JPS62259302A - Conductive paste composition - Google Patents
Conductive paste compositionInfo
- Publication number
- JPS62259302A JPS62259302A JP10267786A JP10267786A JPS62259302A JP S62259302 A JPS62259302 A JP S62259302A JP 10267786 A JP10267786 A JP 10267786A JP 10267786 A JP10267786 A JP 10267786A JP S62259302 A JPS62259302 A JP S62259302A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- conductive paste
- silver
- powder
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 12
- 239000005388 borosilicate glass Substances 0.000 claims description 9
- 239000002612 dispersion medium Substances 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 7
- 230000032683 aging Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、厚膜ハイブリッドＩＣ電気回路基板を構成す
るのに好適な銀を導電性付与成分とする導電ペーストに
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a conductive paste containing silver as a conductivity-imparting component suitable for constructing a thick film hybrid IC electric circuit board.
厚膜ハイブリッドＩＣの電気回路パターンを構成するに
は、一般には、導電ペーストを絶縁基板にスクリーン印
刷したうえ、これを焼成することによって行われる。こ
の分野で使用される導電ペーストとしては、恨パラジウ
ム、ｊ艮白金、金などの貴金属ペーストがよく知られて
いる。このうち特に銀パラジウム系がよく使用されてい
る。この銀パラジウＪ、系導電ペーストは、５〜３０重
量％程度のパラジウム粉末を銀粉末と共に有機分散媒に
分散させたものである。The electrical circuit pattern of a thick film hybrid IC is generally constructed by screen printing a conductive paste on an insulating substrate and then firing it. As conductive pastes used in this field, noble metal pastes such as palladium, platinum, and gold are well known. Among these, silver-palladium-based materials are particularly frequently used. This silver palladium J type conductive paste is made by dispersing approximately 5 to 30% by weight of palladium powder together with silver powder in an organic dispersion medium.
一方、銀ペーストも良く知られている。これは実質上銀
だけを４″Ｆｉｔ性付与成分とするものであり例えばチ
ップコンデンサーの外部電極や９Ｊ接点材料などに多用
されている。しかし、銀単独を導電性付与成分とする導
電ペーストは厚膜ハイブリッドＩＣ基板用にはあまり使
用されない。On the other hand, silver paste is also well known. This paste contains silver as the only component that imparts 4" fit properties, and is widely used, for example, in external electrodes of chip capacitors and 9J contact materials. However, conductive pastes that contain silver alone as the component that imparts conductivity are thick. It is rarely used for membrane hybrid IC substrates.
従来よりｊ７膜ハイブリッドＩ Ｃ７，Ｇ板用に使用さ
れている銀パラジウム系、恨白金系、金などの貴金属ペ
ーストは高価であるという基本的な問題がある。最も多
用されている恨パラジウムペーストは貴金属の中でも最
も安価な銀を主体とするものであるが、パラジウムは恨
価格の２０倍前後の高価なものであるから、そのパラジ
ウム含有量に応じて高価とならざるを得ない。The basic problem is that noble metal pastes such as silver-palladium, platinum, and gold, which have been conventionally used for J7 membrane hybrid IC7, G plates, are expensive. The most commonly used palladium paste is mainly made of silver, which is the cheapest of the precious metals, but since palladium is about 20 times more expensive than the precious metal, the palladium paste is expensive depending on its palladium content. I have no choice but to do so.
したがって、経済性の面から言えば、貴金属成分として
は最も安価な銀だけを導電性付与成分とした導電ペース
トが有利であるが、この場合には次のような問題がある
。すなわち銀単独の場合には、 ｉｉパラジウムに比べ
て半田に対する耐溶解性が乏しく、ハイブリッドＩＣ等
に汎用的に用いられるアルミナ基板に対する接着強度が
、特に熱エージング後に弱い、また高温高温下において
シルバーマイグレーシリンが発生するという銀固有の性
質が強く現れる。これらが、ハイブリッドＩＣに用いら
れない主因となっている。Therefore, from an economic point of view, it is advantageous to use a conductive paste containing only silver, which is the cheapest noble metal component, as a conductivity imparting component, but this case has the following problems. In other words, in the case of silver alone, it has poor resistance to solder dissolution compared to palladium, has weak adhesion strength to alumina substrates commonly used for hybrid ICs, etc., especially after heat aging, and has poor silver migration resistance at high temperatures. The unique property of silver, which generates phosphorus, is strongly expressed. These are the main reasons why they are not used in hybrid ICs.
