GB1266193A - - Google Patents

Info

Publication number
GB1266193A
GB1266193A GB1266193DA GB1266193A GB 1266193 A GB1266193 A GB 1266193A GB 1266193D A GB1266193D A GB 1266193DA GB 1266193 A GB1266193 A GB 1266193A
Authority
GB
United Kingdom
Prior art keywords
substrate
water rinse
solution
electroless
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1266193A publication Critical patent/GB1266193A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1,266,193. Coating with metals. WESTERN ELECTRIC CO. Inc. April 8, 1969 [April 9, 1968], No. 17810/69. Heading C7B and C7F. A metal pattern, e. g. a printed circuit, is formed on a substrate by coating with a solution containing metal ions whose oxidation state is alterable by exposure to ultraviolet radiation less than 3, 000 A, exposing the ions to such a radiation to form a pattern of metal ions capable of reducing catalytic metal ions selected from Au, Ir, Os, Pd, Pt, Rh, and Ag, and then immersing the substrate in a solution of a salt of the catalytic metal. The substrate is then electroless-plated with Cu, Ni, Co, Pt, Pd, Au or Ag. The substrate may be polyimide, polyamide, silicone or epoxy films, unfired or fixed ceramics, paper, cloth or glass fibre. The ultraviolet sensitive solution may be such as to give a positive or negative pattern. Examples of negative solutions are ferric oxalate, citrate or tartrate or mercuric oxalate, citrate or tartrate. Examples of positive solutions are tin, tinanium or lead chlorides or bromides. As shown in Fig. 2 a substrate 11 is fed through a cleaner 12, water rinse 13, ultraviolet sensitive solution 14, dried by air from nozzles 46, optional water rinse 16, exposure to radiation, through a mask, from ultraviolet sources 48, 49, immersion in precious metal salt solution 19, water rinse 21, electroless-plating bath 20, electro-plating bath 22, final water rinse 23, and drier 62. The electroless bath may contain hydrazine, formaldehyde, sodium hypophosphite or boranes as reducing agents and E. D. T. A., cyanides or Rochelle salts as complexing agents. The electro-plating bath may be copper fluoborate or sulphate and the substrate is connected to a negative potential through a roller 32. The anode 86 may have an angled part 90 to decrease the current density during entry. The plated substrate may be subsequently heated.
GB1266193D 1968-04-09 1969-04-08 Expired GB1266193A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71997668A 1968-04-09 1968-04-09

Publications (1)

Publication Number Publication Date
GB1266193A true GB1266193A (en) 1972-03-08

Family

ID=24892157

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1266193D Expired GB1266193A (en) 1968-04-09 1969-04-08

Country Status (10)

Country Link
US (1) US3562005A (en)
BE (1) BE729860A (en)
CH (1) CH531571A (en)
CS (1) CS158640B2 (en)
DE (1) DE1917474C3 (en)
FR (1) FR2005828A1 (en)
GB (1) GB1266193A (en)
NL (1) NL150519B (en)
SE (1) SE349668B (en)
SU (1) SU668632A3 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2196022A (en) * 1986-09-12 1988-04-20 Deutsche Automobilgesellsch Process for the continuous impregnation of nonwoven or needle felt webs with an activating solution for electroless plating
GB2225028A (en) * 1988-11-08 1990-05-23 Deutsche Automobilgesellsch Process for the continuous impregnation of a nonwoven or needle felt web with an activation solution prior to metallisation

