SU375821A1 - - Google Patents
Info
- Publication number
- SU375821A1 SU375821A1 SU1727816A SU1727816A SU375821A1 SU 375821 A1 SU375821 A1 SU 375821A1 SU 1727816 A SU1727816 A SU 1727816A SU 1727816 A SU1727816 A SU 1727816A SU 375821 A1 SU375821 A1 SU 375821A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- dielectric
- layer
- foil
- contact
- areas
- Prior art date
Links
- 239000010410 layer Substances 0.000 description 11
- 239000011888 foil Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1727816A SU375821A1 (enrdf_load_stackoverflow) | 1971-12-22 | 1971-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1727816A SU375821A1 (enrdf_load_stackoverflow) | 1971-12-22 | 1971-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU375821A1 true SU375821A1 (enrdf_load_stackoverflow) | 1973-03-23 |
Family
ID=20497060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1727816A SU375821A1 (enrdf_load_stackoverflow) | 1971-12-22 | 1971-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU375821A1 (enrdf_load_stackoverflow) |
-
1971
- 1971-12-22 SU SU1727816A patent/SU375821A1/ru active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3791858A (en) | Method of forming multi-layer circuit panels | |
| CN114760771B (zh) | 线路板上导通孔的保护方法 | |
| GB1268317A (en) | Improvements in or relating to the manufacture of conductor plates | |
| US2965952A (en) | Method for manufacturing etched circuitry | |
| US3135823A (en) | Metallic element embedding process and product | |
| SU375821A1 (enrdf_load_stackoverflow) | ||
| GB1262245A (en) | Production of circuit boards | |
| DE3377454D1 (en) | Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method | |
| ATE96978T1 (de) | Verfahren zum herstellen von durchkontaktierten leiterplatten mit sehr kleinen oder keinen loetraendern um die durchkontaktierungsloecher. | |
| ES349275A1 (es) | Un metodo de producir un dibujo de circuito conductor de configuracion previamente determinada. | |
| JPS625356B2 (enrdf_load_stackoverflow) | ||
| JPH01137693A (ja) | プリント基板の製造方法 | |
| JPS6345888A (ja) | バンプ付配線板の製造方法 | |
| JPS59114889A (ja) | 導電体パタ−ンの形成方法 | |
| JP2919423B2 (ja) | 印刷配線板の製造方法 | |
| KR920006186B1 (ko) | 배선용 콘택홀 형성방법 | |
| JP2661231B2 (ja) | プリント配線板の製造方法 | |
| JPS58132995A (ja) | 導電ペ−ストのはんだ付け方法 | |
| JP2500659B2 (ja) | 印刷配線板の製造方法 | |
| JPH0373593A (ja) | フレキシブルプリント配線板の製造方法 | |
| JPH0354873B2 (enrdf_load_stackoverflow) | ||
| JPH0329346A (ja) | 半導体パッケージ用基板に回路を形成する方法 | |
| JPH0137877B2 (enrdf_load_stackoverflow) | ||
| JPS6052087A (ja) | プリント板製造方法 | |
| JPH08213737A (ja) | 導体形成方法 |