TW200407966A - Inspection method for exposure device and the exposure device - Google Patents

Inspection method for exposure device and the exposure device Download PDF

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Publication number
TW200407966A
TW200407966A TW092123011A TW92123011A TW200407966A TW 200407966 A TW200407966 A TW 200407966A TW 092123011 A TW092123011 A TW 092123011A TW 92123011 A TW92123011 A TW 92123011A TW 200407966 A TW200407966 A TW 200407966A
Authority
TW
Taiwan
Prior art keywords
aforementioned
optical system
pattern
exposure device
substrate
Prior art date
Application number
TW092123011A
Other languages
English (en)
Chinese (zh)
Other versions
TWI300954B (cg-RX-API-DMAC7.html
Inventor
Fukuhara Kazuya
Inoue Soichi
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200407966A publication Critical patent/TW200407966A/zh
Application granted granted Critical
Publication of TWI300954B publication Critical patent/TWI300954B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW092123011A 2002-08-30 2003-08-21 Inspection method for exposure device and the exposure device TW200407966A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002255210A JP4005881B2 (ja) 2002-08-30 2002-08-30 露光装置の検査方法

Publications (2)

Publication Number Publication Date
TW200407966A true TW200407966A (en) 2004-05-16
TWI300954B TWI300954B (cg-RX-API-DMAC7.html) 2008-09-11

Family

ID=32060786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092123011A TW200407966A (en) 2002-08-30 2003-08-21 Inspection method for exposure device and the exposure device

Country Status (5)

Country Link
US (2) US7286216B2 (cg-RX-API-DMAC7.html)
JP (1) JP4005881B2 (cg-RX-API-DMAC7.html)
CN (2) CN100414438C (cg-RX-API-DMAC7.html)
NL (1) NL1024195C2 (cg-RX-API-DMAC7.html)
TW (1) TW200407966A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394945B (zh) * 2006-06-15 2013-05-01 Hoya Corp 圖案瑕疵檢查方法、圖案瑕疵檢查用測試圖案基板及圖案瑕疵檢查裝置、以及光罩之製造方法、顯示裝置用基板之製造方法
TWI489200B (zh) * 2012-05-29 2015-06-21 Sino American Silicon Prod Inc 半圓對接式光罩圖案的設計方法

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JP3787123B2 (ja) * 2003-02-13 2006-06-21 株式会社東芝 検査方法、プロセッサ及び半導体装置の製造方法
WO2005106593A2 (en) * 2004-04-14 2005-11-10 Litel Instruments Method and apparatus for measurement of exit pupil transmittance
JP2005337957A (ja) * 2004-05-28 2005-12-08 Dainippon Screen Mfg Co Ltd 基板検査装置
EP1852894A1 (en) * 2005-02-25 2007-11-07 Nikon Corporation Exposure method and apparatus, and electronic device manufacturing method
JP2006303196A (ja) 2005-04-20 2006-11-02 Canon Inc 測定装置及びそれを有する露光装置
DE102008004762A1 (de) 2008-01-16 2009-07-30 Carl Zeiss Smt Ag Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung
JP5446648B2 (ja) * 2008-10-07 2014-03-19 信越化学工業株式会社 パターン形成方法
KR20100042924A (ko) * 2008-10-17 2010-04-27 삼성전자주식회사 포토 마스크의 헤이즈 모니터링 시스템 및 모니터링 방법
KR101511158B1 (ko) * 2008-12-16 2015-04-13 삼성전자주식회사 레티클 에러 검출 방법
EP2823288B1 (en) * 2012-03-07 2021-05-05 KLA-Tencor Corporation Wafer and reticle inspection systems and method for selecting illumination pupil configurations
CN106154756B (zh) * 2015-04-07 2020-10-09 联华电子股份有限公司 照明系统以及使用其形成鳍状结构的方法
JP7596106B2 (ja) * 2020-09-28 2024-12-09 キヤノン株式会社 情報処理装置、検査方法、プログラム、露光装置、決定方法、及び物品の製造方法
EP4095573A1 (en) * 2021-05-27 2022-11-30 ASML Netherlands B.V. Diffraction grating for measurements in euv-exposure apparatuses

