JP2931450B2 - Conductor paste - Google Patents
Conductor pasteInfo
- Publication number
- JP2931450B2 JP2931450B2 JP22363191A JP22363191A JP2931450B2 JP 2931450 B2 JP2931450 B2 JP 2931450B2 JP 22363191 A JP22363191 A JP 22363191A JP 22363191 A JP22363191 A JP 22363191A JP 2931450 B2 JP2931450 B2 JP 2931450B2
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- Prior art keywords
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- parts
- conductor
- oxide
- adhesive strength
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- Conductive Materials (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導体形成用の導体ペ−
ストに関し、特に、低温焼成によって配線基板を作製す
るために用いられる導体形成用の導体ペ−ストに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor sheet for forming a conductor.
More particularly, the present invention relates to a conductor paste for forming a conductor used for producing a wiring board by firing at a low temperature.
【０００２】[0002]
【従来の技術】従来、セラミックス配線基板を作製する
方法としては、焼結したアルミナ基板（Ａｌ2Ｏ3を少な
くとも90重量％以上含有する焼結したアルミナ基板）
に、外部導体形成用としてＡｇ−Ｐｄ系ペ−ストを印刷
し、焼成する方法が用いられている。そして、このアル
ミナ基板に用いられるＡｇ−Ｐｄ系ペ−ストとしては、
Ａｇのマイグレ−ションを防止し、導体としての低い抵
抗値を維持させるため、Ａｇに5〜30重量部のＰｄを含
有した組成のもの、つまりＡｇが70〜95重量部、Ｐｄが
5〜30重量部のものである。2. Description of the Related Art Conventionally, as a method for producing a ceramic wiring substrate, a sintered alumina substrate (a sintered alumina substrate containing at least 90% by weight or more of Al 2 O 3 ) is used.
Then, a method of printing and firing an Ag-Pd-based paste for forming an external conductor is used. The Ag-Pd paste used for this alumina substrate includes:
In order to prevent migration of Ag and maintain a low resistance value as a conductor, a composition containing 5 to 30 parts by weight of Pd in Ag, that is, 70 to 95 parts by weight of Ag and Pd of
5 to 30 parts by weight.
【０００３】ところで、近年、高密度の配線を達成する
ために、配線層を多段にした低温焼成多層配線基板が研
究されており、その低温焼成多層配線基板の作製に用い
られる導体としては、上記アルミナ基板に用いられてい
るＡｇ−Ｐｄ系ペ−ストが主として使用されている。In recent years, in order to achieve high-density wiring, a low-temperature fired multilayer wiring board having multiple wiring layers has been studied, and the conductor used for manufacturing the low-temperature fired multilayer wiring board is as described above. Ag-Pd-based paste used for an alumina substrate is mainly used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、低温焼
成多層配線基板には、低温で焼成が可能なようにガラス
等の低融点化合物が含まれているため、アルミナ基板用
に従来使用されていた上記Ａｇ−Ｐｄ系ペ−ストを用い
ると、作製した導体部のはんだの濡れ性が低下し、ま
た、接着強度、特に高温（150℃程度）にされた後の接
着強度の低下が著しいという欠点があった。However, since the low-temperature fired multilayer wiring board contains a low melting point compound such as glass so that it can be fired at a low temperature, the above-mentioned conventional wiring board for an alumina substrate is used. The use of Ag-Pd-based paste has the disadvantages that the wettability of the solder of the produced conductor part is reduced, and that the adhesive strength, particularly the adhesive strength after being heated to a high temperature (about 150 ° C.), is remarkably reduced. there were.
【０００５】そこで、本発明者等は、低温焼成多層配線
基板に適した導体ペ−ストの組成について研究し、従来
用いられていたＡｇ−Ｐｄ系ペ−ストにＭｎの酸化物
（又はＭｎの酸化物とＳｎの酸化物）及びガラスフリッ
トを所定量添加すれば、これらの欠点が解消できるとの
知見を得て、本発明を完成したものである。Accordingly, the present inventors have studied the composition of a conductor paste suitable for a low-temperature fired multilayer wiring board, and have found that an oxide of Mn (or Mn of Mn) has been added to a conventionally used Ag-Pd-based paste. The inventors have found that the addition of a predetermined amount of an oxide and an oxide of Sn) and glass frit can solve these disadvantages, and have completed the present invention.
