instead increase the amount of glass powder to improve adhesive strength.

しかしながらこのような組成の導電ペーストで形成され
る導電皮膜は半田付は性が劣るのが通例であり、そのた
め半田付けが必要な場合は導電皮膜に半田メッキを施す
のであるが、半1flメッキ処理すると該皮膜の接着強
度が者るしく低下する傾向があった。この原因はガラス
中のpbo及びB2O3がメッキ液中の酸で浸されるた
めと考えられる。
However, the conductive film formed from a conductive paste with such a composition usually has poor solderability, and therefore, when soldering is required, the conductive film is solder plated, but semi-1 fl plating treatment is used. Then, the adhesive strength of the film tended to decrease markedly. The reason for this is thought to be that pbo and B2O3 in the glass are soaked with the acid in the plating solution.

本発明はE記欠点を解消し、メッキ処理に耐えられる低
温焼成相等゛心ペーストを提供するものである。
The present invention eliminates the drawback described in E and provides a low-temperature firing phase homocentric paste that can withstand plating treatment.

この目的を達成するため本発明の導電ペーストは、貴金
属粉末700重量部、PbO−、B203−5in2系
ガラス粉末2!;〜20重量部、ジルコニア粉末7〜7
0重量部からなる基材な有機質ビヒク/L、に分散せし
めた点に特徴かある。
In order to achieve this object, the conductive paste of the present invention includes 700 parts by weight of noble metal powder, PbO-, B203-5in2 glass powder, and 2! ~20 parts by weight, zirconia powder 7~7
It is distinctive in that it is dispersed in a base organic vehicle/L consisting of 0 parts by weight.

本発明に用いる貴金属粉末は、従来の厚膜導′東ペース
l−に用いられているのと同様であって、Ag、Pa、
 Pt 、 Au等の単体、合金又はこれらの混合物で
ある。価格の点でAg SAg−Pa 、 Ag−Pt
等が好ましい。貴金属粉末の粒径は1〜ioμmが適当
である。
The noble metal powder used in the present invention is the same as that used in the conventional thick film conductor, and includes Ag, Pa,
It is a simple substance such as Pt or Au, an alloy, or a mixture thereof. Ag SAg-Pa, Ag-Pt in terms of price
etc. are preferred. The particle size of the noble metal powder is suitably 1 to io μm.

ガラス粉末は、焼成時に軟化ないし熔融して貴金属粉末
を基板に側副に接着せしめるものでなければ九−らない
、っこのため軟化点が焼成温度r″す10〜200°C
低いガラスか必要である。この目的のためにPbO−B
203−5in2系ガラスが適当である。
The glass powder must be softened or melted during firing to adhere the noble metal powder to the substrate and its side parts; therefore, the softening point is 10 to 200°C, which is the firing temperature r''.
Low glass or required. For this purpose PbO-B
203-5in2 type glass is suitable.

例えば乙0O0Cで焼成する場合は、pbo乙0、B、
0310゜S 102 J O各重量%のガラス(軟化
点約560°C)を用いることができる。PbO−B2
O3−8iO2系ガラスはZn○、BaO、Al2O3
、TlO2、Z r O2等の酸化物を少量含んでいて
も良い。
For example, when firing at Otsu 0O0C, pbo Otsu 0, B,
0310°S 102 J O glass (softening point about 560°C) can be used. PbO-B2
O3-8iO2 glass is Zn○, BaO, Al2O3
, TlO2, ZrO2, etc. may be contained in small amounts.

ガラス粉末の粒度は−325メツシユ程度に粉砕したも
のが適当である。ガラス粉末の添加割合は貴金属粉末1
00重量部当す1!I;−20重量部とする必要がある
。25重量部未満では基板との接着力が不足であり、2
0重量部を超えると焼成膜の導電性が低下し、該焼成膜
表面に均一にメッキできないO ジルコニア(Z r O2)粉末は焼成皮膜の耐酸性を
向上するために添加される。ジルコニア粉末の添加割合
は、貴金属粉末100”if@部当り7〜10重量部と
する必要がある。1重量部未満では耐酸性向上の効果は
少なく、70重量部を超えろと焼成膜の導電性が低下し
、該焼成膜に均一にメツへできなくなる上、基板と該焼
成膜の接着力が低下する。
The particle size of the glass powder is suitably pulverized to about -325 mesh. The addition ratio of glass powder is 1 part noble metal powder
00 parts by weight 1! I: It is necessary to set it to -20 parts by weight. If it is less than 25 parts by weight, the adhesive strength with the substrate is insufficient;
If the amount exceeds 0 parts by weight, the conductivity of the fired film decreases and the surface of the fired film cannot be plated uniformly. O 2 zirconia (Z r O2) powder is added to improve the acid resistance of the fired film. The addition ratio of zirconia powder should be 7 to 10 parts by weight per 100" parts of noble metal powder. If it is less than 1 part by weight, the effect of improving acid resistance will be small, and if it exceeds 70 parts by weight, the conductivity of the fired film will be improved. In addition, the adhesive force between the substrate and the fired film decreases, making it impossible to bond the fired film uniformly.