本発明はこのような問題の解決を目的としたものである
。The present invention aims to solve such problems.
ｃ問題点を解決する手段〕
本発明は、銀粉末を導電性付与成分として有機分散媒中
に分散させる導電ペーストにおいて、この銀系導電ペー
スト中に、 Ｂｉｔ’ｓ粉末を４重量％以下、 ＣｕＯ
粉末を０．０５〜０．６重量％、 ＭｎＯ２粉末を０．
０５〜０．５重量％、そして、軟化点が７００℃以下の
ホウケイ酸鉛系ガラスフリフトを０．１〜１．５重量％
の量で分散含有させてなる厚膜ハイブリッドＩＣ回路用
に特に適する導電ペースト組成物を提供するものである
。Means for Solving Problems] The present invention provides a conductive paste in which silver powder is dispersed as a conductivity-imparting component in an organic dispersion medium, in which 4% by weight or less of Bit's powder, CuO
0.05-0.6% by weight of powder, 0.0% of MnO2 powder.
05 to 0.5% by weight, and 0.1 to 1.5% by weight of lead borosilicate glass lift with a softening point of 700°C or less.
The purpose of the present invention is to provide a conductive paste composition particularly suitable for thick film hybrid IC circuits, which contains the conductive paste composition dispersed in an amount of .
本発明の導電ペースト組成物は１”ｔＯｓ＋ Ｃｕｂ。The conductive paste composition of the present invention has a 1"tOs+Cub.
Ｍｎ０１および軟化点が７００℃以下のホウケイ酸鉛系
ガラスフリフトを前記した配合量で銀を導電性付与成分
とする導電ペーストに配合分散させたものであり、導電
性付与成分としては銀だけを含ませたものであるにもか
かわらず、半田付き性、半田に対する耐溶解性が著しく
向上し且つ熱エージング後の接着強度の低下が少ないと
いう優れた効果を発揮する。特に本発明に従う導電ペー
スト組成物は、これを焼成した後の導体表面が通常の導
電ペーストの場合の、ようにフラットな表面とはならず
、あたかも等高線が走っているような模様が形成される
。そして、このような模様が現れている場合に特に耐半
田溶解性および接着強度において良好な結果を示すこと
が判明した。Mn01 and lead borosilicate glass flift with a softening point of 700°C or less are blended and dispersed in the above-mentioned amounts in a conductive paste containing silver as a conductivity imparting component, and silver is the only conductivity imparting component. Even though it is contained, it exhibits excellent effects such as significantly improved solderability and resistance to solder dissolution, and less decrease in adhesive strength after heat aging. In particular, in the conductive paste composition according to the present invention, the conductor surface after firing does not become a flat surface as in the case of ordinary conductive paste, but a pattern that looks as if contour lines are running is formed. . It has been found that when such a pattern appears, particularly good results are shown in terms of solder melt resistance and adhesive strength.
本発明の組成物を構成するにさいしては、ＩＩ。In constituting the composition of the present invention, II.
ＢｉｚＯｓ＋ Ｃｕｂ、 Ｍｎ０１および該ガラスフリ
フトはそれぞれ粒径が１０μ園以下、望ましくは５μ−
以下の粉末を使用する。ペーストにするための分散媒と
しては導電ペーストに常用されているあらゆるものが使
用可能であるが５例えば１分散媒中の樹脂成分としてエ
チルセルロースやレジン類等が、そして樹脂成分を溶解
する溶媒としては高沸点のターピネオール類、ブチルカ
ルピトール、ブチルカルピトールアセテート、ジブチル
フタレート或いは１，１．３−１−リメチルペンタンジ
オールのモノ及びジエステル化物等が挙げられる。銀粉
末の配合機としては応用用途に応じて５０〜９０重量％
の範囲とするのがよい、添加成分であるＢｉｇ０３．
Ｃｕｂ。BizOs+ Cub, Mn01 and the glass lift each have a particle size of 10 μm or less, preferably 5 μ-
Use the following powders. Any dispersion medium commonly used for conductive paste can be used as a dispersion medium for making the paste.5 For example, ethyl cellulose or resins can be used as the resin component in the dispersion medium, and as a solvent for dissolving the resin component. Examples include high-boiling terpineols, butyl carpitol, butyl carpitol acetate, dibutyl phthalate, and mono- and di-esterified products of 1,1,3-1-limethylpentanediol. As a blender for silver powder, it is 50 to 90% by weight depending on the application.
The additive component Big03.
Cub.
Ｍｎ０１および該ガラスフリフトの配合量を特許請求の
範囲に記載のような範囲に定めた理由は後述の実施例で
実証するが２本発明で規制する範囲外であると、半田に
対する耐溶解性が低下するかおよび／または熱エージン
グ後の接着強度が相当に弱くなるし、場合によっては半
田付き性が極端に悪くなるからである。なお本発明組成
物における各成分の重量％は分散媒を含めた導電ペース
ト全体に対する重量％である０本発明に従う導電ペース
ト組成物は、前記成分以外の他の添加物１例えばＺｎ、
Ｎｉ等を性能が劣下しない範囲で添加することも可能で
ある。The reason for setting the blending amount of Mn01 and the glass lift within the range described in the claims will be demonstrated in the examples described below, but if it is outside the range regulated by the present invention, the melting resistance to solder may be affected. This is because the adhesive strength decreases and/or the adhesive strength after heat aging becomes considerably weaker, and in some cases, the solderability becomes extremely poor. Note that the weight percent of each component in the composition of the present invention is the weight percent of the entire conductive paste including the dispersion medium.The conductive paste composition according to the present invention may contain other additives other than the above-mentioned components, such as Zn,
It is also possible to add Ni or the like to the extent that the performance does not deteriorate.
以下に、Ｂｔ、ｏ、、 Ｃｕｂ、 Ｍｎ０ｚおよび該ガ
ラスフリフトの添加効果を実施例によって個別に実証す
るが３各実施例の配合量（重量％）は各成分にビヒクル
を加えて１００重量％とじたときの割合であり。Below, the effects of adding Bt, o, Cub, Mn0z, and the glass lift will be demonstrated individually through examples, but the blending amount (wt%) of each of the three examples is 100 wt% when the vehicle is added to each component. This is the ratio when closed.
各成分はいずれも１０μ量以下の粉末を使用した。Powder of each component was used in an amount of 10 μm or less.
またビヒクルとしては、ターピネオール溶媒にエチルセ
ルロースを溶解したものを使用した。The vehicle used was ethyl cellulose dissolved in terpineol solvent.
各導電ペーストの特性評価は次のようにして行った。各
導電ペーストを２５０メツシユのスクリーンにて９６％
アルミナの基板上にバクーン印刷し。The characteristics of each conductive paste were evaluated as follows. 96% of each conductive paste with 250 mesh screen
Printed on an alumina substrate.
乾燥後、８５０℃で焼成する。After drying, it is fired at 850°C.
半田付き性＝２％銀入り半田の２３０℃浴に前記焼成品
を２秒間浸漬したときの半田付き性を、非常に良好であ
ったもの（◎印）、良好であったもの（○印）、やや良
好であったもの（△印）、 不良であったもの（×印）
の四段階で評価する。Solderability = When the fired product was immersed in a 230°C bath containing 2% silver for 2 seconds, the solderability was very good (◎ mark) and good (○ mark). , those that were somewhat good (△ mark), those that were poor (x mark)
Evaluate on a four-level scale.
耐半田溶解性：２％銀入り半田の２３０°Ｃ浴に皇紀焼
成品を１０秒ごとに浸漬し１線巾２５０ミクロン。Resistance to solder melting: Koki fired products are immersed in a 230°C bath of solder containing 2% silver every 10 seconds, and each wire width is 250 microns.
アスペクト比５００の導体ラインが断線するまでの秒数
で評価する。Evaluation is based on the number of seconds it takes for a conductor line with an aspect ratio of 500 to break.
接着強度：各導電ペーストから焼成して作成し−に１２
ｍｍＸ２ｍｍの導体パッドに、径が０．６５ｍｍのスズ
被覆銅線を半田にて接続した状態で１５０℃で６２時間
の熱エージング処理を行ったあと、接続部が切断すると
きの強度（Ｋｇ）を測定する。Adhesive strength: Created by baking from each conductive paste - 12
A tin-coated copper wire with a diameter of 0.65 mm is connected to a conductor pad of mm x 2 mm with solder, and after heat aging treatment at 150°C for 62 hours, the strength (Kg) when the connection part breaks is measured. Measure.
実施例１〜８
本例は本発明組成物のＢｉｚＯｉの添加効果を示すもの
である。Examples 1 to 8 This example shows the effect of adding BizOi to the composition of the present invention.