【０００６】即ち、本発明は、上記欠点を解消する導体
形成用の導体ペ−ストを提供することを目的とする。詳
細には、本発明は、低温焼成多層配線基板の外部導体を
同時焼成で形成したとき、はんだ濡れ性を損なうことな
く、高温（150℃程度）にされた後の接着強度の低下を
抑制することができる導体形成用の導体ペ−ストを提供
することを目的とする。That is, an object of the present invention is to provide a conductor paste for forming a conductor which solves the above-mentioned disadvantages. In detail, the present invention suppresses a decrease in adhesive strength after a high temperature (about 150 ° C.) without impairing solder wettability when the external conductor of a low-temperature fired multilayer wiring board is formed by simultaneous firing. It is an object of the present invention to provide a conductor paste for forming a conductor that can be used.
【０００７】[0007]
【課題を解決するための手段】そして、本発明は、上記
したように、Ａｇ−Ｐｄ系ペ−ストに所定量のＭｎの酸
化物（又はＭｎの酸化物とＳｎの酸化物）及びガラスフ
リットを配合する点を特徴とするものであり、これによ
って、上記はんだ濡れ性並びに接着強度を改善するよう
にしたものである。According to the present invention, as described above, a predetermined amount of an oxide of Mn (or an oxide of Mn and an oxide of Sn) and a glass frit are added to an Ag-Pd-based paste. Is added, whereby the solder wettability and the adhesive strength are improved.
【０００８】即ち、本発明は、70〜95重量部のＡｇと5
〜30重量部のＰｄ及び有機ビヒクルよりなる導体ペ−ス
トに、このＡｇとＰｄの合量に対して、Ｍｎの酸化物を
ＭｎＯ2換算で0.2〜3 重量部（又はこのＭｎの酸化物と
Ｓｎの酸化物をＳｎＯ2換算で0.2〜3重量部）及びガラ
スフリットを0.1〜3重量部配合してなることを特徴とす
る導体ペ−ストである。That is, the present invention relates to a method for preparing 70 to 95 parts by weight of Ag and 5 parts by weight.
Conductor pair consisting of Pd and organic vehicle 30 parts by weight - the strike against the total amount of the Ag and Pd, 0.2 to 3 parts by weight of oxide of Mn in MnO 2 terms (or oxide of Mn and conductors oxides of Sn, characterized in that by blending from 0.1 to 3 parts by weight of 0.2 to 3 parts by weight) and the glass frit in terms of SnO 2 Bae - a strike.
【０００９】以下、本発明を詳細に説明する。本発明に
おいて、ＡｇとＰｄの比率は、回路作製用導体として通
常用いられる範囲、即ち、Ａｇが70〜95重量部、Ｐｄが
5〜30重量部が好ましい。Ｐｄが5重量部未満では、Ａｇ
のマイグレ−ションが起こりやすく、また、はんだ喰わ
れが起こりやすい。一方、30重量部を超えると、導体と
しての抵抗値が高くなり、また、端子として用いた場
合、はんだ濡れが低下するので、好ましくない。Hereinafter, the present invention will be described in detail. In the present invention, the ratio of Ag to Pd is in a range usually used as a circuit-forming conductor, that is, Ag is 70 to 95 parts by weight, and Pd is
5 to 30 parts by weight are preferred. If Pd is less than 5 parts by weight, Ag
Migration is likely to occur, and solder erosion is likely to occur. On the other hand, if it exceeds 30 parts by weight, the resistance value as a conductor increases, and when it is used as a terminal, the solder wettability is reduced, which is not preferable.
【００１０】本発明で配合するＭｎの酸化物としては、
ＭｎＯ2、Ｍｎ2Ｏ3、Ｍｎ3Ｏ4、ＭｎＯを挙げることが
でき、いずれも使用することができる。これらのＭｎの
酸化物を、ＡｇとＰｄの合量に対して、ＭｎＯ2換算で
0.2〜3重量部添加するするのが好ましい。添加量が0.2
重量部未満では、作製した導体のはんだ濡れ性が劣り、
また、高温にさらされた後の接着強度の低下が大きく、
一方、3重量部を超えると、初期の接着強度が低く、導
体材料として充分な特性が得られないので、いずれも好
ましくない。The Mn oxide compounded in the present invention includes:
Examples thereof include MnO 2 , Mn 2 O 3 , Mn 3 O 4 , and MnO, and any of them can be used. These Mn oxides were converted to MnO 2 with respect to the total amount of Ag and Pd.
