SU668632A3 - Способ изготовлени печатных плат - Google Patents
Способ изготовлени печатных платInfo
- Publication number
- SU668632A3 SU668632A3 SU691324306A SU1324306A SU668632A3 SU 668632 A3 SU668632 A3 SU 668632A3 SU 691324306 A SU691324306 A SU 691324306A SU 1324306 A SU1324306 A SU 1324306A SU 668632 A3 SU668632 A3 SU 668632A3
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- salt
- metal
- ultraviolet light
- ions
- solution
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 150000003839 salts Chemical class 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 230000003197 catalytic effect Effects 0.000 claims description 19
- 150000002500 ions Chemical class 0.000 claims description 13
- 229910021645 metal ion Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 12
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims 4
- 229910052753 mercury Inorganic materials 0.000 claims 4
- 239000010970 precious metal Substances 0.000 claims 4
- SFOKDWPZOYRZFF-UHFFFAOYSA-H 2,3-dihydroxybutanedioate;iron(3+) Chemical compound [Fe+3].[Fe+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SFOKDWPZOYRZFF-UHFFFAOYSA-H 0.000 claims 3
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims 3
- VEPSWGHMGZQCIN-UHFFFAOYSA-H ferric oxalate Chemical compound [Fe+3].[Fe+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O VEPSWGHMGZQCIN-UHFFFAOYSA-H 0.000 claims 3
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 claims 3
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims 3
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 238000005868 electrolysis reaction Methods 0.000 claims 2
- 229960002413 ferric citrate Drugs 0.000 claims 2
- NPFOYSMITVOQOS-UHFFFAOYSA-K iron(III) citrate Chemical compound [Fe+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NPFOYSMITVOQOS-UHFFFAOYSA-K 0.000 claims 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 2
- BXDUJMLIUYJHNH-UHFFFAOYSA-L mercury(2+);oxalate Chemical compound [Hg+2].[O-]C(=O)C([O-])=O BXDUJMLIUYJHNH-UHFFFAOYSA-L 0.000 claims 2
- 229910001507 metal halide Inorganic materials 0.000 claims 2
- 150000005309 metal halides Chemical class 0.000 claims 2
- 239000012266 salt solution Substances 0.000 claims 2
- WHOBCSGRDJHAQO-UHFFFAOYSA-L 2,3-dihydroxybutanedioate;mercury(2+) Chemical compound [Hg+2].[O-]C(=O)C(O)C(O)C([O-])=O WHOBCSGRDJHAQO-UHFFFAOYSA-L 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 101100345589 Mus musculus Mical1 gene Proteins 0.000 claims 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- -1 ferric oxalate Chemical class 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229960002523 mercuric chloride Drugs 0.000 claims 1
- 150000002730 mercury Chemical class 0.000 claims 1
- LWJROJCJINYWOX-UHFFFAOYSA-L mercury dichloride Chemical compound Cl[Hg]Cl LWJROJCJINYWOX-UHFFFAOYSA-L 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 235000015145 nougat Nutrition 0.000 claims 1
- 230000008520 organization Effects 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 230000002085 persistent effect Effects 0.000 claims 1
- 238000005488 sandblasting Methods 0.000 claims 1
- 235000002906 tartaric acid Nutrition 0.000 claims 1
- 239000011975 tartaric acid Substances 0.000 claims 1
- 229940095064 tartrate Drugs 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71997668A | 1968-04-09 | 1968-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU668632A3 true SU668632A3 (ru) | 1979-06-15 |
Family
ID=24892157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU691324306A SU668632A3 (ru) | 1968-04-09 | 1969-04-08 | Способ изготовлени печатных плат |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3562005A (enrdf_load_stackoverflow) |
| BE (1) | BE729860A (enrdf_load_stackoverflow) |
| CH (1) | CH531571A (enrdf_load_stackoverflow) |
| CS (1) | CS158640B2 (enrdf_load_stackoverflow) |
| DE (1) | DE1917474C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2005828A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1266193A (enrdf_load_stackoverflow) |