恨：８０重量％、 ＣｕＯ： ０．２重量％、門ｎＯ，
： ０．３重量％、軟化点が５７０℃のホウケイ酸鉛系
ガラスフリット＝１重量％、および表１に示す各種の配
合量のＢ１□Ｏ１を加え、これらに対し合計１００重量
％となるようにビヒクルを添加してペーストを作成した
。これらのペーストの前記基準による評価結果を表１に
総括して示した。Resistance: 80% by weight, CuO: 0.2% by weight, gate nO,
: 0.3% by weight, lead borosilicate glass frit with a softening point of 570°C = 1% by weight, and B1□O1 in various blending amounts shown in Table 1 were added to make a total of 100% by weight. A paste was made by adding vehicle. The evaluation results of these pastes according to the above criteria are summarized in Table 1.
表１の結果から明らかなように、 ＢｉｚＯｉは半田付
き性を劣下させないで接着強度を高めるのに非常に効果
があり、また耐半田溶解性も向上させることができる。As is clear from the results in Table 1, BizOi is very effective in increasing adhesive strength without deteriorating solderability, and can also improve solder melting resistance.
このような接着強度および耐半田溶解性の向上効果は微
量でも現れるが、４重量％を超えてＢ１２Ｊを添加する
と逆に接着強度さろには耐半田溶解性が急激に低下する
ようになる。したがって１本発明においてＢｉｚＯｉは
４重量％以下の量で配合することが重要である。Such an effect of improving adhesive strength and solder melting resistance appears even in a small amount, but when B12J is added in an amount exceeding 4% by weight, the solder melting resistance suddenly decreases as well as the adhesive strength. Therefore, in the present invention, it is important to blend BizOi in an amount of 4% by weight or less.
表１
実施例９〜１７
本例は本発明組成物のＣｕＯの添加効果を示すものであ
る。Table 1 Examples 9 to 17 This example shows the effect of adding CuO to the composition of the present invention.
恨：８０重量％＋ Ｂ＋ｚＯｉ ：２重量％、 Ｍｎ０
ｚ ： ０．３重量％、軟化点が５７０℃のホウケイ酸
鉛系ガラスフリフト：１重世％、および表２に示す各種
の配合量のＣｕＯを加え、これらに対し合計１００重量
％となるようにビヒクルを添加してペーストを作成した
。これらのペーストの前記基準による評価結果を表２に
総括して示した。Resentment: 80% by weight + B+zOi: 2% by weight, Mn0
z: 0.3% by weight, a lead borosilicate glass lift with a softening point of 570°C: 1%, and CuO of various blending amounts shown in Table 2 are added, giving a total of 100% by weight. A paste was made by adding the vehicle as follows. The evaluation results of these pastes according to the above criteria are summarized in Table 2.
表２の結果から明らかなように、微量のＣｕＯ添加（０
，０５重量％以上の添加）により接＠強度が著しく向上
する。そしてこのＣｕＯの添加によって半田付き性が劣
下することもない。しかし、０．６重量％を超える添加
では耐半田溶解性が著しく劣下する。したがって１本発
明組成物においてＣｕＯを０．０５〜０．６重量％添加
することが必要である。As is clear from the results in Table 2, a trace amount of CuO addition (0
, 05% by weight or more), the contact strength is significantly improved. Further, the solderability does not deteriorate due to the addition of CuO. However, if the amount exceeds 0.6% by weight, the solder melting resistance will be significantly reduced. Therefore, it is necessary to add 0.05 to 0.6% by weight of CuO in one composition of the present invention.
表２
実施例１８〜２５
本例は本発明組成物のＭｎＯ□の添加効果を示すもので
ある。Table 2 Examples 18-25 This example shows the effect of adding MnO□ to the composition of the present invention.
銀：８０重量％、 Ｂｉ２Ｏ３： ２重量％、 ＣｕＯ
： ０．２重量％、軟化点が５７０℃のホウケイ酸鉛系
ガラスフリフト：１重量％、および表３に示す各種の配
合量のＭｎ０１を加え、これらに対し合計１００重量％
となるようにビヒクルを添加してペーストを作成した。Silver: 80% by weight, Bi2O3: 2% by weight, CuO
: 0.2% by weight, 1% by weight of lead borosilicate glass lift with a softening point of 570°C, and Mn01 in various blending amounts shown in Table 3, for a total of 100% by weight.