It is preferable to add 0.2 to 3 parts by weight. 0.2 added
When the amount is less than the weight part, the solder wettability of the produced conductor is inferior,
Also, the adhesive strength after exposure to high temperature is greatly reduced,
On the other hand, when the amount exceeds 3 parts by weight, the initial adhesive strength is low, and sufficient characteristics as a conductor material cannot be obtained, so that both are not preferable.
【００１１】本発明において、更に、Ｓｎの酸化物、例
えばＳｎＯ、ＳｎＯ2等を添加すると、導体のはんだ濡
れ性がさらに向上するので、より好適である。その添加
量としては、ＡｇとＰｄの合量に対し、0.2〜3重量部添
加するのが好ましい。0.2重量部未満では、はんだ濡れ
性効果が少なく、3重量部を超えると初期の接着強度が
低く、いずれも好ましくない。In the present invention, it is more preferable to add an oxide of Sn, such as SnO or SnO 2 , since the solder wettability of the conductor is further improved. The addition amount is preferably 0.2 to 3 parts by weight based on the total amount of Ag and Pd. If it is less than 0.2 part by weight, the effect of solder wettability is small, and if it exceeds 3 parts by weight, the initial adhesive strength is low, and both are not preferred.
【００１２】ガラスフリットとしては、600〜900℃で軟
化するものであれば、いずれも使用することができ、本
発明において特に限定するものではないが、ホウケイ酸
亜鉛系のガラスの使用が好ましい。その添加量は、0.1
〜3重量部が好ましい。この量が少ないと初期の接着強
度が低く、一方、多いとはんだ濡れ性が低下するので、
いずれも好ましくない。Any glass frit can be used as long as it softens at 600 to 900 ° C., and is not particularly limited in the present invention, but it is preferable to use zinc borosilicate glass. The addition amount is 0.1
~ 3 parts by weight are preferred. If this amount is small, the initial adhesive strength is low, while if it is large, the solder wettability decreases,
Neither is preferred.
【００１３】有機ビヒクルとしては、エチルセルロ−
ス、メチルセルロ−ス、メタクリレ−ト等の樹脂をα−
テルピネオ−ル、ブチルカルビト−ル等の溶剤に溶解し
たものが用いられる。その量は、印刷性を考慮して適量
用いられるが、通常、Ａｇ−Ｐｄ粉末の合量に対し、10
〜40重量部が好ましい。As an organic vehicle, ethylcellulo-
Resin such as methyl, cellulose, methacrylate, etc.
Those dissolved in solvents such as terpineol and butyl carbitol are used. The amount is appropriately used in consideration of printability, but is usually 10 to the total amount of Ag-Pd powder.
~ 40 parts by weight are preferred.
【００１４】ペ−ストの原料粉末は、印刷性の点から平
均粒径が10μｍ以下のものが好ましく、2μｍ以下の原
料粉末を用いることがペ−ストの均一性向上のため、よ
り好ましい。なお、本発明の導体ペ−ストを適用するに
好適な低温焼成基板としては、アルミナにホウケイ酸亜
鉛系のガラスを混合した基板を挙げることができる。The raw material powder of the paste preferably has an average particle size of 10 μm or less from the viewpoint of printability, and more preferably 2 μm or less for improving the uniformity of the paste. As a low-temperature fired substrate suitable for applying the conductor paste of the present invention, a substrate obtained by mixing zinc borosilicate glass with alumina can be used.
【００１５】[0015]
【実施例】次に、本発明の実施例を比較例と共に挙げ、
本発明をより詳細に説明する。 （実施例１〜１３、比較例１〜６） (1) 原材料 Ａｇ粉末は、市販の平均粒径約1μｍのものを、また、
Ｐｄ粉末は、市販の平均粒径約0.5μｍのものを使用し
た。ガラスフリットは、その組成が重量部でＳｉＯ2 3
5、ＰｂＯ 20、Ａｌ2Ｏ35、Ｂ2Ｏ3 15、ＺｎＯ 20、Ｃ
ａＯ 5になるように配合し、白金るつぼ中1400℃で溶融
し、急冷した後、ボ−ルミルで粉砕したものを使用し
た。有機ビヒクルとしては、エチルセロ−スをα−テル
ピネオ−ルに溶解したものを用いた。Next, examples of the present invention will be described together with comparative examples.