| NL (1) | NL150519B (enrdf_load_stackoverflow) |
| SE (1) | SE349668B (enrdf_load_stackoverflow) |
| SU (1) | SU668632A3 (enrdf_load_stackoverflow) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH580132A5 (enrdf_load_stackoverflow) * | 1970-03-16 | 1976-09-30 | Kollmorgen Corp | |
| US3904783A (en) * | 1970-11-11 | 1975-09-09 | Nippon Telegraph & Telephone | Method for forming a printed circuit |
| US3993802A (en) * | 1971-07-29 | 1976-11-23 | Photocircuits Division Of Kollmorgen Corporation | Processes and products for making articles for electroless plating |
| US3930963A (en) * | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
| US3772056A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
| US3994727A (en) * | 1971-07-29 | 1976-11-30 | Photocircuits Divison Of Kollmorgen Corporation | Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents |
| US3959547A (en) * | 1971-07-29 | 1976-05-25 | Photocircuits Division Of Kollmorgen Corporation | Process for the formation of real images and products produced thereby |
| US3907621A (en) * | 1971-07-29 | 1975-09-23 | Photocircuits Corp | Method of sensitizing substrates for chemical metallization |
| US3772078A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Process for the formation of real images and products produced thereby |
| US3808028A (en) * | 1971-08-11 | 1974-04-30 | Western Electric Co | Method of improving adhesive properties of a surface comprising a cured epoxy |
| US3775157A (en) * | 1971-09-24 | 1973-11-27 | Fromson H A | Metal coated structure |
| US3776770A (en) * | 1971-10-08 | 1973-12-04 | Western Electric Co | Method of selectively depositing a metal on a surface of a substrate |
| US3791340A (en) * | 1972-05-15 | 1974-02-12 | Western Electric Co | Method of depositing a metal pattern on a surface |
| US3839083A (en) * | 1972-10-06 | 1974-10-01 | Texas Instruments Inc | Selective metallization process |
| BG18355A1 (enrdf_load_stackoverflow) * | 1972-11-15 | 1974-10-25 | ||
| US3949121A (en) * | 1973-12-12 | 1976-04-06 | Western Electric Company, Inc. | Method of forming a hydrophobic surface |
| US3964906A (en) * | 1973-12-12 | 1976-06-22 | Western Electric Company, Inc. | Method of forming a hydrophobic surface by exposing a colloidal sol to UV radiation |
| JPS538492B2 (enrdf_load_stackoverflow) * | 1974-08-01 | 1978-03-29 | ||
| US3928670A (en) * | 1974-09-23 | 1975-12-23 | Amp Inc | Selective plating on non-metallic surfaces |
| JPS5238221A (en) * | 1975-09-22 | 1977-03-24 | Mita Ind Co Ltd | Electrophotography |
| US4150171A (en) * | 1976-03-30 | 1979-04-17 | Surface Technology, Inc. | Electroless plating |
| US4190352A (en) * | 1977-06-30 | 1980-02-26 | Bell Telephone Laboratories, Incorporated | Method and apparatus for continuously patterning a photosensitive tape |
| NL7806773A (nl) * | 1978-06-23 | 1979-12-28 | Philips Nv | Additieve werkwijze voor het vervaardigen van metaal- patronen op kunststofsubstraten. |
| US4215781A (en) * | 1979-03-27 | 1980-08-05 | Kliklok Corporation | Article carrier with gusset retainers |
| US4247575A (en) * | 1979-10-29 | 1981-01-27 | American Hospital Supply Corporation | Method of silver plating a tooth structure |
| US4594311A (en) * | 1984-10-29 | 1986-06-10 | Kollmorgen Technologies Corporation | Process for the photoselective metallization on non-conductive plastic base materials |
| DE3631055C1 (de) * | 1986-09-12 | 1987-05-21 | Deutsche Automobilgesellsch | Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung |
| US4775608A (en) * | 1987-10-05 | 1988-10-04 | International Business Machines Corporation | Generation of capacitive servo patterns on magnetic storage disks |
| DE3837835C1 (enrdf_load_stackoverflow) * | 1988-11-08 | 1990-02-22 | Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De | |
| US4975327A (en) | 1989-07-11 | 1990-12-04 | Minnesota Mining And Manufacturing Company | Polyimide substrate having a textured surface and metallizing such a substrate |