A paste was prepared by adding vehicle so that
これらのペーストの前記基準による評価結果を表３に総
括して示した。The evaluation results of these pastes according to the above criteria are summarized in Table 3.
表３の結果から明らかなように、微量のＭｎ０１添加（
０，０５重量％以上の添加）によって接着強度が著しく
向上し、また耐半田溶解性も向上させる。As is clear from the results in Table 3, the addition of a trace amount of Mn01 (
Addition of 0.05% by weight or more) significantly improves adhesive strength and also improves solder melting resistance.
しかし、０．６重世％付近からこれ以上を添加すると接
着強度の低下傾向が現れ、半田付き性も悪くなる。した
がって２本発明組成物においてＭｎＪ粉末を０．０５〜
０．５重量％の範囲で添加することが必実施例２６〜３
５
本例は本発明組成物のガラスフリフトの添加効果を示す
ものである。However, if it is added at around 0.6 weight percent or more, the adhesive strength tends to decrease and the solderability also deteriorates. Therefore, in the two compositions of the present invention, the MnJ powder is 0.05~
Examples 26-3 Must be added in a range of 0.5% by weight
5 This example shows the effect of adding glass lift to the composition of the present invention.
銀＝８０重量％、 Ｂ１１０ｉ ： ２重量％、 Ｃｕ
Ｏ： ０．２重量％＋ ＭｎＯ□：０．３重量％、およ
び軟化点が５７０℃のホウケイ酸鉛系ガラスフリフトを
表４に示す各種の配合Ｗｌ（重量％）で加え、これらに
対し合計１００重量％となるようにビヒクルを添加して
ペーストを作成した。これらのペーストの前記基準によ
る評価結果を表４に総括して示した。Silver = 80% by weight, B110i: 2% by weight, Cu
O: 0.2% by weight + MnO□: 0.3% by weight and lead borosilicate glass lift with a softening point of 570°C were added in various formulations Wl (wt%) shown in Table 4, and to these A paste was prepared by adding the vehicle to a total of 100% by weight. The evaluation results of these pastes according to the above criteria are summarized in Table 4.
表４の結果から明らかなように、ガラスフリフトは耐半
田溶解性を得るうえで極めて重要な成分である。この効
果はガラスフリットを０１１重量％以上添加することに
よって発現する。またガラスフリントは接着強度も高め
る。このような効果はガラスフリットが焼成時に十分軟
化し基板と導体との結合剤として作用することによるも
のであり。As is clear from the results in Table 4, glass lift is an extremely important component in obtaining solder melting resistance. This effect is produced by adding 0.11% by weight or more of glass frit. Glass flint also increases adhesive strength. This effect is due to the fact that the glass frit is sufficiently softened during firing and acts as a bonding agent between the substrate and the conductor.
この意味からガラスフリフトの軟化点は７００℃以下で
あることが望ましい。しかし、ガラスフリフトの配合量
が１．５重量％を超えると、半田付き性が急激に悪くな
り、また接着強度も低下するようになる。したがって１
本発明組成物において軟化点が７００℃以下のホウケイ
酸鉛系ガラスフリットを０．１〜１．５重量％の範囲で
配合した。From this point of view, it is desirable that the softening point of the glass lift is 700°C or lower. However, when the amount of glass lift exceeds 1.5% by weight, the solderability deteriorates rapidly and the adhesive strength also decreases. Therefore 1
In the composition of the present invention, a lead borosilicate glass frit having a softening point of 700° C. or less was blended in an amount of 0.1 to 1.5% by weight.
表４
以上の実施例から明らかなように、銀系感電ペースト中
に、ｎ１□０．粉末を４重量％以下、 ＣｕＯ粉末を０
．０５〜０．６重量％、 Ｍｎ０ｚ粉末を０．０５〜０
．５重量％、そして、軟化点が７００℃以下のホウケイ
酸鉛系ガラスフリットを０．１〜１．５重量％の量で分
散含有させてなる本発明に従う４電ペースト組成物は、
導電性付与成分としてはパラジウムなどの高価な貴金属
を配合せず恨だけからなるにもかかわらず、熱エージン
グ後の接着強度に優れ且つ耐半田溶解性並びに半田付き
性も良好であるから。Table 4 As is clear from the above examples, n1□0. Powder: 4% by weight or less, CuO powder: 0
．． 05-0.6% by weight, 0.05-0% Mn0z powder
．． The tetraelectric paste composition according to the present invention contains 5% by weight of lead borosilicate glass frit with a softening point of 700°C or less dispersed in an amount of 0.1 to 1.5% by weight.