The present invention will be described in more detail. (Examples 1 to 13 and Comparative Examples 1 to 6) (1) Raw material Ag powder is commercially available having an average particle size of about 1 μm.
As the Pd powder, a commercially available powder having an average particle diameter of about 0.5 μm was used. Glass frit is composed of SiO 2 3
5, PbO 20, Al 2 O 3 5, B 2 O 3 15, ZnO 20, C
It was blended so as to obtain aO 5, melted in a platinum crucible at 1400 ° C., quenched, and then pulverized with a ball mill. As the organic vehicle, a solution obtained by dissolving ethyl cellulose in α-terpineol was used.
【００１６】(2) 導体ペ−ストの作製 上記Ａｇ粉末とＰｄ粉末とを表１に示す配合割合に従っ
て混合し、大気中で300℃に加熱処理した。次に、この
加熱処理したＡｇ−Ｐｄ混合粉末を上記有機ビヒクルに
加え、更に、Ｍｎの酸化物、ＳｎＯ2及びガラスフリッ
トの各粉末を表１に従って配合し、三本ロ−ルで混練し
て各種Ａｇ−Ｐｄ導体ペ−ストを作製した。(2) Preparation of Conductor Paste The above-mentioned Ag powder and Pd powder were mixed according to the mixing ratio shown in Table 1, and heat-treated at 300 ° C. in the air. Next, the heat-treated Ag-Pd mixed powder was added to the organic vehicle, and further, each powder of Mn oxide, SnO 2 and glass frit was blended according to Table 1, and kneaded with a triple roll. Various Ag-Pd conductor pastes were produced.
【００１７】(3) 試験用基板の作製 Ａｌ2Ｏ3粉末と前記ガラスフリットと同じ組成のホウケ
イ酸亜鉛ガラスを１：１に混合し、バインダ−を加え、
シ−ト状に成形し、これを積層して2インチ角、厚さ1ｍ
ｍのグリ−ン積層体を得た。このグリ−ン積層体に上記
Ａｇ−Ｐｄ導体ペ−ストを250メッシュのスクリ−ンを
用いて印刷し、大気中400℃で脱バインダ−した後、850
℃で焼成し、2ｍｍ角の導体パッドを20個形成した基板
を作製した。(3) Preparation of Test Substrate Al 2 O 3 powder and zinc borosilicate glass having the same composition as the above glass frit are mixed in a ratio of 1: 1 and a binder is added.
It is formed into a sheet and laminated to form a 2-inch square, 1m thick
Thus, a green laminate of m was obtained. The above-mentioned Ag-Pd conductor paste was printed on the green laminate using a 250-mesh screen, and after removing the binder at 400 ° C. in the atmosphere, the green paste was removed.
The substrate was baked at ℃ to form a substrate on which 20 2 mm square conductive pads were formed.
【００１８】(4) 上記基板に対する各種試験 （はんだ濡れ性の評価） 上記試験用基板を230℃のＡｇ2％入りＰｂ−Ｓｎ共晶は
んだ中に5秒間浸積し、導体がはんだに濡れる面積の割
合を求めた。その試験結果を表１に示した。 （初期の接着強度の測定） 0.8ｍｍ径のＳｎメッキ銅線をＬ字型にし、その水平部
分を上記基板のパッドにはんだ付けし、その垂直部分を
引張ることにより、パッドが該基板から剥がれたときの
強度を測定した。その試験結果を同じく表１に示した。 （高温放置後の接着強度の測定） 上記のＬ字型0.8ｍｍ径のＳｎメッキ銅線を上記基板の
パッドにはんだ付けした後、150℃の恒温槽に100時間放
置し、槽から取出し、そのメッキ銅線の垂直部分を引張
ることにより、パッドが該基板から剥がれたときの強度
を測定した。その試験結果を同じく表１に示した。(4) Various tests on the above-mentioned substrate (Evaluation of solder wettability) The above-mentioned test substrate was immersed in a Pb-Sn eutectic solder containing 230% of Ag at 5% for 5 seconds, and the area of the conductor wetted by the solder was determined. The ratio was determined. The test results are shown in Table 1. (Measurement of Initial Adhesive Strength) A 0.8 mm-diameter Sn-plated copper wire was formed into an L-shape, the horizontal portion was soldered to the pad of the substrate, and the vertical portion was pulled, whereby the pad was separated from the substrate. The strength at that time was measured. The test results are also shown in Table 1. (Measurement of adhesive strength after leaving at high temperature) After soldering the above-mentioned L-shaped 0.8 mm diameter Sn-plated copper wire to the above-mentioned substrate pad, it was left in a thermostat at 150 ° C for 100 hours, taken out of the bath, and The strength when the pad was peeled from the substrate was measured by pulling the vertical portion of the plated copper wire. The test results are also shown in Table 1.