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JPS61210627A (ja) 1985-03-15 1986-09-18 Canon Inc 有効光源測定用ピンホ−ル板
DE3635689A1 (de) * 1986-10-21 1988-05-05 Messerschmitt Boelkow Blohm Verfahren zur vermessung der optischen achse eines leitstrahlprojektors und einrichtung zur durchfuehrung des verfahrens
JP2928277B2 (ja) 1989-08-03 1999-08-03 株式会社日立製作所 投影露光方法及びその装置
JPH03221848A (ja) * 1990-01-26 1991-09-30 Canon Inc 異物検査装置
JP3048168B2 (ja) * 1990-07-19 2000-06-05 キヤノン株式会社 表面状態検査装置及びこれを備える露光装置
JP3158691B2 (ja) * 1992-08-07 2001-04-23 株式会社ニコン 露光装置及び方法、並びに照明光学装置
US6153886A (en) * 1993-02-19 2000-11-28 Nikon Corporation Alignment apparatus in projection exposure apparatus
JP3463335B2 (ja) * 1994-02-17 2003-11-05 株式会社ニコン 投影露光装置
JP3341269B2 (ja) * 1993-12-22 2002-11-05 株式会社ニコン 投影露光装置、露光方法、半導体の製造方法及び投影光学系の調整方法
KR0143814B1 (ko) * 1995-03-28 1998-07-01 이대원 반도체 노광 장치
US5978085A (en) 1997-03-07 1999-11-02 Litel Instruments Apparatus method of measurement and method of data analysis for correction of optical system
US5973771A (en) * 1997-03-26 1999-10-26 International Business Machines Corporation Pupil imaging reticle for photo steppers
JP3784136B2 (ja) * 1997-06-02 2006-06-07 株式会社ルネサステクノロジ 投影露光装置および投影露光方法
US6356345B1 (en) 1998-02-11 2002-03-12 Litel Instruments In-situ source metrology instrument and method of use
JP3302926B2 (ja) * 1998-07-02 2002-07-15 株式会社東芝 露光装置の検査方法
JP3513031B2 (ja) * 1998-10-09 2004-03-31 株式会社東芝 アライメント装置の調整方法、収差測定方法及び収差測定マーク
US6048651A (en) 1998-10-23 2000-04-11 International Business Machines Corporation Fresnel zone mask for pupilgram
JP2001027813A (ja) * 1999-07-14 2001-01-30 Toshiba Corp 露光方法およびその装置
JP3863339B2 (ja) * 2000-03-28 2006-12-27 株式会社東芝 光軸ずれ測定方法
JP2001330964A (ja) 2000-05-22 2001-11-30 Nikon Corp 露光装置および該露光装置を用いたマイクロデバイス製造方法
JP2002075815A (ja) * 2000-08-23 2002-03-15 Sony Corp パターン検査装置及びこれを用いた露光装置制御システム
JP2002083761A (ja) 2000-09-08 2002-03-22 Canon Inc 露光装置及び露光方法
US6597435B2 (en) * 2001-10-09 2003-07-22 Nikon Corporation Reticle stage with reaction force cancellation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394945B (zh) * 2006-06-15 2013-05-01 Hoya Corp 圖案瑕疵檢查方法、圖案瑕疵檢查用測試圖案基板及圖案瑕疵檢查裝置、以及光罩之製造方法、顯示裝置用基板之製造方法
TWI489200B (zh) * 2012-05-29 2015-06-21 Sino American Silicon Prod Inc 半圓對接式光罩圖案的設計方法

Also Published As

Publication number Publication date
US7286216B2 (en) 2007-10-23
US20070236691A1 (en) 2007-10-11
CN101063827A (zh) 2007-10-31
JP2004095871A (ja) 2004-03-25
CN1488999A (zh) 2004-04-14
NL1024195C2 (nl) 2007-10-03
CN100414438C (zh) 2008-08-27
US7327449B2 (en) 2008-02-05
CN100526997C (zh) 2009-08-12
US20040119973A1 (en) 2004-06-24
TWI300954B (cg-RX-API-DMAC7.html) 2008-09-11
JP4005881B2 (ja) 2007-11-14
NL1024195A1 (nl) 2004-03-02

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