Although the conductivity-imparting component does not include expensive noble metals such as palladium and is made only of the material, it has excellent adhesive strength after heat aging, and has good solder melting resistance and solderability.
安価な導電ペーストとして厚膜ハイブリッドＩＣ回路用
に好適に使用できるものである。It can be suitably used as an inexpensive conductive paste for thick film hybrid IC circuits.
Claims (1)
せる銀系導電ペーストにおいて、この銀系導電ペースト
中に、Ｂｉ＿２Ｏ＿３粉末を４重量％以下、ＣｕＯ粉末
を０．０５〜０．６重量％、ＭｎＯ＿２粉末を０．０５
〜０．５重量％、そして、軟化点が７００℃以下のホウ
ケイ酸鉛系ガラスフリットを０．１〜１．５重量％の量
で分散含有させてなる導電ペースト組成物。In a silver-based conductive paste in which silver powder is dispersed as a conductivity-imparting component in an organic dispersion medium, Bi_2O_3 powder is contained in an amount of 4% by weight or less, CuO powder is contained in an amount of 0.05 to 0.6% by weight, 0.05 MnO_2 powder
A conductive paste composition comprising dispersed lead borosilicate glass frit having a softening point of 700° C. or less in an amount of 0.1 to 1.5% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267786A JPS62259302A (en) | 1986-05-02 | 1986-05-02 | Conductive paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267786A JPS62259302A (en) | 1986-05-02 | 1986-05-02 | Conductive paste composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62259302A true JPS62259302A (en) | 1987-11-11 |
| JPH0514363B2 JPH0514363B2 (en) | 1993-02-24 |
Family
ID=14333862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267786A Granted JPS62259302A (en) | 1986-05-02 | 1986-05-02 | Conductive paste composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62259302A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05222546A (en) * | 1992-02-07 | 1993-08-31 | Narumi China Corp | Silver paste |
| KR20010067050A (en) * | 1999-08-06 | 2001-07-12 | 사토 히로시 | Multilayer inductor and production method thereof |
| JP2006302891A (en) * | 2005-04-14 | 2006-11-02 | E I Du Pont De Nemours & Co | Manufacturing method for semiconductor device and conductive composition used in it |
| CN101964219A (en) * | 2010-08-10 | 2011-02-02 | 上海九晶电子材料股份有限公司 | Silver paste for positive of crystalline silicon solar cell and preparation method thereof |
| JP2012221765A (en) * | 2011-04-11 | 2012-11-12 | Tdk Corp | Paste for conductor, glass ceramic substrate and electronic component module |
| KR20160135123A (en) * | 2014-03-20 | 2016-11-24 | 나믹스 가부시끼가이샤 | Conductive paste, laminated ceramic component, printed circuit board, and electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166305A (en) * | 1984-09-07 | 1986-04-05 | 田中マツセイ株式会社 | Conductor composition |
-
1986
- 1986-05-02 JP JP10267786A patent/JPS62259302A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166305A (en) * | 1984-09-07 | 1986-04-05 | 田中マツセイ株式会社 | Conductor composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05222546A (en) * | 1992-02-07 | 1993-08-31 | Narumi China Corp | Silver paste |
| KR20010067050A (en) * | 1999-08-06 | 2001-07-12 | 사토 히로시 | Multilayer inductor and production method thereof |
| JP2006302891A (en) * | 2005-04-14 | 2006-11-02 | E I Du Pont De Nemours & Co | Manufacturing method for semiconductor device and conductive composition used in it |
| CN101964219A (en) * | 2010-08-10 | 2011-02-02 | 上海九晶电子材料股份有限公司 | Silver paste for positive of crystalline silicon solar cell and preparation method thereof |
| JP2012221765A (en) * | 2011-04-11 | 2012-11-12 | Tdk Corp | Paste for conductor, glass ceramic substrate and electronic component module |
| KR20160135123A (en) * | 2014-03-20 | 2016-11-24 | 나믹스 가부시끼가이샤 | Conductive paste, laminated ceramic component, printed circuit board, and electronic device |
| EP3121819A4 (en) * | 2014-03-20 | 2017-11-01 | Namics Corporation | Conductive paste, laminated ceramic component, printed circuit board, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514363B2 (en) | 1993-02-24 |
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