【００１９】[0019]
【表１】 [Table 1]
【００２０】表１から明らかなように、70〜95重量部の
Ａｇと5〜30重量部のＰｄ及び有機ビヒクルよりなる導
体ペ−ストに、このＡｇとＰｄの合量に対し外割でＭｎ
の酸化物をＭｎＯ2換算で0.2〜3重量部、ガラスフリッ
トを0.1〜3重量部配合した実施例1〜3、5、8、10〜13
は、はんだ濡れ性並びに初期の接着強度及び高温放置後
の接着強度とも良好であることが理解できる。また、さ
らにＳｎの酸化物をＳｎＯ2換算で0.2〜3重量部併用し
た実施例4、6、7、9においても、同様な顕著な効果を奏
することが認められた。As can be seen from Table 1, a conductor paste consisting of 70 to 95 parts by weight of Ag and 5 to 30 parts by weight of Pd and an organic vehicle has Mn as an external part relative to the total amount of Ag and Pd.
0.2 to 3 parts by weight of oxide MnO 2 in terms of the implementation and blending 0.1 to 3 parts by weight of glass frit example 1～3,5,8,10～13
Can be understood that the solder wettability, the initial adhesive strength and the adhesive strength after being left at a high temperature are good. Further, in Examples 4, 6, 7, and 9 in which Sn oxide was used in combination with 0.2 to 3 parts by weight in terms of SnO 2 , the same remarkable effect was observed.
【００２１】これに対して、ＡｇとＰｄのみからなる比
較例１では、はんだ濡れ性並びに初期の接着強度及び高
温放置後の接着強度のいずれをも満足できるものが得ら
れなかった。また、Ｍｎの酸化物を配合しない比較例２
では、はんだ濡れ性並びに初期の接着強度については満
足できる値を示すが、高温放置後の接着強度が大幅に低
下することが認められ、一方、ガラスフリットを配合し
ない比較例３では、はんだ濡れ性については満足できる
ものの、初期の接着強度が低く、しかも、高温放置後の
接着強度が大幅に低下することが認められた。On the other hand, in Comparative Example 1 consisting of Ag and Pd alone, no satisfactory solder wettability, initial adhesive strength and adhesive strength after standing at high temperature were obtained. Comparative Example 2 containing no Mn oxide
Shows satisfactory values for the solder wettability and the initial adhesive strength, but it was recognized that the adhesive strength after standing at high temperature was significantly reduced. On the other hand, in Comparative Example 3 in which no glass frit was blended, the solder wettability was high. Was satisfactory, but it was recognized that the initial adhesive strength was low and that the adhesive strength after standing at high temperature was significantly reduced.
【００２２】更に、Ｍｎの酸化物を配合しても、本発明
の範囲外の４重量部添加した比較例４では、はんだ濡れ
性については満足できるものの、初期の接着強度が低
く、一方、ガラスフリットを配合しても、本発明の範囲
外である４重量部添加した比較例５では、はんだ濡れ性
が劣り、しかも、高温放置後の接着強度の大幅な低下が
認められた。Further, even when the oxide of Mn was added, in Comparative Example 4 in which 4 parts by weight was added outside the range of the present invention, although the solder wettability was satisfactory, the initial adhesive strength was low. Even when the frit was blended, in Comparative Example 5 in which 4 parts by weight was added, which was out of the range of the present invention, the solder wettability was inferior, and the adhesive strength after standing at high temperature was significantly reduced.