ジルコニア粉末としては、平均粒径/〜3μm程度のも
のが適当である。
A suitable zirconia powder has an average particle size of about 3 μm.

上記の貴金目粉末、ガラス粉末、ジルコニア粉末からな
る基材は有機′6ビヒクルと共に混練し、均一なペース
ト状とされる。この有機質ビヒクルは従来の厚膜ペース
トに用いられているもので良い。/例トしてエチルセル
ロースをプチルカルビ□トールアセテート、ターピネオ
ールVC70〜20重量係程度溶解したものが挙げられ
る。基材とビヒクルの添〃口割合は最終的に得られるペ
ースト粘度との関連で決めれば良い。標準的な添加割合
は、主成分となる青金4扮末700重量部当り約qo重
量部である。
The base material consisting of the above-mentioned precious metal powder, glass powder, and zirconia powder is kneaded with an organic vehicle to form a uniform paste. The organic vehicle may be that used in conventional thick film pastes. Examples include those obtained by dissolving ethyl cellulose in butyl carbitol acetate and terpineol VC in a weight ratio of about 70 to 20. The ratio of the base material to the vehicle may be determined in relation to the final viscosity of the paste. The standard addition ratio is about qo parts by weight per 700 parts by weight of the main ingredient, Aojin 4 powder.

このように調整されたペーストは従来の導電ペーストと
同様てζ9ミ布、焼成ができる。
The paste prepared in this manner can be processed and fired in the same way as conventional conductive pastes.

本発明の4電ペーストはガラス、又はセラミック基板に
直接しこ焼付けても良いし、既IIC:K :’!Z 
、L−に形成された導体、抵抗体、誘電体等の上テ重ね
て焼付けることもできる。
The four-electrode paste of the present invention may be baked directly onto a glass or ceramic substrate, or it may be applied directly to a glass or ceramic substrate. Z
, a conductor, a resistor, a dielectric, etc. formed in L- can be overlaid and baked.

以下に実、験191]イビ/Jミす。Below is the actual experiment 191] Ibi/J Misu.

実験A/〜?0 貴金属粉末として銀粉灯重量部、パラジウム粉5重量部
を用い、PbO: B2O3: 5in2−60 :1
0 : 10(重量比)のガラス粉/、 、15.3.
10.20及び5重量部、ジルコニア粉0、/、!、i
o及び/、2重量部の全ての組合せについてペーストを
作製し、焼成後の特性を測定した。有機質ビヒクルはエ
チルセルローズf20重量%含有するターピネオール溶
液を用い、上記すべての組合せについて各々110重量
部を適用した。
Experiment A/~? 0 Using parts by weight of silver powder lamp and 5 parts by weight of palladium powder as noble metal powder, PbO: B2O3: 5in2-60:1
0:10 (weight ratio) glass powder/, , 15.3.
10.20 and 5 parts by weight, zirconia powder 0, /,! ,i
Pastes were prepared for all combinations of o and/or 2 parts by weight, and the properties after firing were measured. As the organic vehicle, a terpineol solution containing 20% by weight of ethyl cellulose F was used, and 110 parts by weight of each of the above combinations was applied.

作製したペーストは7インチ角のアルミナ基板にライン
幅に2jミクロン、全長3/2.夕TILIIのジグザ
グパターンでスクリーン印刷L、約13o0cで10分
間乾燥後too 0c  で焼成I7、焼成I7た試料
について下記の均一メッキ性及び耐酸性の試験を行なっ
た。
The prepared paste was placed on a 7 inch square alumina substrate with a line width of 2J microns and a total length of 3/2. The following uniform plating property and acid resistance tests were conducted on the sample which was screen printed with a zigzag pattern of TILII, dried at about 13oC for 10 minutes, and then baked at toooC.

(1)メッキ性二 ワット浴(硫酸ニッケル、塩化ニッ
ケル、硼酸を含有する)を用いてメッキ処理し、燐酸膜
表面に均一にニッケルが電着1〜でいるかどうかを調べ
た。メッキが一部分でも付いていない場合は不可(×印
)とし、一応全面にメッキが付いていれば可(○印ン、
特に良好なものは1埴(よ多印)と12だ。
(1) Plating property Plating was performed using a two-watt bath (containing nickel sulfate, nickel chloride, and boric acid), and it was examined whether nickel was uniformly electrodeposited on the surface of the phosphoric acid film. If there is no plating on the entire surface, it is not acceptable (marked with an x), but if the entire surface is plated, it is acceptable (marked with an ○,
Particularly good ones are 1 Hani (Yotain) and 12.