| US4959121A (en) * | 1990-01-05 | 1990-09-25 | General Electric Company | Method for treating a polyimide surface for subsequent plating thereon |
| US5563867A (en) * | 1994-06-30 | 1996-10-08 | Discovision Associates | Optical tape duplicator |
| US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
| US6436816B1 (en) * | 1998-07-31 | 2002-08-20 | Industrial Technology Research Institute | Method of electroless plating copper on nitride barrier |
| JP2004319927A (ja) * | 2003-04-21 | 2004-11-11 | Shinko Electric Ind Co Ltd | パターニング装置及び膜のパターニング方法 |
| KR100996316B1 (ko) * | 2003-11-20 | 2010-11-23 | 삼성전자주식회사 | 패키지를 허메틱 실링하기 위한 금속 패턴 형성방법 |
| CA2635667A1 (en) * | 2005-12-27 | 2007-07-05 | Bayer Healthcare Llc | Process of making electrodes for test sensors |
| EP1969364A2 (en) * | 2005-12-27 | 2008-09-17 | Bayer Healthcare, LLC | Process of making electrolessly plated auto-calibration circuits for test sensors |
| JP2010530646A (ja) * | 2007-06-18 | 2010-09-09 | スティーブン リー ダットン， | プリント回路および多層プリント回路を作る自動化ダイレクト乳剤プロセス |
| KR100904251B1 (ko) * | 2008-01-28 | 2009-06-25 | 한국생산기술연구원 | 폴리머 표면에 귀금속촉매의 선택적 흡착방법 |
| US8339573B2 (en) * | 2009-05-27 | 2012-12-25 | 3M Innovative Properties Company | Method and apparatus for photoimaging a substrate |
| US20160122233A1 (en) * | 2014-11-05 | 2016-05-05 | Corning Incorporated | Coated glass sleeves and methods of coating glass sleeves |
-
1968
- 1968-04-09 US US719976A patent/US3562005A/en not_active Expired - Lifetime
-
1969
- 1969-03-14 BE BE729860D patent/BE729860A/xx not_active IP Right Cessation
- 1969-03-28 SE SE04409/69A patent/SE349668B/xx unknown
- 1969-04-02 FR FR6910083A patent/FR2005828A1/fr not_active Withdrawn
- 1969-04-05 DE DE1917474A patent/DE1917474C3/de not_active Expired
- 1969-04-08 GB GB1266193D patent/GB1266193A/en not_active Expired
- 1969-04-08 SU SU691324306A patent/SU668632A3/ru active
- 1969-04-09 NL NL696905460A patent/NL150519B/xx not_active IP Right Cessation
- 1969-04-09 CH CH538569A patent/CH531571A/de not_active IP Right Cessation
- 1969-04-09 CS CS251169A patent/CS158640B2/cs unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE349668B (enrdf_load_stackoverflow) | 1972-10-02 |
| DE1917474C3 (de) | 1980-08-21 |
| US3562005A (en) | 1971-02-09 |
| DE1917474B2 (de) | 1975-01-02 |
| CH531571A (de) | 1972-12-15 |
| FR2005828A1 (enrdf_load_stackoverflow) | 1969-12-19 |
| BE729860A (enrdf_load_stackoverflow) | 1969-08-18 |
| GB1266193A (enrdf_load_stackoverflow) | 1972-03-08 |
| CS158640B2 (enrdf_load_stackoverflow) | 1974-11-25 |
| NL6905460A (enrdf_load_stackoverflow) | 1969-10-13 |
| NL150519B (nl) | 1976-08-16 |
| DE1917474A1 (de) | 1970-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SU668632A3 (ru) | Способ изготовлени печатных плат | |
| US2699424A (en) | Electroplating process for producing printed circuits | |
| US4144118A (en) | Method of providing printed circuits | |
| US3668003A (en) | Printed circuits | |
| CN1876891A (zh) | 使不导电基底直接金属化的方法 | |
| US3240684A (en) | Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards | |
| US5770032A (en) | Metallizing process | |
| US5792248A (en) | Sensitizing solution | |
| JP3474291B2 (ja) | ガラス又はセラミックス基板へのめっき層の形成方法 | |
| JPH041067B2 (enrdf_load_stackoverflow) | ||
| SU951765A1 (ru) | Способ изготовлени печатных плат | |
| JPS59185771A (ja) | めつき方法 | |
| JPS6118357B2 (enrdf_load_stackoverflow) | ||
| JPS6021226B2 (ja) | 絶縁基板の無電解メツキ法 | |
| JPS634072A (ja) | 無電解めつき用触媒液及びその製造方法 | |
| JPH03277778A (ja) | めっき方法およびそれに用いる表面処理液 | |
| JPS6234714B2 (enrdf_load_stackoverflow) | ||
| GB1240007A (en) | Improvements in the manufacture of printed circuit boards | |
| JPS61163693A (ja) | プリント配線板の製造方法 | |
| JPS634073A (ja) | 無電解めつき用触媒液及びその製造方法 | |
| JPS634074A (ja) | 無電解めつき用銅コロイド触媒液およびその製造方法 | |
| GB2277745A (en) | Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s | |
| JPS62290879A (ja) | 無電解めつき用銅コロイド触媒液およびその製造方法 | |
| JPS63188992A (ja) | 印刷配線板の製造法 | |
| JPS62271491A (ja) | 印刷配線板の製造方法 |