【００２３】なお、実施例１３と比較例６との比較で明
らかなように、Ｓｎ酸化物の併用により、はんだ濡れ性
の改善が認められるけれども、このＳｎ酸化物の配合量
が本発明の範囲外である４重量部の場合（比較例６）、
初期の接着強度及び高温放置後の接着強度とも低く、満
足できるものではなかった。As is apparent from the comparison between Example 13 and Comparative Example 6, although the improvement in solder wettability was observed when Sn oxide was used in combination, the amount of Sn oxide was within the range of the present invention. In the case of 4 parts by weight outside (Comparative Example 6),
Both the initial adhesive strength and the adhesive strength after standing at high temperature were low, and were not satisfactory.
【００２４】[0024]
【発明の効果】本発明は、以上詳記したとおり、Ａｇ−
Ｐｄ系ペ−ストに所定量のＭｎの酸化物（又はＭｎの酸
化物とＳｎの酸化物）及びガラスフリットを配合した導
体ペ−ストであり、このペ−ストを用いることにより、
低温焼成多層配線基板の外部導体を同時焼成で形成した
とき、初期の接着強度が高く、しかも、はんだ濡れ性を
損なうことなく、高温（150℃程度 ）にされた後の接着
強度の低下を抑制することができる効果を奏する。そし
て、本発明により、長期間安定で、信頼性の高い低温焼
成多層配線基板を提供することができるものである。According to the present invention, as described in detail above, Ag-
A conductor paste in which a predetermined amount of an oxide of Mn (or an oxide of Mn and an oxide of Sn) and a glass frit are blended into a Pd-based paste. By using this paste,
When the outer conductor of a low-temperature fired multilayer wiring board is formed by simultaneous firing, the initial adhesive strength is high, and the decrease in the adhesive strength after high temperature (about 150 ° C) is suppressed without impairing the solder wettability. It has an effect that can be done. According to the present invention, it is possible to provide a low-temperature fired multilayer wiring board which is stable for a long time and has high reliability.
Claims (2)
ｄ及び有機ビヒクルよりなる導体ペ−ストに、このＡｇ
とＰｄの合量に対して、Ｍｎの酸化物をＭｎＯ2換算で
0.2〜3重量部、ガラスフリットを0.1〜3重量部配合して
なることを特徴とする導体ペ−スト。1. 70 to 95 parts by weight of Ag and 5 to 30 parts by weight of P
Ag and a conductive paste made of an organic vehicle.
Of Mn oxide in terms of MnO 2 with respect to the total amount of
A conductor paste comprising 0.2 to 3 parts by weight and 0.1 to 3 parts by weight of glass frit.
ｄ及び有機ビヒクルよりなる導体ペ−ストに、このＡｇ
とＰｄの合量に対して、Ｍｎの酸化物をＭｎＯ2換算で
0.2〜3重量部、Ｓｎの酸化物をＳｎＯ2換算で0.2〜3重
量部、ガラスフリットを0.1〜3重量部配合してなること
を特徴とする導体ペ−スト。2. 70 to 95 parts by weight of Ag and 5 to 30 parts by weight of P
Ag and a conductive paste made of an organic vehicle.
Of Mn oxide in terms of MnO 2 with respect to the total amount of
0.2 to 3 parts by weight, 0.2 to 3 parts by weight of oxide in terms of SnO 2 of Sn, conductor, characterized in that the glass frit by blending 0.1 to 3 parts by weight Bae - strike.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22363191A JP2931450B2 (en) | 1991-08-09 | 1991-08-09 | Conductor paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22363191A JP2931450B2 (en) | 1991-08-09 | 1991-08-09 | Conductor paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0548225A JPH0548225A (en) | 1993-02-26 |
| JP2931450B2 true JP2931450B2 (en) | 1999-08-09 |
Family
ID=16801229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22363191A Expired - Lifetime JP2931450B2 (en) | 1991-08-09 | 1991-08-09 | Conductor paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2931450B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10056508B2 (en) | 2015-03-27 | 2018-08-21 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive pastes comprising a metal compound |
| US10636540B2 (en) | 2015-03-27 | 2020-04-28 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive pastes comprising an oxide additive |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5817188B2 (en) * | 2011-04-11 | 2015-11-18 | Tdk株式会社 | Conductive paste, glass ceramic substrate and electronic component module |
-
1991
- 1991-08-09 JP JP22363191A patent/JP2931450B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10056508B2 (en) | 2015-03-27 | 2018-08-21 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive pastes comprising a metal compound |
| US10636540B2 (en) | 2015-03-27 | 2020-04-28 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive pastes comprising an oxide additive |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0548225A (en) | 1993-02-26 |
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