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH580132A5 (en) * 1970-03-16 1976-09-30 Kollmorgen Corp
US3904783A (en) * 1970-11-11 1975-09-09 Nippon Telegraph & Telephone Method for forming a printed circuit
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
US3994727A (en) * 1971-07-29 1976-11-30 Photocircuits Divison Of Kollmorgen Corporation Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3772056A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US3772078A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Process for the formation of real images and products produced thereby
US3959547A (en) * 1971-07-29 1976-05-25 Photocircuits Division Of Kollmorgen Corporation Process for the formation of real images and products produced thereby
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3775157A (en) * 1971-09-24 1973-11-27 Fromson H A Metal coated structure
US3776770A (en) * 1971-10-08 1973-12-04 Western Electric Co Method of selectively depositing a metal on a surface of a substrate
US3791340A (en) * 1972-05-15 1974-02-12 Western Electric Co Method of depositing a metal pattern on a surface
US3839083A (en) * 1972-10-06 1974-10-01 Texas Instruments Inc Selective metallization process
BG18355A1 (en) * 1972-11-15 1974-10-25
US3949121A (en) * 1973-12-12 1976-04-06 Western Electric Company, Inc. Method of forming a hydrophobic surface
US3964906A (en) * 1973-12-12 1976-06-22 Western Electric Company, Inc. Method of forming a hydrophobic surface by exposing a colloidal sol to UV radiation
JPS538492B2 (en) * 1974-08-01 1978-03-29
US3928670A (en) * 1974-09-23 1975-12-23 Amp Inc Selective plating on non-metallic surfaces
JPS5238221A (en) * 1975-09-22 1977-03-24 Mita Ind Co Ltd Electrophotography
US4150171A (en) * 1976-03-30 1979-04-17 Surface Technology, Inc. Electroless plating
US4190352A (en) * 1977-06-30 1980-02-26 Bell Telephone Laboratories, Incorporated Method and apparatus for continuously patterning a photosensitive tape
NL7806773A (en) * 1978-06-23 1979-12-28 Philips Nv ADDITIVE PROCESS FOR MANUFACTURING METAL PATTERNS ON PLASTIC SUBSTRATES.
US4215781A (en) * 1979-03-27 1980-08-05 Kliklok Corporation Article carrier with gusset retainers
US4247575A (en) * 1979-10-29 1981-01-27 American Hospital Supply Corporation Method of silver plating a tooth structure
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
US4775608A (en) * 1987-10-05 1988-10-04 International Business Machines Corporation Generation of capacitive servo patterns on magnetic storage disks
US4975327A (en) * 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
US4959121A (en) * 1990-01-05 1990-09-25 General Electric Company Method for treating a polyimide surface for subsequent plating thereon
US5563867A (en) * 1994-06-30 1996-10-08 Discovision Associates Optical tape duplicator
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6436816B1 (en) * 1998-07-31 2002-08-20 Industrial Technology Research Institute Method of electroless plating copper on nitride barrier
JP2004319927A (en) * 2003-04-21 2004-11-11 Shinko Electric Ind Co Ltd Patterning device and patterning method of film
KR100996316B1 (en) * 2003-11-20 2010-11-23 삼성전자주식회사 Method of Forming Metal Pattern for Hermetic Sealing of Package
EP1969364A2 (en) * 2005-12-27 2008-09-17 Bayer Healthcare, LLC Process of making electrolessly plated auto-calibration circuits for test sensors
AU2006331555A1 (en) * 2005-12-27 2007-07-05 Bayer Healthcare Llc Process of making electrodes for test sensors
CN101785372B (en) * 2007-06-18 2012-07-18 维克特拉万技术有限公司 Automated direct emulsion process for making printed circuits and multilayer printed circuits
KR100904251B1 (en) * 2008-01-28 2009-06-25 한국생산기술연구원 Selective adsorption method of novel precious metal catalyst on polymer surface
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
US20160122233A1 (en) * 2014-11-05 2016-05-05 Corning Incorporated Coated glass sleeves and methods of coating glass sleeves

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2196022A (en) * 1986-09-12 1988-04-20 Deutsche Automobilgesellsch Process for the continuous impregnation of nonwoven or needle felt webs with an activating solution for electroless plating
GB2196022B (en) * 1986-09-12 1991-04-17 Deutsche Automobilgesellsch Process for the continuous impregnating of nonwoven or needle felt web with an activating solution
GB2225028A (en) * 1988-11-08 1990-05-23 Deutsche Automobilgesellsch Process for the continuous impregnation of a nonwoven or needle felt web with an activation solution prior to metallisation
GB2225028B (en) * 1988-11-08 1993-01-13 Deutsche Automobilgesellsch Process for the continuous impregnation of a non woven or needle felt web with an activation solution

Also Published As

Publication number Publication date
DE1917474C3 (en) 1980-08-21
CH531571A (en) 1972-12-15
NL150519B (en) 1976-08-16
FR2005828A1 (en) 1969-12-19
BE729860A (en) 1969-08-18
DE1917474B2 (en) 1975-01-02
DE1917474A1 (en) 1970-01-08
SE349668B (en) 1972-10-02
NL6905460A (en) 1969-10-13
SU668632A3 (en) 1979-06-15
CS158640B2 (en) 1974-11-25
US3562005A (en) 1971-02-09

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee