CH531571A - Verfahren zum Herstellen eines metallischen Musters auf einer Unterlage - Google Patents

Verfahren zum Herstellen eines metallischen Musters auf einer Unterlage

Info

Publication number
CH531571A
CH531571A CH538569A CH538569A CH531571A CH 531571 A CH531571 A CH 531571A CH 538569 A CH538569 A CH 538569A CH 538569 A CH538569 A CH 538569A CH 531571 A CH531571 A CH 531571A
Authority
CH
Switzerland
Prior art keywords
producing
substrate
metallic pattern
metallic
pattern
Prior art date
Application number
CH538569A
Other languages
English (en)
Inventor
Anthony De Angelo Michael
Jex Sharp Donald
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH531571A publication Critical patent/CH531571A/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH538569A 1968-04-09 1969-04-09 Verfahren zum Herstellen eines metallischen Musters auf einer Unterlage CH531571A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71997668A 1968-04-09 1968-04-09

Publications (1)

Publication Number Publication Date
CH531571A true CH531571A (de) 1972-12-15

Family

ID=24892157

Family Applications (1)

Application Number Title Priority Date Filing Date
CH538569A CH531571A (de) 1968-04-09 1969-04-09 Verfahren zum Herstellen eines metallischen Musters auf einer Unterlage

Country Status (10)

Country Link
US (1) US3562005A (de)
BE (1) BE729860A (de)
CH (1) CH531571A (de)
CS (1) CS158640B2 (de)
DE (1) DE1917474C3 (de)
FR (1) FR2005828A1 (de)
GB (1) GB1266193A (de)
NL (1) NL150519B (de)
SE (1) SE349668B (de)
SU (1) SU668632A3 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA956850A (en) * 1970-03-16 1974-10-29 Frederick W. Schneble (Jr.) Direct bonding of electroless metals to substrates
US3904783A (en) * 1970-11-11 1975-09-09 Nippon Telegraph & Telephone Method for forming a printed circuit
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US3772078A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Process for the formation of real images and products produced thereby
US3959547A (en) * 1971-07-29 1976-05-25 Photocircuits Division Of Kollmorgen Corporation Process for the formation of real images and products produced thereby
US3994727A (en) * 1971-07-29 1976-11-30 Photocircuits Divison Of Kollmorgen Corporation Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
US3772056A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3775157A (en) * 1971-09-24 1973-11-27 Fromson H A Metal coated structure
US3776770A (en) * 1971-10-08 1973-12-04 Western Electric Co Method of selectively depositing a metal on a surface of a substrate
US3791340A (en) * 1972-05-15 1974-02-12 Western Electric Co Method of depositing a metal pattern on a surface
US3839083A (en) * 1972-10-06 1974-10-01 Texas Instruments Inc Selective metallization process
BG18355A1 (de) * 1972-11-15 1974-10-25
US3949121A (en) * 1973-12-12 1976-04-06 Western Electric Company, Inc. Method of forming a hydrophobic surface
US3964906A (en) * 1973-12-12 1976-06-22 Western Electric Company, Inc. Method of forming a hydrophobic surface by exposing a colloidal sol to UV radiation
JPS538492B2 (de) * 1974-08-01 1978-03-29
US3928670A (en) * 1974-09-23 1975-12-23 Amp Inc Selective plating on non-metallic surfaces
JPS5238221A (en) * 1975-09-22 1977-03-24 Mita Ind Co Ltd Electrophotography
US4150171A (en) * 1976-03-30 1979-04-17 Surface Technology, Inc. Electroless plating
US4190352A (en) * 1977-06-30 1980-02-26 Bell Telephone Laboratories, Incorporated Method and apparatus for continuously patterning a photosensitive tape
NL7806773A (nl) * 1978-06-23 1979-12-28 Philips Nv Additieve werkwijze voor het vervaardigen van metaal- patronen op kunststofsubstraten.
US4215781A (en) * 1979-03-27 1980-08-05 Kliklok Corporation Article carrier with gusset retainers
US4247575A (en) * 1979-10-29 1981-01-27 American Hospital Supply Corporation Method of silver plating a tooth structure
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
DE3631055C1 (de) * 1986-09-12 1987-05-21 Deutsche Automobilgesellsch Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung
US4775608A (en) * 1987-10-05 1988-10-04 International Business Machines Corporation Generation of capacitive servo patterns on magnetic storage disks
DE3837835C1 (de) * 1988-11-08 1990-02-22 Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De
US4975327A (en) * 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
US4959121A (en) * 1990-01-05 1990-09-25 General Electric Company Method for treating a polyimide surface for subsequent plating thereon
US5563867A (en) * 1994-06-30 1996-10-08 Discovision Associates Optical tape duplicator
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6436816B1 (en) * 1998-07-31 2002-08-20 Industrial Technology Research Institute Method of electroless plating copper on nitride barrier
JP2004319927A (ja) * 2003-04-21 2004-11-11 Shinko Electric Ind Co Ltd パターニング装置及び膜のパターニング方法
KR100996316B1 (ko) * 2003-11-20 2010-11-23 삼성전자주식회사 패키지를 허메틱 실링하기 위한 금속 패턴 형성방법
CA2635668A1 (en) * 2005-12-27 2007-07-05 Bayer Healthcare Llc Process of making electrolessly plated auto-calibration circuits for test sensors
CA2635667A1 (en) * 2005-12-27 2007-07-05 Bayer Healthcare Llc Process of making electrodes for test sensors
CN101785372B (zh) * 2007-06-18 2012-07-18 维克特拉万技术有限公司 用于制造印刷电路和多层印刷电路的自动直接乳化工艺
KR100904251B1 (ko) * 2008-01-28 2009-06-25 한국생산기술연구원 폴리머 표면에 귀금속촉매의 선택적 흡착방법
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
US20160122233A1 (en) * 2014-11-05 2016-05-05 Corning Incorporated Coated glass sleeves and methods of coating glass sleeves

Also Published As

Publication number Publication date
NL150519B (nl) 1976-08-16
US3562005A (en) 1971-02-09
NL6905460A (de) 1969-10-13
SU668632A3 (ru) 1979-06-15
DE1917474B2 (de) 1975-01-02
DE1917474C3 (de) 1980-08-21
FR2005828A1 (de) 1969-12-19
DE1917474A1 (de) 1970-01-08
CS158640B2 (de) 1974-11-25
SE349668B (de) 1972-10-02
BE729860A (de) 1969-08-18
GB1266193A (de) 1972-03-08

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