(2)耐酸性: 試料な35係塩酸水溶液にグO0cに
てS分間浸漬後水洗I7、垂直に立てたステ/レス針1
/C100gの荷重をかけながら試料面をこすり、皮膜
が基板から剥離するかどうかを調べたO 針が通過l、た跡に皮膜の割れ、剥離が認められたもの
、皮膜が全く接着I7ていないものは不可(×印)とI
7た。接着力が維持されているものは皮膜−に針の条−
痕−か例ゐ−だけで−ある。条痕が光沢を有[2、硬度
が充分法たれていると認められるものは優((■印)と
(7た0ペ一スト組成と試験結果を表にまとめて示[7
た。
(2) Acid resistance: The sample was immersed in a 35% hydrochloric acid aqueous solution at 00C for S minutes, then washed with water at I7, and the steel/less needle 1 was placed vertically.
/C The sample surface was rubbed while applying a load of 100 g to check whether the film peeled off from the substrate.O When the needle passed l, cracks and peeling of the film were observed in the traces, and the film did not adhere at all.I7 Things are not allowed (x mark) and I
7. If the adhesion is maintained, there will be needle stripes on the film.
There are only traces or examples. The paste composition and test results are summarized in the table [7].
Ta.

上記試験結果から、貴金属粉末1OON量部当りガラス
粉末2〜20・4輪:部でかつジルコニア粉末7〜10
重量部のとき、均一メッキ性、耐酸性いずれも良好であ
る二とか分る。
From the above test results, 2 to 20.4 parts of glass powder per 100 parts of precious metal powder and 7 to 10 parts of zirconia powder.
When it comes to parts by weight, it can be seen that both uniform plating properties and acid resistance are good.

実験屋37〜5?3 実験A、?/は責尉叫扮末として銀粉95重量部、白金
粉5重量Ft、阻実験116.′I2は銀粉りS重量部
、金粉5重量部、実験扁33は銀粉を700重量部と(
〜、それぞれガラス粉5重量部、ジルコニア粉5重量部
、ビヒクル170重量部と[7てペーストを作製し、実
験A/〜30と同様に塗布焼成[−でメッキ性、耐酸性
を調べた。ペースト組成と試験結果を表て示す。いずれ
の場合も均一メッキ性、耐酸性共に満足すべき結果が得
られた。
Experimenter 37~5?3 Experiment A,? / contains 95 parts by weight of silver powder, 5 parts by weight of platinum powder, and 116 parts by weight of platinum powder. 'I2 contains 700 parts by weight of silver powder, 5 parts by weight of gold powder, and 700 parts by weight of silver powder for experimental flat plate 33 (
A paste was prepared using 5 parts by weight of glass powder, 5 parts by weight of zirconia powder, and 170 parts by weight of vehicle, respectively, and coated and baked in the same manner as in Experiment A/-30, and the plating properties and acid resistance were investigated. Paste composition and test results are shown. In all cases, satisfactory results were obtained in both uniform plating performance and acid resistance.

Claims (1)

【特許請求の範囲】[Claims] (1)貴金属粉末700重量部、pbo−B203−8
102系ガラス粉末2s−、to重量部、ジルコニア粉
末7〜10重量部からなる基材を有機質ビヒクルに分散
せしめてなる導電ペースト。
(1) 700 parts by weight of noble metal powder, pbo-B203-8
A conductive paste made by dispersing a base material consisting of 2 to 102 parts by weight of glass powder and 7 to 10 parts by weight of zirconia powder in an organic vehicle.
JP16958481A 1981-10-23 1981-10-23 Conductive paste Granted JPS5871507A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16958481A JPS5871507A (en) 1981-10-23 1981-10-23 Conductive paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16958481A JPS5871507A (en) 1981-10-23 1981-10-23 Conductive paste

Publications (2)

Publication Number Publication Date
JPS5871507A true JPS5871507A (en) 1983-04-28
JPH0143965B2 JPH0143965B2 (en) 1989-09-25

Family

ID=15889183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16958481A Granted JPS5871507A (en) 1981-10-23 1981-10-23 Conductive paste

Country Status (1)

Country Link
JP (1) JPS5871507A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894184A (en) * 1986-08-27 1990-01-16 The Furukawa Electric Co., Ltd. Low-temperature burnt conductive paste and method of manufacturing printed circuit board
US5757609A (en) * 1994-06-01 1998-05-26 Murata Manufacturing Co., Ltd. Ceramic capacitor
JP2013058471A (en) * 2011-07-29 2013-03-28 Giga Solar Materials Corp Conductive composition and manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251413A (en) * 1975-10-23 1977-04-25 Okuno Chem Ind Co Composite of enameled glass

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251413A (en) * 1975-10-23 1977-04-25 Okuno Chem Ind Co Composite of enameled glass

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894184A (en) * 1986-08-27 1990-01-16 The Furukawa Electric Co., Ltd. Low-temperature burnt conductive paste and method of manufacturing printed circuit board
US5757609A (en) * 1994-06-01 1998-05-26 Murata Manufacturing Co., Ltd. Ceramic capacitor
JP2013058471A (en) * 2011-07-29 2013-03-28 Giga Solar Materials Corp Conductive composition and manufacturing method

Also Published As

Publication number Publication date
JPH0143965B2 (en) 1989-09-25

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